JPH1152000A - Inspection device and inspection method for printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an inspection surely and quickly by holding an inspection head rockably relative to an inspection table, and positioning the inspection head to a prescribed inspection position while moving it to the inspection position. SOLUTION: An inspection table device 7 can move a lower inspection head to a position facing an upper inspection head device 4 for positioning via the rotation of a knob. The upper inspection head device 4 holds an upper inspection head 17 at a prescribed position while elastically exciting it with an inspection head holding device. An inspection head positioning guide device 62 positions and guides the upper inspection head 17 to a prescribed inspection position by inserting a guide pin 63 into a guide hole 64 when the upper inspection head device 4 is lowered. When the upper inspection head device 4 is continuously lowered, probe needles 26 of the upper inspection head 17 and a lower inspection probe are brought into contact with the inspection contacts of a wiring board 49. The inspection probes are excited in this state, and the inspection of the printed wiring board 49 is made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for inspecting a printed wiring board. More specifically, the inspection head that holds the inspection probe is swingably held, and the inspection head and the inspection probe are guided to a predetermined inspection position with high accuracy at the time of inspection, so that the inspection operation can be performed with high accuracy and speed. The present invention relates to an inspection apparatus and an inspection method for a printed wiring board.

[0002]

2. Description of the Related Art A printed wiring board employed in various electronic devices is formed by forming a circuit pattern on or inside an insulating substrate, and electronic components such as semiconductors are connected to connection terminals provided on the surface. The electronic device is configured by mounting.

In recent years, with the progress of miniaturization of products,
2. Description of the Related Art High-density packaging technology for electronic components has had a great influence on product development. That is, by employing an MCM (multi-chip module) or the like in which bare chips are directly connected on a multilayer wiring board, the mounting density of electronic components mounted on the printed wiring board is increased, and the interval between connection terminals of each electronic component is reduced. The distance between the conductive patterns formed on the substrate has been reduced accordingly.

[0004] In order to inspect a connection failure of a conductive pattern or the like on such a printed wiring board, for example, an inspection apparatus as described in JP-A-4-95881 is used. This inspection device is configured so that the inspection probe with a spring is brought into contact with the connection terminal or through hole of the printed wiring board to electrically detect the connection state of the conductive pattern. It is provided with an inspection head in which inspection probes are arranged with high accuracy. The inspection head is held on a stand or the like so as to be able to reciprocate in the vertical direction. By bringing the inspection head close to the printed wiring board, an inspection probe is brought into contact with the printed wiring board to perform an inspection.

In the above-described inspection apparatus for a printed wiring board, an inspection probe must accurately contact an inspection contact on the board. For this reason, in the conventional inspection apparatus described in the above-mentioned publications, various methods for improving the positioning accuracy of the printed wiring board to be inspected and the positioning accuracy of the inspection head are employed.

[0006]

In the above-mentioned conventional inspection apparatus, a high-precision guide device is employed to secure the positioning accuracy of the inspection head, and the printed wiring board is accurately positioned on the inspection table. The inspection of the printed wiring board is performed by sliding the inspection head along the guide surface of the guide device between the inspection position and the retracted position.

As the mounting density of electronic components increases and the spacing between conductive patterns on a printed wiring board decreases, higher positioning accuracy is required by the inspection head, and an expensive guide device must be employed.

Further, since it is necessary to inspect various printed wiring boards on which different conductive patterns are formed by using one inspection apparatus, it is necessary to make the inspection head detachable. For this reason, a high accuracy is also required for the inspection head attaching / detaching mechanism.

Furthermore, the printed wiring board must be positioned on the inspection table with high accuracy. For this reason,
High precision is also required for a printed wiring board positioning device. Therefore, an inspection apparatus for inspecting a printed wiring board having a high mounting density is extremely expensive.

Further, in order to cope with high-mix low-volume production and increase production efficiency, a so-called multi-cavity printed wiring board, in which conductive patterns corresponding to a plurality of electronic devices are formed on one substrate, is sometimes manufactured. More. On such a multi-cavity substrate, conductive patterns corresponding to several to several tens of electronic devices are formed, and in order to perform inspection at a time, an extremely large number of conductive patterns corresponding to these conductive patterns are provided to an inspection head. Contact probes must be implanted. For this reason, a large number of contact probes must be arranged with high accuracy, and the manufacturing cost of the inspection apparatus increases.

The present invention has been conceived in view of the above-mentioned circumstances, and solves the above-mentioned conventional problems. The present invention can accurately and quickly guide an inspection head and an inspection probe to a predetermined inspection position. It is an object of the present invention to provide a printed wiring board inspection apparatus and an inspection method capable of performing a simple inspection and inspecting a multi-cavity board very easily and at low cost.

[0012]

Means for Solving the Problems To solve the above problems, the present invention takes the following technical means.

