JPH11330195A - Wafer carrier device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve the low cost of a wafer carrier device and to prevent the contamination of the wafer by providing the orbit and the carrier device for moving a wafer holding tool between an underfloor carrying spaces, and moving the wafer holding tool between a clean room and the underfloor carrying space. SOLUTION: Under a floor where a clean room CR is provided, there is an underfloor carrying space FS, and an orbit 15 is provided. A carrier device 11 is provided so that the device is automatically movable on the orbit 15. The carrier device 11 can hold a wafer holding tool 12 and has a moving and mounting device for automatically moving the wafer holding tool 12 to a loader 13. Furthermore, a lifting and lowering device LF is provided upright in the clean room CR and over the underfloor carrying space FS. Then, in the lifting and lowering device LF, a means, which can lift and lower the wafer holding tool 12, is provided. Thus, the wafer holding tool 12 rises up in the clean room CR and is carried to the specified output port.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a wafer transfer apparatus and a wafer transfer method suitable for transferring a wafer in a clean room.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, for example, in a wafer process, processing equipment for performing a predetermined process on a wafer is installed in a clean room in order to avoid contamination. The clean room used for the wafer process is, for example, HEPA (high efficiency).
ency particulate air-filter) filter and ULPA (ult
Generally, a filter such as a ra low penetration air-filter (filter) is provided on a ceiling portion to blow clean air into a clean room. The transfer of a wafer in such a clean room is performed, for example, by housing the wafer in a cassette holding one or a plurality of wafers and moving the cassette. For example, the transfer of a cassette containing wafers from one working area for performing predetermined processing to another working area for performing predetermined processing in a clean room is described in, for example, Japanese Patent Application Laid-Open No. 3-2088764.
As disclosed in Japanese Unexamined Patent Application Publication No. H11-284, a track can be provided in a clean room, and the transfer can be performed by a transfer device that moves on the track.

[0003]

In the above-described conventional wafer transfer technology in a clean room, the cassette is a so-called open type cassette that simply stores wafers, and is exposed to the air in the clean room. Therefore, in order to prevent the wafer from being contaminated with adhered particles, it is necessary to provide a track near a filter provided in the entire area of the ceiling of the clean room, and move the track on the track.
That is, it is necessary to install the transfer device in the highest area in the clean room. For this reason, it is necessary to widen the clean room by the area where the transfer device is installed, and there is a disadvantage that the cost of the clean room increases. In addition, since the transfer device is provided in a clean room, maintenance work of the transfer device is complicated, and there is a disadvantage that the cost is increased. further,
As the transfer device is used, dust may be generated from the transfer device, and there is a disadvantage that the dust may contaminate the inside of the clean room and the wafer. Further, in the conventional transport device, there is a disadvantage that it is difficult to add or change the transport route, and the addition or change requires a large cost. Further, in the conventional transfer device, since the transfer is performed in the clean room, there is a possibility that a worker (operator) in the clean room may come into contact with the transfer device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above disadvantages, and can reduce the cost of a wafer transfer facility, prevent contamination of a transferred wafer, and easily add or change a transfer route. Accordingly, it is an object of the present invention to provide a wafer transfer device capable of preventing interference with an operator.

[0005]

SUMMARY OF THE INVENTION The present invention provides a wafer holder for holding and holding a wafer in an airtight manner and a plurality of work areas in a clean room, each of which is provided under a floor where the work area and the clean room are installed. A plurality of elevating means capable of transferring the wafer holder to and from the formed transfer space, and a transfer means provided in the transfer space and capable of transferring the wafer holder between the respective elevating means. Have.

According to the present invention, a wafer that has been subjected to predetermined processing in a work area of a clean room is accommodated in a wafer holder and transported to the next step. The transfer of the wafer holder to the next step is carried from the clean room to the transfer space by the elevating means, and then to the other work area by the elevating means provided in another work area by the transfer means of the transfer space. .

[0007] Preferably, the wafer holder is a first wafer holder capable of directly holding the wafer and holding it airtightly, and is capable of holding a wafer cassette capable of holding the wafer and holding it airtight. And a second wafer holder. Further, the first wafer holder is used for transporting a wafer in a work area where a specific process is performed on a wafer in the clean room, and the second wafer holder is
It is used for transferring a wafer through the transfer space between the work areas in the clean room and for transferring a wafer in each work area in the clean room. In such a configuration, the first wafer holder is used to transfer the wafer in the work area in a process where the requirement for preventing contamination of the wafer is higher, and the transfer of the wafer between other work areas and in the work area is performed. Then, a second wafer holder is used. Therefore, in a process in which there is a higher demand for prevention of wafer contamination, wafer contamination is prevented individually, and in other cases, the wafer is transferred via a wafer cassette.

A mounting section for mounting the second wafer holder supplied into the working area by the elevating means, and a wafer cassette mounted on the mounting section being taken out of the second wafer holder; And a transfer means for transferring the wafer cassette to a predetermined position. With this configuration, the worker in the work area transports the wafer transport cart, the wafer cassette is automatically removed from the second wafer holder by the transfer means, and the wafer cassette is moved to a predetermined position. Will be posted.

The transfer means has a track provided in the transfer space, and a transfer device capable of traveling on the track and holding the wafer holder.

The transfer device has a transfer means for transferring the wafer holder held by the transfer device to the elevating means.

