JPS5594491A - Forming method for thick minute metal pattern - Google Patents
Forming method for thick minute metal patternInfo
- Publication number
- JPS5594491A JPS5594491A JP247279A JP247279A JPS5594491A JP S5594491 A JPS5594491 A JP S5594491A JP 247279 A JP247279 A JP 247279A JP 247279 A JP247279 A JP 247279A JP S5594491 A JPS5594491 A JP S5594491A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- ultraviolet rays
- coated
- thickness
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To form the above mentioned minute and highly precise pattern, by forming the pattern by remote ultraviolet rays exposing method applying a specific thickness resist layer on conductive metal thin layer coated on the substrate and carrying out electroplating of pattern opening part.
CONSTITUTION: The conductive metal thin film 12, such as Au, etc., is coated on the subsrate 11 and the resist layer 13 having the thickness of 0.5μ or more, is applied on the film 12. Mask for remote ultraviolet rays exposure formed a fixed pattern 102 composed of thin film of light shielding substance on the surface of the substrate 101 made of the material, such as quartz or sapphire, transmitting the remote ultraviolet rays thoroughly by electron beam exposure method, is arranged so as to be contacted the pattern 102 with the resist layer 13. The pattern 102 is transferred on the layer 13 by irradiating the remote ultraviolet rays and the resist pattern 13' is formed through developing process. Metal is coated at the thickness of 0.5μ or more by electroplating method making the pattern 13' as the mask and the thick minute metal pattern 14 is obtained removing the pattern 13'.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP247279A JPS5594491A (en) | 1979-01-10 | 1979-01-10 | Forming method for thick minute metal pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP247279A JPS5594491A (en) | 1979-01-10 | 1979-01-10 | Forming method for thick minute metal pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5594491A true JPS5594491A (en) | 1980-07-17 |
Family
ID=11530254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP247279A Pending JPS5594491A (en) | 1979-01-10 | 1979-01-10 | Forming method for thick minute metal pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5594491A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106521583A (en) * | 2016-11-22 | 2017-03-22 | 宁波康强电子股份有限公司 | Electroplating method of lead frame |
| CN107190307A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating anode device |
| CN107190306A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating system |
-
1979
- 1979-01-10 JP JP247279A patent/JPS5594491A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107190307A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating anode device |
| CN107190306A (en) * | 2016-03-15 | 2017-09-22 | 先丰通讯股份有限公司 | Electroplating system |
| CN106521583A (en) * | 2016-11-22 | 2017-03-22 | 宁波康强电子股份有限公司 | Electroplating method of lead frame |
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