JPH11306990A - Ac color plasma display panel and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent/color mixing generated when phosphor is spread beyond ribs to intrude into the adjacent electric discharge region. SOLUTION: Each rib 4A is formed so that the width w2 of the rib top is greater than the width w1 of the bottom-that is, a taper is formed on the rib 4A in such a way as thinning width toward the bottom. Phosphor 8 is formed from a phosphor paste which is rubbed into gaps formed between the ribs 4A. According to this configuration, a drop of the brightness is prevented by suppressing the decrease in the surface area of the phosphor contributing to light emission owing to smaller width of the rib bottoms, and at the same time, the spacing between adjoining phosphor elements emitting different colors can be enlarged owing to larger width of the rib tops, presenting an effect that color mixing is unlikely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an AC type color plasma display panel in which a plurality of phosphors are arranged to obtain a plurality of emission colors, and a method of manufacturing the same.
In particular, the present invention relates to an AC type color plasma display panel having ribs for partitioning a plurality of phosphors, and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG.
FIG. 5 is an exploded perspective view showing an example of a configuration of an AC type color plasma display panel described in Japanese Patent Publication No. 5 (JP-A-5). FIG.
The configuration shown in FIG. 3 includes one unit light emitting region EU.
FIG. 14 is an exploded perspective view showing another configuration of the AC type color plasma display panel. The region surrounded by the two-dot chain line in FIG. 13 is the unit light emitting region EU. Back glass substrate 2 and front glass substrate 3 having a thickness of about 3 mm face each other with discharge space 67 interposed therebetween. Back glass substrate 2
And the front glass substrate 3, the side of the discharge space 67 is referred to as an inner surface. The other surface of the front glass substrate 3 is referred to as a display surface, and is indicated by reference numeral H. A strip-shaped transparent electrode 61 of about 100 μm to 300 μm disposed on the inner surface of the front glass substrate 3
And a band-shaped metal film 62 of about 50 to 100 μm, and a display electrode X and a display electrode Y adjacent to each other form a pair. The display electrodes X and Y are covered with a dielectric layer 9 having a thickness of about 10 to 50 μm. On the dielectric layer 9, a plurality of ribs 10 extending in a direction perpendicular to the display electrodes X and Y are provided at equal intervals. Note that the rib 10 can be omitted as shown in FIG. In the AC color plasma display panel 60A shown in FIG. 14, a black stripe 65 for clarifying the boundary between adjacent unit light emitting regions in the same stripe is provided on the front glass substrate 3.
Further, as in a rib 4 shown in FIG. 14, an upper rib 63 and a lower rib 64 having different properties may be arranged in one rib 4 in some cases.

On the other hand, a plurality of address electrodes 6 extending in a direction perpendicular to the display electrodes X and Y are provided on the inner surface of the rear glass substrate 2 at intervals, for example, at a pitch of about 200 μm. The adjacent address electrodes 6 are separated by ribs 4 having a width of about several tens μm to several tens μm and a height of about 100 μm to 200 μm. The fluorescent material 8 covers the inner surface of the rear glass substrate 2 except for the portion of the rib 4 that contacts the member on the front glass substrate 3 side and its vicinity.
Is formed to a thickness of, for example, 20 μm. Of course, the thickness of the phosphor 8 varies depending on the location, but the phosphor 8 is also formed on the side wall of the rib 4 and on the address electrode 6.

The back glass substrate 2 and the front glass substrate 3
In the peripheral part, it is sealed with a sealing material such as low melting point glass. The discharge space 67 of the AC type color plasma display panel 60 is filled with, for example, a mixed gas of xenon and neon as a discharge gas.

In order to emit light in the AC type color plasma display panel 60, first, the display electrodes X on the front glass substrate 3 and the address electrodes 6 on the rear glass substrate 2
During this period, a voltage with the display electrode X side being positive is applied to cause a counter discharge. Unnecessary wall charges thereafter are erased by an erase pulse applied to the display electrode and the address electrode 6, and only the unit light emitting region EU in which the wall charges remain remains illuminated. By applying a sustaining pulse to the display electrode X and the display electrode Y, a discharge occurs continuously between the display electrode X and the display electrode Y, and the phosphor is excited by ultraviolet light by the discharge to maintain light emission. The unit light emitting region EU on which wall charges are formed emits light as described above, but the other unit light emitting regions EU do not emit light. For example, even under the same display electrode X and display electrode Y, the phosphor 8 (R) on which wall charges are formed emits red light and the phosphor 8 (R) on which no wall charges are formed. G) does not emit green light.
R, G, and B in parentheses indicate red, green, and blue, which are emission colors of the phosphor.

For each line of the phosphor 8, that is, the phosphors 8 having different emission colors are separated from each other by the ribs 4.
The ribs 4 prevent the emission colors of the adjacent phosphors 8 from being mixed (color mixing). However, as shown in FIG. 15, in the color mixture generation area 66, for example, the opening 6 of the screen plate is used.
When the phosphors 8 are displaced, the adjacent phosphors 8 enter over the ribs 4 and color mixing occurs. The reason why the phosphor 8 enters the adjacent discharge space (the region sandwiched by the ribs 4) beyond the ribs 4 is one of the causes of the structure of the AC type color plasma display panel 60 and the manufacturing method thereof.

