JPH11271806A - Active matrix substrate, liquid crystal device and electronic equipment, and method for inspecting the same active matrix substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To actualize an inspecting function and a precharging function in a narrow area on an active matrix substrate prepared by forming scanning lines, data lines, TFTs, etc., thereon to constitute a liquid crystal device. SOLUTION: An active matrix substrate is equipped with a data line driving circuit 101 provided on one end side of data lines 35, and an inspecting and precharging circuit 201 which is provided on the other end side and supplies an inspection signal to the data lines at the time of inspection performed before the liquid crystal device is assembled and a precharge signal to the data lines during normal operation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method in which various wirings such as scanning lines and data lines, and driving elements such as thin film transistors (hereinafter referred to as TFTs) are formed on a substrate. An active matrix substrate which constitutes an active matrix driving type liquid crystal device or the like by sandwiching liquid crystal, a liquid crystal device and an electronic device having the same, and various kinds of electrical characteristics inspection methods for such an active matrix substrate. Belong, in particular,
It belongs to the technical field such as an active matrix substrate in which peripheral circuits such as a precharge circuit and an inspection circuit are formed on the substrate.

[0002]

2. Description of the Related Art Conventionally, in an active matrix substrate for a liquid crystal device of an active matrix driving system by TFT driving, a large number of scanning lines and data lines arranged vertically and horizontally, and a large number of pixels corresponding to their intersections. In general, electrodes and TFTs are provided on a glass substrate. Such an active matrix substrate is bonded to a counter substrate with a sealant, and a liquid crystal is sealed between the two substrates to form a liquid crystal device. In particular, a defective active matrix substrate in which various wirings and the like formed on the substrate are disconnected or short-circuited, or in which a TFT generates a leak current, is used in an assembly process for assembling the active matrix substrate into a liquid crystal device. It is desirable from the viewpoint of manufacturing efficiency and cost reduction to discover before and before the scribing step or the like for separating the plurality of active matrix substrates formed on the mother substrate from each other and bring them to the next step. Therefore, this type of active matrix substrate includes a scanning line driving circuit, a data line driving circuit, a sampling circuit, a precharge circuit, and the like, and a liquid crystal as one of the peripheral circuits formed in the peripheral area of the screen display area. In some cases, an inspection circuit configured to be able to execute an electrical characteristic inspection of the active matrix substrate before being assembled into the device is provided.

[0003] Such an inspection circuit includes, for example, a plurality of switching elements such as TFTs connected to a plurality of data lines, respectively. Also, an inspection drive signal for driving these switching elements and an inspection drive signal for driving these switching elements are provided. A plurality of test terminals for inputting and measuring a test signal supplied to the data line via a switching element or the like are provided exclusively on the substrate, and further connect these test terminals to the test circuit. Inspection wiring is provided exclusively. Then, by inputting a test drive signal at a predetermined timing while applying a test signal at a predetermined voltage by applying a probe to a test terminal, for example, an open test, a disconnection test, and a sampling switch of a plurality of data lines are input. It is configured such that an electrical characteristic test such as a leak test can be performed for each data line or for a group of a plurality of data lines.

On the other hand, among the above-mentioned peripheral circuits, a precharge circuit is provided with a data line for the purpose of improving a contrast ratio, stabilizing a potential level of a data line, and reducing line unevenness on a display screen. This is a circuit that supplies a precharge signal at a timing preceding an image signal supplied from a line drive circuit, thereby reducing a load when an image signal is written to a data line. In particular, in a 1H inversion driving method in which a voltage polarity applied to a liquid crystal is inverted for each scanning line by inverting a voltage polarity of a data line, which is usually performed for alternating current driving of a liquid crystal, at a predetermined cycle. Is written to the data line in advance, the amount of electricity required when writing the image signal to the data line can be significantly reduced. For example, in JP-A-7-295520,
An example of such a precharge circuit is disclosed.
The sampling circuit is a circuit that samples an image signal in order to stably supply a high-frequency image signal to each data line at a predetermined timing in synchronization with a scanning signal.

Here, if the substrate size of the liquid crystal device provided with the peripheral circuit on the substrate as described above is the same, a screen display area defined by a plurality of pixel portions arranged in a matrix, that is, the liquid crystal device As described above, it is considered that the larger the area in which an image is actually displayed due to the change in the alignment state of the liquid crystal, the larger the basic requirement of the display device. Therefore, the peripheral circuits including the inspection circuit and the precharge circuit described above are generally provided in a narrow and narrow peripheral portion of the substrate located around the screen display area.

[0006]

However, if both the inspection circuit and the precharge circuit described above are to be provided in the peripheral portion of the active matrix substrate, it is necessary to secure a region for forming a TFT constituting these circuits and to provide wiring. There is a problem that it is difficult to route the data. That is, in addition to the scanning line drive circuit and the data line drive circuit, the sampling circuit, the precharge circuit, the inspection circuit, and the like are provided in the above-described narrow and elongated peripheral portion. There is a problem that it becomes difficult.

[0007] In particular, for a test terminal required when a test circuit is provided, the area of the terminal portion becomes, for example, about 100 μm × 100 μm due to the stand up of a probe and the like. That is, there is a problem that such a valuable area on the substrate surface is occupied by the inspection performed before assembling the liquid crystal device. In addition, the inspection terminals thus provided on the substrate surface are usually made of a metal thin film such as Al (aluminum), and are left as they are when not in use after inspection. There is also a problem that the liquid crystal device may be deteriorated or the quality of a displayed image may be deteriorated.

The present invention has been made in view of the above-described problems, and has an active matrix substrate for a liquid crystal device which realizes a precharge function and an inspection function using a relatively small area on a substrate. It is an object to provide a liquid crystal device, an electronic device, and a method for inspecting the active matrix substrate.

[0009]

According to a first aspect of the present invention, there is provided an active matrix substrate for forming a liquid crystal device in which a liquid crystal is sandwiched between a pair of substrates. A plurality of scanning lines and a plurality of data lines intersecting each other on one of the pair of substrates, a scanning line driving circuit for supplying a scanning signal to the plurality of scanning lines, and the plurality of data lines. An image signal supply unit that is provided at one end of a line and supplies an image signal to the plurality of data lines; and an image signal supply unit that is provided in a matrix and is supplied through the plurality of scanning lines and the plurality of data lines. A plurality of pixel units each of which is actively driven based on the scanning signal and the image signal, and which are provided on the other end side of the plurality of data lines, and which are connected to at least the plurality of data lines during inspection. Characterized by comprising an inspection and precharge circuit respectively supplied to the plurality of data lines prior to the pre-charge signal having a predetermined voltage level to the image signal in the normal operation with a No. scanning signal respectively supplied.

According to the first aspect of the present invention, the image signal supply means for supplying an image signal to the plurality of data lines is provided at one end of the plurality of data lines, and the inspection and precharge circuit is provided. Is provided on the other end side of the plurality of data lines. Here, at the time of inspection, an inspection signal for performing a predetermined type of electrical characteristic inspection is supplied to at least a plurality of data lines by an inspection / precharge circuit. Therefore, by using the inspection / precharge circuit and the image signal supply means, a predetermined type of electrical characteristic inspection such as an open or disconnection inspection or a short circuit inspection is performed on each data line located between them and the pixel portion connected thereto. Can be performed.

On the other hand, during normal operation, a precharge signal of a predetermined voltage level is supplied to a plurality of data lines by an inspection / precharge circuit prior to the image signal supplied from the image signal supply means. Then, the image signal is supplied to the plurality of data lines by the image signal supply unit. That is, the inspection and precharge circuit performs the precharge for each data line, and the image signal supply to the precharged data line is favorably performed by the image signal supply unit.

As described above, the inspection and precharge circuit has an inspection function at the time of inspection performed before the assembling step to the liquid crystal device or before the scribing step, and performs the normal operation after the assembling to the liquid crystal device. In this case, the pre-charge function is provided, so that the inspection circuit and the pre-charge circuit are separately provided in the peripheral portion of the substrate as in the related art. The area can be significantly smaller.

According to a second aspect of the present invention, in the active matrix substrate according to the first aspect, the inspection and precharge circuit drives a precharge signal input via a precharge signal line to a precharge circuit. A plurality of precharge switches which are respectively switched and output in accordance with signals and supplied to the plurality of data lines as the inspection signal or the precharge signal, respectively, and the image signal supply means comprises an image signal line. A sampling circuit having a plurality of sampling switches, each of which samples an image signal input thereto via a sampling circuit drive signal and supplies the image signal to the plurality of data lines as the image signal; and Data lines that supply each to multiple sampling switches Characterized in that it is configured to include a dynamic circuit.

According to the second aspect of the present invention, the plurality of sampling switches in the sampling circuit are configured to sample the image signals input via the image signal lines in accordance with the sampling circuit drive signals. The data line drive circuit is configured to supply a sampling circuit drive signal to each of the plurality of sampling switches. Here, at the time of inspection, in the precharge circuit, the precharge signals input via the precharge signal lines are respectively switched and output by a plurality of precharge switches according to the precharge circuit drive signal, and are used as inspection signals. Each is supplied to a plurality of data lines. Therefore, a predetermined type of electrical characteristic test can be performed on each data line located between the plurality of precharge switches and the plurality of sampling switches using the precharge switch, the sampling switch, and the data line driving circuit.

On the other hand, during normal operation, in the precharge circuit, the precharge signals input via the precharge signal lines are respectively switched and output by a plurality of precharge switches in accordance with the precharge circuit drive signal, Each is supplied to a plurality of data lines as a precharge signal. Then, in the image signal supply means, when the sampling circuit drive signal is supplied to each of the plurality of sampling switches by the data line drive circuit, the image signal input via the image signal line is changed according to the sampling circuit drive signal. The signals are respectively sampled by a plurality of sampling switches and supplied to a plurality of data lines as image signals. That is, the precharging of each data line is performed by the inspection and precharging circuit, and the supply of the image signal to each precharged data line is favorably performed by the image signal supply unit.

According to a third aspect of the present invention, in the active matrix substrate according to the second aspect, each of the plurality of precharge switches has the data line connected to a source electrode and the precharge signal line connected to a drain. The precharge circuit drive signal line is connected to an electrode, and the precharge circuit drive signal line is formed of a thin film transistor connected to a gate electrode.