According to a first aspect of the present invention, there is provided an inspection table for positioning and holding a printed wiring board at a predetermined inspection position, and an inspection head for holding a plurality of inspection probes so as to be able to contact and separate from the printed wiring board. An inspection device for a printed wiring board, comprising: an inspection head holding device that holds the inspection head so as to be swingable relative to an inspection table; and the inspection head and / or the inspection probe at a predetermined inspection position. It is provided with guidance means for performing guidance.

According to the present invention, the inspection head is held so as to be swingable relative to the inspection table, and can be accurately positioned at a predetermined inspection position while the inspection head and / or the inspection probe move to the inspection position. With this configuration, the inspection device is intended to be configured without requiring a high accuracy for the mounting structure of the inspection head and the guide device.

Various types of inspection head holding devices can be employed as long as the inspection head can be held swingably. For example, the inspection head can be held via an elastic material such as a spring, or can be held via a ball joint device. Further, it is also possible to use a male-female fitting structure that can swing in a predetermined range.

The swing direction is not particularly limited, and the swing table may be held so as to be able to swing in a horizontal plane facing the inspection table in parallel, or may be held so as to be able to swing in all directions. it can. Further, it can be held so as to be rotatable around an axis parallel to the inspection table.

On the other hand, the swing range is not particularly limited, and may be any range that can absorb the mounting accuracy of the inspection head, an error generated when inspecting the printed wiring board, and the like. In addition, the conductive pattern of the printed wiring board to be inspected,
What is necessary is just to set according to the function etc. of the guidance guide means which guides to an inspection position. In other words, it is only necessary that the guiding head can position the inspection head and the inspection probe at a predetermined inspection position with the finally required accuracy.

Further, it is desirable to add a centering function to the inspection head holding device, which can return to a predetermined standby position and hold the inspection head when the inspection is not performed. For example, it may be configured to return to a predetermined standby position after the inspection by an elastic means such as a spring.

The guiding and guiding means according to the present invention is configured so as to act on the inspection head, the inspection probe, or both, and to position them at a predetermined inspection position.

As the guide means, for example, those according to the invention described in claims 2 to 4 can be employed.

According to the invention described in claim 2 of the present application, the guide means includes a board holding area for integrally attaching and holding the printed wiring board, and a board positioning area arranged around the board holding area. And a plate positioning jig for positioning the printed wiring board at a predetermined inspection position in the substrate positioning area in cooperation with the positioning means provided on the inspection table. In addition, a probe guide hole for guiding each inspection probe to an inspection contact of the printed wiring board is provided in the substrate holding area.

In order to perform a highly accurate inspection, the inspection head and the inspection probe must be accurately positioned, and at the same time, the printed wiring board to be inspected must be accurately positioned.

According to the plate-shaped inspection jig of the present invention, the printed wiring board can be accurately positioned at a predetermined inspection position on the inspection table by the substrate positioning means provided in the substrate positioning area, and the probe formed in the substrate holding area. The guide holes can guide the test probe to the test contacts of the printed wiring board with high accuracy.

Since the plate-shaped inspection jig can be formed by using a resin plate made of polycarbonate or the like or a metal plate, it can be manufactured at extremely low cost.

The printed wiring board integrally held in the board holding area is placed on an inspection table together with a plate-shaped inspection jig, and is integrated with the plate-shaped inspection jig by positioning means provided in the board positioning area. Is positioned at a predetermined position.

Various types of positioning means can be employed. For example, it is possible to provide a conventionally used positioning pin on an inspection table and to provide a positioning hole for engaging with the positioning pin in a substrate positioning area.

By providing the above-mentioned board positioning area, positioning holes and the like can be placed at the most convenient positions for inspection without being affected by the size, shape, conductive pattern, etc. of the printed wiring board to be inspected. Can be provided. In addition, there are almost no restrictions on the size and shape of the positioning means. For this reason, it is possible to accurately position the printed wiring board at a predetermined inspection position.

Various means can be employed as means for integrally holding the printed wiring board on the plate-shaped inspection jig. For example, a printed wiring board can be held using an adhesive tape.

Further, a probe guide hole is formed in the substrate holding area in order to guide the inspection probe provided on the swingably held inspection head to a predetermined inspection contact. The probe guide hole is provided in the substrate holding area in accordance with the inspection contact of the printed wiring board, and is formed to have a shape and a size that allows each contact probe to be inserted and guided. For example, a circular hole having a diameter into which a test probe can be inserted can be formed. By ensuring the dimensional accuracy and the arrangement accuracy of the circular holes, the inspection probe can be accurately guided and guided to the inspection contact with high accuracy.

Further, since the tip of the inspection probe has a chevron shape, even if the center axis of the inspection probe does not coincide with the center of the hole, the tip of the chevron of the inspection probe is located at the edge of the hole. Is brought into contact with a predetermined test contact in such a manner as to be guided. For this reason, even if the guide precision of the inspection head is low, the inspection probe can be reliably guided to the inspection contact.