FIG. 16 is a flowchart showing an outline of a method of manufacturing a conventional AC type color plasma display panel 60. Steps ST1 to ST3 are front panel forming steps on the front glass substrate 3 side, and steps ST4 to ST3.
ST6 is a step of forming a back panel on the side of the back glass substrate 2, and steps ST7 and ST8 are steps of completing the plasma display panel by combining the back glass substrate 2 and the front glass substrate 3. In the front panel forming step, first, in the display electrode forming step ST1, the display electrodes X and the display electrodes Y are formed on the inner surface of the front glass substrate 3. In the transparent dielectric layer forming step ST2, the dielectric layer 9 is formed so as to cover the display electrodes X and the display electrodes Y. In the rib forming step ST3, the rib 10 is
The front panel is completed by forming a plurality of pieces in parallel on the front panel.
Note that the rib forming step ST3 may not be necessary in some cases.

In the process of forming the back panel, first, in an address electrode forming step ST4, for example, a metal paste is printed to form the address electrodes 6. In this step, the underlayer 7 may be formed. The underlayer 7
The function of preventing the diffusion of metal ions from the metal address electrode 6 and the function of improving the luminance of the AC type color plasma display panel 60 by reflecting the visible light emitted from the phosphor 8 to the front panel side. Have. Next, the ribs 4 are formed in the rib forming step ST5. The rib 4 may be formed directly on the rear glass substrate 2 or may be formed on the rear glass substrate 2 via a layer such as the underlayer 7. Next, in a phosphor forming step ST6, a paste-like phosphor 8 is applied between the ribs 4 by, for example, screen printing. The paste is dried to complete the back panel. The front panel and the rear panel completed through the above manufacturing process are assembled and sealed in step ST7. The air between the bonded front panel and the rear panel is evacuated and the space between them is filled with a mixed gas to complete the plasma display panel. In the above-described manufacturing process, color mixing occurs due to printing misalignment of the phosphor 8 in the phosphor forming step ST6 as one factor. Further, the displacement of the rib 4 in the rib forming step ST5 is also one factor of the color mixture. That is, in the formation of the ribs 4 and the phosphors 8 that require very high-precision alignment, when the situation shown in FIG. Occur.

There are several methods for manufacturing the ribs 4 in the rib forming step ST5. Representative methods of manufacturing the rib 4 include (1) a screen printing method,
There are (2) sandblasting, (3) photolithography, and (4) embedded firing. Hereinafter, the formation of the rib by each method of manufacturing the rib will be described with reference to the drawings.
For simplicity of explanation, components other than the ribs and the back glass substrate are not shown.

(1) In the screen printing method, a thick film is repeatedly printed about 10 times in the same place on the rear glass substrate 2 to secure the height of the rib and to prevent the width of the rib from being widened. Form. FIG. 17 is a process diagram schematically showing the first thick film printing process in the screen printing method. FIG. 17A shows a cross section of a screen plate 21 used for screen printing. The prepared screen plate 21 has a desired pattern opening 22
Are formed. The pattern opening 22 is a portion where the emulsion 71 filling the mesh of the wire mesh 70 has been removed. FIG.
FIG. 7B shows a cross section of the screen plate 21 in a state where the paste is filled. The glass paste 29 is screened by a scraper 72 moving in the direction of arrow 74.
1 is uniformly applied. The glass paste 29 is applied by the scraper 72 to form the pattern opening 2.
2, the pattern opening 22 is filled with a glass paste 29. While the glass paste 29 is being applied by the scraper 72, the squeegee 73 is away from the screen plate 21 and therefore does not act on the glass paste 29 even if it moves in the direction of the arrow 74. Next, FIG.
As shown in (c), the scraper 72 and the squeegee 73 moving in the direction of the arrow 75 are separated from the glass paste 29 by the scraper 72 and the squeegee 73 is applied to the screen plate 21 while applying an appropriate tension to the glass paste 2.
9 is transferred up and down so as to transfer 9 to the rear glass substrate 2. The glass paste 29 shown in FIG. 17D transferred to the rear glass substrate 2 in this manner has the same pattern as the pattern opening 22 of the screen plate 21.

The glass paste 29 is composed of a solid component exhibiting a function and a liquid component which plays an important role in the process of forming a thick film, and the solid component includes glass powder. Each time printing of one layer is completed, glass paste 2
9 is performed at a temperature of 150 to 200 ° C., and only the solid components remain, so that the glass paste 2
9 loses its liquidity. Therefore, by repeating recoating and drying on the glass paste 29 of FIG. 17D, the ribs 4 having a high aspect ratio are formed as shown in FIG. The thixotropy related to the change in the shape after printing can be controlled by, for example, the shape of the glass powder, and the glass paste 29 having good thixotropy has a small change in shape after printing. When a thick film pattern having a desired height is formed, the back glass substrate 2 is placed in a firing furnace and the main firing is performed. The main firing is performed at a temperature of 500 to 600 ° C., and the glass powder is directly bonded to each other by the main firing.
Is formed.

FIG. 18 is a diagram schematically showing the relationship between the screen plate 21 and the glass paste 29. As shown in FIG. The emulsion 71 originally located in the pattern opening 22 has been removed, but the exposed wire mesh 70 has been removed from the pattern opening 22.
Exists. Therefore, a mesh mark remains on the top of the glass paste 29 shown in FIG. 17D, and some irregularities are formed. Therefore, some irregularities remain on the top of the rib 4 formed by firing. In order to eliminate the unevenness, the top of the rib 4 may be polished.

