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JPS56111292A - Resist capable of screen printing with high resolution - Google Patents

Resist capable of screen printing with high resolution

Info

Publication number
JPS56111292A
JPS56111292A JP251380A JP251380A JPS56111292A JP S56111292 A JPS56111292 A JP S56111292A JP 251380 A JP251380 A JP 251380A JP 251380 A JP251380 A JP 251380A JP S56111292 A JPS56111292 A JP S56111292A
Authority
JP
Japan
Prior art keywords
high resolution
screen printing
resist capable
resist
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP251380A
Other languages
Japanese (ja)
Other versions
JPH023431B2 (en
Inventor
Jiei Riichi Edowaado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS56111292A publication Critical patent/JPS56111292A/en
Publication of JPH023431B2 publication Critical patent/JPH023431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP251380A 1979-01-12 1980-01-12 Resist capable of screen printing with high resolution Granted JPS56111292A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US309979A 1979-01-12 1979-01-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1112773A Division JPH027492A (en) 1979-01-12 1989-05-01 Manufacture of printed circuit boand

Publications (2)

Publication Number Publication Date
JPS56111292A true JPS56111292A (en) 1981-09-02
JPH023431B2 JPH023431B2 (en) 1990-01-23

Family

ID=21704138

Family Applications (2)

Application Number Title Priority Date Filing Date
JP251380A Granted JPS56111292A (en) 1979-01-12 1980-01-12 Resist capable of screen printing with high resolution
JP1112773A Granted JPH027492A (en) 1979-01-12 1989-05-01 Manufacture of printed circuit boand

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1112773A Granted JPH027492A (en) 1979-01-12 1989-05-01 Manufacture of printed circuit boand

Country Status (3)

Country Link
JP (2) JPS56111292A (en)
GB (1) GB2071668B (en)
IT (1) IT1218426B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138090A (en) * 1982-02-12 1983-08-16 株式会社日立製作所 Method of producing printed circuit board
JPH027492A (en) * 1979-01-12 1990-01-11 Kollmorgen Technol Corp Manufacture of printed circuit boand
JP2006344921A (en) * 2005-05-12 2006-12-21 Maruwa Seisakusho:Kk Manufacturing method for printed circuit board
JP2019081902A (en) * 2018-12-21 2019-05-30 株式会社巴川製紙所 Resin composition, adhesive tape, method for producing resin composition, and method for producing adhesive tape

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101601095B1 (en) 2013-12-31 2016-03-09 현대자동차 주식회사 Thermal insulation coating composition and thermal insulation coating layer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111292A (en) * 1979-01-12 1981-09-02 Kollmorgen Tech Corp Resist capable of screen printing with high resolution

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027492A (en) * 1979-01-12 1990-01-11 Kollmorgen Technol Corp Manufacture of printed circuit boand
JPH0345557B2 (en) * 1979-01-12 1991-07-11 Kollmorgen Tech Corp
JPS58138090A (en) * 1982-02-12 1983-08-16 株式会社日立製作所 Method of producing printed circuit board
JP2006344921A (en) * 2005-05-12 2006-12-21 Maruwa Seisakusho:Kk Manufacturing method for printed circuit board
JP4520392B2 (en) * 2005-05-12 2010-08-04 株式会社丸和製作所 Printed circuit board manufacturing method
JP2019081902A (en) * 2018-12-21 2019-05-30 株式会社巴川製紙所 Resin composition, adhesive tape, method for producing resin composition, and method for producing adhesive tape

Also Published As

Publication number Publication date
GB2071668A (en) 1981-09-23
JPH027492A (en) 1990-01-11
IT8047586A0 (en) 1980-01-14
JPH023431B2 (en) 1990-01-23
GB2071668B (en) 1983-10-12
JPH0345557B2 (en) 1991-07-11
IT1218426B (en) 1990-04-19

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