JPH11215753A - Insulating coil and insulating tape used with the same - Google Patents
Insulating coil and insulating tape used with the sameInfo
- Publication number
- JPH11215753A JPH11215753A JP1708198A JP1708198A JPH11215753A JP H11215753 A JPH11215753 A JP H11215753A JP 1708198 A JP1708198 A JP 1708198A JP 1708198 A JP1708198 A JP 1708198A JP H11215753 A JPH11215753 A JP H11215753A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- insulating
- coil
- impregnated
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、例えば発電機用回
転機、一般産業用回転機または車両用回転機の絶縁コイ
ル、全含浸方式で製造する回転電機用の絶縁コイル並び
にこれに用いる絶縁テープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating coil for a rotating machine for a generator, a rotating machine for general industrial use or a rotating machine for a vehicle, an insulating coil for a rotating electrical machine manufactured by a full impregnation method, and an insulating tape used therefor. It is about.
【0002】[0002]
【従来の技術】発電機用回転機、一般産業用回転機また
は車両用回転機は高電圧化や小型化の要求が高く、上記
回転機に組み込まれる絶縁コイルには耐電圧性、耐熱劣
化性の優れたものが求められている。2. Description of the Related Art A rotating machine for a generator, a rotating machine for general industry, or a rotating machine for a vehicle is required to have a higher voltage and a smaller size, and an insulating coil incorporated in the rotating machine has withstand voltage and heat resistance. What is required is excellent.
【0003】上記回転機に組み込まれる絶縁コイルは一
般に気相中に置かれるが、高電圧下ではコイル部分に存
在する気体の空気破壊に基づくコロナ放電が発生しコイ
ルの絶縁層が破壊される恐れがあるため、絶縁材として
耐熱性、耐コロナ性、耐電圧性などに優れたマイカ箔を
用いた絶縁テープが使用されている。マイカ箔は、マイ
カ原鉱を薄くはがして得られる薄片からなるマイカ箔と
マイカ原鉱またはマイカ箔の残品などを焼成法、水ジェ
ット法などで処理して細かい鱗片状とし、これを抄紙し
てシート状に形成した集成マイカ箔とがある。絶縁テー
プは、ガラスクロス、フィルム、不織布などの補強材を
裏打ち材として、この裏打ち材に上記マイカ箔をバイン
ダ樹脂で貼り合わせたものである。[0003] The insulating coil incorporated in the rotating machine is generally placed in a gaseous phase. At a high voltage, corona discharge occurs due to air destruction of gas existing in the coil portion, and the insulating layer of the coil may be broken. Therefore, an insulating tape using a mica foil having excellent heat resistance, corona resistance, voltage resistance, and the like is used as an insulating material. The mica foil is made by thinning the mica raw ore into thin flakes obtained by baking the mica foil and the mica raw ore or mica foil residue by a firing method, a water jet method, etc. Mica foil formed in a sheet shape. The insulating tape is obtained by using a reinforcing material such as a glass cloth, a film, or a nonwoven fabric as a backing material, and bonding the mica foil to the backing material with a binder resin.
【0004】通常の絶縁コイルは、適当な絶縁被覆を施
した素線を組み合わせて所定の形状を形成したコイル導
体上に、上記絶縁テープを巻回しこれを含浸タンクの中
で真空乾燥し、絶縁層の揮発性分や空気などを除去した
後に、熱硬化性樹脂からなる含浸樹脂を注入して更に加
圧してその巻回層に浸透させ、これを取り出し硬化させ
ることにより絶縁層を形成することにより製造してい
た。[0004] In a normal insulating coil, the above-mentioned insulating tape is wound on a coil conductor having a predetermined shape formed by combining wires having an appropriate insulation coating, and this is vacuum-dried in an impregnation tank to form an insulating coil. After removing the volatile components and air from the layer, inject an impregnated resin consisting of a thermosetting resin, further pressurize and infiltrate the wound layer, take it out and cure it to form an insulating layer It was manufactured by.
【0005】絶縁テープを構成するに当たり、補強材と
マイカ箔からなる絶縁材とを貼り合わせるバインダ樹脂
としては、(1)作業性の点から柔軟性がありかつ表面
のべたつきの少ないもの、(2)熱硬化性樹脂の含浸樹
脂の浸透性がよいもの、(3)耐熱性や絶縁特性に優れ
たものが使用され、エポキシ樹脂やアリル基含有ポリマ
ー等を触媒として有機酸金属塩とともに用いていた。[0005] In forming an insulating tape, as a binder resin for bonding a reinforcing material and an insulating material made of mica foil, (1) a binder resin having flexibility from the viewpoint of workability and having a low surface tackiness; ) A thermosetting resin impregnating resin having good permeability, (3) a resin having excellent heat resistance and insulating properties were used, and an epoxy resin or an allyl group-containing polymer was used as a catalyst together with an organic acid metal salt. .
