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JPH1172627A - Method for packaging fiber type optical device - Google Patents

Method for packaging fiber type optical device

Info

Publication number
JPH1172627A
JPH1172627A JP9231212A JP23121297A JPH1172627A JP H1172627 A JPH1172627 A JP H1172627A JP 9231212 A JP9231212 A JP 9231212A JP 23121297 A JP23121297 A JP 23121297A JP H1172627 A JPH1172627 A JP H1172627A
Authority
JP
Japan
Prior art keywords
optical device
type optical
circuit board
electric circuit
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9231212A
Other languages
Japanese (ja)
Inventor
Hiroshi Fujimoto
寛 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP9231212A priority Critical patent/JPH1172627A/en
Publication of JPH1172627A publication Critical patent/JPH1172627A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Landscapes

  • Light Guides In General And Applications Therefor (AREA)

Abstract

PROBLEM TO BE SOLVED: To facilitate substrate packaging with simple constitution by mounting a fiber type optical device at fixing fittings having solder-fixing terminals. SOLUTION: In the case at least one fiber type optical device 1 is packaged on an electric circuit board 6, the fixing fittings 2 capable of mounting the fiber type optical device 1 therein by a method of tightening the device, etc., are used. The fixing fittings 2 have the solder-fixing terminals 3 treated to allow good soldering by solder plating, etc. The solder-fixing terminals 3 are soldered to solder guide patterns 5 in the state of inserting a low-hardness insulating sheet 4 between the fixing fittings 2 and the electric circuit board 6, by which the fixing fittings 2 mounted with the fiber type optical device 1 may be packaged to the electric circuit board 6. The exertion of influence on the operation of the electric circuits by packaging of the fixing fittings 2 onto the electric circuit board 6 is eliminated by using the low-hardness insulating sheet 4 between the electric circuit board 6 and the fixing fittings 2 of the fiber type optical device 1.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】 本発明は、機能性光ファイ
バをシリンダ状のケースに封入して使用するファイバ型
光デバイスの電気回路基板上に固定するためのファイバ
型光デバイスの実装方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a fiber-type optical device for fixing a functional optical fiber on an electric circuit board of a fiber-type optical device used by being enclosed in a cylindrical case.

【0002】[0002]

【従来の技術】 光ファイバを用いた通信ネットワーク
の構築において、線路用光ファイバとの良好な接続特性
が得られることから、機能性光ファイバをシリンダ上の
ケースに封入して使用するファイバ型光デバイスが多用
されている。近年では中継装置等の筐体に挿入される電
気回路基板上に前記ファイバ型光デバイスが実装される
ようになってきた。以下、従来のファイバ型光デバイス
の電気回路基板実装方法について図3を参照して説明す
る。この実装方法は樹脂あるいは金属製クランプ材7を
電気回路基板6に形成したスルーホール8に挿入、固定
し、ファイバ型光デバイス1に固定することによってフ
ァイバ型光デバイス1が電気回路基板6に実装される。
さらに別の実装方法として、ファイバ型光デバイス1を
固定用樹脂9を用いて直接電気回路基板6上に固定する
方法がある。
2. Description of the Related Art In the construction of a communication network using optical fibers, good connection characteristics with a line optical fiber can be obtained. Devices are heavily used. In recent years, the fiber-type optical device has been mounted on an electric circuit board inserted into a housing such as a relay device. Hereinafter, a conventional method of mounting a fiber-type optical device on an electric circuit board will be described with reference to FIG. In this mounting method, the fiber-type optical device 1 is mounted on the electric circuit board 6 by inserting and fixing a resin or metal clamp member 7 into a through hole 8 formed in the electric circuit board 6 and fixing the same to the fiber-type optical device 1. Is done.
As still another mounting method, there is a method of fixing the fiber-type optical device 1 directly on the electric circuit board 6 using the fixing resin 9.

