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JPS56129348A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56129348A
JPS56129348A JP3252880A JP3252880A JPS56129348A JP S56129348 A JPS56129348 A JP S56129348A JP 3252880 A JP3252880 A JP 3252880A JP 3252880 A JP3252880 A JP 3252880A JP S56129348 A JPS56129348 A JP S56129348A
Authority
JP
Japan
Prior art keywords
layer
printed
metallized
layers
high reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3252880A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3252880A priority Critical patent/JPS56129348A/en
Publication of JPS56129348A publication Critical patent/JPS56129348A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To obtain the cheaper device with high reliability by an arrangement wherein capacitors are formed between the laminated layers of a ceramic substrate in a sandwich structure where an oxide dielectric layer is interposed between metal layers. CONSTITUTION:A W metallized layer 13b is printed at the first layer of a ceramic substrate 1b, one end of which is connected with an external lead 15b and the other end of which is connected with other lead. Then, an oxcide dielectric layer 14b is printed on the W metallized layer 13b and another metallized layer 13b is printed thereon. Next, similar printing is effected at the second layer of the substrate 1b and both terminals thereof are connected in parallel with respect to the metallized layers of the first layer. After forming the similar laminated layers in the desired number and then calcinating, an IC chip 2b is mounted on a mount portion 3b of thus obtained package. In such a manner, by laminating a plurality of sandwich structures, it becomes possible to freely change the electrostatic capacity and to obtain the cheaper device with high reliability.
JP3252880A 1980-03-14 1980-03-14 Semiconductor device Pending JPS56129348A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3252880A JPS56129348A (en) 1980-03-14 1980-03-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3252880A JPS56129348A (en) 1980-03-14 1980-03-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56129348A true JPS56129348A (en) 1981-10-09

Family

ID=12361439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3252880A Pending JPS56129348A (en) 1980-03-14 1980-03-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56129348A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994856A (en) * 1982-11-24 1984-05-31 Matsushita Electric Ind Co Ltd Composite circuit device and mounting method thereof
FR2550009A1 (en) * 1983-07-29 1985-02-01 Inf Milit Spatiale Aeronaut ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR
EP0145694A2 (en) * 1983-12-14 1985-06-19 Jean-Marie Bonameau Protection device against the perturbations and/or interferences in the vicinity of integrated circuits
JPS60148148A (en) * 1984-01-13 1985-08-05 Nec Corp Semiconductor device
US4714952A (en) * 1984-11-01 1987-12-22 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
FR2609841A1 (en) * 1987-01-20 1988-07-22 Toshiba Kk SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
JPH0513066U (en) * 1991-07-26 1993-02-19 京セラ株式会社 Package for storing semiconductor devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994856A (en) * 1982-11-24 1984-05-31 Matsushita Electric Ind Co Ltd Composite circuit device and mounting method thereof
FR2550009A1 (en) * 1983-07-29 1985-02-01 Inf Milit Spatiale Aeronaut ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR
US4654694A (en) * 1983-07-29 1987-03-31 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electronic component box supplied with a capacitor
EP0145694A2 (en) * 1983-12-14 1985-06-19 Jean-Marie Bonameau Protection device against the perturbations and/or interferences in the vicinity of integrated circuits
JPS60148148A (en) * 1984-01-13 1985-08-05 Nec Corp Semiconductor device
JPH0160941B2 (en) * 1984-01-13 1989-12-26 Nippon Electric Co
US4714952A (en) * 1984-11-01 1987-12-22 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
FR2609841A1 (en) * 1987-01-20 1988-07-22 Toshiba Kk SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
JPH0513066U (en) * 1991-07-26 1993-02-19 京セラ株式会社 Package for storing semiconductor devices

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