The inspection head holding the inspection probe can be oscillated by the inspection head holding device. For this reason, even if the inspection probe is displaced by the probe guide hole, an inadvertent force can be prevented from acting on the inspection probe, and the inspection can be reliably performed by preventing the inspection probe from bending. Further, since the inspection probe can be protected from damage or the like, the life of the inspection device can be extended.

Therefore, inspection can be performed even if the arrangement accuracy of the inspection probe or the guidance accuracy of the inspection head is slightly reduced, and high accuracy is not required for the inspection device, and the manufacturing cost of the inspection device is reduced. It becomes possible to reduce.

In the inspection apparatus according to the present invention, the plate-shaped inspection jig and the printed wiring board are integrally joined before the inspection. The printed wiring board and the plate-shaped inspection jig can be quickly and accurately joined by matching the conductive pattern formed on the printed wiring board with the probe guide hole using a microscope or the like. Further, since these joining operations can be performed at a place away from the inspection table, a large number of printed wiring boards can be inspected continuously by preparing a plurality of plate-shaped inspection jigs.

The plate-like inspection jig can be laminated and adhered to one side or both sides of a printed wiring board as required. When the plate-like inspection jig is laminated and attached to one surface of the printed wiring board, an auxiliary plate having only a probe guide hole may be laminated and adhered to the other surface. Of course, plate-like inspection jigs can be provided on both sides of the printed wiring board.

By laminating and attaching the plate-shaped inspection jig and the auxiliary plate to the printed wiring board, an effect of protecting the printed wiring board and the conductive pattern on the surface can be expected when handling the board. Further, even when the conductive pattern is formed on the entire surface of the substrate, the finger does not touch the conductive pattern. Therefore, handling of the substrate becomes easy. In particular, a high effect can be expected on a flexible printed wiring board having flexibility and a ceramic substrate which is easily damaged.

According to the invention described in claim 3 of the present application, the guide means is provided on the inspection head or the inspection table, and when the inspection head approaches the inspection table, the inspection head is moved to a predetermined inspection position. It is configured to include an inspection head positioning guiding device for guiding.

Usually, the inspection head is mounted on a head block connected to the guide device, and is movably held between an inspection position and a retracted position. Therefore, it is only necessary that the positioning can be performed with high accuracy at the inspection position where the inspection probe is brought into contact with the printed wiring board.

The inspection head guiding apparatus according to the present invention acts on the inspection head when the inspection head approaches the inspection table on which the printed wiring board is placed, and guides the inspection head to a predetermined inspection position with high accuracy. It is.

Various types of inspection head positioning / guiding devices can be employed. For example, as in the invention described in claim 4, the inspection head positioning and guiding device includes a guiding pin provided on one of the inspection head and the inspection table, and a guiding hole provided on the other of the inspection head and the inspection table. And can be configured. The test head is positioned at a predetermined test position by engaging the guide pin with the guide hole.

The shapes of the guide pins and the guide holes are not particularly limited, as long as the inspection head can be accurately positioned via the guide pins and the guide holes at the time of completion of the engagement.

For example, while forming a guide hole having a conical recess extending toward the entrance, the tip of the guide pin is formed in a mountain shape, and the guide pin is formed using the inclined surface of the recess. The guide positioning can also be performed at the center position of the concave portion.

According to a fifth aspect of the present invention, there is provided an inspection apparatus for a printed wiring board for inspecting a printed wiring board provided with a plurality of inspection areas corresponding to a plurality of electronic devices. While providing the inspection probe corresponding to one inspection area, the substrate positioning means is configured to sequentially perform inspection by sequentially positioning each inspection area of the printed wiring board at a predetermined inspection position facing the inspection probe. Is what it is.

The present invention corresponds to a so-called multi-cavity printed wiring board in which conductive patterns corresponding to a plurality of electronic devices are formed on one printed wiring board.

Conventionally, an inspection of a multi-cavity substrate corresponding to the plurality of electronic devices has been performed at once by using an inspection head having an inspection probe corresponding to all of the plurality of conductive patterns. For this reason, it was necessary to provide an extremely large number of inspection probes in the inspection head. As a result, high precision is required for the inspection head and the guide device, which makes the inspection device extremely expensive, and cannot be applied to printed wiring boards for electronic devices that are manufactured in small quantities.

According to the present invention, by using a plate-shaped inspection jig, an inspection area corresponding to one electronic device is sequentially positioned at an inspection position by using an inspection device provided with an inspection head corresponding to one electronic device. It is configured so that a multi-piece substrate can be inspected.

In the inspection apparatus according to the present invention, positioning means for sequentially positioning the inspection areas corresponding to the plurality of electronic devices at predetermined inspection positions on the inspection table are provided in the positioning area of the plate-shaped inspection jig. That is, by this positioning means, the printed wiring board is
The inspection is performed at a plurality of positions on the inspection table.

