JPH11212578A - Electronic component and its lead fixing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the strength of the fixation of a lead member to an armor case and to improve the position precision and flatness of a pad part consisting of the lead member by arranging the lead member along the surface of the armor case, and bending and engaging its tip part to an engagement part on the surface of the armor case. SOLUTION: Each lead member 10 is led out of the top surface part of the base body part 4 of the armor case 2, led to the reverse surface side of a lid part 6 along recessed parts 13 formed at four places commonly to the base body part 4 and lid part 6, and folded in conformity with the shape of the lid part 6, and has its tip end part side exposed to the reverse surface of the lid part 6. Lead end parts 10A and 10B of each lead member 10 are originally rectangle and are inserted into the recessed parts as engagement parts on the side of the lid part 6 by cutting one of two corner parts, using the other corner part as a hook part, and folding the hook part toward the lid part 6. Then the hook parts of the lead end parts 10A and 10B are engaged with the internal wall surface of the recessed parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electronic component such as an electroacoustic transducer and a method for fixing a lead thereof.

[0002]

2. Description of the Related Art A surface mount type electronic component such as an electroacoustic transducer has a lead portion on its outer case which is directly soldered onto a wiring conductor of a mounting board. The lead portion is drawn out of the outer case and forms a pad portion on the surface of the outer case. The flatness of the pad portion affects the soldering accuracy.

[0003]

In such an electronic component, if the pad portion is not formed flat, a gap is formed between the pad portion and a wiring conductor (mounting land) of the mounting board, and the electronic component is not electrically connected to the mounting board. The parts are soldered in a twisted state, or poor soldering occurs. Also, when handling electronic components, the deformation of the lead member may be increased by an external force.

The invention or device relating to such a lead member of an electronic component has been disclosed in JP-A-6-334099.
JP-A-4-129261, JP-A-2-65168,
Japanese Utility Model Laid-Open No. 2-72526, Japanese Utility Model Laid-Open No. 1-60542, Japanese Unexamined Patent Application Publication No. 1-138711, and the like, each of which discloses a lead structure of a surface-mounted electronic component.

[0005] However, although these documents describe a bending process of a lead member, the flatness is improved, the lead member is securely and firmly fixed without using an adhesive or the like, and the positional accuracy of a pad portion is improved. Nothing was said to increase

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component in which the strength of fixing a lead member to an outer case is improved, and the positional accuracy and flatness of a pad portion formed of the lead member are improved, and a method of fixing the lead. I do.

[0007]

According to the electronic component and the lead fixing method of the present invention, the leading ends of the lead members (10, 12) drawn out of the outer case (2) are engaged with a part of the outer case. Thereby, the fixing strength between the lead member and the outer case is increased.

That is, according to the electronic component of the present invention, the lead members (10, 12) drawn from the external case (2) accommodating the electronic component body are attached to the surface of the external case. And fixed to the outer case by bending the tip end side and engaging with a locking portion (recess 22, projection 74) provided on the surface of the outer case. I do. The lead member is formed of a conductor and has elasticity itself.
Even if the lead member is bent in accordance with the external shape of the outer case for surface mounting, a gap or displacement occurs between the outer surface of the outer case and the lead member due to its elasticity (spring back). In view of this, in the present invention, a part or the whole of the leading end side of the lead member is locked by the locking portion formed on the outer case. As a result, the lead member can be fixed in tight contact with the outer surface of the outer case, the flatness of the pad portion formed in a part thereof becomes uniform, and the positional accuracy is improved.