According to the third aspect of the present invention, the thin film transistors forming the plurality of precharge switches are turned on when the precharge circuit drive signal is supplied to the gate electrode via the precharge circuit drive signal line. In this state, a precharge signal supplied to the drain electrode via the precharge signal line is supplied from the source electrode to the data line as an inspection signal during inspection or as a precharge signal during normal operation.

Therefore, at the time of inspection, a predetermined type of electrical characteristic inspection can be performed on each data line located between these thin film transistors and a plurality of sampling switches by utilizing the switching operation of these thin film transistors. Also, during normal operation, the precharging of each data line is performed by using the switching operation of these thin film transistors, and the supply of the image signal to each precharged data line is favorably performed by the image signal supply means. become.

According to a fourth aspect of the present invention, in the active matrix substrate according to the third aspect, the thin film transistor comprises one of an N-channel transistor, a P-channel transistor, and a complementary transistor. Features.

According to the fourth aspect of the present invention, the active matrix substrate includes an N-channel transistor and a P-channel transistor, that is, a single-channel TFT, and a complementary transistor including an N-channel transistor and a P-channel transistor. Utilizing the switching operation of the precharge switch, a predetermined type of electrical characteristic test can be reliably performed at the time of inspection, and the precharge can be reliably performed at the time of normal operation.

According to a fifth aspect of the present invention, in the active matrix substrate according to any one of the second to fourth aspects, the data line driving circuit comprises a series of ones for sequentially outputting transfer signals from each stage. A shift register and the sampling circuit driving circuit after limiting the time length of the transfer signal so that the transfer signals output one after another from two adjacent stages in the shift register do not overlap each other in time. And a waveform control circuit that outputs a signal.

According to the active matrix substrate of the present invention, when the transfer signals are sequentially output from each stage of the one-line shift register, the transfer signals successively output from the shift register are temporally shifted. After the time length of the transfer signal is limited by the waveform control circuit so that they do not overlap with each other, the transfer signal is output as a sampling circuit drive signal.
Therefore, it is possible to prevent a situation in which the image signal, the inspection signal, and the precharge signal are supplied across a plurality of data lines due to the operation of the sampling switch corresponding to the temporal overlap between the successive transfer signals. . And
With this configuration, the precharge signal and the precharge circuit drive signal supplied to the inspection and precharge circuit are respectively 1 if the 1H inversion drive is not performed as described above.
In the case of performing the above-described 1H inversion driving, it is sufficient to use two series of precharge signals (the precharge circuit drive signal remains one series). Therefore, compared with the case where the sampling switch is driven by the data line driving circuit based on the plurality of series of transfer signals output from the plurality of series of shift registers,
The number of input / output wirings and input / output terminals for precharge signals and precharge circuit drive signals can be significantly reduced.

According to a sixth aspect of the present invention, in the active matrix substrate according to any one of the first to fifth aspects, each of the plurality of pixel units includes a thin film transistor for active driving. Yes,
The inspection and precharge circuit includes a thin film transistor simultaneously formed from the same film as the thin film transistor in the pixel portion.

According to the active matrix substrate of the present invention, the thin film transistor in the pixel portion and the thin film transistor in the inspection and precharge circuit are formed simultaneously from the same film. It is easy, and the cost of the entire apparatus can be reduced.

A liquid crystal device according to a seventh aspect includes the active matrix substrate according to any one of the first to sixth aspects, the other of the pair of substrates, and the liquid crystal. It is characterized by.

According to the liquid crystal device of the present invention, since the liquid crystal device is provided with the above-described active matrix substrate of the present invention, and various electrical characteristics tests are performed without fail before the assembling process, High reliability. In addition, since there is no test circuit or input / output wiring and input / output terminals dedicated to the test circuit, peripheral circuits for performing normal operations such as a precharge circuit, a sampling circuit, a data line drive circuit, and a scan line drive circuit have a margin. Can be formed.

According to an eighth aspect of the present invention, in the liquid crystal device according to the seventh aspect, the pair of substrates are attached to each other around a screen display area defined by the plurality of pixel portions to surround the liquid crystal. A sealing member to be formed, and a light-shielding peripheral parting formed on the other substrate along a contour of the screen display area between the seal member and the screen display area. At least one of a charge circuit and an input / output wiring of the inspection / precharge circuit is provided at a position facing the peripheral parting.

According to the liquid crystal device of the eighth aspect, the light-shielding peripheral parting is provided along the contour of the screen display area between the seal member and the screen display area on the other substrate (ie, the opposite substrate). And is formed on the second substrate. And
A position where at least one of the inspection and precharge circuit and its input / output wiring faces the peripheral parting
(Referred to as “periphery parting down”) on one substrate. Here, the inspection and precharge circuit is basically an AC drive circuit during normal operation. For this reason, even if an inspection / precharge circuit and its input / output wiring are provided on one substrate portion facing the liquid crystal surrounded by the seal member and sandwiched between the two substrates, the problem of deterioration of the liquid crystal due to the application of the DC voltage is still present. Does not occur. By providing the inspection and precharge circuit and its input / output wiring below the peripheral part, for example, the scanning line driving circuit and the data line driving circuit are formed with a margin in the peripheral portion of the narrow and elongated substrate. be able to.

According to a ninth aspect of the present invention, there is provided an electronic apparatus including the liquid crystal device according to the eighth aspect.

According to the ninth aspect of the present invention, since the electronic apparatus is provided with the above-described liquid crystal device of the present invention, miniaturization is achieved, high-quality operation is possible, and reliability is high. .

According to a tenth aspect of the present invention, there is provided an active matrix substrate inspection method for inspecting an active matrix substrate according to any one of the second to sixth aspects, wherein (i) the data line driving circuit operates normally. By applying a predetermined voltage to the precharge signal line and measuring a current flowing through the image signal line while turning on all of the plurality of precharge switches, or (ii) normally operating the data line drive circuit. By operating a plurality of precharge switches simultaneously driven by the precharge circuit drive signal and applying a predetermined voltage to the image signal line and measuring a current flowing through the precharge signal line, And performing an open or disconnection inspection of the plurality of data lines.

According to the method for inspecting an active matrix substrate according to the tenth aspect, (i) the normal operation of the data line driving circuit and the turning on of all of the plurality of precharge switches, while the predetermined voltage is applied to the precharge signal line. Is applied. Then, the predetermined voltage applied to the precharge signal line is applied to each data line via the precharge switch that is turned on. Since the sampling switches are turned on in units of data lines or in groups of a plurality of data lines, a current flows through the image signal lines when each data line and each image signal line are brought into a conductive state. Therefore, by measuring the current flowing through this image signal line,
By comparing with a reference current obtained when the data line and the pixel unit connected to the data line are in a normal state, it is possible to inspect whether the data line is open or disconnected in units of data line or group of a plurality of data lines.

Alternatively, (ii) a predetermined voltage is applied to the image signal line while the data line drive circuit is operated normally and all the plurality of precharge switches driven simultaneously by the precharge circuit drive signal are turned on. Then, the predetermined voltage applied to the image signal line is sampled by the sampling switch and applied to each data line. Since the precharge switch is turned on, each data line and the precharge signal line are in a conductive state, and a current flows through the precharge signal line by the voltage applied to each data line. Therefore, by measuring the current flowing through the precharge signal line and comparing it with a reference current obtained when the data lines and the like are in a normal state, the data line unit or the group unit including a plurality of data lines can be used.
Opening or disconnection of the data line can be checked.

An active matrix substrate inspection method according to claim 11 is the inspection method for inspecting an active matrix substrate according to claims 2 to 6, wherein (i) all of the sampling switches are turned on. While turning off all of the plurality of precharge switches,
By applying a predetermined voltage between image signal lines electrically connected to adjacent data lines and measuring a current flowing between image signal lines electrically connected to the adjacent data lines, or (ii) applying a predetermined voltage between precharge signal lines electrically connected to adjacent data lines while turning off all the sampling switches and turning on all of the plurality of precharge switches; A short-circuit test of the plurality of data lines is performed by measuring a current flowing between precharge signal lines electrically connected to the adjacent data lines.

According to the method for inspecting an active matrix substrate according to the eleventh aspect, (i) while all the sampling switches are turned on and all of the plurality of precharge switches are turned off, an electric signal is applied to adjacent data lines. A predetermined voltage is applied between the image signal lines to be electrically connected. Then, a predetermined voltage is applied from the image signal line to the data line via the sampling switch. However, since all the precharge switches are turned off, the adjacent data lines are substantially insulated from each other, and the distance between the image signal lines is reduced. No current should flow through. In this state, a current flowing between image signal lines electrically connected to adjacent data lines is measured in this state, and a reference current (nearly zero) obtained when the data lines and the like are in a normal state is determined. By comparison, short-circuiting of data lines can be inspected in data line units or in groups formed of a plurality of data lines.

Alternatively, (ii) a predetermined voltage is applied between precharge signal lines electrically connected to adjacent data lines while all sampling switches are turned off and all the plurality of precharge switches are turned on. Apply.
Then, a predetermined voltage is applied from the precharge signal line to the data line via the precharge switch. However, since the sampling switches are all turned off, adjacent data lines are almost insulated from each other, and the precharge signal No current should flow between the lines. So, in this state,
By measuring a current flowing between precharge signal lines electrically connected to adjacent data lines and comparing it with a reference current (nearly zero) obtained when the data line is in a normal state, the data line The short circuit of the data line can be inspected in units or in groups of a plurality of data lines.

According to a twelfth aspect of the present invention, there is provided an inspection method for inspecting an active matrix substrate according to any one of the second to sixth aspects, wherein (i) all of the sampling switches are turned off. While turning on all the plurality of precharge switches,
By applying a predetermined voltage to the precharge signal line and measuring a current flowing through the image signal line, or (i.
i) applying a predetermined voltage to the image signal line while turning off all of the sampling switches and turning on all of a plurality of precharge switches simultaneously driven by the precharge circuit drive signal; A leakage test of the sampling switch is performed by measuring a current flowing through the line.

According to the method for inspecting an active matrix substrate according to the twelfth aspect, (i) all the sampling switches are turned off and all of the plurality of precharge switches are turned on, and a predetermined voltage is applied to the precharge signal line. Is applied. Then, a predetermined voltage is applied from the precharge signal line to the data line via the precharge switch. However, since all the sampling switches are turned off, a current flows from the data line to the image signal line by the predetermined voltage of the data line. There shouldn't be. In this state, the current flowing through the image signal line is measured and compared with a reference current (nearly zero) obtained when the sampling switch is in a normal state. Leakage of the sampling switch can be inspected for each group.

