JPH11330112A - Manufacture of semiconductor device and transfer mold device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the occurrence of package cracks due to gate part curing resin which is left in an encapsulated body. SOLUTION: This transfer mold device is constituted of injecting melted resin from a gate 20 into a cavity 22 formed by a molding die consisting of upper and lower dies and then curing the injected resin. The device has a gate cutting mechanism for dividing the resin held at a liquid state, during curing or at a cured state by a gate cutting shutter 25 built in the molding die. The division of resin by the shutter 25 is constituted so as to divide the resin on a boundary part between the gate 20 and the cavity 22. Respective gate cutting shutters 25, corresponding to respective cavities 22 of the molding die are constituted so as to execute dividing operation by a single dividing mechanism. The cavity 22 of the molding die constitutes a cavity for forming a resin encapsulated type semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device and a transfer molding apparatus, and more particularly to a technique effective when applied to a manufacturing technique for a resin-sealed semiconductor device.

[0002]

2. Description of the Related Art In a semiconductor device such as an IC (integrated circuit device), a structure in which a semiconductor chip, a wire, and the like are sealed by a sealing body (package) made of resin (resin) is known.

A resin-sealed semiconductor device is manufactured using a lead frame. The sealing region of the lead frame on which the fixing of the semiconductor chip and the wire bonding have been completed is molded by a transfer molding apparatus.
Thereafter, removal of resin burrs protruding from the sealing body (package), cutting / removal of a dam (tie bar) connecting the leads, lead cutting, lead molding, and the like are performed, and a desired semiconductor device is manufactured.

[0004] The transfer molding technology is described in "VLSI Packaging Technology (Lower)" published by Nikkei BP on May 15, 1993, pages P35 to P40.

[0005] In the same document, as a mold, a runner extending in a plurality of directions from a single cull, a type in which the cavity is filled with resin from each runner through each gate, and a multi-plunger with a plurality of plungers The plunger type is described.

[0006]

In the manufacture of a semiconductor device in a conventional transfer molding apparatus, a mold is opened after transfer molding, and the mold is cured in a resin flow path such as a lead frame or a runner that has been molded. The cured resin is taken out.

In the present applicant, the separation of the package cured in each cavity portion and the resin cured in the gate portion (gate portion cured resin) involves grasping the resin cured in the runner portion (runner portion cured resin), A method is employed in which an external force is applied so as to separate the runner cured resin from the lead frame, thereby dividing the gate cured resin at the base of the package.

However, it has been found that such a dividing method causes the following defects.

That is, the lead frame is placed in a shallow recess for setting provided in the lower mold of the mold.
This recess has a shape slightly larger than the lead frame size for inserting and removing the lead frame. Therefore, the setting position of the lead frame slightly changes.

As a result, in the above-described dividing method at the gate portion cured resin portion, the dividing position is not constant, and sometimes the resin cured at the gate portion remains (gate resin residual defect) or the runner portion does not. In some cases, the cured resin may remain (runner portion resin residual defect).

FIG. 10A is a schematic diagram showing a state in which the cured resin 3 is appropriately divided from a sealing body (package) 2 formed over the front and back surfaces of the lead frame 1. FIG. 10B is a schematic diagram showing a gate resin residual defect state in which the gate resin 3a is divided at the boundary between the runner resin 3b as the cured resin 3 and the gate resin 3a and the gate resin 3a remains. FIG. 10C shows that the tip of the gate resin 3a is separated from the package 2 but the gate resin 3a
FIG. 4 is a schematic diagram showing a runner portion resin residual defective state in which both a and the runner portion resin 3b are attached to the lead frame 1.

As an example, the runner resin 3b
Is 0.2 mm, and the length of the gate resin 3a is 0.2 mm.
０．３0.3 mm.

[0013] Residual defects in the gate portion and the runner portion may be caused by the residual hardened resin being caught on a transport rail or the like in a transport mechanism of each processing apparatus performed in a state of a lead frame after transfer molding, resulting in deformation of the lead frame. Or

[0014] Deformation of the lead frame causes a product defect, and also causes a transfer abnormality in a processing apparatus including subsequent steps.

Further, when the dam is cut after the transfer molding process, the remaining cured resin is also cut off, and a crack may be generated in the package due to the shearing force applied to the residual cured resin portion. The occurrence of cracks lowers the moisture resistance of the semiconductor device.