【0006】含浸樹脂としては低粘度の不飽和ポリエス
テル、エポキシ樹脂またはシリコーン樹脂等の熱硬化性
樹脂が用いられるが、特に粘度が低く含浸作業性、取り
扱いが良好で、その硬化物の特性が優れているエポキシ
樹脂を酸無水物で硬化する樹脂系が一般に使用されてい
る。As the impregnating resin, a thermosetting resin such as unsaturated polyester, epoxy resin or silicone resin having a low viscosity is used. In particular, the viscosity is low, the impregnation workability is good, and the properties of the cured product are excellent. A resin system which cures an epoxy resin with an acid anhydride is generally used.
【0007】しかし、エポキシ樹脂―酸無水物硬化系の
含浸樹脂は、可使時間が長い反面、硬化速度が遅いため
硬化触媒を使用するのが一般的であるが、硬化触媒を含
浸樹脂に直接添加すると樹脂粘度の上昇が早くなり、可
使時間が短くなる問題がある。特に、絶縁コイルの絶縁
層への樹脂含浸は、含浸樹脂を満たした含浸タンクに絶
縁コイルを浸漬して行い、含浸が終わると、また、新た
な絶縁コイルを入れ、繰り返し含浸樹脂を使用すること
から、含浸中や含浸樹脂の保存中に粘度上昇がなく可使
時間が長いことが望まれる。However, epoxy resin-anhydride curing impregnated resins generally use a curing catalyst because of a long pot life but a slow curing rate. However, the curing catalyst is directly applied to the impregnated resin. When added, there is a problem that the viscosity of the resin increases quickly and the pot life is shortened. In particular, resin impregnation of the insulation layer of the insulation coil should be performed by immersing the insulation coil in an impregnation tank filled with the impregnation resin, and when impregnation is complete, add a new insulation coil and use the impregnation resin repeatedly. Therefore, it is desired that the pot life be long without increasing the viscosity during the impregnation or storage of the impregnated resin.
【0008】このように含浸樹脂に硬化触媒を直接添加
する方法では、含浸樹脂の可使時間が短くなるため、触
媒分離方式と言われる硬化触媒を含浸樹脂ではなく、絶
縁層側に予め添加しておく方法が知られている。即ち、
硬化触媒を絶縁テープのバインダ樹脂中に添加しておく
方法である。In the method in which the curing catalyst is directly added to the impregnated resin as described above, the pot life of the impregnated resin is shortened. Therefore, the curing catalyst referred to as a catalyst separation system is added in advance to the insulating layer side instead of the impregnated resin. There is a known method. That is,
This is a method in which a curing catalyst is added to the binder resin of the insulating tape.
【0009】一方、絶縁コイルの絶縁処理方式は、コイ
ル単体で樹脂含浸を行い、ヒートプレスにより加熱硬化
させた後に、固定子鉄心スロットに組み込み結線する単
体含浸方式と、樹脂含浸前のコイルを固定子鉄心スロッ
トに組み結線した後、これを一括して含浸する全含浸方
式とがある。従来は、小型の絶縁コイルは全含浸方式、
大型の絶縁コイルはコイル単体で処理する単体含浸方式
がとられていたが、全含浸方式には以下の利点があるた
め、大型な絶縁コイルに対しても全含浸方式の適用が望
まれている。 (1)含浸および硬化工程が1度で済むため加工費が低
減できる。 (2)コイルと固定子鉄心とが含浸樹脂により強固に固
着されるため巻線全体としての機械的剛性が向上する。 (3)コイルと固定子鉄心スロット間に含浸樹脂が充填
されるため、この間の熱抵抗が単体含浸方式のそれと比
べ小さくなる為、機器運転時に固定子コイル導体で発生
する熱に起因するコイルの温度上昇を、単体含浸方式に
比べ効率的に押さえることが可能となる。[0009] On the other hand, the insulation treatment method of the insulating coil includes a resin impregnation of a single coil, heating and curing by a heat press, and then incorporating the coil into a stator core slot for connection and fixing a coil before resin impregnation. There is an all-impregnation method in which after assembling and connecting to a core core slot, this is impregnated collectively. Conventionally, small insulated coils are all impregnated,
The large impregnated coil had a simple impregnation method in which the coil was treated as a single coil.However, since the full impregnation method has the following advantages, the application of the full impregnation method to large insulated coils is desired. . (1) Since only one impregnation and curing step is required, the processing cost can be reduced. (2) Since the coil and the stator core are firmly fixed by the impregnating resin, the mechanical rigidity of the entire winding is improved. (3) Since the impregnating resin is filled between the coil and the stator core slot, the thermal resistance during this period is smaller than that of the simple impregnation method. The temperature rise can be suppressed more efficiently than the simple impregnation method.
