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JPS55121435A - Heat resistant photoresist composition and manufacture thereof - Google Patents

Heat resistant photoresist composition and manufacture thereof

Info

Publication number
JPS55121435A
JPS55121435A JP2940479A JP2940479A JPS55121435A JP S55121435 A JPS55121435 A JP S55121435A JP 2940479 A JP2940479 A JP 2940479A JP 2940479 A JP2940479 A JP 2940479A JP S55121435 A JPS55121435 A JP S55121435A
Authority
JP
Japan
Prior art keywords
meth
compound
photoresist composition
100pts
acrylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2940479A
Other languages
Japanese (ja)
Other versions
JPS6116970B2 (en
Inventor
Kaoru Omura
Takeo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP2940479A priority Critical patent/JPS55121435A/en
Publication of JPS55121435A publication Critical patent/JPS55121435A/en
Publication of JPS6116970B2 publication Critical patent/JPS6116970B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE: To excellently improve the insulating properties and heat resistance of a photoresist by using a specified polymer prepared by introducing acrylate groups into aromatic polyamidoimide, a compound having an ethylenic unsaturated double bond and a photopolymerization initiator as principal components.
CONSTITUTION: Organic solvent-soluble aromatic polyamidoimide having bonds at the 1- and 3-positions of its aromatic rings is reacted with (meth)acrylic acid chloride, glycidyl (meth)acrylate, (meth)acrylic acid or the like in the presence of an organic polar solvent such as N,N-dimethylacetoamide to obtain a polymer represented by the formula. 100pts.wt. of this polymer are blended with 0.1W 100pts.wt. of a compound having an ethylenic unsaturated double bond and 0.01W 20pts.wt. of a photopolymerization initiator such as a carbonyl compound. A solution of the resulting photoresist composition is coated onto a substrate with a roller or the like.
COPYRIGHT: (C)1980,JPO&Japio
JP2940479A 1979-03-15 1979-03-15 Heat resistant photoresist composition and manufacture thereof Granted JPS55121435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2940479A JPS55121435A (en) 1979-03-15 1979-03-15 Heat resistant photoresist composition and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2940479A JPS55121435A (en) 1979-03-15 1979-03-15 Heat resistant photoresist composition and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS55121435A true JPS55121435A (en) 1980-09-18
JPS6116970B2 JPS6116970B2 (en) 1986-05-02

Family

ID=12275192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2940479A Granted JPS55121435A (en) 1979-03-15 1979-03-15 Heat resistant photoresist composition and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS55121435A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470661A (en) * 1990-07-06 1992-03-05 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH0477741A (en) * 1990-07-20 1992-03-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH04130323A (en) * 1990-09-21 1992-05-01 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH11327135A (en) * 1998-05-20 1999-11-26 Fujitsu Ltd Photosensitive heat-resistant resin composition, method for forming pattern of heat-resistant insulating film using this composition, and patterned heat-resistant insulating film obtained by this method
JP2018521191A (en) * 2015-07-22 2018-08-02 サン ケミカル コーポレイション Printed circuit board ink

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470661A (en) * 1990-07-06 1992-03-05 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH0477741A (en) * 1990-07-20 1992-03-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH04130323A (en) * 1990-09-21 1992-05-01 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH11327135A (en) * 1998-05-20 1999-11-26 Fujitsu Ltd Photosensitive heat-resistant resin composition, method for forming pattern of heat-resistant insulating film using this composition, and patterned heat-resistant insulating film obtained by this method
JP2018521191A (en) * 2015-07-22 2018-08-02 サン ケミカル コーポレイション Printed circuit board ink

Also Published As

Publication number Publication date
JPS6116970B2 (en) 1986-05-02

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