JPH11340391A - Cooling module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin-type cooling module of high performance by minimizing unevenness which prevents air from flowing, and at the same time by composing a heat sink having a superior heat-uniformity. SOLUTION: A cooling module 100 is provided with a heat reception plate 1, a flat heat pipe 2 buried in the heat reception plate 1, a thin-type directional fan motor (fan motor) 3 having and an intake opening upward and an exhaust opening in one direction of a side surface, and a fin 4 arranged in parallel with the exhaust opening of the fan motor 3. The fan motor 3 is screwed down to the heat reception plate 1, and the fan 4 is welded to the heat reception plate 1. The heat pipe 2 is buried into the heat reception plate 1 while the heat pipe 2 is thermally, mechanically surely fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling module used for an electronic device such as a personal computer, and more particularly to a thin cooling module for an MCM such as a high-performance MPU module which has become increasingly popular in recent years.

[0002]

2. Description of the Related Art Conventionally, an MPU and its peripheral IC have been individually mounted on a motherboard in a personal computer, which is a representative of electronic information equipment, but in response to recent demands for high-speed processing of a large amount of information. With increasing frequency for high-speed operation, noise processing and the like have become more difficult, and the current mainstream is shifting to MPU modules in which the MPU and its peripheral ICs are modularized.

[0003]

However, the above-described structure is an effective countermeasure for speeding up and noise processing, but the integration of heat-generating components poses a major problem in terms of heat countermeasures. ing.

[0004] That is, despite the fact that the mainstream of products is light and thin, the mass of heat-generating components inside a limited storage case becomes a hot spot, which adversely affects peripheral components, and causes a problem from the surface of the case. Making waste heat difficult.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a high-performance thin cooling module by forming a heat sink having excellent uniformity at the same time as minimizing unevenness which hinders the flow of air. Is to make it easier.

[0006]

According to a first aspect of the present invention, a heat receiving plate, a flat heat pipe, a directional fan motor, and fins are provided. At least a part of the heat pipe is equally embedded, and the heat pipe is a cooling module arranged near a heat source and a fin joint. The fin may be joined to the end of the heat receiving plate in parallel with the exhaust port of the fan motor, or the heat receiving plate may be formed of at least two sheets, and a part serving as an air passage may be cut and raised to form a fin. Alternatively, the fins may be joined directly to the surface of the heat pipe.

Further, the fin is formed on a spring base with a claw corresponding to the width of a heat pipe so that the fin can be detached, the fin is formed on a base of a fan motor, and the fin is formed on a fan motor cover. A cooling module according to claim 1.

The fan motor cover may be extended to at least a part of the fin to form an air guide, or a heat radiating portion of the heat pipe may be joined to the fan motor cover.

[0009]

1 shows a cooling module 100 according to a first embodiment of the present invention. FIG. 2 shows a cooling module 1 shown in FIG.
An embodiment in which 00 is applied to a notebook computer will be described.

Referring to FIG. 1 and FIG.
Reference numeral 0 denotes a heat receiving plate 1, a flat heat pipe 2 embedded in the heat receiving plate 1, a thin directional fan motor (hereinafter simply referred to as a fan) having an intake port above and an exhaust port in one side surface. 3) and fins 4 arranged in parallel with the exhaust port of the fan motor 3
It is composed of

The fan motor 3 is fixed to the heat receiving plate 1 with screws, and the fins 4 are welded to the heat receiving plate 1. The embedding of the heat pipe 2 into the heat receiving plate 1 is securely fixed thermally and mechanically by a method described later.

As shown in FIG. 2, the cooling module 100 is arranged on a notebook personal computer by electrically and mechanically joining the MPU module via a connector 202 on a motherboard 201 incorporated in a housing 200. A part of the heat receiving plate 1 is thermally and mechanically joined to the upper surface of the MPU package 301 by screws 303. Here, the MPU itself is a main heating element and a main heat source in the housing 200.

Here, MPU module 300 includes M
In addition to the PU package 301, a peripheral IC group 302 is mounted, and among them, there is one that needs to attach a heat radiating component, and is thermally bonded to the MPU package 301.

Further, if the fan motor 3 of the cooling module 100 is arranged immediately above the MPU package 301, the cooling performance can be expected to be improved. At the same time, since the MPU package 301 is joined to the heat receiving plate 1 and the heat resistance of the drive IC and the bearing of the general fan motor 3 is 60 ° C. or less, it is necessary to indirectly cool the fan motor 3. Furthermore, it is necessary to dispose the exhaust port of the fan motor 3 near the exhaust part 203 of the housing 200 in order to improve the cooling efficiency, and in many cases, it cannot be realized due to the layout.