【0010】[0010]
【発明が解決しようとする課題】しかしながら、上記触
媒分離方式において、エポキシ樹脂―酸無水物からなる
熱硬化性含浸樹脂を速硬化可能な硬化触媒は、絶縁テー
プのバインダ樹脂であるエポキシ樹脂やアリル基含有ポ
リマーを単独で硬化させる硬化触媒としての作用もある
ため、絶縁テープ製造時の熱履歴や長期保存によりバイ
ンダ樹脂そのものの反応が進み、それに伴って絶縁テー
プが堅くなり、絶縁コイルの絶縁テープの巻回作業性が
悪くなるばかりか含浸樹脂の含浸性が低下して十分な特
性が得られず、絶縁コイルとしての信頼性が大きく低下
するという問題があった。そのため、上記従来のような
絶縁テープは低温で保管しなければならなかったり、絶
縁テープ製造後速やかに使用しなければならないという
制約があった。However, in the above-mentioned catalyst separation method, a curing catalyst capable of rapidly curing a thermosetting impregnated resin composed of an epoxy resin and an acid anhydride is an epoxy resin or an allyl which is a binder resin of an insulating tape. Since it also acts as a curing catalyst to cure the group-containing polymer alone, the reaction of the binder resin itself progresses due to the heat history and long-term storage during the production of the insulating tape, and as a result, the insulating tape becomes harder, and the insulating tape of the insulating coil becomes However, not only the winding workability is deteriorated, but also the impregnating property of the impregnated resin is lowered, so that sufficient characteristics cannot be obtained, and there has been a problem that the reliability as an insulating coil is greatly reduced. Therefore, there is a restriction that the above-described conventional insulating tape must be stored at a low temperature, or must be used immediately after manufacturing the insulating tape.
【0011】また、絶縁テープのバインダ樹脂として従
来使用されているエポキシ樹脂やアリル基含有ポリマー
を使用したものは、樹脂を含浸後、硬化中にバインダ樹
脂が含浸樹脂に溶融拡散して均一状態になる前に、バイ
ンダ樹脂単独で硬化反応を起こすため、絶縁層が不均一
な樹脂硬化物となり、耐熱性が低下し、長期高温熱劣化
により絶縁特性が低下するという問題があった。そのた
め、長期高温熱劣化により絶縁特性が低下するため最高
使用温度にも制限があった。In the case of using an epoxy resin or an allyl group-containing polymer, which has been conventionally used as a binder resin for an insulating tape, after the resin is impregnated, the binder resin melts and diffuses into the impregnated resin during curing to form a uniform state. Before the binder resin alone, a curing reaction is caused by the binder resin alone, so that the insulating layer becomes a non-uniform cured resin product, heat resistance is lowered, and insulation properties are deteriorated due to long-term high-temperature thermal degradation. For this reason, the long-term high-temperature thermal degradation lowers the insulation properties, and thus limits the maximum operating temperature.
【0012】さらに、従来の触媒分離方式で硬化触媒と
して使用されている有機酸金属塩は絶縁テープの保存安
定性は多少改善されるが触媒活性が低く硬化速度が遅い
ため、大型の絶縁コイルでは熱容量が大きいため硬化中
の絶縁コイルの昇温速度が遅く、硬化中に含浸させた樹
脂が漏れ、絶縁コイルとしての信頼性が大きく低下する
という問題があった。そのため、全含浸方式での製造に
おいても適用対象に制限があった。Further, the organic acid metal salt used as a curing catalyst in the conventional catalyst separation system has a somewhat improved storage stability of the insulating tape, but has a low catalytic activity and a low curing speed. Due to the large heat capacity, the rate of temperature rise of the insulating coil during curing is slow, and the impregnated resin leaks during curing, resulting in a problem that reliability of the insulating coil is greatly reduced. For this reason, there is a limitation on the application target even in the production by the full impregnation method.
【0013】本発明は、かかる課題を解決するためにな
されたもので、信頼性の高い絶縁コイルを得ることを目
的とする。また、全含浸方式により製造可能で信頼性の
高い絶縁コイルを得ることを目的とするものである。さ
らに、取扱いの容易な絶縁テープを得ることを目的とす
るものである。The present invention has been made to solve such a problem, and has as its object to obtain a highly reliable insulated coil. It is another object of the present invention to obtain a highly reliable insulated coil that can be manufactured by the full impregnation method. Another object of the present invention is to obtain an insulating tape which is easy to handle.
【0014】[0014]
【課題を解決するための手段】本発明に係る第1の絶縁
コイルは、コイル導体、およびこの導体に、絶縁材を補
強材にバインダ樹脂で接着してなる絶縁テープを巻回し
熱硬化性含浸樹脂を含浸して硬化した絶縁層を備えた絶
縁コイルにおいて、上記バインダ樹脂が硬化触媒を含有
したフェノール樹脂であり、上記熱硬化性含浸樹脂がエ
ポキシ樹脂および酸無水物のものである。According to a first aspect of the present invention, there is provided a first insulated coil comprising a coil conductor, and an insulating tape formed by bonding an insulating material to a reinforcing material with a binder resin by winding the conductor into a thermosetting impregnation. In an insulating coil provided with an insulating layer cured by impregnation with a resin, the binder resin is a phenol resin containing a curing catalyst, and the thermosetting impregnated resin is an epoxy resin and an acid anhydride.