In the electronic component of the present invention, the lead member has a length from one surface of the outer case to an opposite surface via a wall surface, and is protruded from the one surface.
A first bent portion (10X, 12X) corresponding to a first corner portion (4X) formed by the one surface portion and the wall surface, and a second corner portion (6X) formed by the wall surface and the opposite surface portion. A second bent portion (10Y, 12Y), and a pad portion (lead ends 10A, 10B, 12D) on the opposite surface of the outer case.
A, 12B). With such a configuration, the lead member has a certain length corresponding to the outer case, and the first corner of the outer case,
It has been clarified that the first bent portion and the second bent portion formed corresponding to the second corner portion are bent and set on the outer case. In the case of a structure in which the lead member is provided on one surface, the wall surface, and the opposite surface along the surface of the outer case as described above, the path of the lead member becomes longer and bending is performed. For this reason, the springback due to the bending of the first bent portion has a great influence on the positional accuracy of the tip portion of the lead member, that is, the pad portion. In the present invention, the lead member is locked to the outer case near the pad formed on the opposite surface of the outer case. As a result, the gap between the outer surface of the outer case and the lead member due to the spring back of the lead member is prevented, and the flatness and positional accuracy of the pad portion can be improved.

Further, in the electronic component according to the present invention, the second bent portion forms an angle of 90 ° or less. With such an angle setting, the second
Can absorb the springback caused by the bent portion, and as a result, the flatness and positional accuracy of the pad portion can be improved.

According to the method of fixing leads of an electronic component of the present invention, an outer case is formed of an insulating synthetic resin, a lead member is drawn out of the outer case, and the lead member is bent along the surface of the outer case. And a part or the entirety of the leading end of the lead member is locked by a locking part formed on the outer case.

By such a process, the lead member can be formed into a shape corresponding to the outer case, and the precision of adhesion between the outer case and the lead member can be increased, and at the same time, the positional accuracy and flatness of the pad portion can be improved. .

[0013] The electronic component is an electroacoustic transducer. An electroacoustic transducer is an element that receives an electronic signal from an input terminal and converts it into sound.However, by improving the flatness and positional accuracy of the pad portion, the mounting accuracy of the mounting device is increased, and thus the sound emission direction and In addition to the improvement of the mounting density, the improvement of the mounting workability can be improved.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.

1 to 8 show an electroacoustic transducer and a lead fixing method according to a first embodiment of an electronic component and a lead fixing method of the present invention. In this electroacoustic transducer, the outer case 2 is formed of an insulating synthetic resin, and the outer case 2 includes a base 4 and a lid 6.
It is composed of three members. The configuration of the outer case 2 with the two members of the base 4 and the lid 6 is one example, and the outer case 2 may be formed of a single member or three or more members.

In this embodiment, the base 4 and the lid 6 have a rectangular shape. A sound emission hole 8 for emitting internally generated sound to the outside is formed on a side surface of the lid 6. The position of the sound emission hole 8 may be formed on the ceiling surface (or lower surface) side of the lid 6. Further, a pair of lead members 10 and 12 are drawn out from the base portion 4, and each of the lead members 10 and 12 is a metal plate having a belt shape having good conductivity. Each of the lead members 10 and 12 is drawn out from the upper surface of the base portion 4 and is guided to the lower surface side of the lid portion 6 along four concave portions 13 formed in common with the base portion 4 and the lid portion 6. The lid 6 is bent along the shape of the lid 6, and the front end side is exposed on the lower surface of the lid 6. That is, the lead member 10 has a length from one surface portion of the outer case 2 to the opposite surface portion via the left and right wall surfaces, and the first corner portion 4 of the outer case 2 is provided.
X is provided with a first bent portion 10X corresponding to X and a second bent portion 10Y corresponding to the second corner portion 6X, and lead ends 10A and 10B as pad portions are formed. Similarly, the lead member 12 has a length from one surface portion of the outer case 2 to the opposite surface portion via the right and left wall surfaces, and the first bent portion 12X corresponding to the first corner portion 4X of the outer case 2, A second bent portion 12Y corresponding to the second corner portion 6X is provided, and lead ends 12A and 12B as pad portions are formed.

Assuming that the thickness of each of the lead members 10 and 12 is d ₁ and the depth of the recess 13 is d ₂ , for example, d ₂ ≧ d _1, and each of the lead members 10 and 12 is inserted into the recess 13. Is done. However, the lead members 10, 12 and the recess 13
Does not prevent the relationship d from being set to d ₂ ≦ d ₁ .

