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JPS5632722A - Ion implanting apparatus - Google Patents

Ion implanting apparatus

Info

Publication number
JPS5632722A
JPS5632722A JP10722579A JP10722579A JPS5632722A JP S5632722 A JPS5632722 A JP S5632722A JP 10722579 A JP10722579 A JP 10722579A JP 10722579 A JP10722579 A JP 10722579A JP S5632722 A JPS5632722 A JP S5632722A
Authority
JP
Japan
Prior art keywords
slit
electromagnet
strength
magnetic field
specific type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10722579A
Other languages
Japanese (ja)
Inventor
Toshimichi Taya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10722579A priority Critical patent/JPS5632722A/en
Publication of JPS5632722A publication Critical patent/JPS5632722A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To implant ions highly accurately by moving the position of a collector slit in response to the variation of the strength of the magnetic field of the electromagnet which is used for mass separation. CONSTITUTION:An ion beam 2, which is generated in an ion source 1, is accelerated, and is separated by a mass seperating electromagnet 3. The beam 2 of the only specific type of the ions passes a slit 4. If the strength of the magnetic field of the electromagnet 3 is slowly varied, the beam 2 moves laterally. If the slit 4 is moved at the same time, only the specific type of beam can be always passed. When the specific type of beam which has passed the slit in this way strikes the disk 8 which is rotating at a specified location, the beam scans targets 7 which are arranged at the location whose rotating diameter is the same as that of the disk 8. If a step motor 10 which moves on the slit 4 and the scanning power supply which varies the strength of the magnetic field of the electromagnet are electrically correlated, the highly accurate implantation which is structurally stable can be performed.
JP10722579A 1979-08-24 1979-08-24 Ion implanting apparatus Pending JPS5632722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10722579A JPS5632722A (en) 1979-08-24 1979-08-24 Ion implanting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10722579A JPS5632722A (en) 1979-08-24 1979-08-24 Ion implanting apparatus

Publications (1)

Publication Number Publication Date
JPS5632722A true JPS5632722A (en) 1981-04-02

Family

ID=14453657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10722579A Pending JPS5632722A (en) 1979-08-24 1979-08-24 Ion implanting apparatus

Country Status (1)

Country Link
JP (1) JPS5632722A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130605U (en) * 1981-02-10 1982-08-14
JPS61113765A (en) * 1984-11-09 1986-05-31 Nissin Electric Co Ltd End station for ion implanting apparatus
JPS6396855A (en) * 1986-10-13 1988-04-27 Hitachi Ltd Ion implanting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130605U (en) * 1981-02-10 1982-08-14
JPS61113765A (en) * 1984-11-09 1986-05-31 Nissin Electric Co Ltd End station for ion implanting apparatus
JPS6396855A (en) * 1986-10-13 1988-04-27 Hitachi Ltd Ion implanting device

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