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JPS55143059A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS55143059A
JPS55143059A JP5196079A JP5196079A JPS55143059A JP S55143059 A JPS55143059 A JP S55143059A JP 5196079 A JP5196079 A JP 5196079A JP 5196079 A JP5196079 A JP 5196079A JP S55143059 A JPS55143059 A JP S55143059A
Authority
JP
Japan
Prior art keywords
electrodes
integrated circuit
same function
pellet
confronted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5196079A
Other languages
Japanese (ja)
Inventor
Masahiko Nakamae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5196079A priority Critical patent/JPS55143059A/en
Publication of JPS55143059A publication Critical patent/JPS55143059A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To arrange an integrated circuit three dimensionally having high density and high yield by a method wherein main faces of pellets formed with circuits divided into blocks are confronted with each other, and interior electrodes having same function are connected to the both sides of a lead wire and led out to outside. CONSTITUTION:A circuit constitution is divided into two blocks, and main faces of pellets 10, 20 constituting each block are confronted with each other. An interior electrode 11 of pellet 10 and an interior electrode 21 of pellet 20 are located in same position with an out lead wire 30 and are connected. The electrodes 11, 21 are the electrodes having same function. By this way, all electrodes having same function are connected with each other. Therefor the remarkably reduction of yield caused by various defects and the reduction of arrangement density accompanied by the increase of pellet size are removed, and a highly integrated circuit can be obtained.
JP5196079A 1979-04-26 1979-04-26 Integrated circuit device Pending JPS55143059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5196079A JPS55143059A (en) 1979-04-26 1979-04-26 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5196079A JPS55143059A (en) 1979-04-26 1979-04-26 Integrated circuit device

Publications (1)

Publication Number Publication Date
JPS55143059A true JPS55143059A (en) 1980-11-08

Family

ID=12901422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5196079A Pending JPS55143059A (en) 1979-04-26 1979-04-26 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPS55143059A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500905A (en) * 1981-09-30 1985-02-19 Tokyo Shibaura Denki Kabushiki Kaisha Stacked semiconductor device with sloping sides
JPH0341758A (en) * 1989-07-10 1991-02-22 Nec Corp Semiconductor integrated circuit device
US5701031A (en) * 1990-04-26 1997-12-23 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487173A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487173A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500905A (en) * 1981-09-30 1985-02-19 Tokyo Shibaura Denki Kabushiki Kaisha Stacked semiconductor device with sloping sides
JPH0341758A (en) * 1989-07-10 1991-02-22 Nec Corp Semiconductor integrated circuit device
US5701031A (en) * 1990-04-26 1997-12-23 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices
USRE37539E1 (en) 1990-04-26 2002-02-05 Hitachi, Ltd. Sealed stacked arrangement of semiconductor devices

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