[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS56135075A - Nozzle plate - Google Patents

Nozzle plate

Info

Publication number
JPS56135075A
JPS56135075A JP3739680A JP3739680A JPS56135075A JP S56135075 A JPS56135075 A JP S56135075A JP 3739680 A JP3739680 A JP 3739680A JP 3739680 A JP3739680 A JP 3739680A JP S56135075 A JPS56135075 A JP S56135075A
Authority
JP
Japan
Prior art keywords
end edge
ejecting end
ejecting
section
nozzle plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3739680A
Other languages
Japanese (ja)
Inventor
Tamio Ohori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP3739680A priority Critical patent/JPS56135075A/en
Publication of JPS56135075A publication Critical patent/JPS56135075A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

PURPOSE:To reinforce an ejecting end edge and prevent the deformation, etc. of an ejecting port due to the breaking of the ejecting end edge by bevelling the ejecting end edge, a section thereof is a knife edge-shaped, in a nozzle plate mounted to an ink injecting head. CONSTITUTION:A substrate 1, to both surfaces thereof silicon oxide films are formed and to one surface thereof a corrosion window conforming to a nozzle hole pattern is made up, is immersed in an anisotropic etching liquid, a pyramidal corrosion hole is built up from the corrosion window, a nozzle hole 2, a section of an ejecting end edge 3 of an ejecting port 2a thereof is knife edge-shaped, is formed and the nozzle plate is immersed in an etching liquid, volume ratio thereof is, for example, hydrofluoric acid:nitric acid:acetic acid=1:4:3, for a fixed time. Thus, the ejecting end edge 3 is corroded at speed faster than the surface of the substrate 1 and the surface of a circumferential wall of the nozzle hole, the ejecting end edge 3 is bevelled and the ejecting end edge 4, a section thereof is rounded, is made up.
JP3739680A 1980-03-26 1980-03-26 Nozzle plate Pending JPS56135075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3739680A JPS56135075A (en) 1980-03-26 1980-03-26 Nozzle plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3739680A JPS56135075A (en) 1980-03-26 1980-03-26 Nozzle plate

Publications (1)

Publication Number Publication Date
JPS56135075A true JPS56135075A (en) 1981-10-22

Family

ID=12496361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3739680A Pending JPS56135075A (en) 1980-03-26 1980-03-26 Nozzle plate

Country Status (1)

Country Link
JP (1) JPS56135075A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5489065A (en) * 1994-06-30 1996-02-06 Siemens Automotive L.P. Thin disk orifice member for fuel injector
WO1998051506A1 (en) 1997-05-14 1998-11-19 Seiko Epson Corporation Method of forming nozzle for injectors and method of manufacturing ink jet head
US8485640B2 (en) 2007-06-18 2013-07-16 Seiko Epson Corporation Nozzle plate, droplet discharge head, method for manufacturing the same and droplet discharge device
US8820889B2 (en) 2008-09-30 2014-09-02 Fujifilm Corporation Maintenance method of liquid ejection head and liquid ejection apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5489065A (en) * 1994-06-30 1996-02-06 Siemens Automotive L.P. Thin disk orifice member for fuel injector
WO1998051506A1 (en) 1997-05-14 1998-11-19 Seiko Epson Corporation Method of forming nozzle for injectors and method of manufacturing ink jet head
US6375858B1 (en) 1997-05-14 2002-04-23 Seiko Epson Corporation Method of forming nozzle for injection device and method of manufacturing inkjet head
US6863375B2 (en) 1997-05-14 2005-03-08 Seiko Epson Corporation Ejection device and inkjet head with silicon nozzle plate
US8485640B2 (en) 2007-06-18 2013-07-16 Seiko Epson Corporation Nozzle plate, droplet discharge head, method for manufacturing the same and droplet discharge device
US8820889B2 (en) 2008-09-30 2014-09-02 Fujifilm Corporation Maintenance method of liquid ejection head and liquid ejection apparatus

Similar Documents

Publication Publication Date Title
Bassous et al. The fabrication of high precision nozzles by the anisotropic etching of (100) silicon
US4957592A (en) Method of using erodable masks to produce partially etched structures in ODE wafer structures
CN101327682B (en) Nozzle plate, droplet discharge head, method for manufacturing the same and droplet discharge device
US6557967B1 (en) Method for making ink-jet printer nozzles
JPS56114319A (en) Method for forming contact hole
JPS56135075A (en) Nozzle plate
JPS5687666A (en) Plasma etching method
JP3525612B2 (en) Method of processing silicon wafer and electronic device using the silicon wafer
JPS56142071A (en) Ink jet nozzle plate
JPS55130839A (en) Uniform etching method of article
Sooriakumar et al. A comparative study of wet vs. dry isotropic etch to strengthen silicon micro-machined pressure sensor
Vangbo et al. Terracing of (100) Si with one mask and one etching step using misaligned V-grooves
JPS5459083A (en) Double-sided pattern forming method for semiconductor wafer
JPS56126460A (en) Nozzle plate for liquid injection
JPS56162523A (en) Elastic surface wave device
US6620331B1 (en) Method of etching an opening
JPS5595339A (en) Preparation of semiconductor device
JPH038947B2 (en)
JPS5710936A (en) Forming method for contact hole
JPS57137472A (en) Etching method for polycrystalline silicon
JPS57168838A (en) Manufacture of fine nozzle
JPS54137975A (en) Etching method of silicon substrate
JPS57100734A (en) Etching method for semiconductor substrate
KR100212722B1 (en) Thin film etching method
JPS5548933A (en) Forming of mesa groove