【0003】[0003]

【発明が解決しようとする課題】 このように従来のフ
ァイバ型光デバイスの実装方法においてクランプ材7を
用いる場合、電気回路基板6にスルーホール8を形成す
る必要があり、それにより電気回路設計に対して制約を
受けるといった問題が生じる。また固定用樹脂9を用い
る方法では、仕様の変更等によりファイバ型光デバイス
を交換する必要が生じた場合にファイバ型光デバイス1
および電気回路基板6に損傷を与えることなく固定用樹
脂9を除去することが困難であり、さらに金属製のケー
スに封入されたファイバ型光デバイス1であれば電気回
路基板6上の短絡など電気的障害に対する配慮も必要と
なる。そこで、本発明はこのような問題を解決するため
に簡単な構成により電気部品のように基板実装が容易で
ありながら電気回路の回路設計およびその動作に影響を
与えることのない、電気回路基板上へのファイバ型光デ
バイスの固定方法を提供する。
As described above, when the clamp member 7 is used in the conventional method of mounting a fiber-type optical device, it is necessary to form the through hole 8 in the electric circuit board 6, thereby making it difficult to design an electric circuit. On the other hand, there arises a problem of being restricted. In the method using the fixing resin 9, when the fiber type optical device needs to be replaced due to a change in specification or the like, the fiber type optical device 1 can be replaced.
In addition, it is difficult to remove the fixing resin 9 without damaging the electric circuit board 6, and if the fiber type optical device 1 is sealed in a metal case, the short circuit on the electric circuit board 6 may cause an electrical failure. Consideration must also be given to physical obstacles. Therefore, the present invention solves such a problem by using a simple structure on an electric circuit board that does not affect the circuit design and operation of the electric circuit while being easy to mount on an electric board like electric components. Provided is a method of fixing a fiber-type optical device to a fiber.

【0004】[0004]

【課題を解決するための手段】本発明はこれらの課題を
解決するためのものであり、電気回路基板上に少なくと
も一つのファイバ型光デバイスを基板実装のための半田
固定用端子を有する金具の開口部に配設し、前記金具と
前記電気回路基板との間に絶縁体を挿入した状態で前記
金具を前記電気回路基板に半田付けするファイバ型光デ
バイスの実装方法を提供する。
SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and an object of the present invention is to provide a metal fitting having a solder fixing terminal for mounting at least one fiber type optical device on an electric circuit board. A method of mounting a fiber-type optical device, which is disposed in an opening and solders the fitting to the electric circuit board in a state where an insulator is inserted between the fitting and the electric circuit board.

【0005】[0005]

【発明の実施の形態】以下、本発明の実施例について図
面を用いて説明する。図1は本発明の一実施例であるフ
ァイバ型光デバイスの実装方法によって作成されたファ
イバ型光デバイスの構成を示した図であり、図2は本発
明の一実施例であるファイバ型光デバイスの実装方法に
よって作成されるときの分解斜視図である。図1におい
て、本発明のファイバ型光デバイスにおいて、1 はファ
イバ型光デバイス、2 は固定金具、3 は半田固定用端
子、4 は低硬度絶縁シート、5 は半田ガイドパターン、
6 は電気回路基板とから構成されている。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration of a fiber optical device produced by a method of mounting a fiber optical device according to one embodiment of the present invention, and FIG. 2 is a fiber optical device according to one embodiment of the present invention. FIG. 5 is an exploded perspective view when created by the mounting method of FIG. In FIG. 1, in the fiber type optical device of the present invention, 1 is a fiber type optical device, 2 is a fixture, 3 is a solder fixing terminal, 4 is a low hardness insulating sheet, 5 is a solder guide pattern,
6 comprises an electric circuit board.

