JPS5485234A - Hot-melt adhesive - Google Patents
Hot-melt adhesiveInfo
- Publication number
- JPS5485234A JPS5485234A JP15387677A JP15387677A JPS5485234A JP S5485234 A JPS5485234 A JP S5485234A JP 15387677 A JP15387677 A JP 15387677A JP 15387677 A JP15387677 A JP 15387677A JP S5485234 A JPS5485234 A JP S5485234A
- Authority
- JP
- Japan
- Prior art keywords
- hot
- nylon
- polyethylene glycol
- water
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: A hot-melt nylon-type adhesive applicable to only necessary places and usable at any site, comprising a nylon powder dispersed in water containing poly- ethylene glycol.
CONSTITUTION: 15W60 wt.% of nylon powder having an average particle size of 50W250μ, and preferably a melting point of 70W150°C is dispersed in water wherein a polyethylene glycol having an average molecular weight ≥100,000, preferably ≥300,000 is dissolved. The amount of the polyethylene glycol is preferably 0.5W15 parts by wt. per 100 parts by wt. of water. The higher the molecular weight of the polyethylene glycol, the smaller the amount to be added. If the particle size of nylon is <50μ, the adhesive causes strike-through on hot bonding. If the size is >250μ, the hand and appearance are lowered in bonding for a short time.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15387677A JPS5485234A (en) | 1977-12-20 | 1977-12-20 | Hot-melt adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15387677A JPS5485234A (en) | 1977-12-20 | 1977-12-20 | Hot-melt adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5485234A true JPS5485234A (en) | 1979-07-06 |
JPS5515517B2 JPS5515517B2 (en) | 1980-04-24 |
Family
ID=15572034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15387677A Granted JPS5485234A (en) | 1977-12-20 | 1977-12-20 | Hot-melt adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5485234A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006001885A1 (en) * | 2006-01-13 | 2007-07-26 | Siemens Ag | Accurate fixing microcomponents such as ionizing radiation detectors onto carriers (e.g. in tomographic devices) involves use of a melt adhesive |
-
1977
- 1977-12-20 JP JP15387677A patent/JPS5485234A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006001885A1 (en) * | 2006-01-13 | 2007-07-26 | Siemens Ag | Accurate fixing microcomponents such as ionizing radiation detectors onto carriers (e.g. in tomographic devices) involves use of a melt adhesive |
DE102006001885B4 (en) * | 2006-01-13 | 2010-03-04 | Siemens Ag | Detector module of a detector and use of a hot melt adhesive for the production of a detector module |
Also Published As
Publication number | Publication date |
---|---|
JPS5515517B2 (en) | 1980-04-24 |
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