On the lower surface side of the lid 6, a rectangular flat portion 14 is formed at the center thereof, and an inclined concave portion 16 which is inclined from the corner 6X of the lid 6 to the boundary side of the flat portion 14 is formed. I have. For this reason, as shown in FIG. 4, the corner 6X of the lid 6 is set to an acute angle, that is, an angle smaller than a right angle.
Theta ₁ shown in FIG. 4 shows the angle formed between the flat portion 14 and the inclined recess 16, the angle theta ₁ is a few degrees, for example.
Therefore, the distal ends of the lead members 10 and 12 bent along the inclined concave portions 16 are configured to be locked to the lid 6.

The lead ends 10A, 10B, 12A, and 12B of the lead members 10 and 12 each have a rectangular shape. One of the two corners is cut off, and the other corner is hooked. The hook portion 20 is bent toward the lid portion 6 and inserted into the concave portion 22 serving as a locking portion on the lid portion 6 side. Each recess 22 is formed at four positions corresponding to the lead ends 10A, 10B, 12A, 12B. In this embodiment, each of the lead members 10, 1
2, an inner wall surface 23 forming an arcuate surface is formed at a fixed angle with respect to the center line of each of the lead members 10 and 12, in this case, at a position inclined in the 45-degree direction. . As shown in FIG. 5, the lead ends 10A, 10B, 1
The hook portions 20 of 2 </ b> A and 12 </ b> B are locked on the inner wall surface 23 of the concave portion 22. As a result, each of the lead members 10, 12
Is fixed to the outer case 2 in a state in which the lead ends 10A, 10B, 12A, and 12B are in close contact with each other in a shape conforming to the outer shape of the outer case 2. The inner wall surface 23 of the concave portion 22 may be formed as a flat inclined surface.
A, 10B, 12A, 12B can be locked.

In this manner, each of the lead ends 10A, 10A
B, 12A, and 12B are set on the inclined recess 16 of the lid 6 of the outer case 2 to form a pad portion. As a result, the pads B, 12A, and 12B conform to the wiring conductor of the printed circuit board that forms a flat surface, and are stuck in a stable state. It can be mounted, can be securely fixed by connection means such as soldering, and can realize a mechanically fixed state together with highly reliable electrical connection.

Here, the internal structure of the electroacoustic transducer is shown in FIG.
Referring to FIG. 8, a plate-shaped base member 24 made of a magnetic material plate is embedded on the back side of the base portion 4, and a magnetic core called a pole piece is provided in the center of the base member 24. 26 is erected. The base portion 28 of the magnetic core 26 is smaller in diameter than the main body portion 30 and is caulked and fixed so as to penetrate a through hole 32 formed in the base member 24. The magnetic core 26 and the base member 24 are magnetically coupled, and form a single magnetic path. In this embodiment, the magnetic core 26 has a cylindrical shape, and the top has a flat surface. However, in the present invention, the main body 30 of the magnetic core 26 may have a shape other than a cylinder such as a prism. Also, the shape of the top may be a curved surface, and need not be flat.

A coil 34 for exciting the magnetic core 26 is wound around the magnetic core 26. This coil 34
Has a columnar shape, and its top surface is set lower than the magnetic core 26. Therefore, the top side of the magnetic core 26 is
It protrudes slightly from the coil 34. And coil 3
Numeral 4 is fixed to the base member 24 and the magnetic core 26 with an adhesive 36 at the inner diameter corner, and the magnetic core 26 and the base member 24 are fixed.
The coil 34 is prevented from separating from the coil 34 and swinging. Thus, the coil 34, the base member 24 and the magnetic core 2
Increasing the integration with the device 6 contributes to the reliability of the operation and the stabilization of the sound generation characteristics. As the adhesive 36, for example, a silicon-based adhesive is used, and any material may be used as long as the material has no adverse effect on other members and a required adhesive strength can be obtained.

The end of the coil 34, that is, the coil end at the beginning of winding of the coil 34 and the coil end at the end of winding are individually pulled out from the end face portion of the coil 34 on the base member 24 side and formed on the base member 24. The lead members 10, 1, and 1 are guided to the back side of the base member 24 from the through holes 38.
2 are electrically connected to each other by solder 40 and mechanically fixed.

