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JPS5635780A - Preventing method for oxidation of heat-treated copper film - Google Patents

Preventing method for oxidation of heat-treated copper film

Info

Publication number
JPS5635780A
JPS5635780A JP11078079A JP11078079A JPS5635780A JP S5635780 A JPS5635780 A JP S5635780A JP 11078079 A JP11078079 A JP 11078079A JP 11078079 A JP11078079 A JP 11078079A JP S5635780 A JPS5635780 A JP S5635780A
Authority
JP
Japan
Prior art keywords
copper film
heat
oxidation
ceramic blank
trichlene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11078079A
Other languages
Japanese (ja)
Other versions
JPS5946310B2 (en
Inventor
Atsuo Senda
Toru Kasatsugu
Takuji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP54110780A priority Critical patent/JPS5946310B2/en
Publication of JPS5635780A publication Critical patent/JPS5635780A/en
Publication of JPS5946310B2 publication Critical patent/JPS5946310B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Ceramic Capacitors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To increase the reliability of electronic parts, etc., by the heat treatment of the surface of ceramic blank on which a copper film has been formed, then by contacting the surface with the halogenated hydrocarbon such as trichlene thereby preventing the oxidation of the copper film so as to stabilize it.
CONSTITUTION: After copper film is formed on the surface of ceramic blank such as dielectric, insulator, resistor, semiconductor, or electrode by any one method among electroless plating, vacuum deposition, sputtering, ion plating, the copper film is heat-treated in an inert atmosphere at a prescribed temp. Then the surface is allowed to contact with halogenated hydrocarbon such as trichlene, perchlene, freon, chlorobenzene etc. Hereby the surface of the copper film is prevented from being oxidized and is stabilized, hence the preservation of the surface of the copper film is made possible for a long time, and the reliability of electronic parts made of the ceramic blank is increased.
COPYRIGHT: (C)1981,JPO&Japio
JP54110780A 1979-08-29 1979-08-29 Method for preventing oxidation of heat-treated copper coatings Expired JPS5946310B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54110780A JPS5946310B2 (en) 1979-08-29 1979-08-29 Method for preventing oxidation of heat-treated copper coatings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54110780A JPS5946310B2 (en) 1979-08-29 1979-08-29 Method for preventing oxidation of heat-treated copper coatings

Publications (2)

Publication Number Publication Date
JPS5635780A true JPS5635780A (en) 1981-04-08
JPS5946310B2 JPS5946310B2 (en) 1984-11-12

Family

ID=14544415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54110780A Expired JPS5946310B2 (en) 1979-08-29 1979-08-29 Method for preventing oxidation of heat-treated copper coatings

Country Status (1)

Country Link
JP (1) JPS5946310B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188350U (en) * 1983-06-02 1984-12-13 石川ガスケツト株式会社 Local high density gasket
JPS59188954U (en) * 1983-05-31 1984-12-14 石野ガスケツト工業株式会社 cylinder head gasket
JPS6010693A (en) * 1983-06-30 1985-01-19 石井　銀弥 Printed circuit board
JPS6026728U (en) * 1983-07-30 1985-02-23 松下電工株式会社 waterproof packing
JPS6075791U (en) * 1983-10-31 1985-05-27 ジヤパンゴアテツクス株式会社 Piping seal forming material
JPH0483977A (en) * 1990-07-26 1992-03-17 Nippon Pillar Packing Co Ltd Gasket and manufacture thereof
JPH08233109A (en) * 1996-02-13 1996-09-10 Nippon Pillar Packing Co Ltd Gasket
JP2013141016A (en) * 2007-02-19 2013-07-18 Semblant Ltd Printed circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188954U (en) * 1983-05-31 1984-12-14 石野ガスケツト工業株式会社 cylinder head gasket
JPH0117639Y2 (en) * 1983-05-31 1989-05-23
JPS59188350U (en) * 1983-06-02 1984-12-13 石川ガスケツト株式会社 Local high density gasket
JPH0334517Y2 (en) * 1983-06-02 1991-07-22
JPS6010693A (en) * 1983-06-30 1985-01-19 石井　銀弥 Printed circuit board
JPS6026728U (en) * 1983-07-30 1985-02-23 松下電工株式会社 waterproof packing
JPS6075791U (en) * 1983-10-31 1985-05-27 ジヤパンゴアテツクス株式会社 Piping seal forming material
JPH0245594Y2 (en) * 1983-10-31 1990-12-03
JPH0483977A (en) * 1990-07-26 1992-03-17 Nippon Pillar Packing Co Ltd Gasket and manufacture thereof
JPH08233109A (en) * 1996-02-13 1996-09-10 Nippon Pillar Packing Co Ltd Gasket
JP2013141016A (en) * 2007-02-19 2013-07-18 Semblant Ltd Printed circuit board

Also Published As

Publication number Publication date
JPS5946310B2 (en) 1984-11-12

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