JPH1195427A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin compsn. having particularly superior adhesion, resolution and film strength as an etching or plating resist used in the production of a printed circuit board, the precision working of a metal, etc., and to provide a photosensitive element using the compsn. SOLUTION: The photosensitive resin compsn. contains 50-70 pts.wt. polymer obtd. by copolymerizing (meth)acrylic acid with a compd. represented by formula I, 30-50 pts.wt. ethylenically unsatd. compd. having >=100 deg.C b.p. under atmospheric pressure and represented by formula II, a photopolymn. initiator and pigment or dye. The photosensitive resin compsn. is applied on the top of a substrate and dried to obtain the objective photosensitive element. In the formula I, R<1> is H or methyl and R<2> is alkyl. In the formula II, R<3> and R<4> are H or methyl, A, B, X and Y are group (a), (b) or (c) and (k), (l), (m) and (n) are integers of 1-5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition,
More specifically, a photosensitive resin composition having particularly excellent adhesion, resolution and film strength as an etching resist or a plating resist used for production of a printed wiring board, precision processing of a metal, and a photosensitive resin using the same. Sexual element.

[0002]

2. Description of the Related Art Conventionally, in the fields of production of printed wiring boards, precision processing of metals, etc., as a resist material used for etching, plating, etc., a photosensitive resin composition and a film formed on a support, A photosensitive element provided with a protective film thereon is widely used. The printed wiring board forms a photosensitive film layer on a copper substrate using the photosensitive resin composition or the photosensitive element, and after pattern exposure, removes an unexposed portion with a developing solution, and performs etching or plating. It is manufactured by a method in which a cured portion is peeled off from a substrate after a pattern is formed by applying the pattern.

As a developer for removing the unexposed portions, an alkali developing type using an aqueous solution of sodium carbonate or the like is mainly used. This type of photosensitive resin composition or photosensitive element is disclosed in, for example, Japanese Patent Publication No. 1-5691 and Japanese Patent Publication No. Sho.
2-94388, JP-B-54-25957, and JP-B-54-34372.

On the other hand, in recent years, with the increase in density of printed wiring boards, many defects due to insufficient adhesion between the photosensitive resin composition and the substrate and defects due to insufficient resolution have occurred during development. In order to prevent this defect from occurring, it is necessary to improve the adhesion and resolution of the photosensitive resin composition to the substrate. The above-described conventionally known photosensitive resin compositions do not have adhesion and resolution that can cope with such recent high-density printed wiring boards.

[0005]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and is particularly excellent as an etching resist or a plating resist used for manufacturing printed wiring boards, precision processing of metals, and the like. It is an object of the present invention to provide a photosensitive resin composition having excellent adhesion, resolution and film strength, and a photosensitive element using the same.

[0006]

That is, the present invention provides:
(A) (meth) acrylic acid 10 to 15% by weight and 85 to 90% by weight of a compound represented by the general formula [I] are copolymerized as a copolymer component to have a weight average molecular weight of 30,0.
50 to 70 parts by weight of a film-imparting polymer having a value of (weight average molecular weight / number average molecular weight) (dispersion degree of molecular weight) of 2.0 to 3.0;

[0007]

Embedded image (In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 1 to 12 carbon atoms.) (B) At least one kind of ethylenically unsaturated compound represented by the general formula [II] A compound as an essential component, having a boiling point at normal pressure of 100 ° C. or higher and an ethylenically unsaturated compound 30 to
50 parts by weight (provided that the total amount of the components (A) and (B) is 100 parts by weight),

[0008]

Embedded image (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, and A, B, X and Y each independently represent

[0009]

Embedded image And k, l, m and n each independently represent an integer of 1 to 5. (C) The photopolymerization initiator is used in a total amount of the components (A) and (B) of 1
0.5 to 10 parts by weight based on 00 parts by weight and (D) a pigment or dye in a total amount of 1 component (A) and 1 component (B)
It is intended to provide a photosensitive resin composition containing 0.01 to 3.0 parts by weight with respect to 00 parts by weight.

The present invention also provides a photosensitive element obtained by applying the photosensitive resin composition on a support and drying the composition.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The polymer (A) for imparting film properties used in the present invention is (meth) acrylic acid ((meth) acrylic acid means acrylic acid and / or methacrylic acid; the same applies hereinafter). And a compound represented by the general formula [I].

