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JPS54110266A - Heat resistant resin composition dispersed with fine metal powder - Google Patents

Heat resistant resin composition dispersed with fine metal powder

Info

Publication number
JPS54110266A
JPS54110266A JP1661278A JP1661278A JPS54110266A JP S54110266 A JPS54110266 A JP S54110266A JP 1661278 A JP1661278 A JP 1661278A JP 1661278 A JP1661278 A JP 1661278A JP S54110266 A JPS54110266 A JP S54110266A
Authority
JP
Japan
Prior art keywords
metal powder
resin composition
fine metal
heat resistant
resistant resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1661278A
Other languages
Japanese (ja)
Inventor
Ichiro Shibazaki
Kaoru Omura
Takeo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP1661278A priority Critical patent/JPS54110266A/en
Priority to US06/010,290 priority patent/US4377652A/en
Priority to GB7904632A priority patent/GB2016487B/en
Priority to DE2905857A priority patent/DE2905857C2/en
Priority to DE19792953498 priority patent/DE2953498C2/de
Priority to NLAANVRAGE7901256,A priority patent/NL181739C/en
Priority to CA321,623A priority patent/CA1123981A/en
Publication of JPS54110266A publication Critical patent/JPS54110266A/en
Priority to CA000384856A priority patent/CA1143084A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: To prepare a resin composition useful as electrically-conductive resin adhesives, coatings for electric or magnetic shield, etc. and solderable at high temperatures, by dispersing fine metal powder in a binder comprising a specific aromatic (pre)polymer.
CONSTITUTION: A nitrogen containing aromatic (pre)polymer resistant at 250W 500°C [pref. poly(amide)imide soluble in organic polar solvents], is optionally compounded with an epoxy resin, and dissolved in a solvent, e.g. dimethylformamide, etc. 5W95 wt% of fine metal powder, e.g. silver, etc., is dispersed in the solution to give the desired resin composition.
COPYRIGHT: (C)1979,JPO&Japio
JP1661278A 1978-02-17 1978-02-17 Heat resistant resin composition dispersed with fine metal powder Pending JPS54110266A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP1661278A JPS54110266A (en) 1978-02-17 1978-02-17 Heat resistant resin composition dispersed with fine metal powder
US06/010,290 US4377652A (en) 1978-02-17 1979-02-08 Polyamide-imide compositions and articles for electrical use prepared therefrom
GB7904632A GB2016487B (en) 1978-02-17 1979-02-09 Articles for electrical use and compositions useful therefor
DE2905857A DE2905857C2 (en) 1978-02-17 1979-02-15 Polyamide-imide compositions with granular materials and use of such compositions for electrical components, circuit boards and insulating substrates
DE19792953498 DE2953498C2 (en) 1978-02-17 1979-02-15
NLAANVRAGE7901256,A NL181739C (en) 1978-02-17 1979-02-16 COMPOSITION BASED ON AN AROMATIC POLYAMIDE IMIDE.
CA321,623A CA1123981A (en) 1978-02-17 1979-02-16 Soluble aromatic polyamide-imide compositions for electrical use
CA000384856A CA1143084A (en) 1978-02-17 1981-08-28 Soluble aromatic polyamide-imide compositions for electrical use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1661278A JPS54110266A (en) 1978-02-17 1978-02-17 Heat resistant resin composition dispersed with fine metal powder

Publications (1)

Publication Number Publication Date
JPS54110266A true JPS54110266A (en) 1979-08-29

Family

ID=11921137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1661278A Pending JPS54110266A (en) 1978-02-17 1978-02-17 Heat resistant resin composition dispersed with fine metal powder

Country Status (2)

Country Link
JP (1) JPS54110266A (en)
DE (1) DE2953498C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149759A (en) * 1978-05-16 1979-11-24 Asahi Chem Ind Co Ltd Particulate material-containing polyimide composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10121270A1 (en) * 2001-04-30 2003-02-06 Epcos Ag Passivation material for an electrical component as well as piezoelectric component in multilayer construction

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984375A (en) * 1963-12-12 1976-10-05 Westinghouse Electric Corporation Aromatic amide-imide polymers
GB1175555A (en) * 1966-01-25 1969-12-23 Sumitomo Electrical Ind Ltd Polyamideimides and the process for preparing them
AT270224B (en) * 1967-03-20 1969-04-25 Beck & Co Ag Dr Process for the production of new, thermally stable, linear polyamide-imides
DE2441020C3 (en) * 1974-08-27 1982-01-07 Basf Ag, 6700 Ludwigshafen Process for the production of viscosity-stable polyamide-imide solutions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149759A (en) * 1978-05-16 1979-11-24 Asahi Chem Ind Co Ltd Particulate material-containing polyimide composition

Also Published As

Publication number Publication date
DE2953498C2 (en) 1989-06-29

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