A magnet 42 is provided on the outer periphery of the coil 34. This magnet 42 is annular,
An interval 44 is provided between the inner peripheral surface and the coil 34,
A magnetic path is formed in close contact with the base member 24. Also,
The magnet 42 is positioned in the horizontal direction by a supporting protrusion 46 protruding from the inner wall of the base 4 on the outer peripheral side, and a fixing protruding portion 48 protrudes from the lower surface thereof to be fixed vertically. Have been. That is, the magnetic core 26 and the magnet 42 are arranged concentrically,
The support projection 46 and the fixed projection 48 are provided on the base member 24.
It is firmly fixed.

A step portion 50 is formed on the lower side wall portion of the base portion 4, and a resonance plate 52 having a peripheral portion supported by the step portion 50 is provided on the lower surface side of the magnetic core 26. The resonance plate 52 is made of a magnetic material, and a disk-shaped magnetic piece 54 is attached to the center of the resonance plate 52 in order to increase the mass of the resonance plate 52. A gap 5 is provided between the resonance plate 52 and the magnetic core 26.
The magnetic core 26 and the resonance plate 52 form a closed magnetic path through the gap 56.

The opening side of the base 4 is closed by a lid 6, and the space surrounded by the lid 6 forms a resonance chamber 58. The resonance chamber 58 is formed with a rectangular cylindrical sound emission tube 60 extending from the side surface portion to the center portion of the lid portion 6 using a part of the lower surface portion of the lid portion 6. A rectangular sound emission hole 8 is opened in the portion. A plurality of projections 62 are formed on the lower surface of the lid 6 and on the wall surface of the sound emission tube 60 as a means for preventing excessive movement of the resonance plate 52 or dropping of the resonance plate 52 from the step portion 50. ing. Each of the protrusions 62 has its upper end surface set at the same position or a nearby position. In this embodiment, the protrusions 62 are formed integrally with the cover 6, but may be formed separately from the cover 6.

The parallel lead members 10 and 12 are fixed to the upper surface of the base portion 4.
Reference numerals 0 and 12 are drawn from the upper surface side of the base portion 4 to the side surface side. Coil end connection portions 10C and 12C are formed at respective intermediate portions of the respective lead members 10 and 12.

Next, FIG. 9 shows a second embodiment of the electronic component and the lead fixing method of the present invention. Figure 1
In the first embodiment shown in FIG. 8, the concave portion 22 is provided on the inner edge side of the lead members 10 and 12, and the inner wall surface 23 similarly forming an arc-shaped surface (or an inclined surface) is formed. The lead ends 10A, 10A, 1
The corners on the inner edge side of 0B, 12A, and 12B may be cut off, and the corners on the outer edge side may be used as hook portions 20. By bending this hook portion 20 along the inner wall surface 23 of the concave portion 22 and inserting it into the concave portion 22, each of the lead ends 10A, 1A
0B, 12A, and 12B can be firmly fixed to the outer case 2.

Next, FIG. 10 shows a third embodiment of the electronic component and the lead fixing method of the present invention. In this embodiment, each recess 22 is formed by a long groove having the same length as each of the lead members 10 and 12 in a direction orthogonal to the length direction of the lead members 10 and 12. Each of the recesses 22 may have such a width that the ends of the lead members 10 and 12 can be inserted. In this case, the lead ends 10A, 10A
B, 12A, and 12B are bent at right angles along the inner wall surface 23 to form the hook portions 20. By inserting the hook portions 20 into the recesses 22, the respective lead end portions 10A, 10B, 1
2A and 12B can be firmly fixed to the outer case 2. The recesses 22 formed at four places may be connected to two places at a time to form a long groove having the same length as the outer case 2.

Next, FIG. 11 shows a fourth embodiment of the electronic component and the lead fixing method of the present invention. In this embodiment, an inner wall surface 23 forming an arcuate surface is formed in each recess 22 shown in FIG. With such a configuration, the lead ends 10A, 10B, 12
A and 12B can be bent at right angles along the inner wall surface 23, and processed and locked in an arc shape along the inner wall surface 23, so that a stronger fixed state can be expected.

