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JPS5429559A - Scribing machining method - Google Patents

Scribing machining method

Info

Publication number
JPS5429559A
JPS5429559A JP9593677A JP9593677A JPS5429559A JP S5429559 A JPS5429559 A JP S5429559A JP 9593677 A JP9593677 A JP 9593677A JP 9593677 A JP9593677 A JP 9593677A JP S5429559 A JPS5429559 A JP S5429559A
Authority
JP
Japan
Prior art keywords
scribing
machining method
gooves
radiations
deepening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9593677A
Other languages
Japanese (ja)
Inventor
Hiroshi Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9593677A priority Critical patent/JPS5429559A/en
Publication of JPS5429559A publication Critical patent/JPS5429559A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To avoid the scattering and adhering of silicon fine particles and the generation of side wave band, by deepening the gooves with the radiations of laser light, after forming shallow grooves with diamond blade scribing method, when dividing a wafer on which semiconductor elements are formed into pellets.
COPYRIGHT: (C)1979,JPO&Japio
JP9593677A 1977-08-09 1977-08-09 Scribing machining method Pending JPS5429559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9593677A JPS5429559A (en) 1977-08-09 1977-08-09 Scribing machining method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9593677A JPS5429559A (en) 1977-08-09 1977-08-09 Scribing machining method

Publications (1)

Publication Number Publication Date
JPS5429559A true JPS5429559A (en) 1979-03-05

Family

ID=14151145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9593677A Pending JPS5429559A (en) 1977-08-09 1977-08-09 Scribing machining method

Country Status (1)

Country Link
JP (1) JPS5429559A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08192605A (en) * 1995-06-07 1996-07-30 Sumitomo Rubber Ind Ltd Radial tire
JP2001044141A (en) * 1999-07-30 2001-02-16 Nippon Sheet Glass Co Ltd Method for cutting semiconductor substrate
US7772090B2 (en) * 2003-09-30 2010-08-10 Intel Corporation Methods for laser scribing wafers
JP2013235989A (en) * 2012-05-09 2013-11-21 Disco Abrasive Syst Ltd Method for dividing workpiece

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08192605A (en) * 1995-06-07 1996-07-30 Sumitomo Rubber Ind Ltd Radial tire
JP2001044141A (en) * 1999-07-30 2001-02-16 Nippon Sheet Glass Co Ltd Method for cutting semiconductor substrate
JP4581158B2 (en) * 1999-07-30 2010-11-17 富士ゼロックス株式会社 Semiconductor substrate cutting method
US7772090B2 (en) * 2003-09-30 2010-08-10 Intel Corporation Methods for laser scribing wafers
US8364304B2 (en) 2003-09-30 2013-01-29 Intel Corporation Methods and apparatus for laser scribing wafers
JP2013235989A (en) * 2012-05-09 2013-11-21 Disco Abrasive Syst Ltd Method for dividing workpiece

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