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JPS551686B2 - - Google Patents

Info

Publication number
JPS551686B2
JPS551686B2 JP5010173A JP5010173A JPS551686B2 JP S551686 B2 JPS551686 B2 JP S551686B2 JP 5010173 A JP5010173 A JP 5010173A JP 5010173 A JP5010173 A JP 5010173A JP S551686 B2 JPS551686 B2 JP S551686B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5010173A
Other languages
Japanese (ja)
Other versions
JPS4961699A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4961699A publication Critical patent/JPS4961699A/ja
Publication of JPS551686B2 publication Critical patent/JPS551686B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electronic Switches (AREA)
JP5010173A 1972-05-05 1973-05-04 Expired JPS551686B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25077172A 1972-05-05 1972-05-05

Publications (2)

Publication Number Publication Date
JPS4961699A JPS4961699A (en) 1974-06-14
JPS551686B2 true JPS551686B2 (en) 1980-01-16

Family

ID=22949073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5010173A Expired JPS551686B2 (en) 1972-05-05 1973-05-04

Country Status (4)

Country Link
JP (1) JPS551686B2 (en)
CA (1) CA980886A (en)
DE (1) DE2321985A1 (en)
GB (1) GB1391375A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618448Y2 (en) * 1977-09-22 1981-04-30
JPS5486354A (en) * 1977-12-21 1979-07-09 Toyo Dengu Seisakushiyo Kk Thermal printing head
GB2131624B (en) * 1982-12-09 1986-07-09 Standard Telephones Cables Ltd Thick film circuits
DE3328852A1 (en) * 1983-08-10 1985-02-28 Robert Bosch Gmbh, 7000 Stuttgart DEVICE FOR MEASURING THE MASS OF A FLOWING MEDIUM
JP2699381B2 (en) * 1987-04-28 1998-01-19 富士ゼロックス株式会社 Manufacturing method of resistor
JP2569620B2 (en) * 1987-11-09 1997-01-08 富士ゼロックス株式会社 Manufacturing method of thermal head
DE4100865A1 (en) * 1991-01-14 1992-07-16 Siemens Ag Use of reactive substrate in thick film resistor mfr. - has thick dielectric layer acting as adhesion promoter and insulating layer, between resistor layer and substrate
DE19638732C2 (en) * 1996-09-10 2003-04-24 Siemens Ag Process for applying precision electrical resistors to a plastic circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3478191A (en) * 1967-01-23 1969-11-11 Sprague Electric Co Thermal print head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3478191A (en) * 1967-01-23 1969-11-11 Sprague Electric Co Thermal print head

Also Published As

Publication number Publication date
DE2321985A1 (en) 1973-11-15
JPS4961699A (en) 1974-06-14
CA980886A (en) 1975-12-30
GB1391375A (en) 1975-04-23

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