JPS5621320A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5621320A JPS5621320A JP9641979A JP9641979A JPS5621320A JP S5621320 A JPS5621320 A JP S5621320A JP 9641979 A JP9641979 A JP 9641979A JP 9641979 A JP9641979 A JP 9641979A JP S5621320 A JPS5621320 A JP S5621320A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- covers
- silicon nitride
- films
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- -1 Nitrogen ions Chemical class 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000005224 laser annealing Methods 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000005360 phosphosilicate glass Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To make a fine pattern by a silicon nitride film, which covers an electrode contact window making portion, and to prevent the horizontal extension of a source and a drain regions, by irradiating a laser beam to produce the silicon nitride film. CONSTITUTION:An Si gate electrode 4, a gate insulating film 3, an n<+>-type source region 5 and an n<+>-type drain region 6 are produced on an p-type Si substrate 1. Nitrogen ions are injected. The laser beam is selectively irradiated upon the portion wherein the electrode contact window is to be provided, thereby producing the silicon nitride films 7, 7'. An insulating film 8, which covers the electrode 4, and another insulating film 3', which covers the exposed surface of the substrate 1, are produced by thermal oxidation. The films 7, 7' are removed to manufacture a phosphosilicate glass film 9, a source electrode 10 and a drain electrode 11. Since the films 7, 7' are made by ion injection and laser annealing, the fine pattern can be manufactured and the horizontal extension of the regions 5, 6 is prevented. This results in making the device compact.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9641979A JPS5621320A (en) | 1979-07-28 | 1979-07-28 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9641979A JPS5621320A (en) | 1979-07-28 | 1979-07-28 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5621320A true JPS5621320A (en) | 1981-02-27 |
Family
ID=14164450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9641979A Pending JPS5621320A (en) | 1979-07-28 | 1979-07-28 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5621320A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586126A (en) * | 1981-07-03 | 1983-01-13 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS61500687A (en) * | 1983-12-10 | 1986-04-10 | バツテレ デベロプメント コ−ポレ−シヨン | Method for detecting bis-(2-chloroethyl)-sulfide or bis-(2-chloroethyl)-imine |
US4897368A (en) * | 1987-05-21 | 1990-01-30 | Matsushita Electric Industrial Co., Ltd. | Method of fabricating a polycidegate employing nitrogen/oxygen implantation |
WO1993000581A1 (en) * | 1991-06-26 | 1993-01-07 | United Kingdom Atomic Energy Authority | Gas sensor |
US6706576B1 (en) * | 2002-03-14 | 2004-03-16 | Advanced Micro Devices, Inc. | Laser thermal annealing of silicon nitride for increased density and etch selectivity |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5235595A (en) * | 1975-09-13 | 1977-03-18 | Matsushita Electric Works Ltd | Moving object detection system |
JPS5235596A (en) * | 1975-09-12 | 1977-03-18 | Hitachi Ltd | Burglar watch system |
-
1979
- 1979-07-28 JP JP9641979A patent/JPS5621320A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5235596A (en) * | 1975-09-12 | 1977-03-18 | Hitachi Ltd | Burglar watch system |
JPS5235595A (en) * | 1975-09-13 | 1977-03-18 | Matsushita Electric Works Ltd | Moving object detection system |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586126A (en) * | 1981-07-03 | 1983-01-13 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH0330293B2 (en) * | 1981-07-03 | 1991-04-26 | ||
JPS61500687A (en) * | 1983-12-10 | 1986-04-10 | バツテレ デベロプメント コ−ポレ−シヨン | Method for detecting bis-(2-chloroethyl)-sulfide or bis-(2-chloroethyl)-imine |
US4897368A (en) * | 1987-05-21 | 1990-01-30 | Matsushita Electric Industrial Co., Ltd. | Method of fabricating a polycidegate employing nitrogen/oxygen implantation |
WO1993000581A1 (en) * | 1991-06-26 | 1993-01-07 | United Kingdom Atomic Energy Authority | Gas sensor |
GB2271643A (en) * | 1991-06-26 | 1994-04-20 | Atomic Energy Authority Uk | Gas sensor |
GB2271643B (en) * | 1991-06-26 | 1994-08-24 | Atomic Energy Authority Uk | Gas sensor |
US6706576B1 (en) * | 2002-03-14 | 2004-03-16 | Advanced Micro Devices, Inc. | Laser thermal annealing of silicon nitride for increased density and etch selectivity |
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