An object of the present invention is to provide a method of manufacturing a semiconductor device capable of suppressing occurrence of a package crack.

Another object of the present invention is to provide a method of manufacturing a semiconductor device which does not cause deformation of a lead frame during transportation.

It is another object of the present invention to provide a transfer molding apparatus capable of cutting a gate portion cured resin at a fixed position at all times.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0020]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) A step of preparing a lead frame having a support for fixing at least one semiconductor chip and a plurality of leads whose front ends face the periphery of the support, and fixing the semiconductor chip on the support. A step of connecting each electrode of the semiconductor chip and a tip portion of the lead by an electrical connection means, and clamping the lead frame to a mold of a transfer molding apparatus and forming the lead frame by the mold. A step of injecting a molten insulating resin from the gate into the cavity and curing and curing the resin to form a sealing body covering the semiconductor chip and the tip end portion of the lead; and a gate portion cured at the gate portion Separating the cured resin from the sealing body, the method for manufacturing a semiconductor device,
After injecting the resin into the cavity, the gate portion is separated from the sealing body by separating the gate portion cured resin from the encapsulant by dividing with a gate cut shutter incorporated in the mold die in a liquid state or in a cured state or in a cured state at the gate portion. A method for manufacturing a semiconductor device, comprising: The division by the gate cut shutter is performed at the boundary between the gate and the cavity. After the division by the gate cut shutter, the lead frame and the gate portion cured resin cured at the gate portion are separated.

The transfer molding apparatus used in the manufacture of such a semiconductor device has the following configuration.

A transfer molding apparatus configured to inject a molten resin from a gate into a cavity formed by a mold formed by an upper and lower mold, cure the resin after the injection, and cure the resin. There is provided a gate cut mechanism for dividing the resin in the gate portion, which is in a liquid state, in the middle of curing or in a cured state, by a gate cut shutter incorporated in the mold. The division by the gate cut shutter is configured to be performed at a boundary between the gate and the cavity. Each gate cut shutter corresponding to each cavity of the mold is configured to perform a dividing operation by a single driving mechanism. The cavity of the mold constitutes a cavity for forming a resin-sealed semiconductor device.

According to the above-mentioned means (1), (a) the gate portion cured resin is divided by the gate cut shutter at the boundary portion of the mold resin body (sealing body) cured in the cavity, so that the dividing position is always constant. I do.

(B) After the gate is cut, a cured resin such as a gate resin or a runner resin is separated from the lead frame. However, since the cured gate resin is separated from the sealing body, the gate resin is separated. The resin is easily separated from the lead frame, and does not break on the way, so that the residual failure of the cured resin (the gate portion resin and the runner portion resin) does not occur as in the related art.

(C) Since the cured resin does not remain on the lead frame according to the above (b), the residual cured resin is transferred to the transport rail or the like in the transport mechanism of each processing apparatus performed in the state of the lead frame after transfer molding. And the lead frame is not deformed. As a result, the occurrence of defective products such as lead deformation can be suppressed, and the quality of the semiconductor device can be improved and the manufacturing yield of the semiconductor device can be improved.

(D) Since the cured resin does not remain on the lead frame according to the above (b), a transfer abnormality hardly occurs in the transfer of each processing apparatus performed in a state of the lead frame after the transfer molding. Of the semiconductor device can be improved, and the manufacturing cost of the semiconductor device can be reduced.

(E) When the dam is cut after the transfer molding process, no unnecessary force acts on the package because the gate portion cured resin which the punch for cutting the dam contacts does not remain on the edge of the sealing body. Also, no crack is generated in the package, and a decrease in the moisture resistance of the semiconductor device can be prevented.

(F) According to the above (e), the wear of the punch is reduced.

[0030]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

(Embodiment 1) FIGS. 1 to 8 relate to a method of manufacturing a semiconductor device and a transfer molding apparatus according to an embodiment (Embodiment 1) of the present invention.

In the first embodiment, an example in which the present invention is applied to the manufacture of an SOP (Small Outline Package) type resin-sealed semiconductor device in which leads protrude from both sides of a package will be described.

First, an SOP type semiconductor device 10 manufactured by the method for manufacturing a semiconductor device according to the first embodiment will be described.

As shown in FIG. 2, the semiconductor device 10 has a flat rectangular resin-made sealing body (package) 2.
And a plurality of leads 4 protruding from long sides on both sides of the package 2. The lead 4 is of a gull wing type having a surface mounting structure.

