JPS5483075A - Method for applying sealing material - Google Patents
Method for applying sealing materialInfo
- Publication number
- JPS5483075A JPS5483075A JP15006677A JP15006677A JPS5483075A JP S5483075 A JPS5483075 A JP S5483075A JP 15006677 A JP15006677 A JP 15006677A JP 15006677 A JP15006677 A JP 15006677A JP S5483075 A JPS5483075 A JP S5483075A
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- substrate
- molds
- mold
- gaskets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/524—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To apply a sealing material to a substrate regardless to the strength of or the local irregularity of the substrate, by injecting the sealing meterial into a cavity formed between upper and lower molds, releasing one of the mold from the injected sealing material, and transferring the material to the surface of the substrate. CONSTITUTION:A pair of gaskets 26 and 27 are attached to the cavities of the upper and the lower molds 16 and 22. The molds are clamped until both gaskets are brought into close contact; a sealing material 1 is injected into the cavity formed by both gaskets through a nozzle 28; both molds 16 and 22 are separated each other leaving the molded sealing material 1 in the cavity of the lower mold 22; the lower mold having the sealing material 1 is conveyed to the transfer section; a substrate 2 is pressed to the sealing material protruded from the mold 22; and the substrate attached with the sealing material is separated from the lower mold 22.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15006677A JPS5483075A (en) | 1977-12-14 | 1977-12-14 | Method for applying sealing material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15006677A JPS5483075A (en) | 1977-12-14 | 1977-12-14 | Method for applying sealing material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5483075A true JPS5483075A (en) | 1979-07-02 |
JPS6127166B2 JPS6127166B2 (en) | 1986-06-24 |
Family
ID=15488761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15006677A Granted JPS5483075A (en) | 1977-12-14 | 1977-12-14 | Method for applying sealing material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5483075A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000000337A1 (en) * | 1998-06-26 | 2000-01-06 | Asahi Glass Company Ltd. | Method and device for manufacturing transparent plate with frame |
JP2002364748A (en) * | 2001-06-11 | 2002-12-18 | Takenaka Seisakusho:Kk | Method of pasting string packing, method of supplying thin body and method of assembling structure |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01118491A (en) * | 1987-10-31 | 1989-05-10 | Seiji Sakuragi | Extraction type residence atlas |
-
1977
- 1977-12-14 JP JP15006677A patent/JPS5483075A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000000337A1 (en) * | 1998-06-26 | 2000-01-06 | Asahi Glass Company Ltd. | Method and device for manufacturing transparent plate with frame |
EP1048430A1 (en) * | 1998-06-26 | 2000-11-02 | Asahi Glass Company Ltd. | Method and device for manufacturing transparent plate with frame |
US6413347B1 (en) | 1998-06-26 | 2002-07-02 | Asahi Glass Company Ltd. | Method and apparatus for producing a frame-attached transparent plate |
EP1048430A4 (en) * | 1998-06-26 | 2006-05-17 | Asahi Glass Co Ltd | Method and device for manufacturing transparent plate with frame |
JP2002364748A (en) * | 2001-06-11 | 2002-12-18 | Takenaka Seisakusho:Kk | Method of pasting string packing, method of supplying thin body and method of assembling structure |
Also Published As
Publication number | Publication date |
---|---|
JPS6127166B2 (en) | 1986-06-24 |
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