The heat pipe 2 is used to meet each of the above-mentioned conveniences. That is, the material and dimensions of the heat receiving plate 1 used in the above embodiment are a plate made of aluminum having a width of 60 mm, a length of 100 mm, and a thickness of 1.5 mm. The heat conductivity of the plate itself is 15 W which receives heat from the MPU module 300. Although it cannot carry enough heat to make full use of the cooling capacity of the fan motor 3, it extends from the heat receiving portion of the heat receiving plate 1 across the fins 4 and has a width of 7 mm and a thickness of 1 mm.
The fan motor 3 is directly attached to the MPU module 300 because the heat receiving from the MPU module 300 can be diffused to almost the entire surface of the heat receiving plate 1 by embedding the flat heat pipe 2 having a thickness of not less than 2 mm into the heat receiving plate 1. Although the heat exchange is performed at a temperature that is several steps lower, the heat exchange can be performed at an even temperature including the fins 4. Is shown.

The shape of the flat heat pipe 2 embedded in the heat receiving plate 1 is shown in FIGS. 3, 4 and 5, and the method of embedding the heat pipe 2 is shown in FIG.
7 (a) and 7 (b) and FIGS. 8 (a) and 8 (b).

FIG. 3 shows a heat receiving plate 1 having a hole 5 for mounting an MPU module 300 and a fan motor 3 and a heat pipe 2 in which a straight heat pipe 2 is embedded over substantially the entire length thereof. The heat pipe 2 is deformed into an L-shape so that the heat from the MPU module 300 is sufficiently distributed and embedded in the portion where the fins 4 are attached, and FIG. The end of the heat pipe 2 extends as close as possible to the MPU module 300, and in order to make the shape of the fin 4 versatile, the end of the heat pipe 2 should be about Are exposed in parallel to the ends of.

FIG. 6 showing an embedding method has a burr-like projection 11 in advance along the embedding groove 10 of the heat pipe 2 of the heat receiving plate 1.
Since the heat pipe 2 is finished to a size that fits well, the heat pipe 2 is simply pressed from above after insertion, and the protrusion 11 is crushed above the rounded end of the heat pipe 2 in the width direction. 2 is embedded.

The shape of the heat receiving plate 1 shown in FIG. 6A can be mainly processed by extrusion molding of aluminum. However, in the case of die casting, the shape as shown in FIG. 7A is preferable. That is, the formation of the protrusion along the buried groove 10 of the heat pipe 2 of the heat receiving plate 1 is the same as in FIG. 6, but since the protrusion 12 cannot be formed so as to cover the groove 10, the heat of the protrusion 12 A small groove 13 having the same cross section as the convex cross section of the projection 12 is formed in the direction opposite to the groove 10 to be fitted with the pipe 2.
The protrusions 12 are crushed and spread substantially evenly in the widthwise direction above the heat pipe 2 and in both directions of the small grooves 13, and the heat pipe 2 is embedded.

FIGS. 8 (a) and 8 (b) show a structure in which one heat receiving plate 1 is usually separated into two plates 14 and 15,
Considering the degree of freedom of the shape such as fixing the heat pipe 2 and cutting the fin 4 up the plate 14, the embedding of the heat pipe 2 is performed by previously processing the widthwise end of the heat pipe 2 into the stepped portion 20 or the like. By giving
The plates 14 and 15 can be bonded or caulked, but of course, the stepped portion 20 can be formed at the time of the pressing step at the time of caulking.

Next, a method of forming the fins 4 will be described with reference to FIGS. FIG. 9 shows a structure in which a corrugated fin 40 is joined to an end of the heat receiving plate 1 by welding or the like, and FIG. 10 shows a plate 14 described in FIG.
Each of the end portions of the fins 4 is formed by forming a large number of slit holes 16 by pressing or the like and bending it into an L-shape.

FIG. 11 shows a corrugated fin 40 joined directly onto the heat pipe 2 by welding or the like. FIG. 12 shows a corrugated fin 40 on a spring base 21 with claws corresponding to the width of the heat pipe 2. The corrugated fins 40 are welded, and the heat pipe 2 has the stepped portion 20 as described with reference to FIG.

Each of the fins 4 and the corrugated fins 40 shown in FIGS. 9 to 12 may be directly attached to a top plate or the like to form an air guide, but as shown in FIG. A cover 30 of the motor 3 is provided with a folded portion 31 and an extended portion 32 extending to the corrugated fin 40 is provided.
It is preferable to use an air guide that forms an air passage as shown by.