The work of positioning the plate-shaped inspection jig can be performed directly by an operator using a hand or automatically by using a stepping motor or the like.

With the above configuration, the cost of the inspection apparatus can be significantly reduced, the inspection accuracy can be ensured, and it is possible to cope with the inspection of printed wiring boards that are produced in a large variety and in small quantities. .

As positioning means for positioning the multi-cavity printed wiring board, for example, positioning pins provided on the inspection table, and a plurality of sets of positioning pins provided in the positioning area corresponding to the respective inspection areas of the printed wiring board. Holes and holes can be employed. By sequentially engaging the positioning pins with the positioning holes, each inspection area of the printed wiring board can be sequentially positioned at a predetermined inspection position via the plate-shaped inspection jig.

In the plate-shaped inspection jig according to the present invention, since there is almost no limitation on the area for forming the positioning holes, a problem may occur even if a large number of positioning holes corresponding to a plurality of inspection areas are formed. There is no.

In addition, the inspection head and the inspection probe
The inspection head positioning and guiding device and the plate-shaped inspection jig surely guide the inspection contact to the inspection contact point. Therefore, even if the inspection is repeatedly performed, the inspection accuracy does not decrease.

The invention described in claim 6 of the present application includes an inspection table for positioning a printed wiring board at a predetermined inspection position, and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. An inspection method for a printed wiring board, wherein the inspection head is held so as to be swingable relative to an inspection table, and the inspection head is positioned at a predetermined inspection position when the inspection head is close to the printed wiring board. It is characterized in that an inspection is performed by guiding.

The invention according to claim 7 of the present application is characterized in that when a test probe held by a test head approaches a printed wiring board, each test probe is guided to a predetermined test contact to perform a test. Is what you do.

[0054]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a front view of a printed wiring board inspection apparatus according to the present invention, and FIG. 2 is a side view. As shown in these drawings, an inspection apparatus 1 according to the present embodiment includes a base plate 2 placed on a desk, a stand 3 fixed to the rear of the upper surface of the base plate 2 and standing upright, An elevating block 5 that is held so as to be able to move up and down along with the upper inspection head device 4 and that holds the upper inspection head device 4;
An inspection table device 7 provided at a front portion of the base plate 2 so as to face the inspection plate 2 and holding a lower inspection head 6;
Lifting means 8 for lifting the lifting block 5 along the stand 3;

The lifting block 5 is moved toward and away from the inspection table device 7 along a guide surface 9 provided on the front surface of the stand 3. The elevating means 8 includes an operation arm 10 rotatably provided on a side surface of the stand 3 and a drive mechanism (not shown) provided inside the stand 3. The rotation operation is configured to be converted into a vertical movement of the lifting block 5. The drive mechanism can be configured using a well-known gear mechanism or the like, and is configured such that the elevation block 5 is lowered along the guide surface 9 by rotating the operation arm 10 toward the user. .

The inspection table device 7 is held on the base plate 2 via an XY positioning device 11, and a knob 1
The lower inspection head 6 held by the inspection table device 7 is moved by rotating the second and the second inspection device 13 so that the lower inspection head 6 can be positioned at a position facing the upper inspection head device 4.

FIG. 3 shows a sectional structure of the upper inspection head device 4, and FIG. 4 shows a sectional structure of the inspection table device 7.

As shown in FIG. 3, the upper inspection head device 4
Is a cylindrical mounting block 15 fixed to a fixing device 14 provided on the lifting block 5, and a mounting plate integrally joined to the lower surface of the mounting block 15 and brought into contact with the lower surface of the lifting block 5. 16 and an upper inspection head 17 facing the inspection table device 7
And the upper inspection head 17 is attached to the mounting plate 16.
And an inspection head holding device 18 for holding the inspection head in a swingable manner.

The upper inspection head 17 includes a contact plate 19 and a backup plate 2 laminated and fixed thereto.
0 and a probe holding plate 23. A gap 2 for reducing the weight is provided inside the contact plate 19.
1 is formed.

On the other hand, the probe holding plate 23
The backup plate 20 is supported via a plurality of columns 22.
The tip of the inspection probe 24 implanted in the probe holding plate 23 is connected to the contact plate 19.
Are protruded downward through the through holes provided in the holes.

The inspection probe 24 has a well-known structure, and includes a cylindrical tube 25 whose base end is held by the probe holding plate 23, a probe needle 26 which is held inside the cylindrical tube so as to be able to protrude and retract within a predetermined range. And a spring (not shown) for urging the probe needle toward the open end. The distal end of the probe needle 26 is pressed against an inspection contact of a printed wiring board, and an inspection signal can be taken out via a lead wire 27 connected to a base end of the inspection probe.

The inspection head holding device 18 includes a core plate 29 connected and fixed to the upper surface of the backup plate 20 via a spacer 28, and a core plate 2
9 is provided so as to swingably accommodate 9, and a cover plate 32 that covers an upper opening of a core accommodation hole 31 formed in the holding plate 30, wherein the cover plate 32 and the mounting plate 16 It is connected and fixed via a column 33 of the book.