Next, FIGS. 12 and 13 show a fifth embodiment of the electronic component and the lead fixing method for the electronic component according to the present invention. In this embodiment, the angle θ ₂ (> θ ₁ ) between the bottom surface of the inclined recess 16 and the flat portion 14 is set to several tens of degrees by making the angle formed by the corner 6X smaller than that shown in FIG. It was done. By setting such an angle theta _2, the lead end 10A to be locking, 10B, 1
The bending angles of 2A and 12B are made acute, and the lead ends 10
A, 10B, 12A, 12B and the locking strength of the lid 6 can be increased.

Next, FIG. 14 shows a sixth embodiment of the electronic component and the lead fixing method of the present invention. In this embodiment, a projection 74 as a locking portion is formed on the lower surface of the lid 6 as compared with the fifth embodiment. Further, small holes 76 are formed in the lead ends 10A, 10B, 12A and 12B.
The small hole 76 is engaged with the projection 74. With such a configuration, the lead ends 10A, 10A
B, 12A, and 12B are locked to the outer case 2 by the protruding portions 74, and the lead members 10, 12 can be more reliably fixed in a shape conforming to the outer shape of the outer case 2 and in a close contact state. In addition, as in the fifth and sixth embodiments,
When the bending angles of the lead ends 10A, 10B, 12A, 12B are set to be larger than the springback of the lead members 10, 12, flatness is ensured by the bending apex.

FIGS. 15 to 17 show a method for fixing a lead of an electroacoustic transducer as a seventh embodiment of the electronic component and the method for fixing the lead according to the present invention.

As shown in FIGS. 15A and 15B,
The outer case 2 is formed of a synthetic resin, and the lead members 10 and 12 are pulled out horizontally on the upper surface side of the base portion 4 of the electroacoustic transducer in which the component main body is built therein. As shown in FIG. 15B, the cover 6 made of a synthetic resin is
A recess 22 to be locked with the lead ends 10A, 10B, 12A, 12B is formed at a predetermined position and placed. Each lead member 1
A broken line L attached to 0 and 12 indicates a bent portion, and one corner of the tip of each of the lead ends 10A, 10B, 12A and 12B is cut off.

Next, as shown in FIGS. 16C and 16D, a part of each of the lead members 10 and 12 is bent at a right angle to form bent portions 10Y and 12Y.
0A, 10B, 12A, and 12B are formed.

Next, as shown in FIGS. 17 (E) and 17 (F), each of the lead members 10 and 12 is bent along the base portion 4 and the lid portion 6 of the outer case 2, and the lead ends previously bent. The portions 10A, 10B, 12A, and 12B face the lid portion 6, and the hook portions 20 are bent along the inner wall surface 23 of the concave portion 22 and inserted and locked. As a result, the electroacoustic transducer shown in FIG. 1 is obtained.

FIGS. 18 to 20 show an electronic component and a lead fixing method of an electroacoustic transducer according to an eighth embodiment of the present invention.

As shown in FIGS. 18A and 18B,
The lead members 10 and 12 are pulled out horizontally on the upper surface side of the base portion 4 of the electroacoustic transducer. As shown in FIG. 18B, a lead end 1 is previously provided on the lid 6 made of a synthetic resin.
0A, 10B, 12A, and 12B are to be formed at predetermined positions, and the recesses 22 are to be locked.
One corner of the tip of B, 12A, 12B is cut off and placed.

Next, as shown in FIGS. 19C and 19D, a part of each of the lead members 10 and 12 is bent at a right angle along the concave portion 13 on the wall surface side of the base portion 4 to form a bent portion 10X. ,
By forming 12X, it is extended to the lid 6 side.

Next, as shown in FIGS. 20 (E) and 20 (F), each of the lead members 10 and 12 is bent along the base portion 4 and the lid portion 6 of the outer case 2 so that the lead end portions 10A and 10A are bent.
The hooks 20B, 12A, and 12B are bent at an acute angle on the lid 6 so that the hooks 20 are bent along the inner wall surface 23 of the recess 22, and inserted and locked. As a result, the electroacoustic transducer shown in FIG. 1 is obtained.