Alternatively, (ii) a predetermined voltage is applied to the image signal line while all the sampling switches are turned off and all the plurality of precharge switches driven simultaneously by the precharge circuit drive signal are turned on. Then, since the sampling switches are all turned off, no current should flow through the precharge signal line via the data line and the precharge switch due to the predetermined voltage of the image signal line. In this state, the current flowing through the precharge signal line is measured and compared with a reference current (nearly zero) obtained when the sampling switch is in a normal state. The leak of the sampling switch can be inspected for each group consisting of.

According to a thirteenth aspect of the present invention, there is provided an inspection method for inspecting an active matrix substrate according to any one of the second to sixth aspects, wherein (i) all of the sampling switches are turned on. While turning off all of the plurality of precharge switches,
By applying a predetermined voltage to the precharge signal line and measuring a current flowing through the image signal line, or (i.
i) By applying a predetermined voltage to the image signal line and measuring a current flowing through the precharge signal line while turning on all the sampling switches and turning off all of the plurality of precharge switches, A leak test of the precharge switch is performed.

According to the method for inspecting an active matrix substrate according to the thirteenth aspect, (i) all the sampling switches are turned on and all of the plurality of precharge switches are turned off while a predetermined voltage is applied to the precharge signal line. Is applied. Then, since all the precharge switches are turned off, no current should flow through the image signal lines via the data lines and the sampling switches due to the predetermined voltage of the precharge signal lines. Therefore, in this state, the current flowing through the image signal line is measured and compared with a reference current (nearly zero) obtained when the precharge switch is in a normal state. The leak of the precharge switch can be inspected in a group unit consisting of:

Alternatively, (ii) a predetermined voltage is applied to the image signal line while all the sampling switches are turned on and all the plurality of precharge switches are turned off. Then, a predetermined voltage is applied from the image signal line to the data line via the sampling switch, but since all the precharge switches are turned off, a current flows from the data line to the precharge signal line by the predetermined voltage of the data line. There shouldn't be. In this state, the current flowing through the precharge signal line is measured and compared with a reference current (nearly zero) obtained when the precharge switch is in a normal state. Leakage of the precharge switch can be inspected for each group of lines.

The operation and other advantages of the present invention will become more apparent from the embodiments explained below.

[0044]

Embodiments of the present invention will be described below with reference to the drawings.

(Configuration of Active Matrix Substrate) The configuration of an embodiment of the active matrix substrate of the present invention will be described with reference to FIGS.

First, the circuit configuration of the entire active matrix substrate will be described with reference to FIG. FIG. 1 is an equivalent circuit diagram of various wirings, peripheral circuits, and the like provided on an active matrix substrate.

In FIG. 1, the active matrix substrate includes a TFT array substrate 1 made of, for example, a quartz substrate, hard glass, a silicon substrate, or the like. On the TFT array substrate 1, a plurality of pixel electrodes 11 provided in a matrix, a plurality of data lines 35 arranged in the X direction, each extending in the Y direction, and a plurality of data lines 35 arranged in the Y direction. Each of the scanning lines 31 extending along the X direction and each of the data lines 35 and the pixel electrode 11 are interposed between the scanning lines 31 and the conductive state and the non-conductive state therebetween are supplied via the scanning lines 31. A plurality of TFTs 30 are formed as an example of a switching element that controls each according to the scanning signals Y1, Y2,..., Ym. Further, on the TFT array substrate 1, a capacitance line 3 which is a wiring for a storage capacitor 70 is provided.
1 ′ are formed substantially parallel along the scanning line 31 so that the storage capacitor 70 is added to the pixel electrode 11. This can prevent display quality degradation such as flicker caused by parasitic capacitance. The storage capacity 70
May be used as an electrode for forming a storage capacitor. With such a configuration, since it is not necessary to provide the capacitor line 31 ', the pixel aperture ratio can be improved, and a bright liquid crystal device can be provided. By the way, the image signals S1, S2,..., Sn written to the data lines 35 may be supplied line-sequentially in this order, or may be supplied to a plurality of adjacent data lines 35 in groups. You may do it. In this manner, by driving a plurality of adjacent data lines 35 at the same time and shifting the phase of the image signal, the driving frequency of the data line driving circuit can be reduced, and the reliability and power consumption of the circuit can be reduced. Can be realized.

On the TFT array substrate 1, a data line 35 and a TF of a pixel portion connected to the data line 35 at the time of inspection before being assembled into a liquid crystal device 200 (described later) are further provided.
An inspection function for performing various electrical inspections such as an open or disconnection inspection and a short circuit inspection of T30 and the like, and a precharge signal NRS of a predetermined voltage level is applied to a plurality of data lines 35 during normal operation of the liquid crystal device 200 by image signals S1 and S2. ,..., Sn, the inspection and precharge circuit 201 having both functions of supplying a precharge function prior to the image signals S1, S2,.
.., A sampling circuit 301 that samples Sn and supplies each to the plurality of data lines 35, a data line driving circuit 101, and a scanning line driving circuit 104 are formed.

The scanning line driving circuit 104 applies scanning signals Y1, Y2,. , Ym are applied in a pulsed manner in a line-sequential manner.

The data line drive circuit 101 applies a timing at which the scan line drive circuit 104 applies the scan signals Y1, Y2,... ., SHn for each of the image signal lines 304 for each of the data lines 35.
Is supplied to the sampling circuit 301 via the sampling circuit drive signal line 306 at a predetermined timing.

The inspection / precharge circuit 201 includes, for example, a TFT 202 as a switching element and a data line 3
5 and a precharge signal line 204 is connected to the TFT
The precharge circuit drive signal line 206 is connected to the drain or source electrode of the TFT 202 and the gate electrode of the TFT 202. During normal operation, power of a predetermined voltage required for writing the precharge signal NRS is supplied from an external power supply via the precharge signal line 204, and each data line is supplied via the precharge circuit drive signal line 206. 35, the image signals S1, S2,
.., At the timing preceding Sn
A precharge circuit drive signal NRG is supplied from an external control circuit so as to write S. The inspection and precharge circuit 201 preferably has an image signal S of an intermediate gradation level.
The precharge signal NRS corresponding to 1, S2,..., Sn
(Image auxiliary signal). In addition, at the time of inspection, the inspection and precharge circuit 201 can apply an inspection voltage to the data line 35 or flow an inspection current to perform a predetermined type of electrical inspection as described later. It is configured as follows.

The sampling circuit 301 includes a TFT 302
Are provided for each data line 35, the image signal line 304 is connected to the source electrode of the TFT 302, and the sampling circuit drive signal line 306 is connected to the gate electrode of the TFT 302. When the image signals S1, S2,..., Sn are input via the image signal line 304, these are sampled. That is, when the sampling circuit driving signals SH1, SH2,..., SHn are input from the data line driving circuit 101 via the sampling circuit driving signal line 306, the image signals S
1, S2,..., Sn are sequentially applied to the data line 35.

As described above, in the present embodiment, the data line 3
5 are selected for each line, but the data lines 35 may be collectively selected for a plurality of lines at the same time. For example, the image signals S1, S2,... Expanded into a plurality of phases (for example, three phases, six phases, twelve phases,. Sn may be supplied from the image signal line 304 and may be simultaneously sampled for each group. At this time, it is needless to say that the image signal lines 304 are required at least for the number of phase developments.

Next, the TFTs 202 and 3 constituting the inspection / precharge circuit 201 and the sampling circuit 301
02 will be described with reference to FIGS. 2 and 3 respectively. FIG. 2 is a circuit diagram showing various TFTs constituting the TFT 202 of the inspection and precharge circuit 201, and FIG.
FIG. 3 is a circuit diagram showing various TFTs constituting a TFT.

As shown in FIG. 2A, the TFT 202 (see FIG. 1) of the precharge circuit 201 is an N-channel type TFT.
It may be composed of an FT 202a, may be composed of a P-channel TFT 202b as shown in FIG. 2 (2), or may be composed of an N-channel TFT and a P-channel TFT as shown in FIG. 2 (3). It may be composed of a complementary TFT 202c. Note that FIG. 2 (1) to FIG. 2 (3)
In FIG. 1, the precharge circuit drive signal line 2 shown in FIG.
Precharge circuit drive signal 20 input through
6a and 206b are each a TFT 202a as a gate voltage.
To 202c. The precharge signal NRS input via the precharge signal line 204 also shown in FIG.
c. Precharge circuit drive signal 206 applied as gate voltage to N-channel TFT 202a
a and the precharge circuit drive signal 206b applied as a gate voltage to the P-channel type TFT 202b are mutually inverted signals. Therefore, the precharge circuit 201
Is composed of complementary TFTs 202c, at least two or more precharge circuit drive signal lines 206 are required. When the number of the precharge circuit drive signal lines 206 is two or more as described above, wiring may be concentrated on one side of the screen display area, or in combination with the precharge signal line 204, on both sides of the screen display area. May be wired. Alternatively, for example, each or a plurality of adjacent complementary T
The precharge circuit drive signal 206 before the FT 202c
a may be inverted by an inverter to form a precharge circuit drive signal 206b.

As shown in FIG. 3A, the TFT 302 (see FIG. 1) of the sampling circuit 301 is an N-channel type TFT.
It may be composed of an FT 302a, a P-channel TFT 302b as shown in FIG. 3B, or a complementary TFT 302c as shown in FIG.
May be configured. It should be noted that FIG.
In (3), the image signal VID input via the image signal line 304 shown in FIG.
Input to FTs 302a to 302c. Similarly, sampling circuit drive signals 306a and 306b input from the data line drive circuit 101 shown in FIG. 1 via the sampling circuit drive signal line 306 are used as gate voltages for each TFT.
302a to 302c. Also, in the sampling circuit 301, the precharge circuit 201 described above is used.
As in the case of (1), the sampling circuit drive signal 306 applied as a gate voltage to the N-channel TFT 302a
a and a sampling circuit drive signal 306b applied as a gate voltage to the P-channel TFT 302b are mutually inverted signals. Therefore, the sampling circuit 301
Is composed of complementary TFTs 302c, at least two or more sampling circuit drive signal lines 306 for the sampling circuit drive signals 306a and 306b are required.

Next, the configuration and operation of the inspection and precharge circuit 201 provided in the liquid crystal device 200 will be described in more detail.

(Precharge Function of Inspection and Precharge Circuit) First, the precharge function of the inspection and precharge circuit 201 during normal operation of the liquid crystal device 200 will be described with reference to FIG. FIG. 4 is a timing chart of various signals during a normal operation of the inspection and precharge circuit.