As shown in FIG. 3, a support portion (tab) 5 is located in the package 2, and
A semiconductor chip (semiconductor element) 6 is fixed to the lower surface of the device. An electrode (not shown) of the semiconductor chip 6;
The tips of the leads 4 located in the package 2 are electrically connected by conductive wires 7 as electric connection means.

Such a semiconductor device 10 is manufactured using a lead frame. Lead frame 1 is 0.1
It is formed by patterning an iron-nickel alloy plate, copper plate, copper alloy plate or the like having a thickness of about 5 to 0.2 mm by etching or precision press. The lead frame has a structure having a supporting portion for fixing the semiconductor chip and a plurality of leads whose front ends face around the supporting portion.

In the manufacture of the semiconductor device 10, after fixing the semiconductor chip to the support portion of the lead frame, each electrode of the semiconductor chip is connected to the tip of the lead by a conductive wire. Thereafter, the assembled lead frame is clamped to a mold of a transfer molding apparatus, and a molten insulating resin is injected from a gate into a cavity formed by the mold, and the resin is cured and cured. In this way, a package covering the semiconductor chip and the tip of the lead is formed.

Next, the gate portion cured resin cured at the gate portion is separated from the package, unnecessary lead frame portions are cut off, and leads protruding from the periphery of the package are formed, as shown in FIG. Such a semiconductor device is manufactured.

In the first embodiment, at the time of the transfer molding, after the insulating resin in a molten state is injected from a gate into a cavity formed by the mold, the liquid is cured at the gate portion or is in the middle of curing. Is separated by the gate cut shutter incorporated in the mold, thereby separating the gate portion cured resin from the sealing body.

FIG. 4 is a perspective view showing the transfer molding apparatus 50 according to the first embodiment. In FIG.
1 is partially removed to show the inside.

The transfer molding apparatus 50 is an automatic molding apparatus, and a press 52
Is arranged. On the surface plate of the press machine 52, a lower mold 12 of a mold is disposed. Although the upper mold located above the lower mold 12 is omitted, three pillars 53 are provided.
Attached to the upper platen supported by.

The transfer molding apparatus 50 has a multi-plunger structure, and a plurality of pots 16 are arranged in a row on the parting surface of the lower mold 12 as shown in FIG. Runners 17 extend from both sides of the pot 16. The runner 17 communicates with the lower cavity 15 via a gate 20. Also, lower cavity 1
5 is connected to an air vent, but is omitted in the figure. The cull is formed in the upper cavity 21 facing the pot 16 and communicates with the runner 17.

A head of a resin injection plunger (not shown) is located in the pot 16. Then, the preheated tablet is put into the pot 16 with the mold opened. Thereafter, in a state in which the mold is clamped, the molten resin flowing out of the cull flows out into the runner 17 by raising the resin injection plunger.

Above the lower die 12, a cleaner 54 for cleaning the lower die 12 is disposed. The press machine 52
Is provided with an operation panel 55 on the front side.

A loader 56 is disposed at the left end of the transfer molding apparatus 50, and an unloader 57 is disposed at the right end. A frame alignment mechanism 60, a frame transport mechanism 61, a tablet loader 62, and a tablet charge 63 are provided between the loader 56 and the press 52.

Between the press machine 52 and the unloader 57, a package take-out mechanism 64 and an unnecessary cured resin peeling mechanism 65 are provided.

Further, this is one of the features of the present invention. The lower die 12 of the press machine 52 is provided with a gate cut mechanism 24 described later.

Next, regarding the gate cut mechanism 24,
This will be described with reference to FIGS.

As shown in FIG. 1A, a mold 11 of a transfer molding apparatus comprises a lower mold 12 and an upper mold 13.
It consists of When the mold 11 is open, the lead frame 1 is placed on the lower mold 12. The lead frame 1 is placed and accommodated in a shallow recess 14 which is slightly larger than the lead frame 1 provided on the parting surface of the lower die 12 and has a depth corresponding to the thickness of the lead frame 1.

The lead frame 1 is an assembled lead frame in which a semiconductor chip 6 is fixed on a tab 5 and the electrodes of the semiconductor chip 6 and the tips of the leads are connected by conductive wires. In FIG. 1, the lead frame 1
Are mounted on the lower mold 12 with the semiconductor chip 6 positioned below. Also, no leads and wires have been revealed.