The elevating means includes an elevating space for communicating the clean room with the transfer space, an elevating device for elevating the wafer holder in the elevating space between the clean room and the transfer space, Loading means for transferring the wafer holder transferred from the apparatus to the elevator.

An air shower means for blowing air to the wafer holder is provided at an entrance to the lift space on the transfer space side and an entrance to the lift space on the clean room side. With such a configuration, the contaminants adhering to the wafer holder are cleaned by the air shower means, thereby preventing the inside of the clean room from being contaminated.

Air supply means for supplying clean air into the lift space is provided on the clean room side of the lift space of the lift means, and air in the lift space is provided on the transport space side of the lift space. An exhaust means for exhausting to the outside is provided.

At each of the entrances, there are provided shutter means capable of closing the space between the clean room and the elevating space and between the elevating space and the transport space.

The transfer space is formed under a floor of a central passage in the clean room and a plurality of branch passages intersecting the central passage, and the work area is formed in a region defined by the central passage and the branch passage. A main track provided under the floor of the central passage,
A branch track provided under the floor of the branch passage, connected to the main track via a branching means, and reaching a lifting means provided in each of the work areas.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. Wafer transfer system FIG. 1 is a diagram showing a basic structure of a wafer transfer system according to one embodiment of the present invention. Underfloor Transfer Structure FIG. 1 shows a predetermined work module (work area) for performing a predetermined operation on a wafer in a clean room and a structure under the floor. Here, the work module is
When performing predetermined processing such as cleaning, processing and measurement on the wafer,
It is a block for a predetermined number of workers to perform a series of operations, and is a unit work area for the workers to perform a predetermined process. In FIG. 1, the clean room CR
Is provided below the floor FL provided with. A track (rail) 15 is provided along a predetermined route in the underfloor transfer space FS, and a clean room CR is provided.
Continue to other work modules in A transfer device 11 is provided on the track 15 so as to be automatically transferred. The transport device 11 has, for example, wheels driven by an electric motor that engages with the track 15, and can be configured to travel on the track 15 by driving the electric motor.
The transfer device 11 can hold the wafer holder 12 that stores the wafer W, and can transfer the wafer holder 12 to an arbitrary location on the track 15. Further, the transfer device 11 has a transfer mechanism for automatically transferring the held wafer holder 12 to the loader 13.

An elevating device LF is provided upright in the clean room CR and across the underfloor transfer space FS. The clean room CR and the underfloor transfer space FS are communicated through the elevating device LF. Underfloor transfer space FS of lifting device LF
In the lower part of the inside, the wafer holder 12 is loaded into the elevating device, or the wafer holder 1 in the elevating device is placed.
A loader 13 is provided for loading 2 into the transport device. The elevating device LF loads the wafer holder 12 transported in the underfloor transport space FS by the transport device 11 with the loader 13. The wafer holder 12 loaded on the loader 13 is carried by the loader 13 in the lifting device LF. Elevating means capable of elevating and lowering the wafer holder 12 is provided in the elevating device LF, whereby the wafer holder 12 ascends in the clean room CR, and is provided at a predetermined outlet on the clean room CR side of the elevating device LF. Conveyed. The transported wafer holder 12 is placed, for example, by a worker in a store 17 provided beside the elevating device LF. The detailed configuration of the lifting device LF will be described later.

FIG. 2 is a plan view showing an example of a layout of a manufacturing line of a semiconductor device to which the wafer transfer system shown in FIG. 1 is applied. The wafer transfer system configured as described above is applied to, for example, a semiconductor device manufacturing line in the form shown in FIG. 2, in the clean room CR, as shown in FIG. 2, a central passage 21 crossing the center of the drawing, a lateral passage 25 running parallel to the central passage 21, and a central passage 21 and a lateral passage 25. Each work module 30 is formed in an area delimited by the vertical passages 31 that are orthogonal to each other.

Below the floor of the central passage 21, the horizontal passage 25 and the vertical passage 31, the above-mentioned underfloor transfer space FS is formed. In the underfloor transfer space FS of the central passage 21,
A double track 23 is provided, and a single track 24 is provided in the underfloor transfer space FS of the lateral passage 25. The trajectory 23 of the underfloor transfer space FS of the central passage 21 and the trajectory 24 of the underfloor transfer space FS of the lateral passage 25 are connected by a branch unit 27 at a relay point where these trajectories intersect. ing.

Each of the working modules 30 is provided with the above-mentioned lifting devices LF0 to LF30. For example, arrow A
As shown in the figure, the lifting device LF12 to the lifting device LF28
To transfer the wafer holder 12 to the
1 is moved to a predetermined position of the lifting device LF12. The wafer holder 12 is transferred from the loader 13 to the transfer device 11, and the transfer device 11 travels on the track 23. Then, the transfer device 11 is moved to the trajectory 2 of the underfloor transfer space FS of the lateral passage 25 by the branching unit 27 closest to the lifting device LF28.
4 and run on the track 24 to move the lift device LF27
The wafer holder 12 is taken into the work module 30 in which the elevating device LF27 is installed by the elevating device LF27. Thus, in the wafer transfer system of the present embodiment, it is possible to directly transfer the wafer holder 12 between the modules 30.

When a new transport path is provided,
This is performed by providing a new track 24 in the underfloor transfer space FS of the lateral passage 25 and connecting it to the track 23 of the underfloor transfer space FS of the central passage 21 by the branching unit 27. In this case, since the new track 24 is provided in the underfloor transfer space FS, it can be installed more easily than when it is provided in the clean room CR.