The compound represented by the general formula [I] includes
For example, (meth) acrylic acid methyl ester, (meth)
Ethyl acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylate
Examples thereof include amyl acrylate, hexyl (meth) acrylate, and octyl (meth) acrylate. These may be used alone or in combination of two or more, and the combination is not particularly limited.

The film-imparting polymer (A) is preferably soluble or swellable in an aqueous alkali solution (for example, 0.5 to 2.0% by weight of an aqueous solution of sodium carbonate or potassium carbonate). The copolymerization amount of (meth) acrylic acid in the copolymer component is 10 to 15% by weight, preferably 11 to 14% by weight. If the copolymerization amount of (meth) acrylic acid in the polymer imparting film properties exceeds 15% by weight, the adhesiveness tends to decrease, and 1
If it is less than 0% by weight, the development time tends to be long.

The weight-average molecular weight of the film-imparting polymer is from 30,000 to 70,000, preferably from 40,000 to 60,000. When the weight average molecular weight of the film-imparting polymer exceeds 70,000, the development time is prolonged and the resolution is reduced, and
If it is less than 0, the adhesiveness decreases and the film strength decreases.

The value of the weight average molecular weight / number average molecular weight (dispersion degree of molecular weight) of the film imparting polymer is 2.0.
To 3.0, and preferably 2.2 to 2.8. If the degree of dispersion of the molecular weight of the film imparting polymer exceeds 3.0, the resolution tends to decrease, and if it is less than 2.0, the adhesion tends to decrease.

The weight average molecular weight and the number average molecular weight are as follows:
It is measured by GPC and converted using a standard polystyrene calibration curve.

In the present invention, the amount of component (A) is 5 parts per 100 parts by weight of the total of components (A) and (B).
0 to 70 parts by weight, preferably 55 to 67 parts by weight.
If the amount of the component (A) exceeds 70 parts by weight, the curability of the photosensitive resin composition will be insufficient, and the development time will be long. If the amount is less than 50 parts by weight, the photocured product tends to be brittle, and the coating properties when a photosensitive resin composition is coated on a support and dried to produce a photosensitive element are poor.

The ethylenically unsaturated compound (B) used in the present invention has a boiling point at normal pressure of 100 ° C. or higher, and has an ethylenically unsaturated compound represented by the following general formula [II] (hereinafter referred to as “II”). , Ethylenically unsaturated compound (B1)
Call. ) Is included as an essential component.

[0019]

Embedded image (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, and A, B, X and Y each independently represent

[0020]

Embedded image And k, l, m and n each independently represent an integer of 1 to 5. The boiling point of the ethylenically unsaturated compound (B) used in the present invention is 100 ° C or higher, preferably 130 to 400 ° C. When the boiling point of the ethylenically unsaturated compound (B) is less than 100 ° C., the photosensitive resin composition is volatilized at the time of coating and drying on a support and at the time of laminating the photosensitive element on a substrate. May not be obtained.

Specific examples of the ethylenically unsaturated compound (B1) include, for example, 2,2-bis (4-methacryloxypentaethoxyphenyl) propane and 2,2-bis (4
-Methacryloxypentapropoxyphenyl) propane, 2,2-bis (4-methacryloxymonoethoxytetrapropoxyphenyl) propane, 2,2-bis (4
-Methacryloxydiethoxytripropoxyphenyl)
Propane, 2,2-bis (4-methacryloxytriethoxydipropoxyphenyl) propane, 2,2-bis (4-methacryloxytetraethoxymonopropoxy)
And propane. Ethylenically unsaturated compound (B
1) may be used alone or in combination of two or more, and the combination is not particularly limited.