【0015】本発明に係る第2の絶縁コイルは、コイル
導体に、絶縁材を補強材にバインダ樹脂で接着してなる
絶縁テープを巻回した絶縁層を設け、固定子鉄心スロッ
トに収納され、固定子鉄心と共に熱硬化性含浸樹脂を含
浸して硬化し、上記樹脂の硬化物により上記固定子鉄心
と一体化される絶縁コイルにおいて、上記バインダ樹脂
が硬化触媒を含有したフェノール樹脂であり、上記熱硬
化性含浸樹脂がエポキシ樹脂および酸無水物のものであ
る。In a second insulating coil according to the present invention, an insulating layer formed by winding an insulating tape formed by bonding an insulating material to a reinforcing material with a binder resin is provided on a coil conductor, and is housed in a stator core slot. A thermosetting impregnating resin is impregnated and cured together with the stator core, and in an insulating coil integrated with the stator core by a cured product of the resin, the binder resin is a phenol resin containing a curing catalyst, The thermosetting impregnated resin is an epoxy resin and an acid anhydride.
【0016】本発明に係る第3の絶縁コイルは、上記第
1または第2の絶縁コイルにおいて、フェノール樹脂の
フェノール性水酸基が2以上のものである。A third insulating coil according to the present invention is the above-mentioned first or second insulating coil, wherein the phenolic resin has two or more phenolic hydroxyl groups.
【0017】本発明に係る第4の絶縁コイルは、上記第
1ないし第3のいずれかの絶縁コイルにおいて、硬化触
媒がイミダゾール系化合物、イミダゾール系化合物と有
機酸金属塩、または4級アンモニウム塩のものである。The fourth insulating coil according to the present invention, in any one of the first to third insulating coils, wherein the curing catalyst is an imidazole compound, an imidazole compound and an organic acid metal salt, or a quaternary ammonium salt. Things.
【0018】本発明に係る第1の絶縁テープは、硬化触
媒を含有したフェノール樹脂で、絶縁材を補強材に接着
したものである。The first insulating tape according to the present invention is a phenol resin containing a curing catalyst, wherein an insulating material is bonded to a reinforcing material.
【0019】[0019]
【発明の実施の形態】本発明の絶縁コイルは、コイル導
体の周囲に絶縁層を設けたもので、絶縁層は絶縁テープ
を巻回したものに、エポキシ樹脂および酸無水物からな
る熱硬化性含浸樹脂を含浸して硬化したものであり、特
に、上記絶縁テープが、硬化触媒を含有したフェノール
樹脂からなるバインダ樹脂で絶縁材を補強材に接着した
ものである。絶縁テープは、シート状でもテープ状でも
任意の形状で使用できるが、特に断らなければ、本発明
ではこれらを総称して絶縁テープと呼ぶ。DESCRIPTION OF THE PREFERRED EMBODIMENTS The insulated coil according to the present invention has an insulating layer provided around a coil conductor. The insulating layer is formed by winding an insulating tape on a thermosetting curable resin made of an epoxy resin and an acid anhydride. The insulating tape is impregnated with an impregnating resin and cured. In particular, the insulating tape is obtained by bonding an insulating material to a reinforcing material with a binder resin made of a phenol resin containing a curing catalyst. The insulating tape can be used in any shape such as a sheet shape or a tape shape, but unless otherwise specified, these are collectively referred to as an insulating tape in the present invention.
【0020】上記絶縁材としては、マイカ原鉱を薄くは
がして得られる薄片からなるマイカ箔と、マイカ原鉱ま
たはマイカ箔の残品などを焼成法、水ジェット法などで
処理して細かい鱗片状とし、これを抄紙してシート状に
形成した集成マイカ箔とが用いられる。As the insulating material, mica foil composed of flakes obtained by stripping mica raw ore, and the remaining mica raw ore or mica foil, etc., are treated by a firing method, a water jet method or the like to produce fine scales. Then, a laminated mica foil formed into a sheet by making the paper is used.
【0021】上記補強材としては上記マイカ箔を補強で
きるものであれば特に制限はなく、例えば、ガラスクロ
ス、ポリエステルフィルム、ポリイミドフィルム、ポリ
エステル不織布などの絶縁性裏打ち材を用いる。The reinforcing material is not particularly limited as long as it can reinforce the mica foil. For example, an insulating backing material such as a glass cloth, a polyester film, a polyimide film, or a polyester nonwoven fabric is used.