The inner dimension of the core receiving hole 31 is formed slightly larger than the outer dimension of the core plate 29, and the lower opening 34 is formed smaller than the vertical and horizontal dimensions of the core plate 29. I have. Thus, the core plate 29 is swingably held in the core receiving hole 31.

A spacer 28 provided between the core plate 29 and the backup plate 20
Is set to a height at which a gap can be formed between the upper surface of the backup plate 20 and the lower surface of the holding plate 30. This gap is set to be larger than the difference between the height of the core receiving hole 31 and the height of the core plate 29.

Further, the side of the core plate 29,
Between the side faces of the core receiving hole 31, four springs 35 for urging the core plate 29 toward the center of the core receiving hole 31 are provided. With the above configuration, the upper inspection head 17 is swingably held while being elastically biased to a predetermined position.

By the spring 35, the entire upper inspection head including the core plate 29 is held at a predetermined standby position in a natural state. Also, even if displacement occurs during inspection,
It is returned to the standby position.

Since the upper inspection head is positioned and held at a predetermined standby position by the centering function of the spring 35, initial adjustment work and the like by the XY positioning device 11 can be easily performed.

As shown in FIG. 4, the inspection table device 7
Is the base plate 3 fixed on the positioning device 11
6, a table plate 38 supported on the base plate 36 via a plurality of columns 37, and a table plate 38
And a lifting plate 39 which is held at a predetermined height elastically on the upper surface of the lifting plate.

A lower inspection head 6 is provided below the center of the table plate 38. This lower inspection head 6
Is a mounting plate 40 mounted on the lower surface of the table plate 38, and a plurality of columns 4
A probe holding plate 42 supported via the first plate 1 is provided with a base end portion of the inspection probe 43 implanted in the probe holding plate 42 and a probe needle 26 at the tip end is passed through the table plate 38. It protrudes upward from the upper surface through the insertion hole. Note that the structure and mounting structure of the inspection probe 43 are the same as those provided in the upper inspection head device 4, and a description thereof will be omitted.

The lift plate 39 is configured to be held at a predetermined height from the table plate 38 by a float 44 that is projected while being elastically urged from the table plate 38.

As shown in FIG. 4, the float 44 is held in a cylindrical holding cylinder 45 in a state of being elastically urged by a spring 46. The holding cylinder 45 is fitted and fixed in a fitting hole 47 formed in the table plate 38,
The head of the float 44 protrudes from the upper surface of the table 38 at a predetermined height.

The float 44 is held by a spring 46 so as to be able to protrude and retract from the upper surface of the table plate 38, and the tip of the probe needle 26 is lifted up to a position where it is relatively lowered from the upper surface of the plate 39. The lifting plate 39 is configured to be lifted.

In the inspection apparatus 1 according to the present invention, the printed wiring board 49 to be inspected is positioned and mounted on the inspection table apparatus 38 via the plate-shaped inspection jig 48 and held by the upper inspection head apparatus 4. Inspection probe 24 and inspection probe 4 held by lower inspection head 6
3 is contacted from above and below to perform an inspection.

As shown in FIGS. 5 and 6, the plate-like inspection jig 48 according to the present embodiment has a rectangular shape and is formed of a polycarbonate transparent plate having a thickness of about 0.5 mm. I have. This plate-shaped inspection jig 48
The board holding area 5 for holding the printed wiring board 49
0 is provided in the center portion, and a substrate positioning region 52 in which a plurality of positioning holes 51a to 51i are respectively formed is provided on both sides of the substrate holding region 50.

On the other hand, as shown in FIG. 4, the table plate 38 has four positioning holes 51a to 51i.
The positioning pins 53 are protruded.

The positioning pin 53 is housed in a cylindrical holding cylinder 54 so as to be resiliently urged by a spring 55 so as to be able to protrude and retract within a predetermined range. The holding cylinder 54 is fitted and fixed in a fitting hole 56 formed in the table plate 38, so that the positioning pins 38 protrude from the surfaces of the table plate 38 and the floating plate 39 and are held. Positioning hole 51 of the plate-shaped inspection jig 48
The plate-like inspection jig 48 and the printed wiring board 49 held by the jig 48 are positioned at predetermined positions on the table plate 38 by engaging the positioning pins 53 with a to 51i.

The protrusion height of the positioning pin 53 is shown in FIG.
In the inspection state of the printed wiring board 49 shown in (1), the plate-like inspection jig 48 is set so as to be deeply engaged in the positioning holes 51a to 51i so as to be immovably positioned and fixed. On the other hand, in the positioning state shown in FIG.
i, the spring 5
5 can easily be released against the elasticity of 5.