The structure of the lifting device LF will now be described in detail. 3A and 3B are diagrams illustrating an example of the structure of the lifting device LF, wherein FIG. 3A is a cross-sectional view, and FIG. 3B is a plan view of the underfloor transfer space FS. In FIG. 3, the lifting device LF
Inside, there is a drill CR for raising and lowering the wafer holder 12.
An elevating space 101 is formed for communication between the apparatus and the underfloor transport space FS, and a lift (elevator), not shown, is provided in the elevating space 101. The pass box 103, which is an entrance / exit portion on the clean room CR side of the lifting / lowering device LF, is provided with an air shower facility for performing air blowing, and has shutters 103a on both sides.
Is provided. In the pass box 104, which is an entrance on the side of the underfloor transfer space FS, an air shower facility for performing air blowing is provided, and shutters 104a are provided on both sides. An exhaust fan 105 for discarding the air in the lifting device LF is provided below the lifting device LF on the side of the underfloor transfer space FS. Lifting device L
From the upper end of F, clean air is supplied into the elevating space 101. On the other hand, the transfer device 11 that moves on the track 15 includes a fork-type transfer device 11a that transfers the wafer holder 12 held in the transfer device 11, and transfers the wafer holder 12 to the loader 13 of the elevating device LF. It is possible to transfer.

Further, a storage shelf 107 for temporarily storing the wafer holder 12 is provided in the lifting device LF. The storage shelf 107 temporarily stores the wafer holders 12 when the wafer holder 12 is taken out of the clean room CR through the pass box 103 and a take-out station (not shown) provided on the clean room CR side is full. You. The transfer of the wafer holder 12 to the storage shelf 107 is performed by a lift (not shown).

In the lifting device LF having such a configuration, the wafer holder 12 held by the transfer device 11 transferred on the track 15 is transferred onto the loader 13 by the transfer device 11a of the transfer device 11. The loader 13 moves the wafer holder 12 into the pass box 104. Here, dust adhering to the wafer holder 12 is removed by air blowing using an air shower facility provided in the pass box 104. At this time, since the elevating space 101 is isolated from the pass box 104 by the shutter 104a, intrusion of dust into the elevating space 101 is prevented. The wafer holder 12 having been blown by air is carried into the elevating space 101 by the loader 13, lifted and carried into the clean room CR by the above-described lift (not shown), and moved to the pass box 103 on the clean room CR side. In the pass box 103, the air is blown in the same manner as the pass box 104 on the underfloor transfer space FS side, and is taken out into the clean room CR. Therefore, the wafer holder 12 transferred from the underfloor transfer space FS into the clean room CR is cleaned through the pass boxes 103 and 104, and adhered particles such as dust adhered to the wafer holder 12 in the underfloor transfer space FS. It is not brought into the clean room CR.

Further, since clean air is supplied to the elevating space 101 and this air is exhausted outside by the exhaust fan 105, foreign matter such as dust enters the elevating space 101 from the underfloor transport space FS. However, the foreign matter is exhausted through the exhaust fan 105. This prevents foreign substances such as dust from entering the clean room CR through the underfloor transfer space FS.

Operation Method of Wafer Transfer System Next, an operation method of the wafer transfer system according to the present embodiment configured as described above will be described with reference to FIG. 4 and FIG. Here, the work module A shown in FIGS. 4 and 5 is a work area for performing a predetermined process on the wafer, and the work module B is next to the wafer on which the predetermined process has been performed in the work module A. Work area for performing the above processing.

As shown in FIG. 4, the work module A includes an apparatus 110 for performing a predetermined process on a wafer.
Is provided on the side of the apparatus 110, and a storage shelf 114 for mounting the wafer holder 12 is placed on the side of the elevating apparatus LF in the work module A. Storage shelf 11 for placing the wafer holder 12
3 are installed. The work module B is provided with a device 111 for performing the next process on the wafer on which the predetermined process has been performed in the work module A, and the wafer holder 12 is placed beside the device 111. Storage shelf 1
Further, a storage shelf 113 for placing the wafer holder 12 supplied from the elevating device LF is installed on the side of the elevating device LF in the work module B. In addition, for example, ULPA (ultra low penetrati
On-air-filter) is provided in the entire area, and clean air is blown from the filter 115 into the clean room CR. For example, the inside of the clean room CR is maintained at a class 1 clean degree, and the underfloor transfer space FS is maintained at a class 100 clean degree.

FIG. 6 is a diagram showing an example of a configuration of a management system for the work modules A and B. As shown in FIG. 6, the work module A and the work module B have management devices 211 and 212, respectively, so that the work status of the devices 110 and 111 in each work module can be managed. Also, the management device 21
Reference numerals 1 and 212 are connected by a network means 210, and can transmit and receive various kinds of information. The network unit 210 is connected to a management device for another work module. Also, the management device 211,
The 212 is also connected to the lifting device LF and the transport device 12, and can control the operation thereof.