As shown in FIG. 4, the data line driving circuit 10
1 includes a clock signal (CL) that defines a selection time t1 (dot frequency) per pixel.
X) is input as a reference for horizontal scanning. When a transfer start signal (DX) is input, transfer signals X1, X2,... Are sequentially supplied from this shift register. In each horizontal scanning period, such a transfer start signal (DX)
The precharge circuit drive signal (NRG) is supplied at a timing prior to the input of. More specifically, the clock signal (CLY), which is the reference for vertical scanning, goes high and the image signal (VID) reverses its polarity with reference to the voltage center value (VID center) of the signal. After a lapse of time t3, which is a margin from the start to the precharge, the precharge circuit drive signal (NRG)
Is set to a high level. On the other hand, the precharge signal (N
RS) is set to a predetermined level having the same polarity as the image signal (VID) during the horizontal retrace period in response to the inversion of the image signal (VID). Therefore, the precharge circuit drive signal (NRG)
Is at a high level, precharge is performed. Then, a time t4 before the end of the horizontal retrace period and the start of the effective display period, that is, a margin from the end of precharge to the time when an image signal is written is set as time t4, and the precharge circuit drive is performed. The signal (NRG) is at a low level. As described above, the inspection and precharge circuit 201 supplies the precharge signal (NRS) to the plurality of data lines 35 prior to the image signal in each horizontal blanking period.

(Test Function of Test and Precharge Circuit) Next, the test function of the test and precharge circuit 201 will be described with reference to FIGS. FIG. 5 (a)
FIG. 5 is a circuit diagram of a configuration example of the data line driving circuit 101 and the inspection and precharge circuit 201 in a state where the data line open inspection is being performed, and FIG. 5B is a timing chart thereof. FIG. 6 is a circuit diagram of an example of the configuration of the data line driving circuit 101 and the inspection and precharge circuit 201 in a state where a short circuit inspection of the data line is being performed. FIG. 7 is a circuit diagram of another configuration example of the data line driving circuit 101 and the inspection and precharge circuit 201. FIG.
FIG. 8A is a circuit diagram of a part of a shift register included in the other configuration example, and FIG. 8B is a timing chart thereof.

In this embodiment, in particular, as shown in FIG. 1, the data line driving circuit 101 and the sampling circuit 301
Is provided at one end of the plurality of data lines 35, and the inspection and precharge circuit 201 is provided at the other end of the plurality of data lines. 5 to 7, a pixel region located at the center of the data line is omitted, and a circuit configuration at one end and a circuit configuration at the other end of the data line are shown. Then, at the time of inspection, the TFTs 202 included in the inspection and precharge circuit 201 are turned on when a precharge circuit drive signal (NRG) is supplied to the gate electrode via the precharge circuit drive signal line 206, respectively. A precharge signal (NRS) supplied to the drain electrode via the signal line 204 is transmitted from the source electrode to the data line 3.
5 is supplied as an inspection signal at the time of inspection. Alternatively, a current flowing through the precharge signal line 204 is measured as a test current.

Therefore, by utilizing the switching operation of the TFTs 202 of the inspection and precharge circuit 201, these TFTs 202 and the TFTs 302 of the sampling circuit 301 are used.
A predetermined type of electrical characteristic test can be performed on each data line 35 positioned between the data lines 35 and the TFTs of the pixel portion connected to the data lines 35 as described below.

In the present embodiment, the image signal lines 304 corresponding to the image signals VID1 to VID6 expanded in six phases are provided.
Are described in the case where six are provided in parallel,
The number of phase expansions and the number of image signal lines 304 are not limited to these.

(1) First Inspection Method First, as shown in FIG. 5 and FIG. 6, the data line driving circuit 101 includes a one-line shift register 303 for sequentially outputting transfer signals from each stage, and a shift register 303. After limiting the time length of the transfer signals so that the transfer signals output immediately before and after from the two adjacent stages do not overlap each other in time, the sampling circuit drive signal Qn (n =
1, 2, 3,...) Will be described.

In this case, when the start signal DX is input at the timing shown in FIG. 5B, the shift register 303 sequentially outputs a transfer signal in synchronization with the clock signal CLX and its inverted signal. In FIG. 5A, on the other hand, the waveform control circuit 307 takes the non-logical product of the enable signal ENB1 and the transfer signal output from the odd-numbered stage by a NAND circuit, and further shapes the waveform by the buffer circuit 308. On the other hand, the NAND of the enable signal ENB2 and the transfer signal output from the even-numbered stage is NAND
The waveforms are shaped by the circuit and further by the buffer circuit 308, and sampling circuit drive signals Qn (n = 1, 2, 3,...) Which do not overlap with each other in time are sequentially output. When the data line driving circuit 101 is configured in this manner, the image signal, the inspection signal, and the precharge signal (NRS) are supplied across the plurality of data lines 35 in response to the temporal overlap between the successive transfer signals. You can prevent it from happening. With this configuration, the precharge signal (NRS) supplied to the inspection and precharge circuit 201
If the 1H inversion drive is not performed as described above, one series is sufficient for each of the precharge circuit drive signal (NRG) and the precharge circuit drive signal (NRG). Further, even in the case of performing the above-described 1H inversion drive, it is sufficient to form the precharge signal (NRS) in two series (the precharge circuit drive signal (NRG) remains in one series). Accordingly, compared with the case where the sampling circuit is driven by the data line driving circuit based on a plurality of series of transfer signals output from a plurality of series of shift registers described later (see FIG. 7), the inspection and precharge circuit 201 is related. In addition, the number of input / output wirings and input / output terminals for precharge signals and precharge circuit drive signals can be significantly reduced. FIG.
When the TFT 202 is composed of complementary TFTs as shown in (3), it is necessary to input the precharge circuit drive signal NRG and its inverted signal to two gates of each TFT 202. In this case, the precharge circuit drive signal N
The RG and its inverted signal may be supplied via two precharge circuit drive signal lines 206 or the liquid crystal device 20.
0, an inverted signal may be generated from the precharge circuit drive signal NRG.

In the present embodiment, since one series of shift register 303 and waveform control circuit 307 are used, the current described below is measured on image signal line 304 and the following inspection is performed for each data line 35 (ie, for each data line 35). In order to find a defective portion in units of data lines), the number of sequences of the precharge circuit drive signal (NRG) and the precharge signal (NRS) is set so as to satisfy the following equation.

“Number of image signal series ≧ number of shift register series × number of data lines to be turned on at the same time”. If the inspection is performed for each data line by the current measurement in, the number of sequences of the precharge circuit drive signal (NRG) and the precharge signal (NRS) is set to satisfy the following equation.

“Number of precharge signal series × number of precharge circuit drive signal series ≧ number of shift register series × number of data lines to be turned on at the same time” Even if these formulas are not satisfied, a plurality of data lines are required. Inspection (finding of defective parts) is possible in group units, and the purpose of simply finding defective products on the production line and not transferring it to the next process such as the assembly process is achieved. However, since the analysis of the defective portion is very useful for improving the defective product rate in the subsequent manufacturing technology, it is very important to find the defective portion in data line units as in the present embodiment.

(1-1) Inspection of Opening or Disconnection of Data Line In this case, as shown in FIG. 5A, the data line driving circuit 101 and the scanning line driving circuit 104 are operated normally. The plurality of TFTs 2 in the precharge circuit 202
A precharge signal (NRS) having a predetermined voltage of, for example, 5 V is applied to the precharge signal line 204 while turning on all 02 (that is, keeping the precharge circuit drive signal (NRG) at a high level). Then, the predetermined voltage applied to the precharge signal line 204 is applied to each data line 35 via the TFT 202 turned on. Then, the plurality of TFTs 30 in the sampling circuit 301 are generated by the voltage applied to each data line 35.
1 is a sampling circuit drive signal Sn (n = 1, 2,...)
, The current flows through the image signal line 304 when each data line 35 and each image signal line 304 are turned on. Therefore, this image signal line 30
4 is measured and compared with a reference current I obtained when the data line 35 and the TFT 30 of the pixel portion connected to the data line 35 are in a normal state. If the measured current falls within the range of the reference current I ± ε (ε: tolerance or error range), it can be determined that each data line 35 has no opening or disconnection. Conversely, if it is not within this range, it can be determined that each data line 35 is open or disconnected.

In this example, since the total number of image signal lines 304 is even, H (high level) and L
(Low level), H, L, H, and L are applied alternately to different levels of voltage, so that inspection can be performed only once.
If the total number of the image signal lines 304 is an odd number, a voltage having a different level such as H, H, L, H, H, L, H, H, L,. , L, H, L,
If another voltage having a different level such as L, H, L, L, H,... Is applied once, the same content can be inspected by applying the voltage twice.

(1-2) Inspection of short circuit of data line In this case, first, the operation of the scanning line driving circuit 104 is stopped. Then, as shown in FIG.
All the one TFTs 302 are turned on (ie, the start signal DX of the shift register 303 is set to the high level), and all the TFTs 202 of the precharge circuit 201 are turned off (ie, the precharge circuit drive signal (NRG) is turned on). While maintaining the low level, a predetermined voltage is applied between the adjacent image signal lines 304. Specifically, for example, a high-level voltage of 15 V is applied to the image signal lines 304 corresponding to the image signals VID1, 3, and 5, and 0 V is applied to the image signal lines 304 corresponding to the image signals VID2, 4, and 6. Apply low level voltage. Then, TFT
A predetermined voltage is applied from the image signal line 304 to the data line 35 via the line 302, but since the TFTs 202 are all turned off, the adjacent data lines 35 are substantially insulated from each other, and No current should flow between the signal lines 304. In this state, the current flowing between the adjacent image signal lines 304 is measured and compared with a reference current ± i (nearly zero) obtained when the data lines 35 and the like are in a normal state. If the measured current falls within the range of the reference current ± i, each data line 35
It can be determined that there is no short circuit. Conversely, if it is not within this range, it can be determined that each data line 35 has a short circuit.