As described above, the pot (not shown in the figure), the runner 17, the gate 20, the lower cavity 15, and the air vent (not shown) are provided on the parting surface of the lower mold 12.
Etc. are provided. An upper cavity 21 facing the lower cavity 15 is provided on a parting surface of the upper die 13.

When the mold 11 is in a closed state,
A cavity 22 is formed by the lower cavity 15 and the upper cavity 21. In this cavity 22,
The tub 5, the semiconductor chip 6, the wires and the like are located. The molten resin 2 flowing through the runner 17
3 (indicated by dots in the figure) flows from the gate 20 into the cavity 22. The air in the cavity 22 is pushed out of the mold 11 through the air vent by the inflow of the resin 23. The resin 23 is cured and cured by heat in the cavity 22.

In the first embodiment, the liquid or the hardening deformable resin 23 at the gate 20 is divided by the bar-shaped gate cut shutter 25 of the gate cut mechanism 24. That is, as shown by hatching in FIG. 5, the tip of the gate cut shutter 25 blocks the gate 20.

The gate cut shutter 25 is a lower mold 12
Is inserted into the guide hole 26 provided so as to penetrate the
The front end portion of the gate 20 in contact with the edge of the lower cavity 15 is blocked. The front end of the gate cut shutter 25 is brought into contact with the parting surface of the upper die 13 by an advance operation.

In the case of FIG. 1, the tip of the gate cut shutter 25 is flat. In this case, gate 2
This is applicable when the resin 23 filled in the zero portion is liquid or deformable during curing. That is, in a state where the resin 23 is hardened, it is necessary to make the tip sharp so as to be divided, as described later.

As shown in FIG. 6, the gate cut shutter 25 is fixed to an elevating plate 29 disposed below the lower die 12. The elevating plate 29 is fixed to the tip of a plunger 28 of the hydraulic cylinder 27. As described above, the gate cut mechanism 24 includes the hydraulic cylinder 27, the lift plate 2
9, a gate cut shutter 25 and the like. The lifting plate 29 may be driven by a pneumatic cylinder or a motor.

Next, the operation of removing the mold and unnecessary hardened resin by the transfer molding apparatus 50 of the first embodiment will be partially described with reference to the flowchart of FIG.

The assembled lead frame is supplied to the frame alignment mechanism 60 by the loader 56 in two rows. The lead frames aligned by the frame alignment mechanism 60 are supplied onto the lower mold 12 by the frame transport mechanism 61 in a state of two columns and two rows (see FIGS. 5 and 1A).

Next, the tablet supplied by the tablet charge 63 is put into the pot 16 (not shown) by the tablet loader 62 (step 1).
01).

Next, as shown in FIG. 1A, the mold 11 is clamped (step 102). Thereafter, the resin injection plunger is raised (step 103).

Next, at the point when the plunger for resin injection has completed ascending (step 104), the gate cut mechanism 24 is driven forward. As a result, the gate cut shutter 25 rises and shuts off the gate 20 as shown in FIG. 1B (step 105).

Step 104 is for curing the resin (resin).
When the gate cut shutter 25 is raised, the curing is still insufficient and the liquid is in a liquid or semi-cured state and can be freely deformed. As a result, even if the tip of the gate cut shutter 25 is flat, the resin 23 can be removed from between the tip surface of the gate cut shutter 25 and the parting surface of the upper die 13. Depending on the progress of the curing of the resin 23, the gate cut shutter 25
May be an inclined surface.

The gate cut shutter 25 is connected to the gate 20
1 (c), when the hardening is performed to such an extent that the separation by the gate cut shutter 25 is not impaired even if it is removed from the portion
Then, the gate cut mechanism 24 is driven backward (step 106). As shown in FIG. 1C, the resin cured at the gate (gate resin 3a) is divided.

The dividing position is the edge of the sealing body (package) 2 cured in the cavity 22.

Next, the resin injection plunger is lowered (step 107), and the upper mold 13 is relatively separated from the lower mold 12 so that the mold 11 is opened.

Next, the lead frame is taken out from the lower mold 12 by the package take-out mechanism 64, and the lead frame is transported to the unnecessary hardened resin peeling position. Then, the lead frame and the unnecessary hardened resin portion (runner portion) are moved by the unnecessary hardened resin peeling mechanism 65. (A cured resin and a gate-portion cured resin, etc.) to remove unnecessary cured resin from the lead frame.