The ethylenically unsaturated compound (B1) used in the present invention as the ethylenically unsaturated compound (B)
Other ethylenically unsaturated compounds (hereinafter referred to as ethylenically unsaturated compounds (B2)) include, for example, compounds obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol (polyethylene glycol diethylene glycol). (Meth) acrylate (having 2 to 14 ethylene groups), trimethylolpropanedi (meth) acrylate, trimethylolpropanetri (meth) acrylate, trimethylolpropaneethoxytri (meth) acrylate, trimethylolpropanepropoxytri (Meth) acrylate,
Trimethylolpropane ethylene glycol adduct triacrylate, tetramethylolmethane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, polypropylene glycol di (meth) acrylate (having 2 to 14 propylene groups), dipentane Erythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc.),
Esterified product (γ-chloro-β-hydroxypropyl-β′-methacryloyl) of a polycarboxylic acid (such as phthalic anhydride) and a compound having a hydroxyl group and an ethylenically unsaturated group (such as β-hydroxyethyl (meth) acrylate) Oxyethyl-o-phthalate, etc.), alkyl esters of (meth) acrylic acid (methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate Ester), urethane (meth) acrylate (reaction product of tolylene diisocyanate with 2-hydroxyethyl (meth) acrylate, trimethylhexamethylene diisocyanate, cyclohexanedimethanol, and 2-hydroxyethyl (meth) acrylate Reactants, etc.) And the like. These may be used alone or in combination of two or more, and the combination is not particularly limited.

In the present invention, the amount of the component (B) is 3 parts per 100 parts by weight of the total of the components (A) and (B).
0 to 50 parts by weight, preferably 33 to 45 parts by weight.
When the blending amount of the component (B) exceeds 50 parts by weight, the photocured product tends to become brittle, and the photosensitive resin composition is coated on a support and dried to form a coating film when producing a photosensitive element. Inferior. If the amount is less than 30 parts by weight, the curability of the photosensitive resin composition may be insufficient or the development time may be long.

In the present invention, resolution is improved by using the ethylenically unsaturated compound (B1) represented by the general formula [II] as an essential component in the component (B).
The amount of the ethylenically unsaturated compound (B1) in the component (B) is preferably from 10 to 90% by weight, more preferably from 20 to 80% by weight in the component (B).
When the proportion of the ethylenically unsaturated compound (B1) in the component (B) is less than 10% by weight, the effect of improving the resolution may be insufficient. Tends to be longer.

As the photopolymerization initiator (C) used in the present invention, for example, aromatic ketones (benzophenone, N,
N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetraethyl-4,
4'-diaminobenzophenone, 4-methoxy-4'-
Dimethylaminobenzophenone, 2-ethylanthraquinone, phenanthrenequinone, etc.), benzoin (benzoin ether such as benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, methyl benzoin, ethyl benzoin, etc.), benzyl derivative (benzyl benzyl ketal, etc.), 2 , 4,5-triarylimidazole dimer (2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2-
(O-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2-
(O-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5
-Diphenylimidazole dimer, 2,4-bis (p-
Methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methylmercaptophenyl) -4,5-diphenylimidazole dimer Acridine derivative (9-phenylacridine,
1,7-bis (9,9'-acridinyl) heptane and the like; xanthones (thioxanthone, diethylthioxanthone and the like). These can be used alone or 2
A combination of two or more species is used, and there is no particular limitation on the combination. Further, in the present invention, the photopolymerization initiator (C) may contain a photoinitiation auxiliary such as a tertiary amine such as ethyl dimethylaminobenzoate, in addition to the above various photopolymerization initiators.

In the present invention, the compounding amount of the component (C) is 0.5 to 10 parts by weight, preferably 1.0 to 5.0 parts by weight, based on 100 parts by weight of the total of the components (A) and (B). Department. When the amount of the component (C) exceeds 10 parts by weight,
The curability at the bottom of the photosensitive resin composition becomes insufficient and the adhesiveness is reduced. When the amount is less than 0.5 part by weight, the curing time is prolonged.

As the pigment or dye (D) used in the present invention, known pigments or dyes can be used, and in particular, a film-imparting polymer (A) and an ethylenically unsaturated compound (B)
Is selected in consideration of the compatibility with, the target hue, and the light transmittance.

In the present invention, the compounding amount of the component (D) is 0.01 to 3.0 parts by weight, preferably 0.05 to 2.0 parts by weight, based on 100 parts by weight of the total of the components (A) and (B). 5
Parts by weight. When the compounding amount of the component (D) exceeds 3.0 parts by weight, the light transmittance is reduced, the adhesion is reduced, and 0.01%.
If the amount is less than parts by weight, coloring becomes insufficient.