For example, in the work module B, the worker OP moves the storage device 114 from the storage shelf 114 on the side of the device 111.
11, the wafer cassette held by the wafer holder 12 is loaded. The loading of the wafer cassette held by the wafer holder 12 can be performed by the operator OP.
It is also possible to perform semi-automatic loading using a trolley with a lid opening / closing / transfer function described later. Management device 2 for work module B
12 receives an input signal from the device 111 that informs that the wafer cassette has been inserted into the device 111, and based on the signal, holds the wafer to be sent from the work module A to the work module B to the management device 211 of the work module A. A signal requesting that the wafer holder 12 be sent out is transmitted. At this time, the dispatch request signal includes information such as a lot number, a model name, and a process number. The management device 211 of the work module A receives this dispatch request signal and notifies the worker OP of the wafer holder 12 requested by the work module B. The operator OP puts the required wafer holder 12 into the elevating device LF. Wafer holder 1 put into lifting device LF of work module A
2 is transported by the transport device 11 to the lifting / lowering device LF on the working module B side, and is transported into the clean room CR of the working module B by the lifting / lowering device LF on the working module B side.

The wafer holder Next, the configuration of the wafer holder 12 used in the wafer transfer system according to the present embodiment described above. 7 and 8 are views showing an example of the wafer holder 12 used in the wafer transfer system according to the present embodiment. FIG. 7 is a perspective view of an integrated wafer holder, and FIG. It is a perspective view of the wafer holder of a type | mold.
Here, the integrated wafer holder is a type of wafer holder that directly stores a wafer. In addition, the separation type wafer holder is a type of wafer holder that holds a cassette itself capable of aligning and storing a plurality of wafers.

As shown in FIG. 7, the integrated wafer holder 5
1 is a groove 53 for aligning and storing the wafers W therein.
Are formed. The opening 52 of the integrated wafer holder 51 can be airtightly closed by a lid (not shown). In the integrated wafer holder 51,
Since the configuration is such that the wafer W is directly accommodated and the opening 52 is hermetically closed by the lid, it is effective against contamination of the wafer W.

As shown in FIG. 8, the separation type wafer holder 6
Reference numeral 1 has an accommodating portion for accommodating the wafer cassette 70 therein, and has a structure capable of accommodating the wafer cassette 70 and hermetically closing the opening 62 with a lid (not shown). Since the opening 62 is hermetically closed by the lid in the separation-type wafer holder 61, it is effective against contamination of the wafer W. Further, since the wafer cassette 70 is housed and held, a plurality of wafers W can be housed or taken out at a time when the wafer W is transferred,
This is advantageous in that the wafers W can be batch-input into an apparatus that performs a predetermined process on the wafers W. Moreover, the separation type wafer holder 61 can easily clean the separation type wafer holder 61 itself.

Next, a description will be given of a method of using the integrated wafer holder 51 and the separation type wafer holder 61 in the wafer transfer system according to the present embodiment. As shown in FIG. 9, for example, as processing for a wafer, a cleaning step 71 and a gate oxide film forming step 72 are performed.
, These steps 71 and 72 are usually performed in the same work module. That is, a cleaning device for cleaning a wafer and an oxidizing device for forming an oxide film on the wafer are installed in a predetermined work module. In the step of forming the gate oxide film, dust and organic substances are particularly disliked. Therefore, it is necessary to prevent dust and organic substances from being contaminated.

In this embodiment, the transfer of the wafer from the cleaning device to the oxidizing device is performed by the above-described integrated wafer holder 51. Thereby, the wafer is not exposed to the contamination in the clean room CR and the contamination of the wafer cassette, and it is possible to reliably prevent the dust and organic substance contamination of the wafer. In addition, as a process that strongly dislikes dust and organic contamination of the wafer, there are, for example, a process of forming a polysilicon film by a CVD device, a sputtering process, and the like. It is performed by the tool 51.
That is, the transfer of the wafer from the oxidation device to the CVD device, and the transfer of the wafer from the cleaning device to the sputtering device.

On the other hand, in the integrated wafer holder 51, since the loading and unloading of the wafer is performed directly, the loading and unloading work becomes complicated. For this reason, in the present embodiment, the above-described separated type wafer holder 61 is used for wafer transfer between the work modules. Also, the delivery of the wafer in the work module is performed by the separation type wafer holder 61 in the steps other than the above-mentioned step in which the dust and the organic substance contamination of the wafer are extremely disliked. Thus, the wafer transfer operation can be performed collectively by the wafer cassette, so that the transfer operation is easy and can be performed quickly.

Here, a specific configuration of the above-mentioned separation type wafer holder 61 will be described. 10 and 11
Is a diagram showing a configuration of a separation-type wafer holder 61,
FIG. 10 is a perspective view, FIG. 11 (a) is a top view,
FIG. 11B is a side view on the opening side, and FIG. 11C is a side view. 10 and 11, the separation-type wafer holder 61 has a holder main body 62 and a lid 66. The holder body 62 is formed of a rectangular box having an opening 62a and having a rectangular cross section. On both sides of the holder main body 62, a groove-like gripping portion 65 for an operator to hold the holder main body 62 is formed, and a lid 66 is provided near the opening on both sides of the holder main body 62. A locking mechanism 63 for fixing is provided.

At the bottom of the holder main body 62, FIG.
As shown in (b), two holding portions 64 for mounting the wafer cassette 70 housed through the opening 62a.
Are formed in parallel. The holding portion 64 forms a space below the wafer cassette 70 for inserting a reach fork of a trolley with a lid opening / closing / transfer function described later, and a part of the holding portion 64 is formed as shown in FIG. As shown, a fitting groove 70 formed on the bottom surface of the wafer cassette 70 is provided.
a, and has a function of preventing the wafer cassette 70 from laterally shifting.

