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JPS5428755A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS5428755A
JPS5428755A JP9424677A JP9424677A JPS5428755A JP S5428755 A JPS5428755 A JP S5428755A JP 9424677 A JP9424677 A JP 9424677A JP 9424677 A JP9424677 A JP 9424677A JP S5428755 A JPS5428755 A JP S5428755A
Authority
JP
Japan
Prior art keywords
base plate
soldered
soldering method
brough
icicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9424677A
Other languages
Japanese (ja)
Inventor
Nobuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9424677A priority Critical patent/JPS5428755A/en
Publication of JPS5428755A publication Critical patent/JPS5428755A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To provide the subject method wherein electric parts are dip-soldered on a printing circuit base plate, and thereafter the swollen surface formed on the soldering bath surface is brough into contact with the soldered base plate, whereby the suspension of solder like icicle and occurrence of a short-circuiting phenomenon can be prevented.
JP9424677A 1977-08-08 1977-08-08 Soldering method Pending JPS5428755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9424677A JPS5428755A (en) 1977-08-08 1977-08-08 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9424677A JPS5428755A (en) 1977-08-08 1977-08-08 Soldering method

Publications (1)

Publication Number Publication Date
JPS5428755A true JPS5428755A (en) 1979-03-03

Family

ID=14104941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9424677A Pending JPS5428755A (en) 1977-08-08 1977-08-08 Soldering method

Country Status (1)

Country Link
JP (1) JPS5428755A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11506438B2 (en) 2018-08-03 2022-11-22 Hoshizaki America, Inc. Ice machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11506438B2 (en) 2018-08-03 2022-11-22 Hoshizaki America, Inc. Ice machine
US11953250B2 (en) 2018-08-03 2024-04-09 Hoshizaki America, Inc. Ice machine

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