【0022】本発明の絶縁コイルは、絶縁テープのバイ
ンダ樹脂が硬化触媒とフェノール樹脂からなっているの
で、含浸樹脂中のエポキシ樹脂がフェノール樹脂とも反
応し、含浸樹脂、バインダ樹脂が一体となり硬化するた
め、絶縁層の特性が向上し、信頼性の高い絶縁コイルが
得られる。In the insulating coil of the present invention, since the binder resin of the insulating tape is composed of a curing catalyst and a phenol resin, the epoxy resin in the impregnated resin also reacts with the phenol resin, and the impregnated resin and the binder resin are integrally cured. Therefore, the characteristics of the insulating layer are improved, and a highly reliable insulating coil can be obtained.
【0023】本発明に係わるフェノール樹脂としてはフ
ェノール性水酸基を2個以上含むものは、絶縁層におけ
る硬化樹脂の架橋密度が増加し耐熱性が向上するため望
ましいが、特に制限はない。そのような化合物として
は、フェノールノボラック、クレゾールノボラック、キ
シレゾールノボラック、ビスフェノールAのノボラッ
ク、ビスフェノールFのノボラック、ビスフェノールA
Dのノボラック、ビスフェノールA、ビスフェノール
F、ビスフェノールAD、ジアリルビスフェノールA、
ジアリルビスフェノールFまたはジアリルビスフェノー
ルAD等があり、単独またはその混合物があげられる。As the phenolic resin according to the present invention, those containing two or more phenolic hydroxyl groups are preferable because the crosslinking density of the cured resin in the insulating layer is increased and the heat resistance is improved, but there is no particular limitation. Such compounds include phenol novolak, cresol novolak, xylesol novolak, bisphenol A novolak, bisphenol F novolak, bisphenol A
Novolak of D, bisphenol A, bisphenol F, bisphenol AD, diallyl bisphenol A,
There are diallyl bisphenol F and diallyl bisphenol AD, etc., alone or in a mixture thereof.
【0024】作業性および含浸樹脂との相溶性の観点か
ら固体のフェノール樹脂と液状のフェノール樹脂を混合
して用いるのが望ましく、その混合割合は液状のフェノ
ール樹脂は10〜50重量%、固体のフェノール樹脂は
50〜90重量%が望ましい。つまり、固形のフェノー
ル樹脂だけでは絶縁テープが堅くなり、液状のフェノー
ル樹脂だけでは、絶縁テープがべたつき巻回作業性が悪
くなる。また、絶縁コイルに樹脂を含浸後、硬化中にバ
インダの樹脂が完全に含浸させた樹脂中に溶融拡散する
ためには、樹脂状から液状に変化する軟化温度が硬化温
度より低いフェノール樹脂が望ましい。From the viewpoints of workability and compatibility with the impregnating resin, it is desirable to use a mixture of a solid phenolic resin and a liquid phenolic resin. The phenol resin is desirably 50 to 90% by weight. That is, the insulating tape is hardened only with the solid phenol resin, and the insulating tape is sticky and the winding workability is deteriorated only with the liquid phenol resin. In addition, after the resin is impregnated in the insulating coil, the binder resin is preferably a phenol resin having a softening temperature lower than the curing temperature at which the binder resin changes from a liquid state to a liquid state so that the binder resin melts and diffuses into the completely impregnated resin during the curing. .
【0025】本発明に係わる硬化触媒とは、エポキシ樹
脂と、酸無水物またはフェノール樹脂のどちらか一方ま
たは両方との反応を促進させる働きがあれば特に制限は
ない。そのような化合物としては、トリス(ジメチルア
ミノメチル)フェノール、ジメチルベンジルアミンもし
くは1,8―ジアザビシクロ(5,4,0)ウンデセン
―7等の3級アミン系化合物類、2―メチルイミダゾー
ル、2―エチル―4―メチルイミダゾール、2―フェニ
ルイミダゾール、1―ベンジル―2―メチルイミダゾー
ル、1―ベンジル―2―エチルイミダゾール、1―シア
ノエチル―2―メチルイミダゾール、1―シアノエチル
―2―エチル―4―メチルイミダゾール、1―メチル―
2―エチルイミダゾールもしくは1―イソブチル―2―
メチルイミダゾール等のイミダゾール系化合物類、テト
ラメチルアンモニウムクロライド、テトラエチルアンモ
ニウムブロマイド、テトラエチルアンモニウムクロライ
ド、テトラエチルアンモニウムアイオダイド、テトラプ
ロピルアンモニウムブロマイド、テトラブチルアンモニ
ウムブロマイド、テトラブチルアンモニウムクロライ
ド、テトラブチルアンモニウムアイオダイド、トリオク
チルメチルアンモニウムクロライド、トリウラリルメチ
ルアンモニウムクロライド、ベンジルトリエチルアンモ
ニウムクロライド、ベンジルトリエチルアンモニウムブ
ロマイド、ベンジルトリエチルアンモニウムイアイオダ
イド、ベンジルトリブチルアンモニウムクロライド、ベ
ンジルトリブチルアンモニウムブロマイド、ベンジルト
リブチルアンモニウムアイオダイドもしくはフェニルト
リメチルアンモニウムクロライド等の4級アンモニウム
塩類、オクチル酸亜鉛、ナフテン酸亜鉛、コバルトアセ
チルアセチネート、ガブリン酸亜鉛もしくはマンガンア
セチルアセトネート等の有機酸金属塩類、テトラエチル
アンモニウムテトラフェニルボレート、2―エチル―4
―メチルイミダゾリウムテトラフェニルボレート、メチ
ルトリブチルフォスフォニウムテトラフェニルボレート
もしくはテトラフェニルフォスフォニウムテトラフェニ
ルボレート等のボレート塩類、トリフェニルフォスフィ
ン等のリン化合物類、または3フッ化ホウ素モノエチル
アミン等の3フッ化ホウ素アミン錯体などがあげられ
る。このうち、触媒活性の観点からイミダゾール系化合
物類が、触媒活性および絶縁特性の観点からイミダゾー
ル系化合物類および有機酸金属塩類の混合系または4級