Projecting wall portions 65a forming the above-mentioned groove-shaped gripping portions 65 project from both side surfaces in the holder main body 62. The protruding wall portion 65a has a function of preventing the accommodated wafer cassette 70 from laterally shifting. Projecting wall 65
The distance between "a" and "a" is substantially equal to the lateral dimension of the wafer cassette 70 so as to have a predetermined clearance with the side surface of the wafer cassette 70.

At the bottom of the holder main body 62, FIG.
As shown in FIG. 7, a groove 62b is formed, and is used for positioning with a carriage having a lid opening / closing / transfer function described later. In addition, as shown in FIG.
A reach fork of a carriage with a lid opening / closing / transfer function, which will be described later, is inserted into both sides of the lower end of the wafer cassette 70.

As shown in FIG. 12A, the locking mechanism 63 has an operation lever 63a and an engagement pin 63b, and the engagement pin 63 is operated by operating the operation lever 63a.
b can be moved out of the locking mechanism 63.
The engagement pin 63b of the locking mechanism 63 is shown in FIG.
As shown in FIG. 7, a locking portion 68 provided on the front surface of the lid 66 is provided.
Is engaged with the locking portion 68 of the lid 66 to fix the lid 66 to the opening 62 a of the holder main body 62. When the operating pin 63b of the locking mechanism 63 is operated to retract the engaging pin 63b into the locking mechanism 63, the engagement between the locking portion 68 of the lid 66 and the engaging pin 63b is released, and the The holder main body 62 can be removed from the opening 62a.

The lid body 66 is formed with a handle 67 for chucking by a lid opening / closing device of a truck with a lid opening / closing / transfer function, which will be described later, near the center of the front surface. Engagement portion 68 engageable with engagement pin 63b
Is formed. On the rear surface of the lid 66, the holder body 6
A seal portion 69 for tightly sealing the holder main body 62 in close contact with the peripheral edge of the opening 2 is formed. As shown in FIG. 11A, the rear surface of the lid 66 contacts the wafer W held in the wafer cassette 70,
Is formed in a plate-like pad portion 75 for preventing the wafer from shifting from the wafer cassette 70. The pad portion 75 is formed of a relatively soft material such as a urethane-based resin material so as not to damage the wafer W when it comes into contact with the wafer W.

Cart with lid opening / closing / transfer function Next, a cart with lid opening / closing / transfer function used for carrying the above-mentioned separated type wafer holder 61 in the work module will be described. 13 to 16 are views showing the structure of a truck with a lid opening / closing / transferring function. FIG. 13 is a perspective view, FIG. 14 is a top view, FIG. 15 is a side view, and FIG. Is a rear view. Truck 80 with lid opening / closing / transfer function
Are a reach fork mechanism 81 and a lid opening / closing mechanism 83
, Holder holding mechanism 86, and locking release mechanism 8
8 and a lifting mechanism 90.

Each of the above mechanisms is provided directly or indirectly on a mounting plate 98 on a carriage 80 with a lid opening / closing / transferring function. On the mounting plate 98, a mounting portion 99 for mounting the above-mentioned separation type wafer holder 61 is provided.

The unlocking mechanism 88 unlocks the locking mechanism 63 of the separation type wafer holder 61. The unlocking mechanism 88 includes an engagement arm 88a.
And a drive source 88b composed of, for example, a motor for rotating this engagement arm 88a, corresponding to the locking mechanism 63 of the separation type wafer holder 61. The locking release mechanism 88 is provided on the mounting plate 98. The locking release mechanism 88 pivots the engagement arm 88a as shown in FIG.
The operation lever 63a of the locking mechanism 63 of the separation type wafer holder 61 can be operated, and the locking mechanism 6 can be operated.
3 can be unlocked.

The lid opening / closing mechanism 83 opens and closes the lid 63, and the lid 63 of the separation type wafer holder 61.
And can be moved to a predetermined position. The lid opening / closing mechanism 83 has a holding arm 83a and a turning drive unit 83b that can turn the holding arm 83a by 90 degrees. That is, the opening 62a of the separation-type wafer holder 61
The handle 67 of the lid 66 fixed to the
The cover 66 is opened by turning the holding arm 83a by 90 degrees by the turning drive unit 83b. The lid opening / closing mechanism 83 is provided on the mounting plate 98. The activation of the lid opening / closing mechanism 83 is performed by operating the operation button 95 shown in FIG.

The reach fork mechanism 81 has a function of holding the wafer cassette 70 and taking out the wafer cassette 70 from the wafer holder 61. The reach fork mechanism 81 has a pinion and a rack mechanism that is directly moved by a motor M shown in FIG. 14, and the two reach forks 82 can be moved to any position in the direction of linear movement by the pinion and the rack mechanism. ing. The wafer cassette 70 placed on the two reach forks 82 is transferred to the receiving table 300 on the apparatus side. Reach fork mechanism 81
Is provided on the lifting plate 100.

The lifting mechanism 90 raises and lowers the lifting plate 100 to raise and lower the reach fork mechanism 81. The elevating mechanism unit 90 has an extendable and retractable mechanism similar to a pantograph of a train.
0. Therefore, the reach fork 82 of the reach fork mechanism 81 can be moved to an arbitrary height.

