JPH11307995A - Vacuum suction nozzle for electronic parts mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the electronic parts mounting efficiency of an electronic parts mounting machine by preparing vacuum suction nozzles having different opening sizes and selecting the nozzles in accordance with the shapes and sizes of electronic parts. SOLUTION: A vacuum suction nozzle used for an electronic parts mounting machine which mounts electronic parts on a printed board 5 by means of a vacuum suction device is constituted in such a way that a first disk 7 is attached to X-Y shafts 6 which move between an electronic parts supplying section 2 and the printed board 5 in a state where the disk 7 can be rotated around its horizontal axis and a plurality of second disks 8 which can be turned around axes normal to the peripheral side face of the first disk 7 are attached to the peripheral end face of the disk 7, and then, a plurality of vacuum suction nozzles 1 is vertically erected on the circular arcs of the end faces of the second disks 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounting machine for automatically mounting electronic components on a printed circuit board.
The present invention relates to a vacuum suction nozzle which sucks an electronic component and mounts it on a printed circuit board.

[0002]

2. Description of the Related Art As a type of a vacuum suction nozzle provided in a conventional electronic component mounting machine, as shown in FIG.
One or a plurality of vacuum suction nozzles 1a arranged linearly, or a rotatable disk 3 as shown in FIG.
It is known that a plurality of vacuum suction nozzles 1b are arranged along a circumferential end surface of the nozzle.

A vacuum suction nozzle 1a shown in FIG. 3 sequentially sucks electronic components 4 from a supply unit 2 and sequentially mounts them on a printed circuit board 5. The rotary disk type vacuum suction nozzle 1b shown in FIG. 4 rotates the rotary disk 3 and sequentially feeds out the vacuum suction nozzle 1b as shown in the mounting operation of FIG. The components 4 are sequentially sucked and transferred and mounted on the printed circuit board 5. The positioning of the rotating disk is performed by the XY table 6 shown in FIG.

[0004]

In the above-described conventional configuration, if electronic components having the same size and shape are provided, a plurality of vacuum suction nozzles having the same size can be collectively suction-transferred. Efficient. However, there are various shapes of electronic components, and therefore, there has been a problem that the suction and mounting operations have to be repeated while replacing with a number of types of nozzles, thereby lowering the mounting efficiency.

[0005]

SUMMARY OF THE INVENTION In order to solve such a problem, the present invention provides a vacuum suction nozzle in an electronic component mounting machine for mounting an electronic component on a substrate by a vacuum suction device. A first disk provided on an XY axis moving on a printed circuit board and rotatable about a horizontal axis; and a plurality of second disks rotatable about a normal direction of a circumferential end surface of the first disk as an axis. , And a plurality of vacuum suction nozzles projecting vertically in an arc on the end face of the second disk are provided.

According to the present invention, by providing various kinds of suction nozzles on the second disk in advance, it is possible to select a suction nozzle that matches the size and shape of the electronic component. It is possible to provide a vacuum suction nozzle of an electronic component mounting machine capable of mounting different electronic components with one device and improving the mounting efficiency.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a vacuum suction nozzle in an electronic component mounting machine for mounting an electronic component on a substrate by a vacuum suction device, wherein a supply section of the electronic component and a printed circuit board are mounted. A first disk provided on an XY axis for moving around, and rotatable about a horizontal axis, and a plurality of second disks provided rotatably about a normal direction of a circumferential end surface of the first disk as an axis; A plurality of vacuum suction nozzles projecting vertically in an arc on the end face of the second disk are provided, and various kinds of suction nozzles are previously provided on the second disk. Accordingly, it is possible to select a suction nozzle that matches the size and shape of the electronic component, and it is possible to mount electronic components having different sizes and shapes with one device, and to improve the mounting efficiency. .

According to a second aspect of the present invention, the plurality of vacuum suction nozzles disposed on the end face of the second disk are formed from ones having different shapes or dimensions of the openings, and rotate the disk. And selecting a desired vacuum suction nozzle for electronic components having different sizes and shapes by rotating the second rotating disk to select a vacuum suction nozzle suitable for the electronic component. In addition, it has the function of efficiently transferring and mounting electronic components.