FIG. 19 is a view for explaining a cross-sectional structure of a conventional rib and thick film pattern. The layers of the thick film pattern 5 that are overcoated to form the ribs 4 can be divided into, for example, a plurality of groups LA1 to LA5. For example, a porous paste is used to form a layer belonging to the group LA1 so as to prevent a layer superimposed on the layer LA1 from spreading and to print with a certain width. The formation of the layer belonging to the grape LA2 eliminates pattern unevenness. The layer belonging to the group LA3 mainly has a role of securing the height of the rib. Group LA4
The correction of the barrier width is performed in the layer belonging to. Group LA5
The layer belonging to has a role of hiding and smoothing mesh traces. The rib 4 and the thick film pattern 5 are provided with a bottom LA10 and an intermediate portion L formed on the bottom LA10.
A11 and a top LA formed on the intermediate portion LA11
12 can also be classified. The bottom LA10 is shown in FIG.
The back glass substrate 2 shown in FIG. 3 or the underlayer 7 shown in FIG. In order to form the bottom portion LA10, a material having good wettability with the back glass substrate 2 and the base layer 7 is selected as the glass paste 29. The intermediate portion LA11 may have a porous structure in order to ensure the strength of the rib against vibration. The top portion LA12 is formed of a material that can ensure close contact accuracy and contact strength with the rib 10 in FIG. 13 and the front glass substrate 3 in FIG. In addition, the top LA12 is formed of a material that is unlikely to have irregularities. The structure of the conventional rib is not limited to the structure and the material shown in FIG. 19, but the characteristics of the glass paste 29 to be overcoated are changed for each layer so that different functions are provided for each layer. Something to have. The reason why the ribs 4 are lower than the thick film patterns 5 is that the ribs 4 contract during firing.

(2) In the sandblasting method, ribs are formed by shaving a rib material, which is a material similar to the thick film pattern of the screen printing method, with powder such as glass beads. FIG. 20 is a process diagram schematically showing the outline of the rib formation by the sandblast method. In the sandblasting method, first, as shown in FIG.
The rib material 50 has a uniform thickness (for example, 150 to 250).
μm) and flat. The rib material 50 is
For example, it is formed by repeating application and drying of a thick film like a screen printing method. Next, a photoresist 81 is formed on the rib material 50 (see FIG. 20B). When the photoresist 81 is of a negative type, a photomask 82 is prepared so that light passes through a desired pattern, and light is applied to the photoresist 81 through the photomask 82 (see FIG. 20C). By developing it, as shown in FIG. 20D, the exposed portion remains, the unexposed portion is removed, and the photoresist 81 is formed into a desired pattern. When the glass beads are sprayed in the direction of the arrow 83, that is, perpendicularly to the back glass substrate 2, the rib material 50 where the photoresist 81 does not remain is removed, and as shown in FIG. Then, a rib material 50 having a predetermined thick film pattern is formed. The ribs 4 can be formed on the rear glass substrate 2 as shown in FIG. 20F by peeling off the photoresist 81 and firing the rib material 50 similarly to the screen printing method. Since the removal of the rib material 50 by the sandblast method can be performed with high anisotropy, the rib material 50 having a substantially vertical wall can be formed. Even if the wall of the rib 4 is inclined, the inclination is slight. Also in the sandblasting method, when the rib material 50 is formed by multi-layer coating, it has a layer structure, so that each layer can have a different function as in the case of the screen printing method.

(3) In the photolithography method, ribs are formed using a photosensitive rib material. FIG. 21 is a process diagram schematically showing the outline of the formation of the rib by the photolithography method. For example, a dry film 30A is laminated on the rear glass substrate 2 as shown in FIG. Next, by exposing through the mask 33, the region 86 where a pattern is desired to be formed undergoes a chemical change and is altered (FIG. 21B). Upon development, the unexposed portions are removed as shown in FIG. Thereafter, the ribs 4 are formed on the rear glass substrate 2 by placing the rear glass substrate 2 in a firing furnace and performing main firing in the same manner as in the screen printing method. Note that the dry film 30A may be formed on the rear glass substrate 2 by coating with a roll coater.

(4) In the buried firing method, a rib is formed by exposing and developing a pattern for applying a thick film paste. FIG. 22 is a process diagram schematically showing the outline of the formation of the rib by the embedded firing method. FIG.
2 (a), a plurality of photosensitive dry films 4
1 is laminated on the rear glass substrate 2. FIG.
As shown in (b), the photosensitive dry film 41 is exposed to light through the mask 44, and the photosensitive area 42 where no pattern is formed undergoes a chemical change and is altered (FIG. 22 (b)). Exposed photosensitive dry film 4
1 is developed, a trench 88 corresponding to a desired pattern is formed.
Is obtained (see FIG. 22C). As shown in FIG. 22D, a glass paste 29 is printed in the trench 88 using a squeegee 73 or the like. Glass paste 2
After 9 completely fills the trench 88, the surface of the glass paste 29 is made to match the height of the surface of the mask 44 by leveling (see FIG. 22E). Similarly to the screen printing method, the ribs 4 are formed on the rear glass substrate 2 at the same time as the mask 44 is removed by the main baking.

The phosphor 8 must be formed between the ribs 4 formed by the various methods described above. The rib 4 has a width of about several tens μm to several tens μm,
They are arranged at intervals of about 00 to 200 μm. Normal,
Since the phosphor 8 is formed by a screen printing method or the like in the gap between the fine ribs 4, very high precision is required for the alignment.