In this embodiment, using the positioning pins 53 and the plate-like inspection jig 48, a printed wiring board 49 having nine inspection areas 57a to 57i, in other words, a nine-piece printed wiring board Each inspection area of the substrate is configured to be inspected by upper and lower inspection heads 4 and 6 each having an inspection probe corresponding to one inspection area.

That is, as shown in FIG. 5, the plate-shaped inspection jig 48 according to the present embodiment is provided with positioning holes 51a at pitches corresponding to the above-described inspection areas 57a to 57i.
The positioning holes 51a to 51i are formed on both sides, and the positioning holes 53a to 51i are sequentially engaged with the positioning pins 53 on the left and right.
Can be sequentially positioned at the inspection positions facing the upper and lower inspection heads 4 and 6.

For example, with the upper inspection head device 4 shown in FIG. 8 raised, the four positioning pins 53 provided on the front, rear, left and right of the lower inspection head 6 are connected to the left and right 51e of FIG.
The center inspection area 57e can be positioned at the inspection position facing the inspection heads 4 and 6 by engaging with the positioning holes indicated by.

In this embodiment, the inspection is performed by attaching and holding the printed wiring board 49 to the lower surface of the plate-shaped inspection jig 48. As shown in FIG. 5, a printed wiring board 49 is provided in the board holding area 50 of the plate-shaped inspection jig 48.
A pair of openings 58 for adhering and fixing are formed. As shown in FIG. 7, the adhesive tape 59 is hung on the plate-shaped inspection jig 48 and the printed wiring board 49 through the openings 58. The printed wiring board 49 is stuck and held on the plate-shaped inspection jig 48 by sticking it in a bridging manner. Thereby, as shown in FIGS. 5 and 6, the printed wiring board 49 and the plate-shaped inspection jig 48 are integrally bonded and bonded.

By using the adhesive tape 59, the work of attaching the printed wiring board 49 to the plate-like inspection jig 48 can be easily performed.

Further, as shown in FIGS. 8 and 12, probe guide holes 60 corresponding to the test contacts of the printed wiring board 49 are provided in the substrate holding region 50 of the plate-like test jig 48. It is formed in a portion corresponding to 57a-57i. This probe guide hole 60 is
As shown in FIG. 12, the probe needles 26 are formed with an inner diameter slightly larger than the outer diameter of the probe needles 26, and even if the arrangement accuracy of the inspection probes 24 is slightly reduced, each probe needle 26 can be inspected by a predetermined inspection It is possible to surely guide to the contact point.

That is, as shown in FIG. 12, since the tip of the probe needle 26 has a chevron shape,
Even if the center axis of the needle does not coincide with the center of the probe guide hole 60, the tip of the probe needle 26 is guided to the edge 61 of the probe guide hole 60 while being displaced in the direction of the arrow so as to be guided. Then, it is brought into contact with a predetermined inspection contact. For this reason, even if the inspection head is not accurately located at the inspection position, the probe needle can be reliably guided to the inspection contact.

Further, since the probe needle 26 during the inspection can be protected, even if the inspection probe 24 is displaced, the probe needle 26
Can be prevented from being bent or damaged. Further, since the probe guide hole 60 is formed with high precision corresponding to the size of each test contact, the probe guide hole 60 and the test contact on the printed wiring board 49 are overlapped to form a printed wiring. The substrate 49 can be positioned and held on the plate-shaped inspection jig 48 with high accuracy.

Further, in the present embodiment, there is provided an inspection head positioning / guiding device 62 which can guide and position the upper inspection head device 4 to a predetermined inspection position.

The inspection head positioning guiding device 62
As shown in FIG. 8 to FIG.
And a guide hole 64 provided in the inspection table 38.

As shown in FIGS. 3 and 8, the guide pin 63 has a tip portion formed in a mountain shape, and can be retracted within a predetermined range while being elastically biased by a spring 66 in a cylindrical holding cylinder 65. Is held in. By fitting the holding cylinder 65 into fitting holes 67 provided at four corners of the upper inspection head 17, the guide pins 63 are moved to the upper inspection head 1.
7 is held in a state where it protrudes from the lower surface by a predetermined length.

On the other hand, as shown in FIG. 8, a guide hole 6 is provided in a portion of the table plate 38 facing the guide pin 63.
4 are formed. The guide hole 64 includes a conical inclined surface 68 that extends upward and a through hole 69 that penetrates downward. The inner diameter of the uppermost part of the guide hole 64 is set to be larger than the outer diameter of the guide pin 63.

When the upper inspection head device 4 is lowered by rotating the operation arm 10 from the substrate positioning state shown in FIG. 8, the tip of the guide pin 63 is formed on the plate-like inspection jig 48. After passing through the escape hole 70 and the escape hole 71 formed in the lift plate 39, the guide hole 64 is engaged with the guide hole 64. At this time, as shown in FIG. 10, even if the center axis of the guide pin 63 and the axis of the guide hole 64 are displaced, the tip of the guide pin 63 is guided by the inclined surface 68 as it engages. The axes are displaced to coincide. On the other hand, since the upper inspection head 17 is swingably held by the inspection head holding device 18, the guide pin 63 is moved from the position shown by the phantom line in FIG.
Is displaced by an amount (H) displaced in the lateral direction, and the positioning is guided to a predetermined inspection position.

