JPS5639191A - Laser processing method - Google Patents
Laser processing methodInfo
- Publication number
- JPS5639191A JPS5639191A JP11526579A JP11526579A JPS5639191A JP S5639191 A JPS5639191 A JP S5639191A JP 11526579 A JP11526579 A JP 11526579A JP 11526579 A JP11526579 A JP 11526579A JP S5639191 A JPS5639191 A JP S5639191A
- Authority
- JP
- Japan
- Prior art keywords
- laser light
- evaporated material
- treated
- chamber
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
PURPOSE:To enable laser processing under clean atmosphere, by providing the collective unit suctioning the evaporating material from object to be treated, in the laser processing in the chamber filled by inactive gas. CONSTITUTION:The evaporated material from object to be treated is suctioned and collected in the direction apart form the path of laser light. The collector 8 consists of the suction 12 located above the radiation part of laser light 1, flow branching plate 11 warping the gas flow including the evaporated material suctioned from the path of laser light, and discharge outlet 9. The laser light 1 is touched on the object 3 to be treated and the inactive gas atmosphere 6 is fed from the supply inlet 10 in the chamber 5. The most parts of evaporated material 4 from the object 3 is adhered to the inner wall of the unit 8 and the flow branching plate 11, and the exhaust gas 9 including comparatively less evaporated material 4 is reused outside the chamber. Further, by filling the filter material such as glass fiber to the space in the unit 8, the efficiency of colllection of evaporated material can be increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526579A JPS5639191A (en) | 1979-09-10 | 1979-09-10 | Laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526579A JPS5639191A (en) | 1979-09-10 | 1979-09-10 | Laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5639191A true JPS5639191A (en) | 1981-04-14 |
Family
ID=14658382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11526579A Pending JPS5639191A (en) | 1979-09-10 | 1979-09-10 | Laser processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5639191A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59156596A (en) * | 1982-09-01 | 1984-09-05 | ウエスチングハウス エレクトリツク コ−ポレ−シヨン | Welder |
| JPH01218792A (en) * | 1988-02-29 | 1989-08-31 | Mitsubishi Electric Corp | Laser beam machine |
| WO1997031747A1 (en) * | 1996-02-29 | 1997-09-04 | Merck & Co., Inc. | Laser drilling process for producing a plurality of holes in chemical dosage forms using acousto-optic deflector |
-
1979
- 1979-09-10 JP JP11526579A patent/JPS5639191A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59156596A (en) * | 1982-09-01 | 1984-09-05 | ウエスチングハウス エレクトリツク コ−ポレ−シヨン | Welder |
| JPH029556B2 (en) * | 1982-09-01 | 1990-03-02 | Westinghouse Electric Corp | |
| JPH01218792A (en) * | 1988-02-29 | 1989-08-31 | Mitsubishi Electric Corp | Laser beam machine |
| WO1997031747A1 (en) * | 1996-02-29 | 1997-09-04 | Merck & Co., Inc. | Laser drilling process for producing a plurality of holes in chemical dosage forms using acousto-optic deflector |
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