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JPS5550021A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5550021A
JPS5550021A JP12388378A JP12388378A JPS5550021A JP S5550021 A JPS5550021 A JP S5550021A JP 12388378 A JP12388378 A JP 12388378A JP 12388378 A JP12388378 A JP 12388378A JP S5550021 A JPS5550021 A JP S5550021A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
acid
compounding
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12388378A
Other languages
Japanese (ja)
Inventor
Kunihito Sakai
Fumihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12388378A priority Critical patent/JPS5550021A/en
Publication of JPS5550021A publication Critical patent/JPS5550021A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide an epoxy resin composition giving a colorless and clear cured article which keeps its colorlessness even after the long-term thermal aging, and useful for the encapsulation of a silicon photo-diode, by compounding an epoxy resin with an imidazole derivative and a carboxylic acid.
CONSTITUTION: The title resin composition is prepared by compounding (A) 100 parts by weight of an epoxy resin with (B) ≥0.1 part of additives composed of (a) an imidazole derivative such as 2-methylimidazole, and (b) a carboxylic acid such as acetic acid and caproic acid. The epoxy resin is pref. a bisphenol-type one, and is cured by with acid anhydride-type curing agent or an amine-type curing agent.
COPYRIGHT: (C)1980,JPO&Japio
JP12388378A 1978-10-07 1978-10-07 Epoxy resin composition Pending JPS5550021A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12388378A JPS5550021A (en) 1978-10-07 1978-10-07 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12388378A JPS5550021A (en) 1978-10-07 1978-10-07 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5550021A true JPS5550021A (en) 1980-04-11

Family

ID=14871718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12388378A Pending JPS5550021A (en) 1978-10-07 1978-10-07 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5550021A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7474009B2 (en) * 2004-12-30 2009-01-06 Henkel Corporation Optoelectronic molding compound that transmits visible light and blocks infrared light
KR20190035904A (en) * 2016-08-15 2019-04-03 에보니크 데구사 게엠베하 Anhydride Epoxy Curing Agent with Imidazole Salt Additives for Epoxy Resin Systems
JP2020501000A (en) * 2016-12-12 2020-01-16 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ A novel low temperature acid anhydride epoxy curing system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7474009B2 (en) * 2004-12-30 2009-01-06 Henkel Corporation Optoelectronic molding compound that transmits visible light and blocks infrared light
KR20190035904A (en) * 2016-08-15 2019-04-03 에보니크 데구사 게엠베하 Anhydride Epoxy Curing Agent with Imidazole Salt Additives for Epoxy Resin Systems
JP2019524967A (en) * 2016-08-15 2019-09-05 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ Acid anhydride epoxy curing agent containing imidazole salt additive for epoxy resin system
JP2020501000A (en) * 2016-12-12 2020-01-16 エボニック デグサ ゲーエムベーハーＥｖｏｎｉｋ Ｄｅｇｕｓｓａ ＧｍｂＨ A novel low temperature acid anhydride epoxy curing system
US11286336B2 (en) 2016-12-12 2022-03-29 Evonik Operations Gmbh Low temperature anhydride epoxy cured systems

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