【0006】図1および図2にもとづいて、実装方法に
ついて説明する。電気回路基板6上に少なくとも一つの
ファイバ型光デバイス1を実装する場合、前記ファイバ
型光デバイスを締め付け等の方法によりその内部に搭載
可能な固定金具2を用いる。前記固定金具2はハンダメ
ッキ等により良好な半田付けが行えるように処理した半
田固定用端子3を有している。前記固定金具2と前記電
気回路基板6との間に低硬度絶縁シート4を挿入した状
態で、前記半田固定用端子3を半田ガイドパターン5に
半田付けすることで、前記ファイバ型光デバイス1を搭
載した前記固定金具2を前記電気回路基板6に実装する
ことができる。
A mounting method will be described with reference to FIGS. 1 and 2. When at least one fiber type optical device 1 is mounted on the electric circuit board 6, a fixing fitting 2 which can be mounted inside the fiber type optical device by a method such as tightening is used. The fixing fitting 2 has a solder fixing terminal 3 which is processed by solder plating or the like so that good soldering can be performed. With the low-hardness insulating sheet 4 inserted between the fixture 2 and the electric circuit board 6, the fiber fixing device 3 is soldered to the solder guide pattern 5 to solder the fiber-type optical device 1. The mounted fixture 2 can be mounted on the electric circuit board 6.

【0007】[0007]

【発明の効果】本発明の請求項1記載のファイバ型光デ
バイス実装方法によれば、ファイバ型光デバイス1を半
田固定用端子3を有する固定金具2に搭載することで、
前記ファイバ型光デバイス1を、前記半田固定用端子3
を半田付け出来るよう生成された半田ガイドパターン5
を有する電気回路基板6上に、電気部品の一つであるか
のように容易かつ確実に、加えて電気的障害を生じるこ
となく実装を行うことが可能となり、さらに前記ファイ
バ型光デバイス1の前記固定用金具2への搭載を着脱可
能な方法とすることによって、仕様変更等の理由による
前記ファイバ型光デバイス1の交換を、前記電気回路基
板6に影響を与えることなく容易に行うことが可能とな
る。
According to the fiber type optical device mounting method according to the first aspect of the present invention, the fiber type optical device 1 is mounted on the fixture 2 having the solder fixing terminals 3 by using
The fiber type optical device 1 is connected to the solder fixing terminal 3.
Guide pattern 5 generated to enable soldering
On the electric circuit board 6 having the above-mentioned structure, it is possible to easily and reliably mount the electric circuit board 6 as one of the electric components without causing any electric trouble. By making the mounting on the fixing fitting 2 detachable, the fiber-type optical device 1 can be easily replaced without affecting the electric circuit board 6 due to a change in specification or the like. It becomes possible.

【0008】次に、請求項2記載のファイバ型光デバイ
スの実装方法によれば、半田固定用端子3を電気回路基
板6の実装面と平行を成す平面とし、さらに前記半田固
定用端子3にハンダメッキを施し、前記電気回路基板6
上に前記半田固定用端子3を半田付けする半田ガイドパ
ターン5を形成することにより、前記電気回路基板6に
スルーホール8を形成することなく、回路設計に制約を
与えることなしに、ファイバ型光デバイスの前記電気回
路基板への半田付けによる表面実装が可能となる。
Next, according to the fiber type optical device mounting method of the second aspect, the solder fixing terminal 3 is a plane parallel to the mounting surface of the electric circuit board 6, and the solder fixing terminal 3 is mounted on the solder fixing terminal 3. Solder plating is applied to the electric circuit board 6
By forming the solder guide pattern 5 for soldering the solder fixing terminal 3 thereon, the through hole 8 is not formed in the electric circuit board 6 and the fiber-type optical Surface mounting of the device by soldering to the electric circuit board becomes possible.

【0009】さらに、請求項3記載のファイバ型光デバ
イスの実装方法によれば、電気回路基板6とファイバ型
光デバイス1の固定金具2との間に挿入する絶縁体に低
硬度絶縁シート4を用いることで、前記電気回路基板6
上への前記固定金具2の実装により電気回路の動作に影
響を与えることなく、さらに前記低硬度絶縁シート4に
適切な厚みを持たせることで、前記固定金具2を実装す
る領域での低背電気部品の有無に関わらず、前記ファイ
バ型光デバイス1の前記電気回路基板6上への実装が可
能となる。
Further, according to the fiber type optical device mounting method of the third aspect, the low hardness insulating sheet 4 is provided on the insulator inserted between the electric circuit board 6 and the fixture 2 of the fiber type optical device 1. By using, the electric circuit board 6
The low-hardness insulating sheet 4 is provided with an appropriate thickness without affecting the operation of the electric circuit by mounting the fixing bracket 2 thereon, so that the low-profile in the mounting area of the fixing bracket 2 is reduced. The fiber-type optical device 1 can be mounted on the electric circuit board 6 irrespective of the presence or absence of electric components.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の一実施例であるファイバ型光デバイ
スの実装方法によって作成されたファイバ型光デバイス
の構成を示した図である。
FIG. 1 is a diagram showing a configuration of a fiber-type optical device created by a method of mounting a fiber-type optical device according to an embodiment of the present invention.