For example, FIG.
FIG. 1 is a cross-sectional view schematically showing a state of each stage relating to imprinting of a phosphor, described in Japanese Patent Application Publication No. JP-A-2006-133125. For example, a back glass substrate 2 provided with an address electrode 6 made of silver and having a thickness of about 20 μm and a rib 4 made of low melting point glass and having a height h of about 130 μm is prepared. This rib 4
Widths w1 and w2 near the bottom and the top of the
m, about 40 μm. Such back glass substrate 2
Then, the phosphor paste 90 is printed for each emission color in the following procedure. In other words, as shown in FIG. 23A, the screen plate 92 provided with the opening 91 having a predetermined width is aligned with the rear glass substrate 2 and is arranged so as to abut the rib 4. . The openings 91 are provided at a pitch three times the pitch P at which the ribs 4 are arranged. The squeegee 73 pushes the phosphor paste 90 out of the opening 91, and the gap between the ribs 4 is almost completely filled with the phosphor paste 90. Three different colors (R, G, B)
By repeatedly performing the process shown in FIG. 23A for the phosphor paste 90, the state shown in FIG. 23B is obtained. After that, the phosphor paste 90 is dried,
Baking at a temperature of 500-600 ° C. The phosphor paste 90 used at this time is obtained by mixing 10 to 50% by weight of a phosphor with a vehicle. As the vehicle of the phosphor paste 90 evaporates, the deposition of the phosphor paste 90 is greatly reduced, and a discharge space is obtained by forming the phosphor 8 thin as shown in FIG.

[0019]

A conventional AC type color plasma display panel and a method of manufacturing the same are constructed as described above, and the ribs formed by the screen printing method described above are originally thin. Since there is a tendency to taper, for example, there is a problem that color mixing occurs when phosphors of different colors cross the ribs and enter adjacent lines. For example, when it is desired to emit only the red phosphor, a discharge is caused only in the line where the red phosphor is formed to emit light, but a green phosphor is formed on the red phosphor at the top of the rib. When covered, a color mixture in which green is mixed with red occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a method of manufacturing an AC type color plasma display panel which reduces the incidence of defective products due to color mixing. In addition, an AC having a structure that is less likely to be a defective product due to color mixing than a conventional one.
It is intended to obtain a type color plasma display panel.

[0021]

According to a first aspect of the present invention, there is provided an AC type color plasma display panel including a front transparent substrate, a rear substrate bonded to the front transparent substrate, and a rear substrate on the transparent substrate side. A plurality of ribs are arranged side by side, and a rib having a tapered side wall such that a bottom portion near the back substrate has a smaller width than a top portion far from the back substrate, and is disposed between the ribs of the back substrate. ,
A phosphor covering at least the side wall extending from the bottom to the top of the rib, and the phosphor adjacent to the rib sandwiching the rib includes phosphors emitting lights of different colors.

According to a second aspect of the present invention, there is provided a method of manufacturing an AC type color plasma display panel, wherein the side wall is tapered such that a bottom portion near the back substrate is narrower than a top portion far from the back substrate. Forming a phosphor on the rear substrate, and printing a phosphor between the ribs so as to cover the side wall of the rib so that the phosphors arranged between the ribs have different emission colors. And is provided.

The method for manufacturing an AC type color plasma display panel according to the third invention is the same as the method for manufacturing an AC type color plasma display panel according to the second invention,
The step of forming the ribs on the back substrate includes forming a thick film pattern on the back substrate by replacing and printing a screen plate in order from a screen plate having a small pattern width to a screen plate having a large pattern width. When,
Baking the thick film pattern to form a rib.

A method for manufacturing an AC color plasma display panel according to a fourth aspect of the present invention is the method for manufacturing an AC color plasma display panel according to the second aspect of the present invention.
The step of forming the rib on the rear substrate includes the step of forming a layer of a photosensitive rib material having a uniform thickness on the rear substrate, and the step of forming the photosensitive rib through a mask on which a predetermined pattern is formed. An exposure step of exposing the material, a development step of developing the photosensitive rib material, and a step of firing the photosensitive rib material to form a rib, wherein in the exposing step,
When the photosensitive rib material is a positive type, overexposure is performed, or when the photosensitive rib material is a negative type, the exposure is terminated before an appropriate exposure is performed.

The method for manufacturing an AC type color plasma display panel according to the fifth invention is the same as the method for manufacturing an AC type color plasma display panel according to the second invention,
The step of forming the rib on the back substrate includes forming a photosensitive dry film on the back substrate, and exposing the photosensitive dry film through a mask on which a predetermined pattern is formed. And a developing step of developing the photosensitive dry film, a step of applying a glass paste in a gap of the photosensitive dry film, a step of peeling the photosensitive dry film, and drying and firing the glass paste And the step of exposing, in the exposing step, when the photosensitive dry film is a positive type, ends the exposure before it becomes an appropriate exposure, or when the photosensitive dry film is a negative type, it is overexposed. And