アンモニウム塩類が好ましい。The curing catalyst according to the present invention is not particularly limited as long as it has a function of accelerating the reaction between the epoxy resin and one or both of the acid anhydride and the phenol resin. Such compounds include tertiary amine compounds such as tris (dimethylaminomethyl) phenol, dimethylbenzylamine or 1,8-diazabicyclo (5,4,0) undecene-7, 2-methylimidazole, Ethyl-4-methylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-ethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methyl Imidazole, 1-methyl-
2-ethylimidazole or 1-isobutyl-2-
Imidazole compounds such as methylimidazole, tetramethylammonium chloride, tetraethylammonium bromide, tetraethylammonium chloride, tetraethylammonium iodide, tetrapropylammonium bromide, tetrabutylammonium bromide, tetrabutylammonium chloride, tetrabutylammonium iodide, trioctyl Methyl ammonium chloride, triuralyl methyl ammonium chloride, benzyl triethyl ammonium chloride, benzyl triethyl ammonium bromide, benzyl triethyl ammonium iodide, benzyl tributyl ammonium chloride, benzyl tributyl ammonium bromide, benzyl tributyl ammonium Quaternary ammonium salts such as iodide or phenyltrimethylammonium chloride, organic acid metal salts such as zinc octylate, zinc naphthenate, cobalt acetylacetate, zinc gabulinate or manganese acetylacetonate, tetraethylammonium tetraphenylborate, 2-ethyl ―4
-Borate salts such as methylimidazolium tetraphenylborate, methyltributylphosphonium tetraphenylborate or tetraphenylphosphonium tetraphenylborate, phosphorus compounds such as triphenylphosphine, and 3 such as boron trifluoride monoethylamine. Boron fluoride amine complex and the like. Among these, imidazole compounds are preferable from the viewpoint of catalytic activity, and mixed or quaternary ammonium salts of imidazole compounds and organic acid metal salts are preferable from the viewpoint of catalytic activity and insulating properties.
【0026】本発明に係わる含浸用の熱硬化性樹脂はエ
ポキシ樹脂および酸無水物からなれば特に制限はない。
また、耐熱性向上のためにエポキシ樹脂―酸無水物に分
子構造中にヘテロ環をもつマレイミド樹脂などを添加し
てもよい。The thermosetting resin for impregnation according to the present invention is not particularly limited as long as it comprises an epoxy resin and an acid anhydride.
Further, a maleimide resin having a heterocyclic ring in the molecular structure may be added to the epoxy resin-anhydride to improve heat resistance.
【0027】本発明に係わる絶縁テープは、フェノール
樹脂に硬化触媒を添加したバインダ樹脂を溶剤に溶解さ
せ、これを絶縁材および補強材に塗工し溶剤を揮発させ
て作製する。バインダ樹脂の含有量は絶縁テープの3〜
15重量%であることが望ましく、3重量%未満である
とマイカ箔等の絶縁材と補強材が十分に一体化せず、1
5重量%を越えると含浸樹脂の含浸が不十分とになり硬
化後の特性が低下する。The insulating tape according to the present invention is produced by dissolving a binder resin obtained by adding a curing catalyst to a phenolic resin in a solvent, applying this to an insulating material and a reinforcing material, and evaporating the solvent. The binder resin content is 3 ~
If it is less than 3% by weight, the insulating material such as mica foil and the reinforcing material will not be sufficiently integrated, and
If it exceeds 5% by weight, the impregnation with the impregnated resin becomes insufficient, and the properties after curing deteriorate.
【0028】本発明の絶縁コイルは、上記絶縁テープを
絶縁被覆を施した素線を組み合わせて所定の形状を形成
したコイル導体上に巻回し、これを含浸タンクの中で真
空乾燥し、絶縁層の揮発性分や空気などを除去した後に
熱硬化性樹脂からなる含浸樹脂を注入して更に加圧して
その巻回層に浸透させ、これを取り出し硬化させること
により絶縁層を形成して得ることができる。The insulating coil of the present invention is obtained by winding the above-mentioned insulating tape on a coil conductor having a predetermined shape formed by combining the wires coated with an insulating coating, and drying this in a vacuum in an impregnation tank. After removing the volatile components and air, an impregnating resin made of a thermosetting resin is injected, further pressurized and penetrated into the wound layer, taken out and cured to form an insulating layer, thereby obtaining an insulating layer. Can be.
