JPS4968367U - - Google Patents
Info
- Publication number
- JPS4968367U JPS4968367U JP1972112370U JP11237072U JPS4968367U JP S4968367 U JPS4968367 U JP S4968367U JP 1972112370 U JP1972112370 U JP 1972112370U JP 11237072 U JP11237072 U JP 11237072U JP S4968367 U JPS4968367 U JP S4968367U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1972112370U JPS4968367U (en) | 1972-09-29 | 1972-09-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1972112370U JPS4968367U (en) | 1972-09-29 | 1972-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4968367U true JPS4968367U (en) | 1974-06-14 |
Family
ID=28339060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1972112370U Pending JPS4968367U (en) | 1972-09-29 | 1972-09-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4968367U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013110435A (en) * | 2003-08-28 | 2013-06-06 | Intellectual Discovery Co Ltd | Light-emitting device/assembly having enhanced heat conductivity, system including the same and method of enhancing heat conductivity |
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1972
- 1972-09-29 JP JP1972112370U patent/JPS4968367U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013110435A (en) * | 2003-08-28 | 2013-06-06 | Intellectual Discovery Co Ltd | Light-emitting device/assembly having enhanced heat conductivity, system including the same and method of enhancing heat conductivity |