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JPS55127041A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS55127041A
JPS55127041A JP3443479A JP3443479A JPS55127041A JP S55127041 A JPS55127041 A JP S55127041A JP 3443479 A JP3443479 A JP 3443479A JP 3443479 A JP3443479 A JP 3443479A JP S55127041 A JPS55127041 A JP S55127041A
Authority
JP
Japan
Prior art keywords
pellet
resin
header
peripheral edge
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3443479A
Other languages
Japanese (ja)
Inventor
Joga Imai
Satoru Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3443479A priority Critical patent/JPS55127041A/en
Publication of JPS55127041A publication Critical patent/JPS55127041A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To absorb an external force to be applied on a pellet peripheral edge and thus to keep the pellet from being applied with a large force by covering the pellet peripheral edge to which the external force to arise due to a difference in thermal conductivity is applied with a soft and easily deformable resin.
CONSTITUTION: A pellet 2 is fixed on the main surface of a header 1, and the top of the pellet 2 is covered with a soft coating resin 5. The resin 5 is then given thick on a peripheral edge of the pellet 2 on mounting hole 7 side of the header 1, thus forming a shock absorber 10. Further the inside edges of the pellet 2 and a lead 3 are covered with a hard coating resin 6. The resin 6 is then arranged to spread to a header end 9 on which the mounting hole 7 is not provided. According to this constitution, in case there occurs a thermal contraction phenomenon to have the resin 6 move in the direction of the header end along the header surface, the shock absorber 10 is pushed and crushed by the resin 6, and hence the pellet edge is prevented from being applied with a large force.
COPYRIGHT: (C)1980,JPO&Japio
JP3443479A 1979-03-26 1979-03-26 Resin-sealed semiconductor device Pending JPS55127041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3443479A JPS55127041A (en) 1979-03-26 1979-03-26 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3443479A JPS55127041A (en) 1979-03-26 1979-03-26 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS55127041A true JPS55127041A (en) 1980-10-01

Family

ID=12414107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3443479A Pending JPS55127041A (en) 1979-03-26 1979-03-26 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS55127041A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2229859A (en) * 1988-05-02 1990-10-03 Nippon Steel Corp Roll surface cutting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2229859A (en) * 1988-05-02 1990-10-03 Nippon Steel Corp Roll surface cutting method

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