(1-3) Inspection of TFT Leakage in Sampling Circuit In this case, first, the operation of the scanning line driving circuit 104 is stopped. In FIG. 6, all the TFTs 302 of the sampling circuit 301 are turned off (that is, the start signal DX of the shift register 303 is set to a low level), and all the TFTs 202 of the precharge circuit 201 are turned on (that is, the precharge circuit 201 is turned on). Charge circuit drive signal (NR
G) is set to the high level) and the precharge signal line 20
4 is applied with a predetermined voltage, for example, 12V. Then, a predetermined voltage is applied from the precharge signal line 204 to the data line 35 via the TFT 202. However, since all the switches of the TFT 302 of the sampling circuit 301 are turned off, the predetermined voltage of the data line 35 is applied to the data line 35.
Therefore, no current should flow through the image signal line 304. Therefore, in this state, the current flowing through the image signal line 304 is measured, and the reference current ± (nearly zero) obtained when the TFT 302 or the like of the sampling circuit 301 is in a normal state.
Compare with i. If the measured current falls within the range of the reference current ± i, it can be determined that there is no leak in each TFT 302. Conversely, if not within this range, each TFT
In 302, it can be determined that there is a leak.

(1-4) Inspection of TFT Leak in Precharge Circuit In this case, first, the operation of the scanning line driving circuit 104 is stopped. In FIG. 6, all the TFTs 302 of the sampling circuit 301 are turned on (that is, the start signal DX of the shift register is set to the high level), and all the TFTs 202 of the precharge circuit 201 are turned off (that is, precharged). While the circuit drive signal (NRG) is at low level), the precharge signal line 204
For example, a predetermined voltage such as 12 V is applied. Then T
Since all of the FTs 202 are turned off, the image signal lines 30 via the data lines 35 and the TFTs 302 of the sampling circuit 301 by a predetermined voltage of the precharge signal lines 204.
No current should flow through 4. Therefore, in this state, the current flowing through the image signal line 304 is measured and compared with a reference current ± i (nearly zero) obtained when the TFT 202 or the like of the precharge circuit 201 is in a normal state. If the measured current is within the range of the reference current ± i, it can be determined that there is no leak in each TFT 202. Conversely, if it is not within this range, it can be determined that each TFT 202 has a leak.

(2) Second Inspection Method Next, as shown in FIG.
For example, a case where a four-system eight-phase shift register 303 'that sequentially outputs a transfer signal from each stage is provided (that is, a case where the waveform control circuit 307 shown in FIGS. 5 and 6 is not provided)
Will be described.

In FIG. 7, when a start signal DX is input, each series of the shift register 303 'receives a clock signal CLX1, its inverted signal, and a clock signal CLX2.
, And sequentially outputs transfer signals (ie, sampling circuit drive signals Q1, Q2,...) In synchronization with the clock signal CLX3 and its inverted signal, and the clock signal CLX4 and its inverted signal.

In this case, a circuit portion forming one system of the shift register (system for outputting sampling circuit drive signals Q1, Q5, Q9...) Is extracted and FIG.
The timing chart is shown in FIG. 8B.
As shown in FIG. 8B, transfer signals (that is, sampling circuit drive signals Q) output from two stages adjacent to each other in each sequence of the shift register 303 ′ are successively output.
1, Q5, Q9,...) Overlap one another temporally. Similarly, transfer signals (that is, sampling circuit drive signals Q2, Q6, Q10,...) Output immediately before and after two adjacent stages overlap with each other in other streams, and overlap with each other in time. The transfer signals (that is, the sampling circuit drive signals Q3, Q7, Q11,...) Overlap each other in time, and the transfer signals (that is, the sampling circuit drive signals Q2,
Q6, Q10,...) Overlap with each other in time.

Therefore, when the data line driving circuit 101 is configured as described above, the image signal lines 3 which have been
By limiting the number of data lines 35 that are simultaneously turned on using the signal lines 04, the sampling circuits connected to the same image signal line 304 by the sampling circuit drive signals Qi overlapping each other as shown in FIG. 301 TFT
A configuration is adopted in which the two motors 302 are not simultaneously driven.

In the second inspection method, since a plurality of series of shift registers 303 'are used, the current described in the precharge signal line 204 is measured, and the inspection described below is performed for each data line 35 (that is, the data line 35). The precharge circuit drive signal (NR
G) and the number of sequences of the precharge signal (NRS) are set so as to satisfy the following equation.

“Number of precharge signal series × (number of precharge circuit drive signal series × 2) ≧ (number of shift register series × 2) × number of simultaneously turned on data lines” In the example, the precharge circuit drive signal (NRG) has two lines (NRG1 and NRG2), and the precharge signal (NRS) has four lines (NRS).
1, NRS2, NRS3 and NRS4).

Even when the above expression is not satisfied, or as in the case of the first inspection method described above, the image signal line 304
Inspection of a group consisting of a plurality of data lines (detection of a defective portion) is also possible by measuring the current in the semiconductor device. Not purpose is achieved.

As described above, a plurality of shift registers 30
When 3 ′ is used, the input for the precharge signal (NRS) and the precharge circuit drive signal (NRG) is compared with the case where the above-described one-series shift register 303 is used (see FIGS. 5 and 6). Although the number of output wirings and input / output terminals is large, the advantage of the present embodiment over the prior art by using both the inspection circuit and the precharge circuit is not lost.

(2-1) Opening or disconnection inspection of data lines In this case, in FIG. 7, the data line driving circuit 101 and the scanning line driving circuit 104 are operated normally.

First, the plurality of NRG1 series TFTs 202 in the precharge circuit 202 are turned on (that is, the precharge circuit drive signal (NRG1) is set to a high level) and the plurality of NRG2 series TFTs 20 are turned on.
2 while the image signal line 3 is in the off state (ie, while the precharge circuit drive signal (NRG2) is at a low level).
For example, a predetermined voltage such as 5 V is applied to the signal line 04. Then, the predetermined voltage applied to the image signal line 304 is applied to each data line 35 and each image by sequentially turning on the plurality of TFTs 301 in the sampling circuit 301 by the sampling circuit drive signal Sn (n = 1, 2,...). Signal line 3
At the time when the circuit 04 is turned on, a current flows through the precharge signal line 204 corresponding to the NRG1 series. Therefore, the current flowing through the precharge signal line 204 is measured and compared with a reference current obtained when the data lines 35 and the like are in a normal state, thereby opening or disconnecting each data line 35 corresponding to the NRG1 series. Can be determined.

Next, N in the precharge circuit 202
The plurality of TFTs 202 of the RG2 series are turned off (that is, the precharge circuit drive signal (NRG1) is set to low level), and the plurality of TFTs 202 of the NRG2 series are turned on (that is, the precharge circuit drive signal (N
While keeping RG2) at a high level), a predetermined voltage such as 5 V is applied to the image signal line 304, and the above-described NRG is applied.
As in the case of one series, it is possible to determine whether or not each data line 35 corresponding to the NRG2 series is open or disconnected.

(2-2) Inspection of Short-circuit of Data Line In this case, first, the operation of the scanning line driving circuit 104 is stopped. In FIG. 7, all the TFTs 302 of the sampling circuit 301 are turned off (that is, the start signal DX of the shift register is set to a low level), and all the TFTs 202 of the precharge circuit 201 are turned on (that is, the precharge is performed). A predetermined voltage is applied between adjacent precharge signal lines while the circuit drive signals (NRG1 and NRG2) are at a high level. In particular,
The precharge signal lines 204 corresponding to the precharge signals NRS1 and NRS3 are set to a high level of, for example, 12V, and the precharge signal lines 204 corresponding to the precharge signals NRS2 and NRS4 are set to a low level of, for example, 0V. Then, a predetermined voltage is applied from the precharge signal line 204 to the data line 35 via the TFT 202. However, since all the TFTs 302 are turned off, the adjacent data lines 35 are almost insulated from each other and No current should flow between adjacent precharge signal lines 204. Therefore, in this state, the current flowing between the adjacent precharge signal lines 204 is measured, and is compared with a reference current (nearly zero) obtained when the data lines 35 and the like are in a normal state. The presence or absence of a short circuit in each data line 35 can be determined.

(2-3) Inspection of TFT Leakage in Sampling Circuit In this case, first, the operation of the scanning line driving circuit 104 is stopped, and in FIG.
02 is turned off (that is, the start signal DX of the shift register is set to low level).

First, a plurality of NRG1 series TFTs 202 in the precharge circuit 202 are turned on (that is, the precharge circuit drive signal (NRG1) is set to a high level), and a plurality of NRG2 series TFTs 20 are turned on.
2 while the image signal line 3 is in the off state (ie, while the precharge circuit drive signal (NRG2) is at a low level).
For example, a predetermined voltage such as 12 V is applied to the signal line 04. Then, as for the predetermined voltage applied to the image signal line 304, no current should flow to the precharge signal line 204 via the data line 35 and the TFT 202 because all the switches of the TFT 302 of the sampling circuit 301 are turned off.
Therefore, in this state, the current flowing through the precharge signal line 204 is measured, and the TFT3 of the sampling circuit 301 is measured.
By comparing with a reference current obtained when 02 or the like is in a normal state (nearly zero), it is possible to determine whether or not each TFT 302 of the sampling circuit 301 corresponding to the NRG1 series has a leak.

Next, N in the precharge circuit 202
The plurality of TFTs 202 of the RG2 series are turned off (that is, the precharge circuit drive signal (NRG1) is set to low level), and the plurality of TFTs 202 of the NRG2 series are turned on (that is, the precharge circuit drive signal (N
While keeping RG2) at a high level), a predetermined voltage such as 12 V is applied to the image signal line 304, and the above-described NR
As in the case of the G1 series, it is possible to determine whether or not there is a leak in each TFT 302 of the sampling circuit 301 corresponding to the NRG2 series.

(2-4) Inspection of TFT Leak in Precharge Circuit In this case, first, the operation of the scanning line drive circuit 104 is stopped. In FIG. 7, all the TFTs 302 of the sampling circuit 301 are turned on (that is, the start signal DX of the shift register is set to the high level), and all the TFTs 202 of the precharge circuit 201 are turned off (that is, the precharge is performed). While the circuit drive signals (NRG1 and NRG2) are at a low level, the image signal line 30
4 is applied with a predetermined voltage, for example, 12V. Then, as for the predetermined voltage applied to the image signal line 304, no current should flow to the precharge signal line 204 via the TFT 302 and the data line 35 because all the switches of the TFT 202 of the precharge circuit 302 are turned off. .
Therefore, in this state, the current flowing through the precharge signal line 204 is measured, and the TFT 2 of the precharge circuit 201 is measured.
By comparing with a reference current obtained when 02 or the like is in a normal state (nearly zero), it is possible to determine whether or not each TFT 202 of the precharge circuit 201 has a leak.