The method of manufacturing an AC type color plasma display panel according to the sixth invention is the same as the method of manufacturing an AC type color plasma display panel of the second invention.
The step of forming the ribs on the back substrate includes forming a rib material on the back substrate, forming a photoresist having a predetermined pattern on the rib material, and powdering the rib material. A sandblasting step of forming the rib material by spraying a body, a step of peeling the photoresist, and a step of firing the rib material, wherein the sandblasting step is performed on a plane perpendicular to the longitudinal direction of the rib. The powder is sprayed from a direction having a predetermined angle with respect to a perpendicular to the rib material plane.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Summary of the Invention) First, an outline of a method of manufacturing an AC type color plasma display panel of the present invention and a structure of the AC type color plasma display panel will be described. The outline of the method of manufacturing an AC type color plasma display panel according to the present invention is different from the conventional method in a rib forming step ST5 shown in FIG. FIG. 1 is a schematic diagram showing a cross-sectional structure of a back glass substrate in each manufacturing process of an AC type color plasma display panel. The cross-sectional structure shown in FIG.
This corresponds to the state where the address electrode forming step ST4 in FIG. 16 has been completed. Address electrodes 6 are formed on the rear glass substrate 2 at a pitch of about 100 to 200 μm, and a base layer 7 for protecting the address electrodes 6 is formed thereon. The following cross-sectional structure shown in FIG. 1B corresponds to the state where the rib forming step ST5 in FIG. 16 has been completed. The rib 4A having the reverse taper is arranged between the address electrodes 6 on the rear glass substrate 2 and substantially in parallel with the address electrodes 6. Here, the inverted tapered rib refers to a rib in which the width at the top of the rib is smaller than the width at the bottom of the rib. The cross-sectional structure shown in FIG.
This corresponds to the state where the phosphor forming step ST6 in FIG. 16 has been completed. As shown in FIG. 1C, the phosphor 8 is formed between the ribs 4A in the same process as in FIG. FIG.
The cross-sectional structure shown in (c ′) is in the same manufacturing process stage as the cross-sectional structure shown in FIG.
(C ′) shows a case where the alignment of some of the phosphors 8 is shifted. Therefore, in the region surrounded by the dotted frame 20, the phosphor 8 rides on the top of the rib 4A. However, the width w2 at the top of the rib 4A is equal to the width w1 at the bottom.
The shifted phosphor 8 does not enter the adjacent discharge space. As described above, the rib 4 in the manufacturing process is used.
Color mixing caused by the relative displacement between A and the phosphor 8 can be suppressed. The larger the value of w2 / w1 is, the better.
A range of 3 is preferred. Further, it is preferable that the gap between the top and the top is one third or more of the gap between the bottoms of two adjacent ribs 4A.

FIG. 2 is a schematic diagram showing an example of a cross-sectional structure of an AC type color plasma display panel having an inversely tapered rib. In FIG. 2, a detailed structure is omitted because a portion related to the reverse tapered rib is mainly illustrated. In the AC type color plasma display panel shown in FIG.
0 is formed, and the ribs 4A and the ribs 10 correspond one to one. Therefore, the alignment of the ribs 4A and the ribs 10 is performed at the stage of the assembly and sealing step ST7 in FIG. At this time, the AC type color plasma display panel of the present invention has the reverse tapered rib 4A, so that the width w2 at the top of the rib 4 is wide, and therefore the alignment margin is large. In the discharge space, since the width of the bottom of the rib is not increased, a decrease in the surface area of the phosphor contributing to light emission is suppressed, so that a decrease in luminance can be prevented.

FIG. 3 is a schematic view showing another example of the cross-sectional structure of an AC type color plasma display panel having an inversely tapered rib. In FIG. 3, a detailed structure is omitted because a portion related to the inversely tapered rib is illustrated as a center. In the AC type color plasma display panel shown in FIG. 3, the dielectric layer 9 and the MgO film 11 are formed on the entire inner surface of the front glass substrate 3, and the top of the rib 4A is a flat surface on the side of the front glass substrate 3. Will come into contact with the member. Therefore, the width of the rib 4A in contact with the member on the side of the front glass substrate 3 is larger than that of the conventional AC type color plasma display panel,
The performance of separating adjacent discharge spaces across the rib 4A is improved. Therefore, for example, in a discharge space adjacent to the rib 4A, inter-cell discharge may not easily occur, and the performance of the AC type color plasma display panel may be improved.

Embodiment 1 Next, a method of manufacturing an AC type color plasma display panel according to Embodiment 1 of the present invention will be described with reference to FIG. FIG. 4 is a process diagram schematically showing a thick film pattern forming process by a screen printing method in the method for manufacturing an AC type color plasma display panel according to the first embodiment. First, FIG.
To three screen versions 21a to 21c shown in FIG.
Prepare Pattern openings 22a to 22c having different widths are formed in the screen plates 21a to 21c, respectively. These pattern widths have the following relationship: width of pattern opening 22a of lower screen plate 21a <width of pattern opening 22b of middle screen plate 21b <width of pattern opening 22c of upper screen plate 21c. . First, using the screen plate 21a among the screen plates 21a to 21c, the lower glass paste 20 is formed on the rear glass substrate 2 as shown in FIG.
Temporarily dry the lower glass paste 20 as in the past,
On top of the dried thick film pattern lower layer 23, FIG.
As shown in (b), the middle glass paste 24 is formed using the screen plate 21b. Therefore, the width of the middle glass paste 24 is larger than the width of the thick film pattern lower layer 23. Next, the intermediate glass paste 24 is preliminarily dried, and an upper glass paste 26 is formed on the dried thick film intermediate layer 25 using a screen plate 21c as shown in FIG. 4C. . The width of the upper glass paste 26 is wider than the width of the middle layer 25 of the thick film pattern. Through such steps, the reverse tapered rib 4A shown in FIG. 1 can be formed.