The photosensitive resin composition of the present invention contains 2,2 '
Polymerization inhibitors such as -methylenebis (4-ethyl-6-t-butylphenol); coloring agents such as tribromomethylphenylsulfone and leucocrystal violet; and further, plasticizers, stabilizers, adhesion promoters, fragrances, and defoamers. And the like may be added as necessary.

In the photosensitive resin composition of the present invention, each of the above components is dissolved in a solvent for dissolving the components, for example, toluene, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, chloroform, methylene chloride, By dissolving in dimethylformamide, methanol, ethanol or the like, a uniform solution can be obtained.

The photosensitive resin composition of the present invention can be used as a photosensitive element by coating it on a support and drying to form a photosensitive layer.

As the support, a polymer film, for example, a film made of polyethylene terephthalate, polypropylene, polyethylene or the like is used. Among them, a polyethylene terephthalate film is preferable.

Since these polymer films must be removable from the photosensitive layer later, they must not be surface-treated or made of a material that cannot be removed. . Further, the thickness of these polymer films is preferably 5 to 20 μm, and 7 to 1 μm.
More preferably, it is 6 μm.

Two of these polymer films may be used, one of which may be laminated on both sides of the photosensitive layer as a support for the photosensitive layer and the other as a protective film for the photosensitive layer.

In producing a photoresist image using the photosensitive element of the present invention, if the above protective film is present, after removing the protective film, the photosensitive layer is pressed against a substrate while heating. It is laminated by doing. The surface to be laminated is usually a metal surface, but is not particularly limited.

The temperature of the thermocompression bonding of the photosensitive layer is not particularly limited, but is usually 90 to 130 ° C. Further, the pressure of the thermocompression bonding of the photosensitive layer is not particularly limited, but is usually 1 to 10 k.
gf / cm ² , preferably 3 to 6 kgf / cm ² .

If the photosensitive layer is heated as described above, it is not necessary to preheat the substrate in advance, but the substrate may be preheated to further improve the lamination property.

The photosensitive layer thus laminated is then imagewise exposed to actinic light using a negative or positive film. At this time, if the polymer film present on the photosensitive layer is transparent, it may be exposed as it is, and if it is opaque, it must be removed. In terms of protecting the photosensitive layer, the polymer film is transparent,
It is preferable to expose through the polymer film while the polymer film remains.

As the active light, a light generated from a known active light source, for example, a carbon arc, a mercury vapor arc, a xenon arc or the like is used. Since the sensitivity of the photopolymerization initiator contained in the photosensitive layer is usually maximum in the ultraviolet region, the active light source should be one that effectively emits ultraviolet light.

Those in which the photopolymerization initiator is sensitive to visible light,
For example, in the case of 9,10-phenanthrene quinone or the like, visible light is used as the active light, and as the light source, a photographic flood bulb, a sun lamp, or the like is used in addition to the above.

Next, after exposure, if a polymer film or the like is present on the photosensitive layer, it is removed, and then, using an aqueous alkali solution, for example, spraying, rocking immersion, brushing, scrubbing, etc. The unexposed portion is removed by a known method and development is performed.

Examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium hydroxide, sodium hydroxide and potassium hydroxide, lithium carbonate or bicarbonate, sodium carbonate or deuterium carbonate. Carbonates, alkali carbonates such as potassium carbonate or bicarbonate, potassium phosphate, alkali metal phosphates such as sodium phosphate,
Alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used, and sodium carbonate is particularly preferable.

The pH of the aqueous alkali solution used for development is 9
To 11, and the temperature is adjusted according to the developability of the photosensitive layer.

A surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating the development, and the like may be mixed in the aqueous alkali solution.

Further, when manufacturing a printed wiring board,
The surface of the substrate exposed using the developed photoresist image as a mask is processed by a known method such as etching or plating. The photoresist image is then typically stripped with an aqueous solution that is more alkaline than the aqueous alkaline solution used for development. As this strongly alkaline aqueous solution,
For example, a 1 to 5% by weight aqueous sodium hydroxide solution is used.

