JPS5599923A - Photo-setting resin composition for coating hybrid integrated circuit - Google Patents
Photo-setting resin composition for coating hybrid integrated circuitInfo
- Publication number
- JPS5599923A JPS5599923A JP841579A JP841579A JPS5599923A JP S5599923 A JPS5599923 A JP S5599923A JP 841579 A JP841579 A JP 841579A JP 841579 A JP841579 A JP 841579A JP S5599923 A JPS5599923 A JP S5599923A
- Authority
- JP
- Japan
- Prior art keywords
- group
- monofunctional
- photo
- integrated circuit
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Silicon Polymers (AREA)
Abstract
PURPOSE: The title composition capable of forming cured resin articles having improved electrical properties, heat resistance, and moisture-resistant adhesion, comprising a specific acryloyloxy group-containing organopolysiloxane, an addition- polymerizable monomer, an epoxy compound, and a photosensitizer.
CONSTITUTION: A composition comprising (A) 100pts.wt. of an acryloyloxy group- containing organopolysiloxane of formula I [R1 is bifunctional hydrocarbon group; R2 is monofunctional hydrocarbon group; at least one of X's is monofunctional group of formula II (R3 is H or 1W4C alkyl group; R4 is bifunctional hydrocarbon group); the rest are H; n is 0 or an integer 1W4; 0<a≤3, 0≤b<3, 0< a+b≤3], (B) 5W200pts.wt. of an addition-polymerizable monomer having a monofunctional group of formula III (R5 is H or 1W4C alkyl group) and a boiling point ≥100°C under normal pressure, (C) 0.01W50pts.wt. of an epoxy compound having one or more epoxy groups in one molecule, and (D) 0.01W10pts.wt. of a photosensitizer.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP841579A JPS5599923A (en) | 1979-01-26 | 1979-01-26 | Photo-setting resin composition for coating hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP841579A JPS5599923A (en) | 1979-01-26 | 1979-01-26 | Photo-setting resin composition for coating hybrid integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5599923A true JPS5599923A (en) | 1980-07-30 |
JPS612084B2 JPS612084B2 (en) | 1986-01-22 |
Family
ID=11692498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP841579A Granted JPS5599923A (en) | 1979-01-26 | 1979-01-26 | Photo-setting resin composition for coating hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5599923A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63218744A (en) * | 1987-03-06 | 1988-09-12 | Toyo Ink Mfg Co Ltd | Plastic coating agent curable by actinic energy radiation |
JP2010229382A (en) * | 2009-02-19 | 2010-10-14 | Sanei Kagaku Kk | Si-BASED RESIN COMPOUNDED CURABLE RESIN COMPOSITION |
-
1979
- 1979-01-26 JP JP841579A patent/JPS5599923A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63218744A (en) * | 1987-03-06 | 1988-09-12 | Toyo Ink Mfg Co Ltd | Plastic coating agent curable by actinic energy radiation |
JPH0615631B2 (en) * | 1987-03-06 | 1994-03-02 | 東洋インキ製造株式会社 | Active energy ray-curable coating agent for plastics |
JP2010229382A (en) * | 2009-02-19 | 2010-10-14 | Sanei Kagaku Kk | Si-BASED RESIN COMPOUNDED CURABLE RESIN COMPOSITION |
Also Published As
Publication number | Publication date |
---|---|
JPS612084B2 (en) | 1986-01-22 |
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