In the above description of the first embodiment, the case where each of the screen plates 21a to 21c is used once has been described. However, the screen plate 21a is used a plurality of times to form the thick film pattern lower layer 23 composed of a plurality of layers. The screen plate 21b may be formed a plurality of times to form the thick film pattern middle layer 25 comprising a plurality of layers, and the screen plate 21c may be used a plurality of times. The same effect as described in the first embodiment can be obtained. The types of screen plates used for screen printing for forming a thick film pattern are not limited to three types, but may be more.

Further, as shown in FIG.
During printing by 1a to 21c, a screen plate 21d having a solid pattern may be used. FIG. 5A shows FIG.
This is a state corresponding to (a). Next, as shown in FIG. 5B, a glass paste 29 is applied to the solid pattern as uniformly as possible. Then, by bringing the glass paste 29 into contact with the lower glass paste 20,
The lower glass paste 27 is transferred onto the thick film pattern lower layer 23 as shown in FIG. The width of the lower glass paste 27 formed at that time is almost the same as the width of the lower layer 23 of the thick film pattern. The screen plate 2 is placed on the thick film pattern lower layer 28 formed by drying the lower glass paste 27.
1b is used to form the middle glass paste 24. Similarly, after the drying step after FIG. 4B and after the completion of FIG. 4C, printing of the glass paste 29 by a solid pattern may be performed.

Embodiment 2 FIG. Next, a method of manufacturing an AC type color plasma display panel according to Embodiment 2 of the present invention will be described with reference to FIGS. FIG. 6 is a process diagram schematically showing a rib forming step by a photolithographic method. As shown in FIG. 6A, a photosensitive rib material 30 is coated on the entire surface of the rear glass substrate 2 with a roll coater 32.
Apply using. The photosensitive rib material 30 is usually composed of glass powder, a filler, a monomer, a polymer, and a polymerization initiator. The filler is a filler, such as CaO or Al ₂ O ₃ . A roll coater 32 is used to apply the photosensitive rib material 30.
May be used instead of a printing machine. Further, as shown in FIG. 21, a dry film 30A may be used. Next, the pattern of the mask 33 is transferred to the photosensitive rib material 30 by exposure. In the case where the photosensitive rib material 30 is of a positive type, portions where light is not irradiated remain to form ribs.
As shown in (b), the pattern light-shielding portion 34 of the mask 33 is provided in accordance with a predetermined pattern, and blocks light at the predetermined pattern. On the other hand, when the photosensitive rib material is a negative type, a portion where light is applied remains to form a rib.
As shown in (b ′), the pattern opening 35 of the mask 33 is formed.
Are provided in accordance with a predetermined pattern, and light is transmitted at the predetermined pattern. At the time of exposure, when the photosensitive rib material is of a positive type, the exposure amount is set to be larger than an appropriate amount or the exposure time is set longer than an appropriate length to bring about an overexposed state. On the other hand, when the photosensitive rib material is a negative type, on the contrary, the exposure amount is reduced or the exposure time is shortened, and the exposure is completed before reaching an appropriate exposure. By adjusting the exposure in this manner, as shown in FIG. 6C, the photosensitive rib material 30 remaining after development is in an overhang state in which the top is wider than the bottom. Then, as in the conventional case, the rear glass substrate 2
Is placed in a firing furnace and dried and fired to form a reverse tapered rib 4A. FIG. 7 is a diagram for explaining a difference in exposure between a case where the photosensitive rib is a positive type and a case where the photosensitive rib is a negative type. The positive exposure will be described with reference to FIG. 7A, and the negative exposure will be described with reference to FIG. In the case of the positive type, the exposed portion is not removed and the unexposed portion remains, so that excessive exposure is performed to form the inversely tapered rib 4. In FIG. 7A,
The region 31a is shaded by the pattern light-shielding portion 34 and is not exposed at all, and the region 31b is exposed by light diffraction.
c is exposed by direct light. Therefore, the cross section of the region 31a that remains when developed is inverted trapezoidal. On the other hand, in the case of the negative type, the unexposed portion is not removed and the exposed portion remains, so that in order to form the inversely tapered rib 4, the exposure is completed before reaching an appropriate exposure. In FIG. 7B, the region 31a is exposed by direct light passing through the pattern opening 35, the region 31b is not exposed because the amount of exposure to the direct light passing through the pattern opening 35 is small, and the region 31c is exposed. It is not exposed because it is not exposed to direct light. Therefore, the area 3 remaining when developed
1a has an inverted trapezoidal cross section.

In the above description of the second embodiment, 1
Although the case where the photosensitive rib material of the type is used has been described,
As shown in FIG. 8, a plurality of types of photosensitive rib materials may be used. In the case of the positive type, as shown in FIG. 8A, the upper photosensitive rib material 30a is moved from the lower photosensitive rib material 30e to the lower photosensitive rib material 30e.
By using a material which is more sensitive to light as it goes, it becomes easy to increase the inclination of the taper of the inversely tapered rib which can be formed when the exposure is excessive. On the other hand, in the case of the negative type, as shown in FIG.
By using the one that is less sensitive to light from the point a to the lower part 30e, it becomes easier to increase the inclination of the taper of the inversely tapered rib that can be formed when the exposure is completed before appropriate exposure.