As described above, the inspection and precharge circuit 201 in the present embodiment has an inspection function at the time of inspection performed before the assembling process into the liquid crystal device 200 or before the scribe process. It has a precharge function during normal operation after assembling. For this reason,
Compared with the conventional case where the inspection circuit and the precharge circuit are separately provided in the peripheral portion of the substrate, the area on the substrate required to realize these two functions can be significantly reduced. In particular, there is no need to provide dedicated test terminals and test wiring that are not required during normal operation as in the past, and input / output wiring and input / output terminals for precharging can be used for testing, which is very advantageous. is there. Furthermore, the inspection terminals that are no longer needed as in the related art are corroded and adversely affect the active matrix substrate and the liquid crystal device incorporating the same, and the inspection circuit and the inspection wiring are defective. And the possibility of leading to failure of the liquid crystal device as a whole is reduced, which is double advantage.

(Overall Configuration of Liquid Crystal Device) Next, an overall configuration example of a liquid crystal device provided with an active matrix substrate including the above-described inspection and precharge circuit 201 will be described with reference to FIGS. 9 and 10. FIG. Here, FIG. 9 is a plan view of the liquid crystal device viewed from the counter substrate side, and FIG.
HH ′ sectional view of FIG.

9 and 10, on the TFT array substrate 1, a screen display area defined by a plurality of pixel electrodes 11 (that is, a liquid crystal on which an image is actually displayed due to a change in the alignment state of the liquid crystal layer 50). A sealing material 52 made of a photocurable resin as an example of a sealing member that surrounds the liquid crystal layer 50 by bonding the two substrates together around the (device region)
It is provided along the screen display area. A light-shielding peripheral partition 53 is provided between the screen display area on the counter substrate 2 and the sealing material 52.

When the TFT array substrate 1 is put in a light-shielding case having an opening corresponding to the screen display area later, the peripheral display 53 may have an edge of the opening of the case due to a manufacturing error or the like. That is, for example, several hundred μm for the case of the TFT array substrate 1.
It is formed of a band-shaped light-shielding material having a width of 500 μm or more around the screen display area so as to allow a deviation of about m. Such light-shielding peripheral parting 53
Is, for example, Cr (chromium), Ni (nickel), Al
The counter substrate 2 is formed by sputtering, photolithography, and etching using a metal material such as (aluminum). Alternatively, it is formed from a material such as resin black in which carbon or Ti (titanium) is dispersed in a photoresist.

The data line driving circuit 101 and the mounting terminals 102 are provided along the lower side of the screen display area in the area outside the sealing material 52, and the scanning line driving circuit is provided along the two left and right sides of the screen display area. Circuits 104 are provided on both sides of the screen display area. Further, a plurality of wirings 105 for connecting the scanning line driving circuits 104 provided on both sides of the screen display area are provided on an upper side of the screen display area. Also,
At least one of the corners of the opposing substrate 2
A silver point 106 made of a conductive material for providing electrical continuity between the TFT array substrate 1 and the counter substrate 2 is provided. The opposite substrate 2 having substantially the same contour as the sealing material 52 is fixed to the TFT array substrate 1 by the sealing material 52.

In this embodiment, particularly, the inspection / precharge circuit 201 and the sampling circuit 301 are provided on the TFT array substrate 1 at a position facing the light-shielding peripheral partition 53 formed on the opposite substrate 2. The data line driving circuit 101 and the scanning line driving circuit 104 are provided on a narrow and elongated peripheral portion of the TFT array substrate 1 not facing the liquid crystal layer 50.

The inspection / precharge circuit 201 and the sampling circuit 301 are basically AC driven circuits during normal operation. Therefore, these inspection and precharge circuits 201 are provided in the portion of the TFT array substrate 1 facing the liquid crystal layer 50 surrounded by the sealing material 52 and sandwiched between the two substrates.
Even if the sampling circuit 301 is provided, the problem of deterioration of the liquid crystal layer 50 due to application of a DC voltage does not occur. On the other hand, the data line driving circuit 101 and the scanning line driving circuit 1
Reference numeral 04 denotes a peripheral portion of the TFT array substrate 1 that does not face the liquid crystal layer 50. Therefore, the liquid crystal layer 50
In particular, it is possible to prevent DC voltage components from the data line driving circuit 101 and the scanning line driving circuit 104, which are DC driven, from leaking and being applied.

Then, below the peripheral parting 53,
Inspection and precharge circuit 201 and sampling circuit 3
By providing 01, the scanning line driving circuit 104 and the data line driving circuit 101 can be formed with a margin in the peripheral portion of the TFT array substrate 1, and these peripheral circuits are designed to meet specific specifications. It becomes easier.

In this embodiment, a precharge signal line 204 and a precharge circuit drive signal line 206 (FIG. 1)
) Is provided on the TFT array substrate 1 at a position facing the peripheral partition 53. in this case,
Since the inspection and precharge circuit 201 is basically an AC drive circuit during normal operation, such a precharge signal line 204 and a precharge circuit drive signal line are provided on the TFT array substrate 1 facing the liquid crystal layer 50. However, the problem of deterioration of the liquid crystal due to the application of the DC voltage does not occur. If two types of input / output wirings are provided below the peripheral partition 53, the effective display area of the liquid crystal device is not reduced.

(Detailed Configuration of Liquid Crystal Device) Next, a specific configuration of each pixel portion and the like of the liquid crystal device will be described with reference to FIGS. Here, FIG. 11 is a plan view of a pixel portion adjacent to the liquid crystal device, and FIG. 12 is a plan view of a TFT constituting an inspection / precharge circuit of the liquid crystal device.
FIG. 13 is a sectional view taken along line AA ′ of FIG. 11 and FIG.
FIG. 14 is a cross-sectional view showing a cross section taken along line -B ′, and FIG.
FIG. 3B is a cross-sectional view taken along a precharge signal line wired under the periphery of the liquid crystal device, showing a cross section taken along line −C ′.
In FIGS. 13 and 14, the scale of each layer and each member is different so that each layer and each member have a size recognizable in the drawings.

As shown in the plan view of FIG. 11, in the screen display area, a plurality of pixel electrodes 11 are arranged in a matrix on the TFT array substrate 1, and a TFT 30 (shown by a broken line) is adjacent to each pixel electrode 11. (Enclosed region), and a data line 35, a scanning line 31, and a capacitance line 31 'are provided along the vertical and horizontal boundaries of the pixel electrode 11, respectively. The data line 35 is electrically connected to the source region of the semiconductor layer 32 via the contact hole 37, and the channel region of the semiconductor layer 32 (the hatched portion in the lower right portion of FIG. 11).
Is controlled by a gate electrode which is a part of the scanning line 31. The drain region of the semiconductor layer 32 is electrically connected to the pixel electrode 11 via the contact hole 38.
In order to add a storage capacitor to the pixel electrode 11, a capacitor line 31 'is provided. The storage capacitor is an interlayer insulating layer (for example, a gate insulating layer described later) between a first storage capacitor electrode 32 ′ extending from the drain region of the semiconductor layer 32 and the capacitor line (second storage capacitor electrode) 31 ′. Is formed as a dielectric. When the capacitance line 31 'is formed of a polysilicon film or the like in the same step as the scanning line, a constant potential line 501 made of a low-resistance metal such as Al or a metal silicide formed in the same step as the data line and the contact hole are used. It is preferable to make an electrical connection through 502. By adopting such a configuration,
The resistance of the capacitance line 31 'can be reduced. In addition, as shown in FIG. 11, the constant potential line 501 extends from a power supply or the like supplied to a peripheral circuit provided around the screen display area, and is wired in the area of the peripheral parting 53. It is not necessary to provide an input terminal, and furthermore, by forming a wiring in an area such as the peripheral partition 53 which has been a dead space in the related art, the size of the liquid crystal device can be reduced.

As shown in the plan view of FIG. 12, in the inspection / precharge circuit 201, a precharge signal line 204, a precharge circuit drive signal line 206, and a data line 35 are arranged in parallel. The precharge signal line 204 is connected to each TF through each contact hole 37 ″.
The data line 35 is electrically connected to the source region of T202, and the data line 35 is connected to each TFT 2 through each contact hole 38 ″.
02 is electrically connected to the drain region. The precharge circuit drive signal line 206 is disposed as a gate electrode of the TFT 202 in a channel portion connecting the source region and the drain region, with a gate insulating film interposed therebetween.

AA ′ of FIG. 11 in the sectional view of FIG.
As shown in the cross section, the liquid crystal device has T
FT array substrate 1 and first interlayer insulating layer 41, semiconductor layer 32, gate insulating layer 33, and scanning line 3 laminated thereon
1 (gate electrode), second interlayer insulating layer 42, data line 35
(Source electrode), a third interlayer insulating layer 43, a pixel electrode 11, and an alignment film 12, and a TFT 30 is provided for each pixel. Further, the liquid crystal device includes, in the pixel portion, a counter substrate 2 made of, for example, a glass substrate, and a common electrode 21, an alignment film 22, and a light-shielding film 23 laminated thereon, and further sandwiched between these two substrates. Liquid crystal layer 50.

First interlayer insulating layer 41, second interlayer insulating layer 42
And the third interlayer insulating layer 43 is NSG, PSG, BS, respectively.
G, BPSG or other silicate glass film, silicon nitride film, silicon oxide film, or the like. The pixel electrode 11 is made of, for example, a transparent conductive thin film such as an ITO film (indium tin oxide film) or an opaque material having a high reflectance such as Al. The alignment films 12 and 22 are made of, for example, an organic thin film such as a polyimide thin film. The common electrode 21 is made of ITO
It is made of a film or the like and is formed over the entire surface of the counter substrate 2. The light-shielding film 23 is provided in a predetermined region facing the TFT 30 and is made of a metal material or resin black as in the case of the peripheral partition 53 described above. It has the function of preventing color mixing of materials. The liquid crystal layer 50 includes a sealing material 52 between the TFT array substrate 1 and the opposing substrate 2.
The liquid crystal is formed by enclosing the liquid crystal in a space surrounded by (see FIGS. 9 and 10) by vacuum suction or the like, and is made of, for example, a liquid crystal in which one or several kinds of nematic liquid crystals are mixed. The seal material 52 is an adhesive made of, for example, a photo-curable resin or a thermo-curable resin, and includes a spacer for setting a distance between the two substrates to a predetermined value.

