JPS5648162A - Electric circuit sealing element - Google Patents
Electric circuit sealing elementInfo
- Publication number
- JPS5648162A JPS5648162A JP12363779A JP12363779A JPS5648162A JP S5648162 A JPS5648162 A JP S5648162A JP 12363779 A JP12363779 A JP 12363779A JP 12363779 A JP12363779 A JP 12363779A JP S5648162 A JPS5648162 A JP S5648162A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electric circuit
- board
- sealing element
- projecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To make checking and additional wiring easier, when providing terminals for an element which sealed an electric circuit, by projecting the first terminal downwards towards a board on which a wiring pattern is made and projecting the second terminal which is connected inside upwards. CONSTITUTION:When providing terminals for a sealing element 1 which contains an electric circuit, the first terminal 2 for packaging is projected downwards towards a packaging board 3 on which a wiring pattern 4 is prepared and connected to the pattern 4 using solder 5. The second terminal 6 which has been connected inside the element 1 is formed projecting above the upper surface of the element 1. By so doing, the element 1 can be checked easily with a probe 7 even after the element has been packaged to the board 3, and also additional wiring can be made easily. Also, the first terminal 2 may be projected from the side face of the element 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12363779A JPS5648162A (en) | 1979-09-26 | 1979-09-26 | Electric circuit sealing element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12363779A JPS5648162A (en) | 1979-09-26 | 1979-09-26 | Electric circuit sealing element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5648162A true JPS5648162A (en) | 1981-05-01 |
Family
ID=14865507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12363779A Pending JPS5648162A (en) | 1979-09-26 | 1979-09-26 | Electric circuit sealing element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5648162A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146259B2 (en) * | 1971-12-17 | 1976-12-08 | ||
JPS53763B2 (en) * | 1973-03-28 | 1978-01-12 |
-
1979
- 1979-09-26 JP JP12363779A patent/JPS5648162A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5146259B2 (en) * | 1971-12-17 | 1976-12-08 | ||
JPS53763B2 (en) * | 1973-03-28 | 1978-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5745955A (en) | Sealing container | |
JPS5779652A (en) | Resin-sealed semiconductor device | |
HK8681A (en) | A method of electrically connecting an integrated circuit component to circuitry on a substrate | |
JPS5648162A (en) | Electric circuit sealing element | |
JPS5230184A (en) | Semiconductor device | |
JPS5348469A (en) | Production of hybrid integrated circuit device | |
JPS57187955A (en) | Sealing structure of semiconductor element | |
JPS5412263A (en) | Semiconductor element and production of the same | |
JPS51138358A (en) | Electronic circuit testing apparatus | |
JPS55101064A (en) | Continuity check unit | |
GB1555227A (en) | Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards | |
JPS6450551A (en) | Ic package structure | |
JPS55123151A (en) | Integrated circuit device | |
JPS52116867A (en) | Electronic circuit package | |
GB1553133A (en) | Electrical dual-inline circuit package | |
JPS5240972A (en) | Packaging construction of semiconductor device | |
JPS5348465A (en) | Connecting method of lead frame utilizing through-holes | |
JPS5546561A (en) | Method of fabricating hybrid integrated circuit | |
JPS52116073A (en) | Hermetic structure in which integrated circuit element is sealed up ai rtightly | |
JPS5362479A (en) | Integrated circuit with power terminals for testing | |
JPS6484630A (en) | Measuring jig for semiconductor integrated circuit | |
JPS552965A (en) | Electronic watch | |
JPS5310245A (en) | Piezoelectric component and its manufacture | |
JPS5740945A (en) | Integrated circuit device | |
JPS57104247A (en) | Terminal block with resistor |