JPS54137757U - - Google Patents
Info
- Publication number
- JPS54137757U JPS54137757U JP3175678U JP3175678U JPS54137757U JP S54137757 U JPS54137757 U JP S54137757U JP 3175678 U JP3175678 U JP 3175678U JP 3175678 U JP3175678 U JP 3175678U JP S54137757 U JPS54137757 U JP S54137757U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3175678U JPS54137757U (ja) | 1978-03-13 | 1978-03-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3175678U JPS54137757U (ja) | 1978-03-13 | 1978-03-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54137757U true JPS54137757U (ja) | 1979-09-25 |
Family
ID=28883934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3175678U Pending JPS54137757U (ja) | 1978-03-13 | 1978-03-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54137757U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015208868A (ja) * | 2014-04-24 | 2015-11-24 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法並びにモールド成形品 |
-
1978
- 1978-03-13 JP JP3175678U patent/JPS54137757U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015208868A (ja) * | 2014-04-24 | 2015-11-24 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法並びにモールド成形品 |