[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS5648162A - Electric circuit sealing element - Google Patents

Electric circuit sealing element

Info

Publication number
JPS5648162A
JPS5648162A JP12363779A JP12363779A JPS5648162A JP S5648162 A JPS5648162 A JP S5648162A JP 12363779 A JP12363779 A JP 12363779A JP 12363779 A JP12363779 A JP 12363779A JP S5648162 A JPS5648162 A JP S5648162A
Authority
JP
Japan
Prior art keywords
terminal
electric circuit
board
sealing element
projecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12363779A
Other languages
Japanese (ja)
Inventor
Makoto Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP12363779A priority Critical patent/JPS5648162A/en
Publication of JPS5648162A publication Critical patent/JPS5648162A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make checking and additional wiring easier, when providing terminals for an element which sealed an electric circuit, by projecting the first terminal downwards towards a board on which a wiring pattern is made and projecting the second terminal which is connected inside upwards. CONSTITUTION:When providing terminals for a sealing element 1 which contains an electric circuit, the first terminal 2 for packaging is projected downwards towards a packaging board 3 on which a wiring pattern 4 is prepared and connected to the pattern 4 using solder 5. The second terminal 6 which has been connected inside the element 1 is formed projecting above the upper surface of the element 1. By so doing, the element 1 can be checked easily with a probe 7 even after the element has been packaged to the board 3, and also additional wiring can be made easily. Also, the first terminal 2 may be projected from the side face of the element 1.
JP12363779A 1979-09-26 1979-09-26 Electric circuit sealing element Pending JPS5648162A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12363779A JPS5648162A (en) 1979-09-26 1979-09-26 Electric circuit sealing element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12363779A JPS5648162A (en) 1979-09-26 1979-09-26 Electric circuit sealing element

Publications (1)

Publication Number Publication Date
JPS5648162A true JPS5648162A (en) 1981-05-01

Family

ID=14865507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12363779A Pending JPS5648162A (en) 1979-09-26 1979-09-26 Electric circuit sealing element

Country Status (1)

Country Link
JP (1) JPS5648162A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146259B2 (en) * 1971-12-17 1976-12-08
JPS53763B2 (en) * 1973-03-28 1978-01-12

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146259B2 (en) * 1971-12-17 1976-12-08
JPS53763B2 (en) * 1973-03-28 1978-01-12

Similar Documents

Publication Publication Date Title
JPS5745955A (en) Sealing container
JPS5779652A (en) Resin-sealed semiconductor device
HK8681A (en) A method of electrically connecting an integrated circuit component to circuitry on a substrate
JPS5648162A (en) Electric circuit sealing element
JPS5230184A (en) Semiconductor device
JPS5348469A (en) Production of hybrid integrated circuit device
JPS57187955A (en) Sealing structure of semiconductor element
JPS5412263A (en) Semiconductor element and production of the same
JPS51138358A (en) Electronic circuit testing apparatus
JPS55101064A (en) Continuity check unit
GB1555227A (en) Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
JPS6450551A (en) Ic package structure
JPS55123151A (en) Integrated circuit device
JPS52116867A (en) Electronic circuit package
GB1553133A (en) Electrical dual-inline circuit package
JPS5240972A (en) Packaging construction of semiconductor device
JPS5348465A (en) Connecting method of lead frame utilizing through-holes
JPS5546561A (en) Method of fabricating hybrid integrated circuit
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS5362479A (en) Integrated circuit with power terminals for testing
JPS6484630A (en) Measuring jig for semiconductor integrated circuit
JPS552965A (en) Electronic watch
JPS5310245A (en) Piezoelectric component and its manufacture
JPS5740945A (en) Integrated circuit device
JPS57104247A (en) Terminal block with resistor