At this time, the package 2 and the gate resin 3a
Is separated, the gate portion resin 3a and the runner portion resin 3b are peeled off from the lead frame 1 without being broken without applying unnecessary force. Also, the gate resin 3
Although a slightly remains in the package 2, the punch for cutting the dam does not touch when the dam is cut in a later step.
Therefore, the occurrence of package cracks due to the contact of the punch is also eliminated.

FIG. 7 is a plan view showing a part of the lead frame 1 from which the unnecessary cured resin has been removed. The portion having the width W is a region where the gate portion cured resin and the runner portion cured resin were present. Then, the remaining portion of the gate portion cured resin coincides with the edge of the package 2 and does not protrude greatly unlike the conventional case.

After the unnecessary hardening resin is peeled off by the unnecessary hardening resin peeling mechanism 65, the lead frame 1 is carried out to the unloader 57 by a transport mechanism (not shown).

Thus, the transfer molding operation is completed. The lead frame is thereafter subjected to a main curing process.

According to the first embodiment, the following effects can be obtained.

(1) Gate portion cured resin (gate portion resin 3
In the case of a), the boundary portion of the package 2 cured in the cavity 22 is divided by the gate cut shutter 25 by the gate cut mechanism 24, so that the dividing position is always constant.

(2) After the gate is cut, the gate resin 3
a and the cured resin such as the runner resin 3b are separated from the lead frame 1, but since the gate resin 3a is separated from the sealing body, the gate resin 3a is easily separated from the lead frame 1. In addition, there is no breakage of the cured resin (the gate portion resin 3a and the runner portion resin 3b) as in the related art without breakage in the middle.

(3) Since the cured resin does not remain on the lead frame 1 according to the above (2), the remaining cured resin is transported in the transport mechanism of each processing apparatus performed in the state of the lead frame 1 after transfer molding. The lead frame 1 is not deformed by being caught on a rail or the like. As a result, the occurrence of defective products such as lead deformation can be suppressed, and the quality of the semiconductor device can be improved and the manufacturing yield of the semiconductor device can be improved.

(4) Since the cured resin does not remain in the lead frame 1 according to the above (2), a transfer abnormality is less likely to occur in the transfer of each processing apparatus performed in the state of the lead frame 1 after the transfer molding. In addition, the operation rate of the device can be improved, and the manufacturing cost of the semiconductor device 10 can be reduced.

(5) When the dam is cut after the transfer molding process, unnecessary force acts on the package because the gate resin 3a with which the punch for cutting the dam contacts does not remain on the edge of the sealing body. Also, no crack is generated in the package, and a decrease in the moisture resistance of the semiconductor device 10 can be prevented.

(6) According to the above (5), punch wear at the time of dam cutting is reduced.

(Embodiment 2) FIG. 9 is a perspective view showing a gate cut shutter in a transfer molding apparatus according to another embodiment (Embodiment 2) of the present invention.

Gate Cut Shutter 2 of Second Embodiment
5 has a sharp end 70, and can be divided even when the gate resin 3a is hardened. The curing in this case means curing at the time of curing before the resin is removed from the transfer mold apparatus and the main curing of the resin is performed. That is,
The hardened state is such that it cannot be separated by the gate cut shutter 25 having a flat tip.

In the second embodiment, the sharp shape 70 has a single-edged structure, but may have a double-edged structure.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

[0082]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) Since the resin is cut off at the gate portion during transfer molding, a protruding resin residue unlike the conventional case does not occur in the sealing body of the manufactured semiconductor device. (2) As a result, the punch for dam cutting does not come into contact with the protruding resin remaining portion, so that the occurrence of package cracks due to the contact can be prevented, thereby improving the quality of the semiconductor device and the production yield of the semiconductor device. Can be improved. Further, the wear of the punch at the time of dam cutting is eliminated.

(3) The lead frame is not deformed due to a part of the transport mechanism contacting the protruding resin remaining portion, and the occurrence of lead bending failure can be prevented.

(4) A part of the transfer mechanism comes into contact with the protruding resin remaining portion, and the resin remaining portion falls off, so that the transfer mechanism of the transfer mechanism is less likely to occur, and the operation rate of the apparatus is improved. As a result, the manufacturing cost of the semiconductor device can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a state in which a gate portion cured resin is separated from a package in a method of manufacturing a semiconductor device according to an embodiment (Embodiment 1) of the present invention.