When the inspection head 4 is further lowered, as shown in FIG. 12, the tips of the probe needles 26 projecting from the upper inspection head 17 are brought into contact with the plate-like inspection jig 4.
8 and comes into contact with the inspection contacts on the upper surface of the printed wiring board 49 while the lower surface of the upper inspection head 17 presses the plate-shaped inspection jig 48 and the printed wiring board 49 downward. As a result, the lift plate 39 supported by the float 44 is also displaced downward, and the probe needle 26 of the lower inspection probe 43 projects upward from the lift plate 39 and comes into contact with the inspection contact on the lower surface of the printed wiring board 49. . In this state, the inspection probes 24 and 43 are energized, and the printed wiring board 49 is inspected.

When the operation arm 10 is rotated to raise the upper inspection head device 4 after the inspection is completed, the probe needle 26 of the upper inspection probe 24 comes out of the probe guide hole 60, and the floating is pressed by the float 44. The plate 39 rises from the table plate 38, and the probe needle 26 of the lower inspection probe 43 is separated from the printed wiring board 49. Thereafter, the guide pin 63 comes out of the guide hole 64 and returns to the state shown in FIG. Also,
The upper inspection head 17 is moved by the elasticity of the spring 34.
It is returned to a predetermined standby position.

In the state shown in FIG. 8, the head of the positioning pin 53 is engaged with the positioning hole 51e, and the plate-like inspection jig 48 is temporarily fixed. Therefore,
The engagement between the positioning pin 53 and the positioning hole 51e is
It can be easily released against the elasticity of the positioning pin 53. For this reason, the plate-shaped inspection jig 48 can be moved in the horizontal direction, and the next inspection area can be positioned at the inspection position. On the other hand, the elasticity of the positioning pins 53 allows the temporary fixing to the desired inspection position stepwise, so that the work of positioning the plate-shaped inspection jig 48 can be easily performed.

As described above, in the present embodiment, the upper inspection head 17 held swingably is guided and positioned to a predetermined inspection position by the inspection head positioning and guiding device 62, and then each of the upper probe needles is moved. 26 can be guided to a predetermined inspection contact point of the printed wiring board 49 via the probe guide hole 60 formed in the plate-shaped inspection jig 48. That is, the upper inspection head 17 and the inspection probe 60 can be positioned in two stages by the inspection head positioning guiding device 62 and the probe guide hole 60. In the embodiment, the upper inspection head 1 is controlled by the inspection head positioning guiding device 62.
7 can be positioned with respect to a predetermined inspection position with an error of 0.5 mm.
It is configured so that positioning can be performed up to an error within μm.

For this reason, even if the swing range of the upper inspection head 17 is set large, the inspection can be performed with high accuracy. Further, even if the inspection is repeatedly performed, the positioning accuracy does not decrease. In addition, it is not necessary to increase the accuracy of the guide device for the inspection head, and the cost of the inspection device can be greatly reduced.

The scope of the present invention is not limited to the above embodiment.

In the embodiment, the present invention is applied to a nine-piece printed wiring board. However, the present invention is applied to a single-piece printed wiring board or a multi-piece printed wiring board corresponding to ten or more electronic devices. Can be applied.

In the embodiment, a plate-shaped inspection jig made of a transparent resin material is used, but other plate-shaped materials such as a metal material can be used.

The method of joining the printed wiring board and the plate-shaped inspection jig is not limited to the above embodiment, and can be joined using, for example, positioning holes formed in the printed wiring board.

Further, in the embodiment, the opening 75 for contacting the lower probe needle 26 with the printed wiring board 49 is provided at the center of the floating plate 39, but the opening is not provided. An inspection probe guide hole similar to that provided in the shape inspection jig may be formed so that the probe needle can be guided and guided.

The shape of the probe guide hole is not limited to the embodiment, but can be changed according to the shape of the inspection probe. For example, a guide surface having a conical inner surface may be formed at the entrance of the probe needle so as to cope with a case where the probe needle is largely displaced from the inspection position.

Further, the inspection head holding device is not limited to the embodiment. For example, as shown in FIG. 13, a core 72 having an upper inspection head 17 having an inverted conical outer surface is provided.
On the other hand, a holding hole 73 having a conical inner surface corresponding to the outer surface of the core 72 may be formed in the holding plate 30, and the core 72 may be held in the holding hole 73.

In this case, as shown by the imaginary line in FIG. 13, the core 72 is displaceably held in the holding hole 73, and when no inspection is performed, the core 72 is
Is displaced downward by gravity, and the axes of the core 72 and the holding hole 73 are matched by gravity by the conical side surface, and are held at a predetermined standby position. Therefore, it is convenient for the work of positioning the table device and the like.