Embodiment 3 FIG. Next, a method of manufacturing an AC type color plasma display panel according to Embodiment 3 of the present invention will be described with reference to FIGS.
The method for manufacturing an AC type color plasma display panel according to the third embodiment is a manufacturing method using an embedded firing method. As described with reference to FIG. 22, in the conventional embedded baking method, the side wall of the photosensitive region 42 is substantially vertical, and thus the side wall of the rib 4 to be formed is also vertical. Therefore, in the method of manufacturing an AC type color plasma display panel according to the third embodiment, in order to form the rib 4A, the side wall of the photosensitive region 42 is tapered, and the width of the top of the photosensitive region 42 is reduced to the width of the bottom. It is formed narrower than that. FIG. 9 is a schematic diagram illustrating a cross-sectional shape of the photosensitive dry film 41 remaining on the rear glass substrate 2 after development. By forming the photosensitive dry film 41 into a trapezoidal shape, the cross-sectional shape of the space 80 in which the glass paste 29 is embedded can be inverted trapezoidal. Therefore, by embedding and firing the glass paste 29 in the same manner as in the related art, the inversely tapered rib 4A as shown in FIG. 1 can be formed.

FIG. 10 is a diagram for explaining a difference in exposure between a case where the photosensitive dry film is a positive type and a case where the photosensitive dry film is a negative type. Positive exposure using FIG.
The negative exposure will be described with reference to FIG. In the case of the positive type, the exposed portion is not removed and the unexposed portion remains, so that in order to form the photosensitive dry film 41 in a trapezoidal shape, the exposure is terminated before reaching an appropriate exposure. In FIG. 10A, the region 43a is shaded by the mask 44 and is not exposed, and the region 43b is
It is not exposed because the amount of exposure to direct light passing through
The area 43c is exposed to direct light. Therefore, the cross sections of the regions 43a and 82b which remain when developed are trapezoidal. On the other hand, in the case of the negative type, an unexposed portion is not removed and the exposed portion remains, so that excessive exposure is performed to form the photosensitive dry film 41 in a trapezoidal shape. In FIG. 10B, the area 43a is exposed by direct light, the area 43b is exposed by light diffraction, and the area 43c is shaded by the mask 44 and is not exposed at all. Therefore, the regions 43a and 82 which remain when developed.
The cross section of b is trapezoidal.

In the above description of the third embodiment, 1
Although the case where the types of photosensitive dry films 41 are used has been described, a plurality of types of photosensitive dry films 41a to 41e may be used as shown in FIG. In the case of the positive type, as shown in FIG. 11A, the upper photosensitive dry film 41a to the lower photosensitive dry film
By using a material that is less sensitive to light as it goes to 1e, it becomes easier to increase the slope of the taper of the photosensitive region 42 that can be formed when the exposure is completed before appropriate exposure. On the other hand, in the case of the negative type, as shown in FIG. 11 (a), by using the photosensitive dry film 41a which is more sensitive to light from the upper photosensitive dry film 41a to the lower photosensitive evaporator 140e, excessive exposure is performed. It is easy to increase the inclination of the taper of the photosensitive region 42 that can be formed.

Embodiment 4 FIG. Next, a method of manufacturing an AC type color plasma display panel according to Embodiment 4 of the present invention will be described with reference to FIG. The method for manufacturing an AC type color plasma display panel according to the fourth embodiment is a method using a sandblast method.
As described with reference to FIG. 20, in the conventional sandblasting method, since the anisotropy at the time of removing the rib material 50 by sandblasting is high, the side wall of the rib material 50 when sandblasting is completed becomes substantially vertical ( FIG. 20 (e)). Therefore, the side wall of the rib member 50 formed by firing the rib member 50 is also vertical. Therefore, in the method of manufacturing an AC type color plasma display panel according to the fourth embodiment, the angle at which powder such as glass beads is sprayed during sandblasting is slightly shifted from the vertical direction.
FIG. 12 is a diagram showing the relationship between the direction in which the glass beads are sprayed and the rib member 50 in a cross section perpendicular to the longitudinal direction of the rib. Since the arrows 51 and 52 have angles α and β with respect to the vertical, respectively, by spraying glass beads in the directions of the arrows 51 and 52, the side walls of the rib material 50 are vertically set as shown in FIG. Will have the same angle. Therefore, the rib finally obtained through the same process as the conventional one after this has an inverted tapered shape.

[0039]

As described above, A according to claim 1
According to the C-type color plasma display device, since the width of the bottom of the rib is not increased, the decrease in the surface area of the phosphor contributing to light emission is suppressed, thereby preventing the luminance from decreasing.
Since the width of the top of the rib is increased, the distance between adjacent phosphors having different emission colors can be increased, and there is an effect that color mixing can be suppressed.

According to the method of manufacturing an AC type color plasma display device according to the second aspect, the width of the top of the rib is widened, so that the width of the phosphor printing is shifted to such an extent that the phosphor adjacent to the rib is mixed. This has the effect that the margin can be increased when printing the phosphor on the ribs.

According to the method of manufacturing an AC type color plasma display device according to any one of claims 3 to 6, an inverse tapered shape is obtained by slightly modifying a conventionally known method. There is an effect that the rib can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a cross-sectional structure of a back glass substrate in each manufacturing process of an AC type color plasma display panel of the present invention.

FIG. 2 shows an AC having a reverse-tapered rib according to the present invention.
FIG. 1 is a schematic view showing an example of a cross-sectional structure of a color plasma display panel.