The holder holding mechanism 86 presses the separation-type wafer holder 61 placed on the trolley 80 with a lid opening / closing / transfer function toward the trolley 80 with a lid opening / closing / transfer function. Separable wafer holder 61 from the carriage 80 with transfer function
Not move. As shown in FIG. 17, the holder holding mechanism 86 has a columnar holding weight 86a held by a flange 85 fixed on the mounting plate 98. The holding weight 86a is inserted into a through hole formed in the flange portion 85, and the stepped portion 86f of the holding weight 86a is held so as to be able to engage with the flange portion 85. A stopper ring 8 is provided on the lower surface of the flange portion 85.
6b is fixed to the stopper ring 86b.
A fixing screw 86c is provided. Holder weight 86a
A groove 86d into which the fixing screw 86c is fitted is formed on the outer periphery of the groove. Also, on the tip surface of the holding weight 86a,
A contact plate 86e made of a relatively soft material such as a urethane-based resin material is fixed. Also, the flange portion 85
Is rotatable at an angle of 90 degrees in the direction of the arrow, as shown in FIG. Accordingly, when the separation type wafer holder 61 is mounted on the mounting portion 99 of the carriage 80 with a lid opening / closing / transferring function, the flange portion 85 is shifted from the state shown in FIG. If it is rotated, mounting of the separation type wafer holder 61 on the mounting portion 99 becomes easy.

When the holder holding mechanism 86 does not press the upper surface of the wafer cassette 70, as shown in FIG. 18A, the holding screw 86c tightens the fixing screw 86c to separate the contact plate 86e from the upper surface of the wafer cassette 70. It shall be in a state of being separated. When the upper surface of the wafer cassette 70 is pressed by the holder pressing mechanism 86, the fixing weight 86c is loosened, so that the pressing weight 86a descends as shown by the arrow in FIG. 18B. The contact plate 86e contacts the upper surface of the wafer cassette 70. Thereby, the holding weight 86a
Presses the upper surface of the wafer cassette 70. Since the contact plate 86e is formed of a soft material, the upper surface of the wafer cassette 70 will not be damaged even if it comes into contact with the contact plate 86e.

Wheels 91 are provided at the lower part of the trolley 80 with a lid opening / closing / transfer function. The wheels 91 are made of, for example, a relatively soft material such as a urethane-based material, and reduce vibrations to the carriage 80 with a lid opening / closing / transfer function. The trolley 80 with a lid opening / closing / transfer function is provided with a battery 92 and a charger 93, and includes a reach fork mechanism 81, a lid opening / closing mechanism 83, and a locking release mechanism 8.
8 and the power for driving the lifting mechanism 90 can be supplied.

A handle 94 for adjusting the position of the reach fork and a handle 95 for adjusting the rotation of the reach fork are provided below the placement plate 98 of the trolley 80 with a lid opening / closing / transfer function. Reach fork position adjustment handle 9
By rotating this, the whole reach fork mechanism 81 can be moved in a direction perpendicular to the longitudinal direction of the reach fork 82, for example, within a range of ± 50 mm. Reach fork rotation adjustment handle 95
By rotating this, the entire reach fork mechanism 81 can be rotated within an angle range of, for example, 10 degrees. Adjustment by the reach fork position adjustment handle 94 and the reach fork rotation adjustment handle 95 allows the pedestal 300 of the detachable wafer holder 61 to be adjusted.
Can be accurately positioned.

A bogie positioning pin 97 is provided on the front of the bogie 80 with a lid opening / closing / transfer function. FIG.
And as shown in FIG. 15, by fitting into a positioning recess 300a formed in the receiving base 300 on the apparatus side,
The carriage 80 with a lid opening / closing / transfer function can be positioned with respect to the receiving table 300.

The cart 80 with the lid opening / closing / transferring function having the above configuration.
Is used, for example, as shown in FIG. FIG.
As shown in FIG. 7A, the separation type wafer holder 61 containing the wafer cassette 70 loaded into the work module from the lifting device LF and taken out to the mounting table 302 is stored in the storage shelf 3.
03. These separation type wafer holders 61
The operator OP places the necessary detachable wafer holder 61 on the carriage 80 with a lid opening / closing / transfer function. Then, FIG.
As shown in FIG. 0 (b), the operator OP pushes the trolley 80 with a lid opening / closing / transfer function to carry it to the device 304 for performing a predetermined process in the work module. When the trolley 80 with a lid opening / closing / transfer function is carried to the device 304, the trolley 80 with a lid opening / closing / transfer function automatically opens the lid 66 of the separation type wafer holder 61 and is accommodated in the wafer holder 61. The wafer cassette 70 is automatically transferred to the receiving table 300 of the apparatus 304. The empty separation type wafer holder 61 is stored in the storage shelf 305 by the operator OP.

Next, an automatic transfer operation of the wafer cassette 70 housed in the separation type wafer holder 61 of the carriage 80 with the lid opening / closing / transfer function having the above-mentioned structure to the receiving table 300 of the apparatus 304 is shown in FIG. This will be described with reference to FIGS. First, as shown in FIG. 21A, the upper surface of the wafer cassette 70 mounted on the mounting portion 99 of the carriage 80 with the lid opening / closing / transferring function is pressed by the holder pressing mechanism 86. The pressing operation of the holder pressing mechanism 86 is performed by loosening the fixing screw 86c of the holder pressing mechanism 86 as described above. Thereby, the separation type wafer holder 61 is attached to the mounting portion 9 of the carriage 80 having the lid opening / closing / transferring function.
9 fixed. This operation is performed by the operator OP.

