JPS54112939A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS54112939A JPS54112939A JP1925278A JP1925278A JPS54112939A JP S54112939 A JPS54112939 A JP S54112939A JP 1925278 A JP1925278 A JP 1925278A JP 1925278 A JP1925278 A JP 1925278A JP S54112939 A JPS54112939 A JP S54112939A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- adhesive
- copper
- organic material
- anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000011368 organic material Substances 0.000 abstract 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 abstract 1
- 239000011354 acetal resin Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- -1 aluminum silicate anhydride Chemical class 0.000 abstract 1
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 229920006324 polyoxymethylene Polymers 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000004408 titanium dioxide Chemical group 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical group [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title adhesive having improved bonding strength, heat resistance for soldering, and tracking resistance, obtained by adding a specific amount of aluminum slilcate anhydride as a filler to an organic material.
CONSTITUTION: A) 100 parts by wt. of an organic material (e.g., polyvinyl acetal resin, etc.) excluding solvents is blended with B) 10W300 parts by wt., preferably 20W150 parts by wt. of aluminum silicate anhydride to give the desired compound. Not more than 70 wt.% of the ingredient B is substituted by zirconium silicate or titanium dioxide, if necessary.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1925278A JPS54112939A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1925278A JPS54112939A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54112939A true JPS54112939A (en) | 1979-09-04 |
JPS5550076B2 JPS5550076B2 (en) | 1980-12-16 |
Family
ID=11994220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1925278A Granted JPS54112939A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54112939A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
US4741309A (en) * | 1986-10-22 | 1988-05-03 | Corrie Bergen | Throttle locking device for a diesel engine |
US4937010A (en) * | 1983-07-15 | 1990-06-26 | Laboratoire Suisse De Recherches Horlogeres | Paint with suspended oil inclusions; preparation and applications processes |
JPH02179741A (en) * | 1989-01-04 | 1990-07-12 | Toshiba Chem Corp | Copper clad laminated sheet |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50141623A (en) * | 1974-05-02 | 1975-11-14 | ||
JPS5319253A (en) * | 1976-08-03 | 1978-02-22 | Taihei Kogyo Kk | Device for arranging* cutting and polishing hair part of toothbrush etc* |
-
1978
- 1978-02-22 JP JP1925278A patent/JPS54112939A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50141623A (en) * | 1974-05-02 | 1975-11-14 | ||
JPS5319253A (en) * | 1976-08-03 | 1978-02-22 | Taihei Kogyo Kk | Device for arranging* cutting and polishing hair part of toothbrush etc* |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
JPH0219995B2 (en) * | 1981-11-16 | 1990-05-07 | Kanegafuchi Chemical Ind | |
US4937010A (en) * | 1983-07-15 | 1990-06-26 | Laboratoire Suisse De Recherches Horlogeres | Paint with suspended oil inclusions; preparation and applications processes |
US4741309A (en) * | 1986-10-22 | 1988-05-03 | Corrie Bergen | Throttle locking device for a diesel engine |
JPH02179741A (en) * | 1989-01-04 | 1990-07-12 | Toshiba Chem Corp | Copper clad laminated sheet |
Also Published As
Publication number | Publication date |
---|---|
JPS5550076B2 (en) | 1980-12-16 |
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