In the embodiment, both the plate-shaped inspection jig and the inspection head positioning / guiding device are provided as the above-mentioned guidance and guide means, but the inspection head can be positioned by only one of them.

Further, in the embodiment, only the upper inspection head 17 is swingably held, but the lower inspection head may be swingably held. Further, the entire upper inspection head device may be held swingably.

Further, the configuration of the inspection apparatus is not limited to the embodiment, and the present invention is applied as long as the inspection head holding the inspection probe is moved to contact the printed wiring board. be able to.

[Brief description of the drawings]

FIG. 1 is a front view of an inspection device according to the present invention.

FIG. 2 is a side view of the inspection device according to the present invention.

FIG. 3 is an enlarged sectional view of the upper inspection head device 4.

FIG. 4 is an enlarged sectional view of the inspection table device.

FIG. 5 is a plan view in which a printed wiring board is held by a plate-shaped inspection jig.

6 is a side view of the plate-shaped inspection jig shown in FIG.

FIG. 7 is a sectional view taken along line VII-VII in FIG. 5;

FIG. 8 is a cross-sectional view of a main part of the inspection apparatus, showing a state where the upper inspection head device is separated.

FIG. 9 is a cross-sectional view of a main part of the inspection apparatus, showing a state in which a printed wiring board is being inspected.

FIG. 10 is an enlarged cross-sectional view of a main part of FIG. 9, illustrating the operation of the inspection head positioning guidance device.

FIG. 11 is an enlarged view of a main part of FIG. 3, and is a cross-sectional view illustrating an operation of the inspection head holding device.

FIG. 12 is an enlarged cross-sectional view of a main part of FIG. 9, illustrating the operation of a probe guide hole.

FIG. 13 is a sectional view showing another embodiment of the inspection head holding device.

[Explanation of symbols]

 Reference Signs List 1 inspection device 6 lower inspection head 7 inspection table device 17 upper inspection head 18 inspection head holding device 24 inspection probe 43 inspection probe 48 plate-shaped inspection jig 49 printed wiring board 50 substrate holding region 51 positioning hole 52 substrate positioning region 53 positioning pin 57 Inspection Area 60 Probe Guide Hole 62 Inspection Head Positioning Guidance Device 63 Guide Pin 64 Guide Hole

Claims (7)

[Claims] An inspection apparatus for a printed wiring board, comprising: an inspection table capable of positioning and holding a printed wiring board at a predetermined inspection position; and an inspection head for holding a plurality of inspection probes so as to be able to contact and separate from the printed wiring board. An inspection head holding device that holds the inspection head so as to be able to swing relative to an inspection table, and a guide unit that guides the inspection head and / or the inspection probe to a predetermined inspection position. In addition, inspection equipment for printed wiring boards. 2. The method according to claim 1, wherein the guiding and guiding means includes a plate-shaped inspection jig including a board holding area for integrally attaching and holding the printed wiring board, and a board positioning area arranged around the board holding area. In the substrate positioning area, a substrate positioning means for positioning the printed wiring board at a predetermined inspection position in cooperation with the positioning means provided on the inspection table is provided, and in the substrate holding area. Provided with a probe guide hole for guiding each inspection probe to the inspection contact point of the printed wiring board,
The printed wiring board inspection apparatus according to claim 1. 3. An inspection head positioning / guiding device which is provided on the inspection head or the inspection table and guides the inspection head to a predetermined inspection position when the inspection head approaches the inspection table. The printed wiring board inspection device according to claim 1, wherein the inspection device is configured to include the same. 4. The inspection head positioning / guiding device includes a guide pin provided on one of the inspection head and the inspection table, and a guide hole provided on the other of the inspection head and the inspection table. The printed circuit board inspection apparatus according to claim 3, wherein the inspection head is positioned at a predetermined inspection position by engaging the guide pin with the guide hole. 5. A printed wiring board inspection apparatus for inspecting a printed wiring board provided with a plurality of inspection areas corresponding to a plurality of electronic devices, wherein the inspection head includes an inspection probe corresponding to one inspection area. On the other hand, the board positioning means is configured to perform an inspection by sequentially positioning each inspection area of the printed wiring board at a predetermined inspection position facing the inspection probe,
An apparatus for inspecting a printed wiring board according to claim 1. 6. An inspection method for a printed wiring board, comprising: an inspection table for positioning the printed wiring board at a predetermined inspection position; and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. The inspection head is held so as to be relatively swingable with respect to an inspection table, and when the inspection head is close to a printed wiring board, the inspection is performed by positioning and guiding the inspection head to a predetermined inspection position. Inspection method of printed wiring board. 7. When a test probe held by a test head approaches a printed wiring board, each test probe is guided to a predetermined test contact to perform a test.
An inspection device for a printed wiring board according to claim 6.