Next, the operation button 95 of the carriage 80 with the cover opening / closing / transfer function is operated to activate the cover opening / closing mechanism 83. When the lid opening / closing mechanism 83 is activated, FIG.
As shown in the figure, the holding arm 83a of the lid opening / closing mechanism 83
Rotates 90 degrees, and the holding arm 83a automatically chucks the handle 67 of the lid 66 of the separation-type wafer holder 61.

Next, when the chucking of the handle 67 of the lid 66 of the separation type wafer holder 61 by the holding arm 83a is completed, the locking release mechanism 88 is operated, and FIG.
By the operation described above, the locking of the lid 66 by the locking mechanism 63 of the separation type wafer holder 61 is automatically released.

Next, as shown in FIG. 21D, the holding arm 83a of the lid opening / closing mechanism 83 is turned again, and the lid 66 of the separation type wafer holder 61 is removed from the holder main body 62, and the wafer is removed. The state where the lid 66 is held is maintained until the cassette 70 is transferred.

Next, as shown in FIG. 22 (a), the reach fork mechanism 81 operates and the reach fork 82
Is inserted below the wafer cassette 70 in the separation-type wafer holder 61.

Next, as shown in FIG. 22 (b), the lifting mechanism 90 of the carriage 80 with the lid opening / closing / transfer function operates, and the lifting plate 100 rises to a predetermined position in the direction of the arrow.
As a result, one end of the reach fork 82 holds the lower part of the separation type wafer holder 61.

Next, as shown in FIG. 22C, the reach fork 82 moves in the direction of the arrow, and takes out the wafer cassette 70 from the inside of the separation type wafer holder 61.

Next, the reach fork 82 is once lowered, and the wafer cassette 70 is placed on the lift plate 100.
Then, as shown in FIG.
Numeral 2 moves in the direction of the separation type wafer holder 61 indicated by the arrow, rises again to a predetermined position, and holds the wafer cassette 70. As a result, the other end of the reach fork 82 holds the lower part of the wafer cassette 70.

Next, as shown in FIG. 23 (a), the reach fork 82 is moved to the cradle 30 on the apparatus side indicated by the arrow (1).
After moving to the predetermined position in the direction of 0, the reach fork 82 descends in the direction of arrow (2), and places the wafer cassette 70 on the receiving table 300.

When the mounting of the wafer cassette 70 on the receiving table 300 is completed, the reach fork 82 is moved to the position shown in FIG.
As shown in FIG. Further, as shown in FIG. 23 (c), the lid opening / closing mechanism 83 holding the lid 66 is operated again to turn the lid 66 to remove the opening of the separated type wafer holder 61 which is empty. When closed, the locking release mechanism 88 operates to operate and lock the locking mechanism 63. In addition, as shown in FIG.
The pressing of the upper surface of the separation type wafer holder 61 by the holder holding mechanism 86 is released.

By the above operation, the separation type wafer holder 6
The transfer operation of the wafer cassette 70 from No. 1 to the receiving table 300 is completed.

As described above, according to the present embodiment, the track and the transfer device 11 for transferring the wafer holder 12 are installed in the underfloor transfer space FS, and the wafer holder 12 is moved by the lifting device LF to the clean room CR and the clean room CR. Since the transfer is performed between the underfloor transfer spaces FS, there is no need to provide a transfer mechanism for transferring the wafer between the work modules in the clean room CR. For this reason, it is not necessary to provide a wafer transfer facility in the clean room CR, and it is possible to reduce the cost required for the scale and performance of the clean room CR. Further, in the present embodiment, unlike the case where a wafer transfer facility is provided in the clean room CR, no contaminants are generated from the transfer facility. Further, since the wafer transfer facility is outside the clean room CR, there is no interference with the operator, which is preferable from the viewpoint of safety. The underfloor transfer space F
Since the transport device is provided in S, maintenance work is easy. In the wafer transfer system according to the present embodiment, the number of tracks can be easily increased via the branching unit, so that the transfer route can be easily changed and added.

In this embodiment, since the wafer is transported in the work module using the carriage 80 with a lid opening / closing / transfer function, the work is conventionally performed by an operator into a device for performing a predetermined process on a wafer. Can be automated, and labor can be saved. Further, by properly using the integral type wafer holder 51 and the separation type wafer holder 61, both reliable prevention of wafer contamination and speeding up of wafer transfer can be achieved.

[0067]

According to the present invention, it is not necessary to provide a wafer transfer facility in a clean room, and the cost required for the scale and performance of the clean room facility can be reduced. In addition, since the track and transport device are provided in the transport space under the floor of the clean room, work during maintenance is easy, there is no interference with workers, safety is high, and changes in the transport route can be easily added. is there.

[Brief description of the drawings]

FIG. 1 is a diagram showing a basic structure of a wafer transfer system according to one embodiment of the present invention.

FIG. 2 is a plan view showing an example of a layout of a production line of a semiconductor device to which the wafer transfer system shown in FIG. 1 is applied.

FIG. 3 is a diagram showing an example of the structure of a lifting device LF,
(A) is a sectional view, and (b) is a plan view in the underfloor transport space FS.

FIG. 4 is a diagram for explaining an operation method of the wafer transfer system according to the embodiment.

FIG. 5 is a diagram for explaining an operation method of the wafer transfer system according to the embodiment.

FIG. 6 is a diagram illustrating an example of a configuration of a work module management system.

FIG. 7 is a diagram illustrating an example of a wafer holder 12 used in the wafer transfer system according to the embodiment;
It is a perspective view of an integral type wafer holder.

