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JPS5521536A - Method of forming partial nickel layer - Google Patents

Method of forming partial nickel layer

Info

Publication number
JPS5521536A
JPS5521536A JP9348778A JP9348778A JPS5521536A JP S5521536 A JPS5521536 A JP S5521536A JP 9348778 A JP9348778 A JP 9348778A JP 9348778 A JP9348778 A JP 9348778A JP S5521536 A JPS5521536 A JP S5521536A
Authority
JP
Japan
Prior art keywords
layer
nickel
exposed
copper plated
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9348778A
Other languages
Japanese (ja)
Other versions
JPS586794B2 (en
Inventor
Junichi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP53093487A priority Critical patent/JPS586794B2/en
Publication of JPS5521536A publication Critical patent/JPS5521536A/en
Publication of JPS586794B2 publication Critical patent/JPS586794B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To form a nickel layer of predetermined thickness at required portion of an article to be plated by plating first copper plated layer and nickel electroplated layer thereon on the entire surface and plating second copper plated layer on the predetermined portion as a mask to thereby remove the exposed copper layer on the exposed nickel layer.
CONSTITUTION: A nickel striken plated layer 45 is formed, for example, on the entire surface of an Fe-Cr alloy wire 40. Then, the first copper plated layer 46 of 10W15μ of thickness is formed on the entire upper surface of the layer 45. A nickel electroplated layer 47 of 8W10μ of thickness is formed on the entire upper surface of the layer 46. Then, the second copper plated layers 48, 48 of 1W3μ of thickness are coated on the predetermined portion on the layer 47. It is then dipped in alkaline solution of aromatic nitro compound containing amine compound to thereby selectively remove the exposed nickel plated layer 47. Then, it is dipped in an ammonia alkaline oxidizer solution to thereby remove the second copper plated layers 48, 48 and exposed the first copper plated layer 46. Then, it is removed from the exposed nickel layer 45 with acid, and treated selectively with Cr oxidation treatment.
COPYRIGHT: (C)1980,JPO&Japio
JP53093487A 1978-07-31 1978-07-31 Method of forming partial nickel layer Expired JPS586794B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53093487A JPS586794B2 (en) 1978-07-31 1978-07-31 Method of forming partial nickel layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53093487A JPS586794B2 (en) 1978-07-31 1978-07-31 Method of forming partial nickel layer

Publications (2)

Publication Number Publication Date
JPS5521536A true JPS5521536A (en) 1980-02-15
JPS586794B2 JPS586794B2 (en) 1983-02-07

Family

ID=14083691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53093487A Expired JPS586794B2 (en) 1978-07-31 1978-07-31 Method of forming partial nickel layer

Country Status (1)

Country Link
JP (1) JPS586794B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201794A (en) * 1985-03-01 1986-09-06 Tsukada Riken Kogyo Kk Partial plating method
JPS61201793A (en) * 1985-03-01 1986-09-06 Tsukada Riken Kogyo Kk Partial plating method
US6006627A (en) * 1997-06-27 1999-12-28 Honda Giken Kogyo Kabushiki Kaisha Operation lever unit for engine-powered working machine
EP0967374A2 (en) 1998-06-26 1999-12-29 Honda Giken Kogyo Kabushiki Kaisha Operation-control lever unit for engine-powered working machine
WO2012108546A1 (en) * 2011-02-09 2012-08-16 大日本印刷株式会社 Stainless substrate with gold-plated layer, and method for forming partially gold-plated pattern on stainless substrate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201794A (en) * 1985-03-01 1986-09-06 Tsukada Riken Kogyo Kk Partial plating method
JPS61201793A (en) * 1985-03-01 1986-09-06 Tsukada Riken Kogyo Kk Partial plating method
US6006627A (en) * 1997-06-27 1999-12-28 Honda Giken Kogyo Kabushiki Kaisha Operation lever unit for engine-powered working machine
EP0967374A2 (en) 1998-06-26 1999-12-29 Honda Giken Kogyo Kabushiki Kaisha Operation-control lever unit for engine-powered working machine
US6209412B1 (en) 1998-06-26 2001-04-03 Honda Giken Kogyo Kabushiki Kaisha Operation-control lever unit for engine-powered working machine
WO2012108546A1 (en) * 2011-02-09 2012-08-16 大日本印刷株式会社 Stainless substrate with gold-plated layer, and method for forming partially gold-plated pattern on stainless substrate
JP5196086B2 (en) * 2011-02-09 2013-05-15 大日本印刷株式会社 Stainless steel substrate having gold plating layer and method of forming partial gold plating pattern on stainless steel substrate
US8828213B2 (en) 2011-02-09 2014-09-09 Dai Nippon Printing Co., Ltd. Stainless substrate having a gold-plating layer, and process of forming a partial gold-plating pattern on a stainless substrate
US10017862B2 (en) 2011-02-09 2018-07-10 Dai Nippon Printing Co., Ltd. Stainless substrate having a gold-plating layer, and process of forming a partial gold-plating pattern on a stainless substrate

Also Published As

Publication number Publication date
JPS586794B2 (en) 1983-02-07

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