FIG. 3 shows an AC of the present invention having a reverse tapered rib.
FIG. 7 is a schematic view showing another example of a cross-sectional structure of a color plasma display panel.

FIG. 4 is a process diagram schematically showing an example of a thick film pattern forming process by a screen printing method in the first embodiment.

FIG. 5 is a process chart for explaining another example of the thick film pattern forming process by the screen printing method in the first embodiment.

FIG. 6 is a process diagram schematically showing a rib forming step by a photolithography method in the second embodiment.

FIG. 7 is a diagram for explaining a difference in exposure in Embodiment 2 between a case where a photosensitive rib is a positive type and a case where a photosensitive rib is a negative type.

FIG. 8 is a diagram for describing a case where a plurality of types of photosensitive rib materials are used in the second embodiment.

FIG. 9 is a schematic diagram showing a cross-sectional shape of a photosensitive dry film remaining on a rear glass substrate after development in a third embodiment.

FIG. 10 is a diagram for explaining a difference in exposure in Embodiment 3 between a case where a photosensitive dry film is a positive type and a case where a photosensitive dry film is a negative type.

FIG. 11 is a diagram illustrating a case where a plurality of types of photosensitive dry films are used in the third embodiment.

FIG. 12 is a view showing a relationship between a direction in which glass beads are sprayed and a rib material in a cross section perpendicular to the longitudinal direction of the rib.

FIG. 13 is an exploded perspective view showing a configuration example of a conventional AC type color plasma display panel.

FIG. 14 is an exploded perspective view showing another configuration example of a conventional AC type color plasma display panel.

FIG. 15 is a diagram for explaining the occurrence of color mixing.

FIG. 16 is a flowchart showing a manufacturing process of a conventional AC type color plasma display panel.

FIG. 17 is a process chart showing an example of a rib forming process by a conventional screen printing method.

FIG. 18 is a diagram for explaining a state of a screen plate and a glass paste during printing.

FIG. 19 is a cross-sectional view for explaining the structure of a conventional rib and thick film pattern.

FIG. 20 is a process diagram showing an example of a rib forming process by a conventional sandblast method.

FIG. 21 is a process chart showing an example of a rib forming process by a conventional photolithography method.

FIG. 22 is a process diagram showing an example of a rib forming process by a conventional embedded firing method.

FIG. 23 is a process chart showing an example of a conventional phosphor forming process.

[Explanation of symbols]

2 back glass substrate, 3 front glass substrate, 4,4A
Rib, 6 address electrode, 7 underlayer, 8 phosphor, 2
1, 21a-21d Screen plate, 50 rib material.

Claims (6)

[Claims] 1. A front transparent substrate, a rear substrate bonded to the front transparent substrate, and a plurality of rear substrates arranged on the rear substrate on the transparent substrate side, and a bottom near the rear substrate is far from the rear substrate. A rib having a tapered side wall so as to have a width smaller than that of the top, and a fluorescent member disposed between the rib of the back substrate and covering at least the side wall reaching the top from the bottom of the rib. An AC-type color plasma display panel, wherein the phosphors adjacent to each other with the rib interposed therebetween include phosphors emitting lights of different colors. 2. A step of forming a rib having a tapered side wall on the rear substrate so that a bottom near the rear substrate is narrower in width than a top far from the rear substrate, and sandwiching the rib. Printing a phosphor between the ribs so as to cover the side walls of the ribs so that the phosphors arranged in step (c) have different emission colors. 3. The step of forming the ribs on the back substrate includes: replacing the screen plate with a screen plate having a large pattern width in order from a screen plate having a large pattern width to perform printing; The method for manufacturing an AC type color plasma display panel according to claim 2, further comprising: forming a pattern; and firing the thick film pattern to form a rib. 4. The step of forming the rib on the back substrate includes forming a layer of a photosensitive rib material having a uniform thickness on the back substrate, and using a mask having a predetermined pattern formed thereon. An exposing step of exposing the photosensitive rib material to light, a developing step of developing the photosensitive rib material, and a step of baking the photosensitive rib material to form a rib. 3. The AC type color plasma according to claim 2, wherein the overexposure is performed when the photosensitive rib material is a positive type, or the exposure is terminated before an appropriate exposure is performed when the photosensitive rib material is a negative type. Display panel manufacturing method. 5. The step of forming the rib on the back substrate, the step of forming a photosensitive dry film on the back substrate, and the step of forming the photosensitive dry film via a mask on which a predetermined pattern is formed. An exposing step of exposing; a developing step of developing the photosensitive dry film; a step of applying a glass paste in a gap of the photosensitive dry film; a step of removing the photosensitive dry film; A step of drying and baking, in the exposure step, when the photosensitive dry film is a positive type, terminates the exposure before becoming an appropriate exposure, or excessively when the photosensitive dry film is a negative type. 3. The method for manufacturing an AC type color plasma display panel according to claim 2, wherein exposure is performed. 6. The step of forming the rib on the rear substrate, the step of forming a rib on the rear substrate, the step of forming a photoresist having a predetermined pattern on the rib, A sandblasting step of spraying powder on the material to form the rib material, a step of removing the photoresist, and a step of firing the rib material, wherein the sandblasting step is performed in a longitudinal direction of the rib. 3. The method of manufacturing an AC type color plasma display panel according to claim 2, wherein the powder is sprayed from a direction having a predetermined angle with respect to a perpendicular to the rib material plane on a plane perpendicular to the rib material plane.