The TFT 30 includes a scan line 31 (gate electrode), a semiconductor layer 32 in which a channel is formed by an electric field from the scan line 31, a gate insulating layer 33 that insulates the scan line 31 from the semiconductor layer 32, and a semiconductor layer 32. It has a source region 34 formed, a data line 35 (source electrode), and a drain region 36 formed in the semiconductor layer 32. A corresponding one of the plurality of pixel electrodes 11 is connected to the drain region 36. As will be described later, the source region 34 and the drain region 36 are formed by doping the semiconductor layer 32 with a predetermined concentration of N-type or P-type dopant depending on whether an N-type or P-type channel is formed. Is formed.

The semiconductor layer 32 constituting the TFT 30 is formed, for example, by forming a-Si layer on the first interlayer insulating layer 41 as a base.
After the (amorphous silicon) film is formed, the film is formed by performing an annealing process and performing solid phase growth to a thickness of about 500 to 2000 °. The semiconductor layer 32 is made of Sb (antimony) or As in the case of a P-channel type TFT 30.
Doping is performed by ion implantation using a dopant of a group V element such as (arsenic) or P (phosphorus). In the case of the N-channel type TFT 30, the source region 34 and the drain region are formed by doping by ion implantation using a dopant of a group III element such as B (boron), Ga (gallium), and In (indium). A region 36 is formed. Further, the TFT 30 is replaced with an LDD (Lightly Do
In the case of an N-channel TFT having a Ped Drain Structure (ped drain structure) structure, a part of the source region 34 and the drain region 36 adjacent to the channel side is lightly doped with a dopant of a group V element such as P (phosphorus). Is formed, and a high-concentration doped region is formed with a dopant of a group V element such as P (phosphorus). In the case of forming a P-channel TFT 30, the source region 34 and the drain region 36 are formed using a dopant of a group III element such as B (boron). The TFT 30
May be a TFT having an offset structure or a self-aligned TFT. Further, as the pixel switching TFT 30, an N-channel TFT capable of writing at high speed is often used.

As described above, the liquid crystal device of this embodiment mode
A P-channel TFT and an N-channel TF are formed on a TFT array substrate 1 on which a pixel switching TFT 30 is formed.
Since T can be formed in substantially the same process, peripheral circuits such as the data line driving circuit 101 and the scanning line driving circuit 104 are provided on the same substrate as the pixels in the peripheral portion outside the screen display area as shown in FIG. Can be formed. This eliminates the need for an external drive circuit, which is very advantageous in terms of cost and size reduction of the liquid crystal device.

The gate insulating layer 33 has a thickness of about 9
By performing thermal oxidation at a temperature of 00 to 1300 ° C,
It is obtained by forming a relatively thin thermal oxide film having a thickness of about 300 to 1500 °. Alternatively, in order to prevent the substrate from warping due to heat, a multi-layer gate insulating layer 33 may be formed by forming a silicon oxide film or a silicon nitride film on the thermal oxide film.

The scanning line 31 (gate electrode) is formed by low pressure CVD.
After a polysilicon film is deposited by a method or the like, it is formed by a photolithography process, an etching process, or the like. Alternatively, W (tungsten), Mo (molybdenum), Ta
It may be formed from a high melting point metal film such as (tantalum) or a metal alloy film such as a metal silicide film. In this case, scan line 3
If 1 (gate electrode) is arranged as a light-shielding film corresponding to part or all of the area covered by the light-shielding film 23, part or all of the light-shielding film 23 is omitted due to the light-shielding property of the metal film or the metal silicide film. It is also possible to do. In this case, in particular, there is an advantage that the pixel aperture ratio can be prevented from lowering due to misalignment between the opposing substrate 2 and the TFT array substrate 1.

The data line 35 (source electrode) may be formed of a transparent conductive thin film such as an ITO film as in the case of the pixel electrode 11. Alternatively, about 10
It may be formed from a low-resistance metal such as Al (aluminum) or a metal alloy film such as a metal silicide deposited to a thickness of 00 to 5000 °. If the data lines 35 are formed of a film having a high light-shielding property such as Al (aluminum), the data lines 35
Can be used in place of the light-shielding film 23 provided on the opposing substrate, and in this case also, there is an advantage that a decrease in the pixel aperture ratio due to misalignment of the opposing substrate 2 and the TFT array substrate 1 can be prevented.

In the second interlayer insulating layer 42, a contact hole 37 for electrically connecting the data line 35 and the source region 34 of the semiconductor layer is opened. Furthermore, the second
A contact hole 38 to the drain region 36 of the semiconductor layer is formed in the correlation insulating layer 42 and the third interlayer insulating layer 43. The pixel electrode 11 is electrically connected to the drain region 36 of the semiconductor layer via a contact hole 38 to the drain region 36 of the semiconductor layer. The aforementioned pixel electrode 1
1 is provided on the upper surface of the third interlayer insulating layer 43 configured as described above.

A storage capacitor 70 is added to the pixel electrode 11 adjacent to the TFT 30. This storage capacity 70
More specifically, the drain region 36 of the semiconductor layer 32
, A first storage capacitor electrode 32 ′, an insulating layer 33 ′ formed in the same step as the gate insulating layer 33, and a capacitor line 31 ′ (second storage capacitor electrode) formed in the same step as the scanning line 31. , The second and third interlayer insulating layers 42 and 43,
The pixel electrode 11 includes a part of the pixel electrode 11 opposed to the capacitance line 31 ′ via the second and third interlayer insulating layers 42 and 43. Since the storage capacitor 70 is provided in this manner, high-definition display can be performed even when the duty ratio is small.

Next, FIG. 12B in the sectional view of FIG.
As shown in the -B 'section (left side in the figure), the liquid crystal device is provided with a TFT 202 (see FIG. 1) of the inspection and precharge circuit 201 for each data line 35. This TF
More specifically, T202 is formed in the same step as the semiconductor layer 32 ″ formed in the same step as the semiconductor layer 32, the gate insulating layer 33 ″ formed in the same step as the gate insulating layer 33, and the scanning line 31. A precharge circuit drive signal line 206 is provided. The semiconductor layer 32 ″ has T
Similarly to the case of the FT 30, the source region 34 "and the drain region 36" are provided with the channel region interposed therebetween, and the drain region 36 "is passed through the contact holes 37" and 38 "opened in the second interlayer insulating layer 42, respectively. "Is the data line 3
5, and a precharge signal line 204 is connected to the source region 34 ″. The TFT 202 having such a layer structure is opposed to the light-shielding peripheral partition 53 provided on the counter substrate 2. It is preferable that the liquid crystal device be provided at the position on the TFT array substrate 1. This makes it possible to effectively use the area of the peripheral partition 53, which has been a dead space in the related art, so that the size of the liquid crystal device can be reduced.

As shown in the sectional view of FIG. 14, the second
The precharge signal line 204 and the precharge circuit drive signal line 206 pass over the interlayer insulating layer 42. Most of these precharge signal lines 204 and precharge circuit drive signal lines 206 are low-resistance wirings formed of a metal thin film of Al or the like formed in the same process as the data lines 35. As described above, by forming the precharge signal line 204 and the precharge circuit drive signal line 206 in the area of the peripheral parting 53, the area which has been a dead space can be effectively used.
The size of the liquid crystal device can be reduced.

Although not shown in FIGS. 11 to 14, the TFT 302 (see FIG. 1) of the sampling circuit 301 is replaced with the TFT 202 of the inspection / precharge circuit 201.
It is preferable to provide the TFT array substrate 1 at a position facing the light-shielding peripheral partition 53 provided on the counter substrate 2. This allows
Since the area occupied by the data line driving circuit 101 can be increased, a multifunctional liquid crystal device can be realized. Alternatively, it is needless to say that this is advantageous in reducing the size of the liquid crystal device.

Although not shown in FIG. 11 to FIG. 14, for example, TN
(Twisted nematic) mode, STN (super TN) mode, D-STN (double-STN) mode, and other operation modes, and normally white mode / normally black mode. A plate or the like is arranged in a predetermined direction.
In addition, an RGB color filter,
A dichroic filter, a micro lens, or the like may be formed. Further, the TFT array substrate 1 is provided with
7497, JP-B-3-52611, JP-A-3-125123, JP-A-8-171101, etc.
For example, a light-shielding layer made of a refractory metal may be provided.

The liquid crystal device of the present embodiment is applicable to various liquid crystal materials (liquid crystal phases), operation modes, liquid crystal arrangements, driving methods, and the like.

(Electronic Apparatus) Next, an embodiment of an electronic apparatus including the liquid crystal device 100 according to the embodiment described in detail above will be described with reference to FIGS.

First, FIG. 15 shows a schematic configuration of an electronic apparatus provided with the liquid crystal device 100 and its driving circuit 1004.

In FIG. 15, the electronic equipment includes a display information output source 1000, a display information processing circuit 1002, and a drive circuit 1.
004, a liquid crystal device 100, a clock generation circuit 1008, and a power supply circuit 1010. The display information output source 1000 includes a ROM (Read Only Memory),
It includes a memory such as an AM (Random Access Memory), an optical disk device, and a tuning circuit that tunes and outputs an image signal, and displays display information such as an image signal in a predetermined format based on a clock signal from a clock generation circuit 1008. Output to the information processing circuit 1002. The display information processing circuit 1002 includes various known processing circuits such as an amplification / polarity inversion circuit, a phase expansion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit. Digital signals are sequentially generated from the information and output to the driving circuit 1004 together with the clock signal CLK. The drive circuit 1004 drives the liquid crystal device 100. The power supply circuit 1010 supplies a predetermined power to each of the above-described circuits. Note that the drive circuit 1004 may be mounted on the TFT array substrate included in the liquid crystal device 100, and in addition, the display information processing circuit 1002 may be mounted.

Next, FIGS. 16 to 18 show specific examples of the electronic apparatus thus configured.

In FIG. 16, a liquid crystal projector 1100, which is an example of electronic equipment, prepares three liquid crystal modules each including the liquid crystal device 100 in which the above-described drive circuit 1004 is mounted on a TFT array substrate, and each of them has a light valve for RGB. It is configured as a projector used as 100R, 100G and 100B. LCD projector 11
In 00, when the projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, three mirrors 1106 and two dichroic mirrors 1108
Light components R, G, and B corresponding to the three primary colors RGB.
Light valves 100R, 1R corresponding to each color
00G and 100B respectively. At this time, in particular, the B light is applied to the incident lens 1 to prevent light loss due to a long optical path.
122, relay lens 1123 and emission lens 1124
And is guided through a relay lens system 1121 composed of Then, the light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B, respectively, are combined again by the dichroic prism 1112, and then projected as a color image on the screen 1120 via the projection lens 1114.