According to a third aspect of the present invention, the second disk includes:
At the suction position, the vacuum suction nozzle is supported by the first disk via a holder having a cam for pushing out a fixed amount,
The vacuum suction nozzle at the suction position is set to a position protruding from other nozzles, and the electronic component is suctioned. The suction nozzle located at the suction position protrudes from the other suction nozzle to suction the electronic component. Therefore, it has an operation capable of performing the suction operation without interfering with the surroundings.

[0010]

FIG. 1 shows a preferred embodiment of the present invention.
This will be described with reference to FIG. FIG. 1 is a perspective view of a main part showing a vacuum suction nozzle of the present invention. An XY table 6 is provided with a first rotating disk 7 rotatable about a horizontal axis. A plurality of second rotating disks 8 rotatable around a normal line are provided on an end surface on the circumference of the rotating disk 7. The second rotating disk 8 is provided with a plurality of vacuum suction nozzles 1 projecting vertically on the circular arc. The nozzle 1 for sucking the electronic component 4 is positioned at a predetermined position by rotating the rotary disk 8 and connected to a vacuum path (not shown). As shown in FIG. 2, the rotating disk 8 is supported by a first rotating disk 7 via a holder 9 and a cam 10 for pushing a predetermined amount of the vacuum nozzle 1 at a predetermined position of the holder 9 at the suction position. Is provided. Therefore, when the rotating disk 8 holding the vacuum suction nozzle 1 is rotated, the rotating disk 8
Is provided with a cam 10 for pushing out the vacuum suction nozzle 1 by a fixed amount, the suction nozzle 1 located at the suction position is protruded from other suction nozzles, and the electronic component 4 is suctioned in the protruded state. I do. Therefore, the suction nozzle 1 can perform a suction operation without interfering with surrounding electronic components. In addition, the plurality of vacuum suction nozzles 1 have different nozzle openings (four types in FIG. 1), and are selected according to the size and shape of the electronic component 4. This can be automatically selected if it is set in advance in a program that controls the operation. In the transfer operation of the electronic component 4, the electronic component 4 of the component supply unit 2 is sequentially sucked while the rotating disk 8 is rotating, and then mounted on the printed circuit board 5. The positioning of the rotating disk is performed by the XY table 6.

[0011]

As described above, according to the present invention, various kinds of suction nozzles having different openings can be provided in advance on a rotating disk, and the nozzles can be electronically exchanged while being programmably exchanged. Selection can be made according to the size and shape of the component, and not only electronic components having different sizes and shapes can be mounted by one device, but also mounting efficiency of the electronic component can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a vacuum suction nozzle of the present invention.

FIG. 2 is an explanatory development view for pushing out a vacuum suction nozzle.

FIG. 3 is a perspective view of a conventional example.

FIG. 4 is a perspective view of a conventional example.

FIG. 5 is an operation explanatory diagram of a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 vacuum suction nozzle 2 supply unit 3 rotating disk 4 electronic component 5 printed board 6 XY table 7 first rotating disk 8 second rotating disk 9 holder 10 cam

Claims (3)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component on a board by a vacuum suction device.
A first disk provided on a shaft and rotatable about a horizontal axis; and a plurality of second disks provided rotatably about a normal direction of a circumferential end surface of the first disk as a second disk. A vacuum suction nozzle for an electronic component mounting machine, comprising a plurality of vacuum suction nozzles projecting vertically on an arc of an end face of the electronic component mounting machine. 2. A plurality of vacuum suction nozzles arranged on an end face of a second disk are formed from nozzles having different shapes or dimensions of openings, and a desired vacuum suction nozzle is formed by rotating the disk. 2. A vacuum suction nozzle for an electronic component mounting machine according to claim 1, wherein said nozzle is selected. 3. The second disk is supported by the first disk via a holder having a cam for pushing out a predetermined amount of the vacuum suction nozzle at the suction position, and the vacuum suction nozzle at the suction position is separated from the other nozzles. 2. The vacuum suction nozzle of an electronic component mounting machine according to claim 1, wherein the suction position is a protruding position, and the electronic component is sucked.