FIG. 2 is a perspective view of a semiconductor device manufactured by the method for manufacturing a semiconductor device according to the first embodiment;

FIG. 3 is a sectional view of the semiconductor device manufactured by the method of manufacturing a semiconductor device according to the first embodiment;

FIG. 4 is a perspective view of a transfer molding apparatus used in the method of manufacturing a semiconductor device according to the first embodiment.

FIG. 5 is a schematic plan view showing a lower mold of a mold in the transfer molding apparatus of the first embodiment.

FIG. 6 is a schematic diagram showing a lower mold of a mold and a gate cutting mechanism in the transfer molding apparatus according to the first embodiment.

FIG. 7 is a plan view showing a part of a lead frame used in the method of manufacturing a semiconductor device according to the first embodiment.

FIG. 8 is a flowchart showing some steps during transfer molding in the method for manufacturing a semiconductor device according to the first embodiment.

FIG. 9 is a perspective view showing a gate cut shutter in a transfer molding apparatus according to another embodiment (Embodiment 2) of the present invention.

FIG. 10 is a schematic diagram showing a normal division state and a defective division state when the gate portion cured resin is divided from the package.

[Explanation of symbols]

1 ... lead frame, 2 ... sealed body (package), 3 ...
Cured resin, 3a gate resin, 3b runner resin, 4 leads, 5 support (tab), 6 semiconductor chip (semiconductor element), 7 wire, 10 semiconductor device, 1
1 mold die, 12 lower mold, 13 upper mold, 14 recess, 15 lower cavity, 16 cull, 17 runner, 20 gate, 21 upper cavity, 22 cavity, 23 resin 24 gate cut mechanism, 25 gate cut shutter, 26 guide hole, 27 hydraulic cylinder, 28 plunger, 29 elevating plate, 50 transfer mold device, 51 cover, 52 press machine, 53 support, 54 ... cleaner, 55 ... operation panel,
Reference numeral 56: loader, 57: unloader, 60: frame alignment mechanism, 61: frame transfer mechanism, 62: tablet loader, 63: tablet charge, 64: package removal mechanism, 65: unnecessary hardening resin peeling mechanism, 70:
Sharp shape.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI // B29K 101: 10 105: 20

Claims (7)

[Claims] 1. A step of preparing a lead frame having a support portion for fixing at least one semiconductor chip and a plurality of leads facing the periphery of the support portion, and fixing the semiconductor chip on the support portion. Connecting each electrode of the semiconductor chip to the tip of the lead by an electrical connection means; clamping the lead frame to a mold of a transfer molding apparatus; and forming a cavity formed by the mold. A process of injecting a molten insulating resin from a gate and curing and curing the resin to form a sealing body covering the semiconductor chip and the tip portion of the lead; and curing the gate portion cured at the gate portion Separating the resin from the sealing body, wherein the resin is injected into the cavity. After entering, the gate portion cured resin is separated from the sealing body by dividing the resin in a liquid state or in the middle of curing or in a cured state at the gate portion by a gate cut shutter incorporated in the mold. Semiconductor device manufacturing method. 2. The method according to claim 1, wherein the division by the gate cut shutter is performed at a boundary between the gate and the cavity. 3. The method according to claim 1, wherein, after the division by the gate cut shutter, the lead frame and the gate portion cured resin cured at the gate portion are separated.
A method for manufacturing a semiconductor device according to claim 2. 4. A transfer molding apparatus configured to inject a molten resin from a gate into a cavity formed by a molding die of an upper and lower mold, cure the resin after the injection, and cure the resin. And a gate cutting mechanism for dividing the resin in the gate portion, which is in a liquid state or in the middle of curing or in a cured state, with a gate cut shutter incorporated in the mold. 5. The transfer molding apparatus according to claim 4, wherein the division by the gate cut shutter is configured to be divided at a boundary portion between the gate and the cavity. 6. The transfer according to claim 4, wherein each gate cut shutter corresponding to each cavity of the mold is operated so as to be divided by a single driving mechanism. Molding equipment. 7. The transfer according to claim 4, wherein the cavity of the molding die constitutes a cavity for forming a resin-sealed semiconductor device. Molding equipment.