Next, FIGS. 21 and 22 show an example of a mounting form of the electroacoustic transducer shown in FIG. FIG.
(A) and (B), the lead ends 10A, 10B, 12A,
12B are land portions 66A, 66B of the printed circuit board 64,
It is placed on 68A, 68B and fixed and electrically connected with solder 70. In this case, since the sound emission hole 8 is formed on the side surface of the outer case 2 in the electroacoustic transducer, the sound emission hole 8 is set near the printed circuit board 64.

Next, FIGS. 23 and 24 show an example of a mounting form of the electro-acoustic transducer in which the sound emission hole 8 is formed on the ceiling surface (bottom surface) of the lid 6. As shown in FIG. 23, the lead ends 10A, 1
0B, 12A, and 12B are land portions 6 of the printed circuit board 64.
6A, 66B, 68A, 68B, and fixed and electrically connected with solder 70. In this case, the sound output hole 8 is formed in the ceiling (or bottom) of the lid 6 of the outer case 2 in the electroacoustic transducer.
A through-hole 72 for inserting the sound emission tube 9 having the sound emission hole 8 formed therein is formed. The electroacoustic transducer is mounted on the printed circuit board 64 in a stable state with the sound emission tube 9 inserted into the sound emission tube 9. Has been implemented. In this case, the sound emitted from the electroacoustic transducer is emitted to the back side of the printed board 64, and the printed board 64 constitutes a baffle plate.

By the way, the electroacoustic transducer is mounted on an electronic device such as a mobile phone or a pager as a notifying means. Since the electronic device has various forms, the electroacoustic transducer has various installation forms. Is required. The electro-acoustic transducer shown in each of the above-described embodiments meets such a demand. That is, the pair of lead members 10 and 12
Is pulled out from the upper surface of the outer case 2 and reaches the bottom surface along the wall surface. Therefore, the upper surface of the outer case 2,
It has a structure in which lead members 10 and 12 are installed on a wall surface and a bottom surface, and it is possible to mount electronic components on each surface. In an electroacoustic transducer having such a structure,
Since the lead members 10 and 12 have a longer path and are bent, the lead ends 10A, 10B and 12
The flatness and positional accuracy of A and 12B are as follows:
12 are greatly affected by the springback. The present invention can greatly contribute to the improvement of flatness and positional accuracy of a lead member particularly in an electroacoustic transducer having such a structure.

In each of the above embodiments, a concave portion is provided on the surface of the outer case as a locking portion for the lead end portion, and a small hole is formed in a part of the lead end portion and a protrusion is formed on the outer case surface. Although the example of forming was described,
The present invention is not limited to these. That is, the gist of the present invention is to mechanically lock the end of the lead on the surface of the outer case, and it goes without saying that various forms other than the above are conceivable.

[0045]

As described above, according to the present invention,
The following effects are obtained. a. The lead member can be placed in close contact with the outer surface of the outer case,
It is possible to improve the positional accuracy and flatness of the pad portion formed by a part thereof, and it is possible to improve the soldering accuracy with respect to the mounting board. b. As a result of increasing the fixing strength between the outer case and the leading end side of the lead member, the lead member is not deformed by an external force, and the fixing strength of the electronic component after soldering is increased. c. In the case of the electro-acoustic transducer, the positional accuracy with respect to the mounting substrate is increased, and additional adjustment work such as adjustment of the sound emission direction is not required. As a result, it is possible to contribute to simplification of the mounting work.

[Brief description of the drawings]

FIG. 1 is a side view of an electroacoustic transducer showing a first embodiment of an electronic component and a lead fixing method of the present invention.

FIG. 2 is a side view of the electroacoustic transducer shown in FIG.

FIG. 3 is a bottom view of the electroacoustic transducer shown in FIG.

FIG. 4 is a diagram showing a fixed portion of a lead end in the electroacoustic transducer.

FIG. 5 is a cross-sectional view showing a fixed portion of a lead end in the electroacoustic transducer.