【0029】絶縁コイルの絶縁処理方式は、上記のよう
にコイル単体で樹脂含浸を行いヒートプレスにより加熱
硬化させた後に、固定子鉄心スロットに組み込み結線す
る単体含浸方式と、樹脂含浸前のコイルを固定子鉄心ス
ロットに組み結線した後、これを一括して含浸する下記
全含浸方式とがある。As described above, the insulation treatment method of the insulating coil is such that the coil is impregnated with a resin alone, heat-cured by a heat press, then incorporated into a stator core slot and connected, and a coil before resin impregnation is used. There is the following total impregnation method in which a stator core slot is assembled and connected, and then impregnated collectively.
【0030】全含浸方式とは、コイル導体に上記絶縁テ
ープを巻回した絶縁層を設け、固定子鉄心スロットに収
納し、固定子鉄心と共に上記熱硬化性含浸樹脂を含浸し
て硬化し、上記樹脂の硬化物により上記固定子鉄心と一
体化させる方法である。In the total impregnation method, an insulating layer in which the above-mentioned insulating tape is wound around a coil conductor is provided, stored in a stator core slot, impregnated with the thermosetting impregnating resin together with the stator core, and cured. This is a method of integrating the stator iron core with a cured resin.
【0031】また、イミダゾール系化合物類などの活性
の高い触媒をバインダ樹脂に添加すると、上記全含浸方
式で含浸した絶縁コイルも硬化時に樹脂漏れなく硬化す
ることができ信頼性の高い絶縁コイルが得られる。When a highly active catalyst such as an imidazole compound is added to the binder resin, the insulating coil impregnated by the above-mentioned total impregnation method can be cured without resin leakage at the time of curing, and a highly reliable insulating coil can be obtained. Can be
【0032】更に、フェノール樹脂は、エポキシ樹脂の
硬化触媒では反応しないため、絶縁テープ製造時の熱履
歴や長期保存でも変化なく、安定性、取り扱いに優れた
絶縁テープが得られる。Further, since the phenol resin does not react with the curing catalyst of the epoxy resin, there is no change in the heat history and the long-term storage during the production of the insulating tape, and an insulating tape excellent in stability and handling can be obtained.
【0033】[0033]
【実施例】以下、本発明を実施例に基づき具体的に説明
する。本発明はこれら実施例に限定されない。なお、実
施例および比較例中で用いるバインダ樹脂、硬化触媒、
含浸樹脂、酸無水物の略号は下記のとおりである。 フェノール樹脂 XLC―4L:キシレゾールノボラック(水酸基当量1
68){商品名:XLC―4L,三井東圧(株)製} PSM―4261:フェノールノボラック(水酸基当量
103){商品名:PSM―4261,群栄化学工業
(株)製} YLH129:ビスフェノールAのノボラック(水酸基
当量120){商品名:YLH129,油化シェルエポ
キシ(株)製} DABPA:ジアリルビスフェノールA{商品名:DA
BPA,三井東圧(株)製} DABPF:ジアリルビスフェノールF{商品名:DA
BPF,本州化学(株)製} イミダゾール系化合物類 2E4MZ:2―エチル―4―メチルイミダゾール{商
品名:2E4MZ,四国化成工業(株)製} 1B2MZ:1―ベンジル―2―メチルイミダゾール
{商品名:1B2MZ,四国化成工業(株)製} 4級アンモニウム塩 TEA―Cl:テトラエチルアンモニウムクロライド
{和光純薬工業(株)製} BTEA―Cl:ベンジルトリエチルアンモニウムクロ
ライド{和光純薬工業(株)製} BTEA―Br:ベンジルトリエチルアンモニウムブロ
マイド{和光純薬工業(株)製} BTEA―I:ベンジルトリエチルアンモニウムイアイ
オダイド{和光純薬工業(株)製} 有機酸金属塩 Co(II)AA:コバルト(II)アセチルアセトナ
ート{和光純薬工業(株)製} 上記以外の硬化触媒として DMP―30:トリス(ジメチルアミノメチル)フェノ
ール{商品名:DMP―30,ローム・アンド・ハース
(株)製} DBU:1,8―ジアザビシクロ(5,4,0)ウンデ
セン―7{和光純薬工業(株)製} エポキシ樹脂 E825:ビスフェノールA型エポキシ樹脂(エポキシ
当量178){商品名:E825,油化シェルエポキシ
(株)製} EX201:レゾルシン型エポキシ樹脂(エポキシ当量
118){商品名:EX201,ナガセ工業(株)製} E834:ビスフェノールA型エポキシ樹脂(エポキシ
当量250){商品名:E834,油化シェルエポキシ
社製} E1001:ビスフェノールA型エポキシ樹脂(エポキ
シ当量475){商品名:E1001,油化シェルエポ
キシ社製} E1032:トリフェニルメタン型多官能エポキシ樹脂
(エポキシ当量173){商品名:E1032,油化シ
ェルエポキシ社製} 酸無水物 QH―200:メチル―テトラヒドロフタル酸無水物
(酸無水物当量166){商品名:QH―200,日本
ゼオン(株)製} エポキシ樹脂以外の樹脂 PKHH:フェノキシ樹脂{商品名:PKHH,ユニオ
ンカーバイド(株)製} ダップ:ジアリルイソフタレートポリマー{商品名:ダ