FIGS. 14A and 14B both show the fin 4 formed by welding a corrugated fin 40 to the end of the cover 30 of the fan motor 3.

In this case, as shown in FIGS. 16 and 17, which are the third and fourth embodiments of the present invention, in order to prevent the fin efficiency from being deteriorated due to the poor heat conduction from the heat receiving plate 1, The heat receiving portion of the heat pipe 2 is embedded in the plate 1, but the heat radiating portion is preferably directly thermally bonded to the fin mounting portion of the fan motor cover 30.

Although not shown, the fins 4 are located between the fan motor 3 and the heat receiving plate 1, that is, the fan motor 3
Of course, it can be configured on the base of

Although the above-described fin shape has mainly been described with reference to the corrugated fins 40, well-known fins such as offset fins and extrusion fins are appropriately used.

[0028]

As described above, according to the present invention, a thin and short cooling module is realized by embedding a flat heat pipe in a heat receiving plate to cool an MCM such as an MPU module, which is increasingly faster, and obstruct the flow of air. There is no projection that interferes with the placement of other electronic components, and even if there is a limited amount of heat-generating components inside the storage enclosure, there is no adverse effect on surrounding components, and the exterior of the enclosure is not affected. An excellent cooling module capable of effectively disposing of waste heat can be provided.

[Brief description of the drawings]

FIG. 1 shows a perspective view of a cooling module according to a first embodiment of the present invention.

FIG. 2 shows a sectional view of an embodiment in which the present invention is applied to a notebook computer.

FIG. 3 shows a perspective view of one embodiment of the embedded shape of the heat pipe of the present invention.

FIG. 4 shows a perspective view of another embodiment of the embedded shape of the heat pipe of the present invention.

FIG. 5 is a perspective view of another embodiment of the embedded shape of the heat pipe of the present invention.

FIG. 6 shows a sectional view of one embodiment of the method of embedding a heat pipe of the present invention.

FIG. 7 is a sectional view of another embodiment of the method for embedding a heat pipe of the present invention.

FIG. 8 is a sectional view showing another embodiment of the method of embedding a heat pipe according to the present invention.

FIG. 9 shows a perspective view of one embodiment of a fin configuration of the present invention.

FIG. 10 shows a perspective view of another embodiment of the configuration of the fin of the present invention.

FIG. 11 shows a perspective view of another embodiment of the fin configuration of the present invention.

FIG. 12 shows a perspective view of another embodiment of the configuration of the fin of the present invention.

FIG. 13 shows a perspective view of another embodiment of the configuration of the fin of the present invention.

FIG. 14 shows a perspective view of another embodiment of the configuration of the fin of the present invention.

FIG. 15 shows a perspective view of a second embodiment of the present invention.

FIG. 16 shows a perspective view of a third embodiment of the present invention.

FIG. 17 shows a perspective view of a fourth embodiment of the present invention.

[Explanation of symbols]

 In the drawings, the same reference numerals indicate the same or corresponding parts. REFERENCE SIGNS LIST 100 cooling module 200 housing 203 exhaust unit 300 MPU module 1 heat receiving plate 2 heat pipe 3 fan motor 4 fin 5 hole 10 groove 11 protrusion 12 protrusion 13 small groove 14, 15 plate 16 slit hole 20 stepped portion 21 spring base with nail Reference Signs List 30 fan motor cover 31 folded part 32 cover extension part 40 corrugated fin

Claims (9)

[Claims] 1. A heat receiving plate, a flat heat pipe, a directional fan motor, and fins, at least a part of the heat pipe being substantially equally buried in a plane of the heat receiving plate, wherein the heat pipe is provided near a heat source and a fin joint. Cooling module placed. 2. A fin is provided in parallel with an exhaust port of a fan motor.
The cooling module according to claim 1, wherein the cooling module is joined to an end of the heat receiving plate. 3. A heat receiving plate comprising at least two heat receiving plates,
2. The cooling module according to claim 1, wherein a part that becomes the air passage is cut and raised to form a fin. 4. The cooling module according to claim 1, wherein the fin is directly joined to a surface of the heat pipe. 5. The cooling module according to claim 4, wherein the fin is formed on a spring base with a claw corresponding to the width of the heat pipe and is detachable. 6. The cooling module according to claim 1, wherein the fin is formed on a base of the fan motor. 7. The cooling module according to claim 1, wherein the fin is formed on a fan motor cover. 8. The cooling module according to claim 1, wherein the fan motor cover is extended to at least a part of the fin to form an air guide. 9. The cooling module according to claim 7, wherein the heat radiating portion of the heat pipe is joined to the fan motor cover.