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JPS4873762A - - Google Patents

Info

Publication number
JPS4873762A
JPS4873762A JP47089643A JP8964372A JPS4873762A JP S4873762 A JPS4873762 A JP S4873762A JP 47089643 A JP47089643 A JP 47089643A JP 8964372 A JP8964372 A JP 8964372A JP S4873762 A JPS4873762 A JP S4873762A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47089643A
Other languages
Japanese (ja)
Other versions
JPS573234B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4873762A publication Critical patent/JPS4873762A/ja
Publication of JPS573234B2 publication Critical patent/JPS573234B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
JP8964372A 1972-01-04 1972-09-08 Expired JPS573234B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21539572A 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
JPS4873762A true JPS4873762A (en) 1973-10-04
JPS573234B2 JPS573234B2 (en) 1982-01-20

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8964372A Expired JPS573234B2 (en) 1972-01-04 1972-09-08

Country Status (2)

Country Link
JP (1) JPS573234B2 (en)
FR (1) FR2166347A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
EP1608209A1 (en) * 2004-06-17 2005-12-21 Furukawa Circuit Foil Co., Ltd. Conductive base material with resistance layer and circuit board material with resistance layer
US7215235B2 (en) 2003-04-11 2007-05-08 Furukawa Circuit Foil Co., Ltd Conductive substrate with resistance layer, resistance board, and resistance circuit board
US7794578B2 (en) 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
CN107675176A (en) * 2017-08-21 2018-02-09 陕西天元智能再制造股份有限公司 The workpiece surface enhanced processing method that a kind of differential arc oxidation is combined with vacuum cladding

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric METAL COVERED LAMINATE AND MANUFACTURING METHOD
JPS6199134A (en) * 1984-10-20 1986-05-17 Fuji Photo Film Co Ltd Erasing unit of accumulative fluorescent sheet
EP2602288B1 (en) 2010-08-06 2017-09-06 Hitachi Chemical Company, Ltd. Liquid composition, and resistor film, resistor element and circuit board using same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (en) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision Printed resistors and their manufacturing process
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS5542510B2 (en) * 1977-11-21 1980-10-31
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS6255713B2 (en) * 1980-04-03 1987-11-20 Furukawa Saakitsuto Fuoiru Kk
US4935310A (en) * 1980-04-03 1990-06-19 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
US7794578B2 (en) 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
US7215235B2 (en) 2003-04-11 2007-05-08 Furukawa Circuit Foil Co., Ltd Conductive substrate with resistance layer, resistance board, and resistance circuit board
EP1608209A1 (en) * 2004-06-17 2005-12-21 Furukawa Circuit Foil Co., Ltd. Conductive base material with resistance layer and circuit board material with resistance layer
CN107675176A (en) * 2017-08-21 2018-02-09 陕西天元智能再制造股份有限公司 The workpiece surface enhanced processing method that a kind of differential arc oxidation is combined with vacuum cladding
CN107675176B (en) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 A kind of workpiece surface enhanced processing method that differential arc oxidation is combined with vacuum cladding

Also Published As

Publication number Publication date
JPS573234B2 (en) 1982-01-20
FR2166347A1 (en) 1973-08-17
FR2166347B1 (en) 1977-12-30

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