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JPS5510326A - Setting method of brazing material for member to be brazed - Google Patents

Setting method of brazing material for member to be brazed

Info

Publication number
JPS5510326A
JPS5510326A JP8292478A JP8292478A JPS5510326A JP S5510326 A JPS5510326 A JP S5510326A JP 8292478 A JP8292478 A JP 8292478A JP 8292478 A JP8292478 A JP 8292478A JP S5510326 A JPS5510326 A JP S5510326A
Authority
JP
Japan
Prior art keywords
liquid
brazing material
work
powder
brazed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8292478A
Other languages
Japanese (ja)
Other versions
JPS5622424B2 (en
Inventor
Toshio Kumagai
Tamio Furuya
Yasuo Hirokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP8292478A priority Critical patent/JPS5510326A/en
Publication of JPS5510326A publication Critical patent/JPS5510326A/en
Publication of JPS5622424B2 publication Critical patent/JPS5622424B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: To set brazing material automatically and efficiently by infiltrating liquid in the bonding spacing of the members to be brazed and sprinkling powder brazing material thereby forming liquid bond deposit.
CONSTITUTION: Members to be brazed (works) 1, 2 are tentatively bonded. Next, they are wetted by being exposed to a spray or by other thing to infiltrate liquid 4 into the bonding spacings 3. The liquid other than the liquid 4 in the spacing 3 is removed. Next, powder brazing material 5 is sprinkled or poured. The deposited powder sucks up the liquid 4 and forms the liquid bond deposit 51 of the powder brazing material of the amount corresponding to bead form in the opening portion 31 at the spacing of the bond part. The unnecessary powder brazing material 52 is removed through turning over, oscillation vibration or rotation of the work W or air blow or multiple impulsive contact of particle form material. This completes setting of the brazing material. Next, the work is put in a brazing furnace and is heated. The work W is cooled, whereby the work W is integrally bonded.
COPYRIGHT: (C)1980,JPO&Japio
JP8292478A 1978-07-10 1978-07-10 Setting method of brazing material for member to be brazed Granted JPS5510326A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8292478A JPS5510326A (en) 1978-07-10 1978-07-10 Setting method of brazing material for member to be brazed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8292478A JPS5510326A (en) 1978-07-10 1978-07-10 Setting method of brazing material for member to be brazed

Publications (2)

Publication Number Publication Date
JPS5510326A true JPS5510326A (en) 1980-01-24
JPS5622424B2 JPS5622424B2 (en) 1981-05-25

Family

ID=13787776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8292478A Granted JPS5510326A (en) 1978-07-10 1978-07-10 Setting method of brazing material for member to be brazed

Country Status (1)

Country Link
JP (1) JPS5510326A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082167A (en) * 1990-09-13 1992-01-21 Nippon Steel Corporation Method of soldering honeycomb body
KR100898428B1 (en) * 2001-09-07 2009-05-21 에미텍 게젤샤프트 퓌어 에미시온스테크놀로기 엠베하 Method and device for applying a solder material to a metallic structure by means of vibration
US11910902B2 (en) 2017-12-28 2024-02-27 Koninklijke Philips N.V. Dual motion cleansing with a mechanical click-on accessory

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082167A (en) * 1990-09-13 1992-01-21 Nippon Steel Corporation Method of soldering honeycomb body
USRE35063E (en) * 1990-09-13 1995-10-17 Nippon Steel Corporation Method of soldering honeycomb body
KR100898428B1 (en) * 2001-09-07 2009-05-21 에미텍 게젤샤프트 퓌어 에미시온스테크놀로기 엠베하 Method and device for applying a solder material to a metallic structure by means of vibration
US11910902B2 (en) 2017-12-28 2024-02-27 Koninklijke Philips N.V. Dual motion cleansing with a mechanical click-on accessory

Also Published As

Publication number Publication date
JPS5622424B2 (en) 1981-05-25

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