FIG. 8 is a diagram illustrating an example of a wafer holder 12 used in the wafer transfer system according to the embodiment;
It is a perspective view of a separation type wafer holder.

FIG. 9 is a diagram for explaining how to use the integrated wafer holder and the separated wafer holder in the wafer transfer system of the present embodiment.

FIG. 10 is a perspective view showing a configuration of a separation-type wafer holder 61 according to the present embodiment.

11A and 11B are diagrams illustrating a configuration of a separation-type wafer holder 61, wherein FIG. 11A is a top view, FIG. 11B is a side view on the opening side, and FIG. 11C is a side view.

FIG. 12 is a diagram showing a structure of a locking mechanism.

FIG. 13 is a perspective view showing the structure of a carriage with a cover opening / closing / transfer function.

FIG. 14 is a top view showing the structure of the trolley with a cover opening / closing / transfer function.

FIG. 15 is a side view showing the structure of a carriage with a cover opening / closing / transfer function.

FIG. 16 is a rear view showing the structure of the cart with a lid opening / closing / transfer function.

FIG. 17 is a view showing the structure of a holder holding mechanism.

FIG. 18 is a view showing the operation of the holder holding mechanism,
(A) shows the state at the time of the non-pressing operation, and (b) shows the state at the time of the pressing operation.

FIG. 19 is a diagram showing a relationship between an engagement arm of a locking release mechanism and a locking mechanism 63.

FIG. 20 is a diagram for explaining a method of using the carriage with a lid opening / closing / transfer function.

FIG. 21 is a view for explaining the transfer operation of the wafer cassette accommodated in the separation type wafer holder of the carriage with a cover opening / closing / transfer function.

FIG. 22 is a view for explaining the transfer operation of the carriage with the lid opening / closing / transfer function following FIG. 21;

FIG. 23 is a view for explaining the transfer operation of the carriage with the cover opening / closing function following FIG. 22;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Transfer apparatus, 12 ... Wafer holder, 51 ... Integral wafer holder, 61 ... Separable wafer holder, 13 ... Loader, 15 ... Track, 80 ... Carriage with lid opening / closing / transfer function, L
F: Lifting device, CR: Clean room.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Toshiro Kizakihara 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation

Claims (12)

[Claims] 1. A wafer holder for hermetically storing and holding a wafer, and a plurality of work areas in a clean room, each being provided between a plurality of work areas, and a transfer space formed under the floor where the clean room is installed. A wafer transfer apparatus, comprising: a plurality of lifting / lowering means capable of transferring the wafer holding tool; and a transfer means provided in the transfer space and capable of transferring the wafer holding tool between the respective lifting / lowering means. 2. The wafer holding device according to claim 1, wherein the first wafer holding device directly accommodates the wafer and holds the wafer in an airtight manner, and the second wafer housing device accommodates a wafer cassette capable of holding the wafer in an airtight manner. 2. The wafer transfer device according to claim 1, comprising a wafer holder. 3. The wafer holding device according to claim 1, wherein the first wafer holder is used for transferring a wafer in a work area for performing a specific process on a wafer in the clean room, and the second wafer holder is mounted on the clean room. 3. The wafer transfer device according to claim 2, wherein the transfer device is used for transferring a wafer through the transfer space between each of the work areas in the inside and for transferring a wafer in each of the work areas in the clean room. 4. A mounting section for mounting the second wafer holder supplied into the working area by the elevating means, and a wafer cassette mounted on the mounting section to the second wafer holder. 3. The wafer transfer apparatus according to claim 2, further comprising: a transfer carriage that is movable in the work area and has a transfer unit that transfers the wafer cassette to a predetermined position. 5. The wafer transfer according to claim 1, wherein the transfer means includes a track provided in the transfer space, and a transfer device capable of traveling on the track and holding the wafer holder. apparatus. 6. The wafer transfer device according to claim 5, wherein the transfer device has a transfer means for transferring the wafer holder held by the transfer device to the elevating means. 7. The lift unit, wherein the lift unit lifts and lowers the wafer holder between the clean room and the transfer space in the lift space. 2. The wafer transfer device according to claim 1, further comprising a loading unit that transfers the wafer holder transferred from the transfer unit to the elevator. 8. An air inlet / outlet section for blowing air to a wafer holder at an entrance / exit portion to the elevation space on the transfer space side and an entrance / exit portion to the elevation space on the clean room side. Wafer transfer equipment. 9. An air supply means for supplying clean air into the elevating space on the clean room side of the elevating space of the elevating means, and an air supply means on the transport space side of the elevating space in the elevating space. The wafer transfer device according to claim 7, further comprising an exhaust unit that discharges air to the outside. 10. The shutter according to claim 8, wherein each of said entrances and exits is provided with shutter means capable of closing between said clean room and said elevating space and between said elevating space and said transport space. Wafer transfer device. 11. The transfer space is formed under a floor of a central passage in the clean room and a plurality of branch passages intersecting the central passage, and the work area is defined by an area defined by the central passage and the branch passage. A main track provided under the floor of the central passage, provided below the floor of the branch passage, connected to the main track via a branch unit, and provided in each of the work areas. 6. The wafer transfer device according to claim 5, further comprising: a branch trajectory reaching the lifting means. 12. The wafer transfer apparatus according to claim 1, wherein a cleanness of the transfer space is lower than a cleanness of the clean room.