JPS49115662A - - Google Patents
Info
- Publication number
- JPS49115662A JPS49115662A JP2614773A JP2614773A JPS49115662A JP S49115662 A JPS49115662 A JP S49115662A JP 2614773 A JP2614773 A JP 2614773A JP 2614773 A JP2614773 A JP 2614773A JP S49115662 A JPS49115662 A JP S49115662A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2614773A JPS49115662A (ja) | 1973-03-07 | 1973-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2614773A JPS49115662A (ja) | 1973-03-07 | 1973-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49115662A true JPS49115662A (ja) | 1974-11-05 |
Family
ID=12185421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2614773A Pending JPS49115662A (ja) | 1973-03-07 | 1973-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49115662A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752125A (en) * | 1980-09-16 | 1982-03-27 | Nec Corp | Mesa structure semiconductor device |
| JPH025447A (ja) * | 1988-01-27 | 1990-01-10 | General Instr Corp | 半導体デバイスの製造方法並びにその製造方法に使用する可撓性ウエファ構造 |
| US6730579B1 (en) | 1999-02-05 | 2004-05-04 | Sharp Kabushiki Kaisha | Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching |
-
1973
- 1973-03-07 JP JP2614773A patent/JPS49115662A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752125A (en) * | 1980-09-16 | 1982-03-27 | Nec Corp | Mesa structure semiconductor device |
| JPH025447A (ja) * | 1988-01-27 | 1990-01-10 | General Instr Corp | 半導体デバイスの製造方法並びにその製造方法に使用する可撓性ウエファ構造 |
| US6730579B1 (en) | 1999-02-05 | 2004-05-04 | Sharp Kabushiki Kaisha | Method of manufacturing a semiconductor dice by partially dicing the substrate and subsequent chemical etching |