[0046]

EXAMPLES Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

Example 1, Comparative Examples 1 to 13 Synthesis of Film-Promoting Polymer (a) 104.4 g of a 3/2 solution (hereinafter referred to as solution II) by weight of methylcellosolve / toluene was placed in a 300 ml flask at 85 ° C. Warm up. After keeping the temperature at 85 ° C. for 30 minutes, a solution B obtained by dissolving 13.0 g of methacrylic acid, 57.3 g of methyl methacrylate, 29.7 g of ethyl acrylate, and 1.3 g of azobisisobutyronitrile in 11.4 g of the solution was dissolved for 4 hours. To cause a drop reaction in the flask. Thereafter, the temperature was kept for 2 hours, and 0.15 g of azobisisobutyronitrile was added to the solution # 3.
The solution was added to 4.2 g of the solution C, and the mixture was further kept warm for 5 hours and then cooled to obtain a film-imparting polymer (a). The methacrylic acid copolymerization amount of the obtained film property imparting polymer (a) was 13% by weight, the weight average molecular weight was 50,000,
The degree of dispersion of the molecular weight was 2.4.

Synthesis of Polymer (b) for Imparting Film Property A solution B to which a dropping reaction was carried out for 4 hours was added with 8.0 g of methacrylic acid,
62.3 g of methyl methacrylate, ethyl acrylate 2
9.7 g and 1.3 g of azobisisobutyronitrile were dissolved in 11.4 g of the solution to obtain a film-imparting polymer (b) under the same method and under the same conditions. The methacrylic acid copolymerization amount of the obtained film property imparting polymer (b) was 8% by weight, the weight average molecular weight was 51,000, and the degree of dispersion of the molecular weight was 2.3.

Synthesis of Film-Promoting Polymer (c) 18 g of methacrylic acid, 52.3 g of methyl methacrylate, 29.times.
7 g and 1.3 g of azobisisobutyronitrile in solution # 1
A film-imparting polymer (c) was obtained in the same manner and under the same conditions except that the polymer was dissolved in 1.4 g. The methacrylic acid copolymerization amount of the obtained film property imparting polymer (c) is
18% by weight, the weight average molecular weight was 49,000, and the degree of dispersion of the molecular weight was 2.4.

Synthesis of Film-Promoting Polymer (d) The azobisisobutyronitrile content in Solution B was adjusted to 0.5
g, the content of azobisisobutyronitrile in Solution C was set at 0.
A film-imparting polymer (d) was obtained in the same manner and under the same conditions except that the amount was changed to 05 g. Methacrylic acid copolymerization amount of the obtained film property imparting polymer (d) was 13% by weight,
The weight average molecular weight is 82,000 and the degree of molecular weight dispersion is 2.
It was 5.

Synthesis of Polymer (e) for Imparting Film Property The azobisisobutyronitrile content in the solution B was 5.3.
g, the content of azobisisobutyronitrile in Solution C was set at 0.
A film-imparting polymer (e) was obtained in the same manner and under the same conditions except that the amount was changed to 5 g. The resulting film-forming polymer (e) had a methacrylic acid copolymerization amount of 13% by weight, a weight average molecular weight of 25,000, and a degree of molecular weight dispersion of 2.3.
Met.

Synthesis of Film-Promoting Polymer (f) The synthesis temperature was 70 ° C., the azobisisobutyronitrile content in solution B was 1.0 g, and the azobisisobutyronitrile content in solution C was 0.1 g. The same way, except that
Under the conditions, a film-imparting polymer (f) was obtained. The methacrylic acid copolymerization amount of the obtained film property imparting polymer (f) was 13% by weight, the weight average molecular weight was 51,000, and the degree of dispersion of the molecular weight was 1.7.

Synthesis of Film-Promoting Polymer (g) The synthesis temperature was 95 ° C., the azobisisobutyronitrile content in solution B was 1.6 g, and the azobisisobutyronitrile content in solution C was 0.20 g. A film imparting polymer (g) was obtained in the same manner and under the same conditions as described above. The methacrylic acid copolymerization amount of the obtained film property imparting polymer (g) was 13% by weight, and the weight average molecular weight was 50,000.
0 and the degree of dispersion of the molecular weight was 3.3.