【図2】 本発明の一実施例であるファイバ型光デバイ
スの実装方法によって作成されるときの分解斜視図であ
る。
FIG. 2 is an exploded perspective view when produced by a method of mounting a fiber type optical device according to an embodiment of the present invention.

【図3】 従来のファイバ型光デバイスの実装方法を説
明した図である。
FIG. 3 is a diagram illustrating a conventional method of mounting a fiber-type optical device.

【符号の説明】[Explanation of symbols]

1 …ファイバ型光デバイス 2 …固定金具 3 …半田固定用端子 4 …低硬度絶縁シート 5 …半田ガイドパターン 6 …電気回路基板 7 …クランプ材 8 …スルーホール 9 …固定用樹脂 1… Fiber type optical device 2… Fixing fixture 3… Solder fixing terminal 4… Low hardness insulating sheet 5… Solder guide pattern 6… Electrical circuit board 7… Clamping material 8… Through hole 9… Fixing resin

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電気回路基板上に少なくとも一つのファ
イバ型光デバイスを基板実装のための半田固定用端子を
有する金具の開口部に配設し、前記金具と前記電気回路
基板との間に絶縁体を挿入した状態で前記金具を前記電
気回路基板に半田付けすることを特徴とするファイバ型
光デバイスの実装方法。
At least one fiber-type optical device is provided on an electric circuit board in an opening of a metal fitting having a solder fixing terminal for mounting the board, and insulation is provided between the metal fitting and the electric circuit board. A method of mounting a fiber-type optical device, wherein the metal fitting is soldered to the electric circuit board with a body inserted.
【請求項2】 前記半田固定用端子を電気回路基板の実
装面と平行を成す平面にするとともに前記半田固定用端
子にハンダメッキを施すことによって前記電気回路基板
上に前記半田固定用端子を半田付けする半田ガイドパタ
ーンが形成されていることを特徴とする請求項1記載の
ファイバ型光デバイスの実装方法。
2. The method according to claim 1, wherein the solder fixing terminal is formed on a plane parallel to a mounting surface of the electric circuit board, and the solder fixing terminal is solder-plated on the electric circuit board. 2. The method for mounting a fiber-type optical device according to claim 1, wherein a solder guide pattern to be attached is formed.
【請求項3】 前記電気回路基板とファイバ型光デバイ
スの固定金具との間に挿入する絶縁体に低硬度絶縁シー
トを用いることを特徴とする請求項1記載のファイバ型
光デバイスの実装方法。
3. The method for mounting a fiber-type optical device according to claim 1, wherein a low-hardness insulating sheet is used as an insulator inserted between the electric circuit board and a fixture of the fiber-type optical device.
JP9231212A 1997-08-27 1997-08-27 Method for packaging fiber type optical device Pending JPH1172627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9231212A JPH1172627A (en) 1997-08-27 1997-08-27 Method for packaging fiber type optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9231212A JPH1172627A (en) 1997-08-27 1997-08-27 Method for packaging fiber type optical device

Publications (1)

Publication Number Publication Date
JPH1172627A true JPH1172627A (en) 1999-03-16

Family

ID=16920095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9231212A Pending JPH1172627A (en) 1997-08-27 1997-08-27 Method for packaging fiber type optical device

Country Status (1)

Country Link
JP (1) JPH1172627A (en)

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