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JPS54152970A - Resin-molding method, mold and molded body - Google Patents

Resin-molding method, mold and molded body

Info

Publication number
JPS54152970A
JPS54152970A JP6107678A JP6107678A JPS54152970A JP S54152970 A JPS54152970 A JP S54152970A JP 6107678 A JP6107678 A JP 6107678A JP 6107678 A JP6107678 A JP 6107678A JP S54152970 A JPS54152970 A JP S54152970A
Authority
JP
Japan
Prior art keywords
mold
resin
air
air vent
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6107678A
Other languages
Japanese (ja)
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Nobuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6107678A priority Critical patent/JPS54152970A/en
Publication of JPS54152970A publication Critical patent/JPS54152970A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To remove easily resin sticking to a mold by providing a air vent for air evacuation from mold space to the surface of a molded body or inside of it.
CONSTITUTION: On tab 4 of lead frame 1, circuit element 16 is fixed and connected, and a molded part is positioned inside and cavity 12 of mold 9 and matched with mold 12; and melting resin is flowed into runners 11 and 13 to fill space 15 with resin 18 by pressure. At this time, air is forced to flow out of the mold from air vent 19 formed of the surface of mold 10 and groove 8 provided to external frame 2 at the opposite side of the flow-in gate. The tip part of the flow of the resin flows partially into this air vent 19 to let the air out perfectly. Then, separating the mold removes the resin, which immersed into the air vent, stuck to the lead frame, leaving a little resin on the separation surface of the upper mold. Consequently, peeling-off is simplified and cleaning is also simple.
COPYRIGHT: (C)1979,JPO&Japio
JP6107678A 1978-05-24 1978-05-24 Resin-molding method, mold and molded body Pending JPS54152970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6107678A JPS54152970A (en) 1978-05-24 1978-05-24 Resin-molding method, mold and molded body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6107678A JPS54152970A (en) 1978-05-24 1978-05-24 Resin-molding method, mold and molded body

Publications (1)

Publication Number Publication Date
JPS54152970A true JPS54152970A (en) 1979-12-01

Family

ID=13160671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6107678A Pending JPS54152970A (en) 1978-05-24 1978-05-24 Resin-molding method, mold and molded body

Country Status (1)

Country Link
JP (1) JPS54152970A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501540A (en) * 1981-12-24 1985-02-26 Toyota Jidosha Kabushiki Kaisha Insert molding device
US4599062A (en) * 1981-01-26 1986-07-08 Dai-Ichi Seiko Co., Ltd. Encapsulation molding apparatus
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
US4700525A (en) * 1986-04-16 1987-10-20 Donnelly Corporation Molded panel assembly and fasteners therefor
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
JPH0268114U (en) * 1988-11-11 1990-05-23
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
US5071612A (en) * 1988-12-12 1991-12-10 Kabushiki Kaisha Toshiba Method for sealingly molding semiconductor electronic components
US5293065A (en) * 1992-08-27 1994-03-08 Texas Instruments, Incorporated Lead frame having an outlet with a larger cross sectional area than the inlet
US5395800A (en) * 1992-01-30 1995-03-07 Fuji Electric Co., Ltd. Method for assembling semiconductor devices with lead frame containing common lead arrangement
US5853771A (en) * 1997-08-19 1998-12-29 Oki Electric Industry Co., Ltd. Molding die set and mold package
US7026710B2 (en) * 2000-01-21 2006-04-11 Texas Instruments Incorporated Molded package for micromechanical devices and method of fabrication

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4599062A (en) * 1981-01-26 1986-07-08 Dai-Ichi Seiko Co., Ltd. Encapsulation molding apparatus
US4501540A (en) * 1981-12-24 1985-02-26 Toyota Jidosha Kabushiki Kaisha Insert molding device
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
US4700525A (en) * 1986-04-16 1987-10-20 Donnelly Corporation Molded panel assembly and fasteners therefor
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
US5096853A (en) * 1988-10-20 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a resin encapsulated semiconductor device
JPH0268114U (en) * 1988-11-11 1990-05-23
JPH058106Y2 (en) * 1988-11-11 1993-03-01
US5071612A (en) * 1988-12-12 1991-12-10 Kabushiki Kaisha Toshiba Method for sealingly molding semiconductor electronic components
US5395800A (en) * 1992-01-30 1995-03-07 Fuji Electric Co., Ltd. Method for assembling semiconductor devices with lead frame containing common lead arrangement
US5293065A (en) * 1992-08-27 1994-03-08 Texas Instruments, Incorporated Lead frame having an outlet with a larger cross sectional area than the inlet
US5853771A (en) * 1997-08-19 1998-12-29 Oki Electric Industry Co., Ltd. Molding die set and mold package
US7026710B2 (en) * 2000-01-21 2006-04-11 Texas Instruments Incorporated Molded package for micromechanical devices and method of fabrication

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