FIG. 6 is a plan view in which a part of the electro-acoustic transducer is cut away.

FIG. 7 is a longitudinal sectional view of the electroacoustic transducer.

FIG. 8 is a plan view of the electroacoustic transducer.

FIG. 9 is a bottom view of an electroacoustic transducer showing a second embodiment of the electronic component and the lead fixing method of the present invention.

FIG. 10 is a bottom view of an electro-acoustic transducer showing a third embodiment of the electronic component and the lead fixing method of the present invention.

FIG. 11 is a bottom view of an electroacoustic transducer showing a fourth embodiment of an electronic component and a lead fixing method of the present invention.

FIG. 12 is a side view of an electroacoustic transducer showing a fifth embodiment of the electronic component and the lead fixing method of the present invention.

13 is a diagram showing a fixed portion of a lead end in the electroacoustic transducer shown in FIG.

14A and 14B show an electroacoustic transducer according to a sixth embodiment of the electronic component and the lead fixing method of the present invention, and FIG.
Is a bottom view thereof, and (b) is a partially enlarged view thereof.

15A and 15B show a manufacturing process of an electroacoustic transducer according to a seventh embodiment of the electronic component and the lead fixing method of the present invention, wherein FIG. 15A is a side view and FIG. 15B is a bottom view.

16 shows a manufacturing process of the electro-acoustic transducer of FIG. 15,
(C) is a side view thereof, and (D) is a bottom view thereof.

17 shows a manufacturing process of the electro-acoustic transducer of FIG. 15,
(E) is a side view thereof, and (F) is a bottom view thereof.

FIGS. 18A and 18B show a manufacturing process of an electroacoustic transducer according to an eighth embodiment of the electronic component and the lead fixing method of the present invention, wherein FIG. 18A is a side view and FIG.

19 shows a manufacturing process of the electro-acoustic transducer of FIG. 18,
(C) is a side view thereof, and (D) is a bottom view thereof.

20 shows a manufacturing process of the electro-acoustic transducer of FIG. 18,
(E) is a side view thereof, and (F) is a bottom view thereof.

FIG. 21 illustrates an example of a mounting form of an electroacoustic transducer,
(A) is a side view thereof, and (B) is a bottom view thereof.

FIG. 22 shows an implementation of the electroacoustic transducer of FIG. 21;
(A) is the top view, (B) is the side view.

FIG. 23 is a plan view showing another example of the mounting configuration of the electroacoustic transducer.

24 shows an implementation of the electro-acoustic transducer of FIG. 23,
(A) is a side view thereof, and (B) is a bottom view thereof.

[Explanation of symbols]

2 Exterior case 4X First corner 6X Second corner 10X, 12X First bent 10Y, 12Y Second bent 10A, 10B, 12A, 12B Lead end (pad part) 10, 12 Lead member 22 recess (locking part) 74 protrusion (locking part)

Claims (5)

[Claims] 1. A lead member drawn out of an outer case housing an electronic component body is arranged along the surface of the outer case, and a leading end thereof is bent to provide a lead member provided on the surface of the outer case. An electronic component, wherein the electronic component is fixed to the outer case by engaging a stop portion. 2. The lead member has a length extending from one surface portion of the outer case to the opposite surface portion via a wall surface, and protrudes from the one surface portion to form a first corner formed by the one surface portion and the wall surface. A first bent portion corresponding to a portion, a second bent portion corresponding to a second corner formed by the wall surface and the opposite surface portion,
The electronic component according to claim 1, wherein a pad portion is formed on an opposite surface portion of the outer case. 3. The electronic component according to claim 2, wherein the second bent portion forms an angle of 90 ° or less. 4. An outer case made of an insulating synthetic resin,
The lead member is pulled out from the outer case, and the lead member is bent and arranged along the surface of the outer case, and a part or the entirety of the leading end of the lead member is fixed to a locking portion formed on the outer case. A lead fixing method for an electronic component, wherein the lead is fixed. 5. The method according to claim 1, wherein the electronic component is an electroacoustic transducer. 5. The method according to claim 4, wherein the electronic component is an electroacoustic transducer.