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JPS55123131A - Exposer for mask alignment - Google Patents

Exposer for mask alignment

Info

Publication number
JPS55123131A
JPS55123131A JP3001179A JP3001179A JPS55123131A JP S55123131 A JPS55123131 A JP S55123131A JP 3001179 A JP3001179 A JP 3001179A JP 3001179 A JP3001179 A JP 3001179A JP S55123131 A JPS55123131 A JP S55123131A
Authority
JP
Japan
Prior art keywords
mask
wafer
temperature
gas
controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3001179A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP3001179A priority Critical patent/JPS55123131A/en
Publication of JPS55123131A publication Critical patent/JPS55123131A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To transfer or align fine patterns at high precision by controlling the temperature of a mask and an exposed matter independently each other. CONSTITUTION:An Si wafer 2 if controlled for temperature by heating from a support 1 and injection 9 of an N2 gas, a mask 4 is controlled for temperature by a device provided on a support 3 and injections 10, 11 of the N2 gas, thereby preventing independent temperature control systems of the mask 4 and the wafer 2 from exerting an influence each other by an air curtain given by a given temperature of N2 gas flow 8. After alignment of the mask and the wafer, a fine out-of-position between a mask pattern 5 and a pattern on the wafer surface is detected, temperatures of the wafer 2 and the mask 4 are changed independently according to the out- of-position, and then both are realigned accurately according to a very small amount of expansion or contraction. A precision transfer is now obtainable through exposing X ray 6.
JP3001179A 1979-03-16 1979-03-16 Exposer for mask alignment Pending JPS55123131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3001179A JPS55123131A (en) 1979-03-16 1979-03-16 Exposer for mask alignment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3001179A JPS55123131A (en) 1979-03-16 1979-03-16 Exposer for mask alignment

Publications (1)

Publication Number Publication Date
JPS55123131A true JPS55123131A (en) 1980-09-22

Family

ID=12291919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3001179A Pending JPS55123131A (en) 1979-03-16 1979-03-16 Exposer for mask alignment

Country Status (1)

Country Link
JP (1) JPS55123131A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112329A (en) * 1981-12-26 1983-07-04 Fujitsu Ltd Process of exposing resist film to x-rays
JPS58191433A (en) * 1982-05-04 1983-11-08 Fujitsu Ltd Method and device for roentgen-ray transfer
JPS5950439U (en) * 1982-09-27 1984-04-03 キヤノン株式会社 semiconductor exposure equipment
JPS62198122A (en) * 1986-02-26 1987-09-01 Hitachi Ltd Semiconductor processor
JPH01155622A (en) * 1987-12-14 1989-06-19 Canon Inc X-ray exposure and applicable mask
US5329126A (en) * 1991-03-22 1994-07-12 Canon Kabuhiki Kaisha Apparatus and process for vacuum-holding an object
US7252492B2 (en) * 2002-06-20 2007-08-07 Obducat Ab Devices and methods for aligning a stamp and a substrate
JP2013502063A (en) * 2009-08-11 2013-01-17 ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング Method and apparatus for maintaining a constant mask size
JP2015135871A (en) * 2014-01-16 2015-07-27 キヤノン株式会社 Holding device, lithographic device, and method of manufacturing article

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398782A (en) * 1976-12-29 1978-08-29 Fujitsu Ltd Positioning method for exposure unit
JPS53139980A (en) * 1977-05-11 1978-12-06 Philips Nv Method of and device for producing microminiature solid state device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398782A (en) * 1976-12-29 1978-08-29 Fujitsu Ltd Positioning method for exposure unit
JPS53139980A (en) * 1977-05-11 1978-12-06 Philips Nv Method of and device for producing microminiature solid state device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112329A (en) * 1981-12-26 1983-07-04 Fujitsu Ltd Process of exposing resist film to x-rays
JPS58191433A (en) * 1982-05-04 1983-11-08 Fujitsu Ltd Method and device for roentgen-ray transfer
JPS5950439U (en) * 1982-09-27 1984-04-03 キヤノン株式会社 semiconductor exposure equipment
JPS62198122A (en) * 1986-02-26 1987-09-01 Hitachi Ltd Semiconductor processor
JPH01155622A (en) * 1987-12-14 1989-06-19 Canon Inc X-ray exposure and applicable mask
US5329126A (en) * 1991-03-22 1994-07-12 Canon Kabuhiki Kaisha Apparatus and process for vacuum-holding an object
US5680428A (en) * 1991-03-22 1997-10-21 Canon Kabushiki Kaisha Process for holding an object
US7252492B2 (en) * 2002-06-20 2007-08-07 Obducat Ab Devices and methods for aligning a stamp and a substrate
JP2013502063A (en) * 2009-08-11 2013-01-17 ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング Method and apparatus for maintaining a constant mask size
JP2015135871A (en) * 2014-01-16 2015-07-27 キヤノン株式会社 Holding device, lithographic device, and method of manufacturing article

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