JPS4832474A - - Google Patents
Info
- Publication number
- JPS4832474A JPS4832474A JP8007772A JP8007772A JPS4832474A JP S4832474 A JPS4832474 A JP S4832474A JP 8007772 A JP8007772 A JP 8007772A JP 8007772 A JP8007772 A JP 8007772A JP S4832474 A JPS4832474 A JP S4832474A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/175,529 US3968193A (en) | 1971-08-27 | 1971-08-27 | Firing process for forming a multilayer glass-metal module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4832474A true JPS4832474A (en) | 1973-04-28 |
Family
ID=22640587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8007772A Pending JPS4832474A (en) | 1971-08-27 | 1972-08-11 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS4832474A (en) |
IT (1) | IT964138B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62174955A (en) * | 1987-01-10 | 1987-07-31 | Mitsubishi Electric Corp | Manufacture of semiconductor package |
JPH0982857A (en) * | 1995-09-18 | 1997-03-28 | Nec Corp | Multi-chip package structure |
-
1972
- 1972-08-11 JP JP8007772A patent/JPS4832474A/ja active Pending
- 1972-08-22 IT IT2836172A patent/IT964138B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62174955A (en) * | 1987-01-10 | 1987-07-31 | Mitsubishi Electric Corp | Manufacture of semiconductor package |
JPH0982857A (en) * | 1995-09-18 | 1997-03-28 | Nec Corp | Multi-chip package structure |
Also Published As
Publication number | Publication date |
---|---|
IT964138B (en) | 1974-01-21 |