In FIG. 17, a laptop personal computer (PC) 1200 for multimedia, which is another example of electronic equipment, includes the above-described liquid crystal device 100 in a top cover case, and further includes a CPU,
The keyboard 1202 accommodates a memory, a modem, and the like.
Is provided.

Further, as shown in FIG.
Liquid crystal device 1 which does not include the display device 4 or the display information processing circuit 1002
In the case of 00, the IC 1324 including the drive circuit 1004 and the display information processing circuit 1002
TCP (Tape Carrier Package) 1 mounted on 2
The liquid crystal device 100 may be physically, electrically, and electrically connected to the TFT 320 via an anisotropic conductive film provided on a peripheral portion of the TFT array substrate 1 so that the liquid crystal device 100 can be manufactured, sold, used, and the like.

In addition to the electronic devices described with reference to FIGS. 16 to 18, a liquid crystal television, a viewfinder type or a monitor direct-view type video tape recorder, a car navigation device, an electronic organizer, a calculator, a word processor, an engineering machine, etc. A workstation (EWS), a mobile phone, a video phone, a POS terminal, a device with a touch panel, and the like are examples of the electronic device shown in FIG.

[0125]

According to the active matrix substrate of the present invention, the inspection and precharge circuit has an inspection function at the time of inspection performed before the assembling step to the liquid crystal device or before the scribing step. In normal operation after assembling, these two functions are realized compared to the conventional case where the inspection circuit and precharge circuit are separately provided on the peripheral part of the board. The area on the substrate required to perform the process is significantly small. Especially,
Unlike the conventional case, it is not necessary to provide an inspection terminal or an inspection wiring which is unnecessary at the time of normal operation, and the input / output wiring and the input / output terminal for precharging can be used for the inspection, which is very advantageous.

According to the liquid crystal device and the electronic apparatus of the present invention, various electrical characteristics tests are reliably performed, so that the reliability is high, and the peripheral circuits can be designed to a high specification with a margin. High-quality operation with high reliability can be performed. Further, the size of the entire apparatus can be reduced.

According to the active matrix substrate inspection method of the present invention, various electrical inspections such as an open or disconnection inspection and a short circuit inspection can be performed relatively easily.

[Brief description of the drawings]

FIG. 1 is an equivalent circuit diagram of various wirings, peripheral circuits, and the like provided in an embodiment of an active matrix substrate according to the present invention.

FIG. 2 is a circuit diagram of a TFT constituting a test and precharge circuit provided in the embodiment of the active matrix substrate.

FIG. 3 is a circuit diagram of a TFT included in a sampling circuit provided in the embodiment of the active matrix substrate.

FIG. 4 is a timing chart of various signals during a normal operation of the inspection and precharge circuit provided in the embodiment of the active matrix substrate.

FIG. 5 is a circuit diagram of a configuration example of a data line driving circuit and an inspection / precharge circuit provided in the embodiment of the active matrix substrate (FIG. 5A), and various signals in the data line opening inspection; Timing chart (FIG. 5)
(B)).

6 is a circuit diagram showing a state of the circuit shown in FIG. 5 in a data line short-circuit test.

FIG. 7 is a circuit diagram of another configuration example of the data line driving circuit provided in the embodiment of the active matrix substrate and a test and precharge circuit.

8 is a circuit diagram (FIG. 8A) showing a part of a series of shift registers provided in another configuration example of the data line driving circuit in FIG. 7 and a timing chart thereof (FIG. b)).

FIG. 9 is a plan view showing an overall configuration of a liquid crystal device according to an embodiment of the present invention.

FIG. 10 is a sectional view taken along line H-H ′ of FIG. 9;

FIG. 11 is a plan view of a pixel portion in an embodiment of a liquid crystal device.

FIG. 12 is a plan view of a TFT constituting a test and precharge circuit in the embodiment of the liquid crystal device.

13 is a sectional view taken along the line AA ′ of FIG. 11 and a line BB ′ of FIG.
It is sectional drawing which shows a cross section.

FIG. 14 is a sectional view showing a section taken along line C-C ′ of FIG. 11;

FIG. 15 is a block diagram showing a schematic configuration of an embodiment of an electronic device according to the present invention.

FIG. 16 is a cross-sectional view illustrating a liquid crystal projector as an example of an electronic apparatus.

FIG. 17 is a front view showing a personal computer as another example of the electronic apparatus.

FIG. 18 is a perspective view illustrating a liquid crystal device using TCP as another example of the electronic apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... TFT array substrate 2 ... Counter substrate 11 ... Pixel electrode 30 ... TFT 50 ... Liquid crystal layer 52 ... Sealing material 53 ... Peripheral partition 70 ... Storage capacitance 100 ... Liquid crystal device 101 ... Data line drive circuit 104 ... Scan line drive circuit 201 ... Inspection and precharge circuit 202 ... TFT 204 ... Precharge signal line 206 ... Precharge circuit drive signal line 301 ... Sampling circuit 302 ... TFT 304 ... Image signal line 306 ... Sampling circuit drive signal line 307 ... Waveform control circuit

Claims (13)

[Claims] 1. An active matrix substrate for forming a liquid crystal device in which a liquid crystal is sandwiched between a pair of substrates, wherein a plurality of scanning lines intersecting each other are provided on one of the pair of substrates. A plurality of data lines; a scanning line driving circuit that supplies a scanning signal to the plurality of scanning lines; and an image that is provided at one end of the plurality of data lines and supplies an image signal to the plurality of data lines. Signal supply means, and a plurality of pixel units provided in a matrix and each of which is actively driven based on the scanning signal and the image signal supplied through the plurality of scanning lines and the plurality of data lines, respectively. Are provided on the other end sides of the plurality of data lines, respectively, to supply an inspection signal to at least the plurality of data lines at the time of inspection, and to output a precharge signal of a predetermined voltage level during normal operation. An active matrix substrate, comprising: an inspection / precharge circuit that supplies each of the plurality of data lines prior to an image signal. 2. The test and precharge circuit, which switches and outputs a precharge signal input via a precharge signal line according to a precharge circuit drive signal, and outputs the precharge signal as the test signal or the precharge signal. A plurality of precharge switches for supplying the data signals to a plurality of data lines, respectively, wherein the image signal supply means samples the image signals input via the image signal lines in accordance with the sampling circuit drive signals, A sampling circuit having a plurality of sampling switches for respectively supplying the plurality of data lines as the image signal; and a data line driving circuit for supplying the sampling circuit drive signal to each of the plurality of sampling switches. 2. The active matrix substrate according to claim 1, wherein 3. The plurality of precharge switches each have the data line connected to a source electrode, the precharge signal line connected to a drain electrode, and the precharge circuit drive signal line connected to a gate electrode. 3. The active matrix substrate according to claim 2, comprising a thin film transistor. 4. The active matrix substrate according to claim 3, wherein said thin-film transistor comprises one of an N-channel transistor, a P-channel transistor, and a complementary transistor. 5. A data line driving circuit comprising: a series of shift registers for sequentially outputting a transfer signal from each stage; and a transfer signal output from two adjacent stages in the shift register immediately before and after the shift register. 5. The apparatus according to claim 2, further comprising: a waveform control circuit configured to limit a time length of the transfer signals so that the transfer signals do not overlap with each other in time, and output the signal as the sampling circuit drive signal. An active matrix substrate according to item 1. 6. The plurality of pixel units each include a thin film transistor for active driving, and the inspection and precharge circuit includes a thin film transistor formed simultaneously from the same film as the thin film transistor of the pixel unit. The active matrix substrate according to claim 1, wherein: 7. A liquid crystal device comprising: the active matrix substrate according to claim 1; the other substrate of the pair of substrates; and the liquid crystal. 8. A seal member surrounding the liquid crystal by bonding the pair of substrates around a screen display area defined by the plurality of pixel units, and a seal member between the seal member and the screen display area. A light-shielding peripheral partition formed on the other substrate along a contour of a screen display area; and at least one of the inspection / precharge circuit and the input / output wiring of the inspection / precharge circuit. The liquid crystal device according to claim 7, wherein: is provided at a position facing the peripheral parting. 9. An electronic apparatus comprising the liquid crystal device according to claim 8. 10. The method for inspecting an active matrix substrate according to claim 2, wherein (i) operating the data line drive circuit normally and turning on all of the plurality of precharge switches,
By applying a predetermined voltage to the precharge signal line and measuring a current flowing through the image signal line, or (i.
i) applying a predetermined voltage to the image signal line while normally operating the data line drive circuit and turning on all of a plurality of precharge switches simultaneously driven by the precharge circuit drive signal; An inspection method for an active matrix substrate, comprising: performing an open or disconnection inspection of the plurality of data lines by measuring a current flowing through the lines. 11. The method for inspecting an active matrix substrate according to claim 2, wherein (i) all of the sampling switches are turned on and all of the plurality of precharge switches are turned off. By applying a predetermined voltage between image signal lines electrically connected to adjacent data lines and measuring a current flowing between image signal lines electrically connected to the adjacent data lines, or ii) applying a predetermined voltage between precharge signal lines electrically connected to adjacent data lines while turning off all of the sampling switches and turning on all of the plurality of precharge switches; By measuring the current flowing between the precharge signal lines electrically connected to the adjacent data lines, it is possible to perform a short-circuit inspection of the plurality of data lines. Inspection method of the active matrix substrate having a butterfly. 12. The method for inspecting an active matrix substrate according to claim 2, wherein (i) turning off all of the sampling switches and turning on all of the plurality of precharge switches, By applying a predetermined voltage to a precharge signal line and measuring a current flowing in the image signal line, or (ii) turning off all the sampling switches and simultaneously driving by the precharge circuit drive signal By applying a predetermined voltage to the image signal line and measuring a current flowing through the precharge signal line while turning on all of the plurality of precharge switches,
An inspection method for an active matrix substrate, wherein a leakage inspection of the sampling switch is performed. 13. The method of testing an active matrix substrate according to claim 2, wherein (i) turning on all of the sampling switches and turning off all of the plurality of precharge switches, By applying a predetermined voltage to a precharge signal line and measuring a current flowing through the image signal line, or (ii) turning on all the sampling switches and turning off all of the plurality of precharge switches In addition, a method for inspecting an active matrix substrate, wherein a leak test of the precharge switch is performed by applying a predetermined voltage to the image signal line and measuring a current flowing through the precharge signal line.