Preparation of photosensitive element and evaluation of properties A solution of the photosensitive resin composition having the composition shown in Tables 1 and 2 was dried on a polyethylene terephthalate film (Lumirror (registered trademark) manufactured by Toray Industries, Inc.) having a thickness of 16 μm. Coating was performed to a thickness of 30 μm, followed by drying and coating with a 25 μm-thick polyethylene film to obtain a photosensitive element. While peeling off the polyethylene film from the obtained photosensitive element, the surface of the photosensitive layer was polished by Scotchbright (registered trademark) Bafrol (manufactured by Sumitomo 3M), dried and washed on the copper surface of the copper-clad laminate, and then subjected to Hitachi high temperature laminator. Were continuously laminated to obtain a test piece. Table 3 shows the lamination conditions.

The test piece was exposed at 40 mJ / cm ² by means of an ultra-high pressure mercury lamp through a 21-step tablet and an adhesion and resolution test pattern. After standing for 10 minutes, the polyethylene terephthalate film was peeled off and developed with a 1% by weight aqueous sodium carbonate solution at 30 ° C. for a minimum development time of 2.0 × development time, and the number of curing steps of the step tablet, the adhesion of the resist and the resolution were read. . What is the minimum development time?
It means the minimum time required to dissolve and remove the uncured resist. Table 4 shows the results. In Table 4, L means the line width of the resist, and S means the width of the space between the resists.

Further, a photosensitive element is laminated on a copper-clad laminate having a through-hole of 3.2 mmφ in the same manner as described above, and a colorless and transparent 175 μm PET film is interposed therebetween.
Exposure and development were performed in the same manner as described above. Then 2.0mm
A steel rod of φ was pressed onto the film on the through-hole (displacement speed 2 cm / min), and the strength at which the film was broken (film strength of the resist) was measured. Table 4 shows the results.

The coloring was determined by visually observing the contrast between the resist pattern after development and copper, and the results are shown in Table 4. In Table 4, ○ means that the contrast is good, and × means that the contrast is low, and it is difficult to confirm whether or not a desired pattern is accurately formed at a desired position.

[0058]

[Table 1]

[0059]

[Table 2]

[0060]

[Table 3]

[0061]

[Table 4] As apparent from Table 4, the photosensitive resin composition of the present invention and the photosensitive element using the same have particularly excellent adhesion, resolution, and film strength as compared with the others.

[0062]

According to the present invention, a photosensitive resin composition having particularly excellent adhesion, resolution and film strength as an etching resist or a plating resist used for production of printed wiring boards, precision processing of metals, and the like. Was obtained.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI G03F 7/027 502 G03F 7/027 502 H05K 3/06 H05K 3/06 H 3/18 3/18 D (72) Inventor Minami Yoshitaka 4-13-1, Higashicho, Hitachi City, Ibaraki Prefecture Inside the Hitachi Chemical Co., Ltd. Yamazaki Plant

Claims (2)

[Claims] (A) (meth) acrylic acid 10 to 15
Weight-average molecular weight obtained by copolymerization of 85-90% by weight of a compound represented by the general formula [I] with a weight-average molecular weight of 30,000-70,000,
The value of the number average molecular weight (degree of dispersion of molecular weight) is 2.0 to 3.0.
50 to 70 parts by weight of a polymer for imparting film properties to (In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 1 to 12 carbon atoms.) (B) At least one kind of ethylenically unsaturated compound represented by the general formula [II] A compound as an essential component, having a boiling point at normal pressure of 100 ° C. or higher and an ethylenically unsaturated compound 30 to
50 parts by weight (provided that the total amount of the components (A) and (B) is 100 parts by weight), (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, and A, B, X and Y each independently represent And k, l, m and n each independently represent an integer of 1 to 5. (C) The photopolymerization initiator is used in a total amount of the components (A) and (B) of 1
0.5 to 10 parts by weight based on 00 parts by weight and (D) a pigment or dye in a total amount of 1 component (A) and 1 component (B)
A photosensitive resin composition containing 0.01 to 3.0 parts by weight based on 00 parts by weight. 2. A photosensitive element obtained by applying and drying the photosensitive resin composition according to claim 1 on a support.