ップ,大阪曹達(株)製}DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments. The present invention is not limited to these examples. In addition, the binder resin used in the Examples and Comparative Examples, a curing catalyst,
Abbreviations of the impregnated resin and the acid anhydride are as follows. Phenol resin XLC-4L: xylesol novolak (hydroxyl equivalent 1
68) {Trade name: XLC-4L, manufactured by Mitsui Toatsu Co., Ltd.} PSM-4261: Phenol novolak (hydroxyl equivalent: 103) {Trade name: PSM-4261, manufactured by Gunei Chemical Industry Co., Ltd.} YLH129: Bisphenol A Novolak (hydroxyl equivalent: 120) {trade name: YLH129, manufactured by Yuka Shell Epoxy Co., Ltd.} DABPA: diallyl bisphenol A {trade name: DA
BPA, manufactured by Mitsui Toatsu Co., Ltd. DABPF: diallyl bisphenol F Product name: DA
BPF, manufactured by Honshu Chemical Co., Ltd.} Imidazole compounds 2E4MZ: 2-ethyl-4-methylimidazole {brand name: 2E4MZ, manufactured by Shikoku Kasei Kogyo Co., Ltd.} 1B2MZ: 1-benzyl-2-methylimidazole {brand name : 1B2MZ, manufactured by Shikoku Chemicals Co., Ltd. Quaternary ammonium salt TEA-Cl: tetraethylammonium chloride {manufactured by Wako Pure Chemical Industries, Ltd.} BTEA-Cl: benzyltriethylammonium chloride {manufactured by Wako Pure Chemical Industries, Ltd.} BTEA-Br: benzyltriethylammonium bromide (manufactured by Wako Pure Chemical Industries, Ltd.) BTEA-I: benzyltriethylammonium iodide (manufactured by Wako Pure Chemical Industries, Ltd.) Organic metal salt Co (II) AA: cobalt ( II) Acetylacetonate (manufactured by Wako Pure Chemical Industries, Ltd.) -30: Tris (dimethylaminomethyl) phenol {trade name: DMP-30, manufactured by Rohm and Haas Co., Ltd.} DBU: 1,8-diazabicyclo (5,4,0) undecene-7 << Epoxy resin E825: bisphenol A type epoxy resin (epoxy equivalent: 178) >> Product name: E825, manufactured by Yuka Shell Epoxy Co., Ltd. >> EX201: resorcinol type epoxy resin (epoxy equivalent: 118) {Trade name: EX201, manufactured by Nagase Industries Co., Ltd.} E834: Bisphenol A type epoxy resin (epoxy equivalent 250) {Trade name: E834, manufactured by Yuka Shell Epoxy Co.} E1001: Bisphenol A type epoxy resin (epoxy equivalent 475) {Product name: E1001, manufactured by Yuka Shell Epoxy Co., Ltd.} E1032: G Phenylmethane-type polyfunctional epoxy resin (epoxy equivalent: 173) {Product name: E1032, manufactured by Yuka Shell Epoxy Co.} Acid anhydride QH-200: methyl-tetrahydrophthalic anhydride (acid anhydride equivalent: 166) {Product name: QH-200, manufactured by Zeon Corporation. Resin other than epoxy resin PKHH: phenoxy resin {trade name: PKHH, manufactured by Union Carbide Co., Ltd.} Dap: diallyl isophthalate polymer {trade name: Dap, Osaka Soda Co., Ltd. Production
【0034】実施例1. (1)絶縁テープ用バインダ溶液の調製 本発明に係わる絶縁テープ作製のためのバインダ樹脂溶
液として、固体状のフェノール樹脂(商品名:XLC―
4L)が70重量部(以下部という)、液状のフェノー
ル樹脂(商品名:DABPA)が30部、硬化触媒(商
品名:DMP―30)が7部からなる組成物を用い、こ
れらをアセトンとトルエンの1:1混合有機溶剤に溶解
して、不揮発分の濃度が約25重量%になるように調製
した。Embodiment 1 (1) Preparation of Binder Solution for Insulating Tape As a binder resin solution for producing an insulating tape according to the present invention, a solid phenol resin (trade name: XLC-
4L) is a composition consisting of 70 parts by weight (hereinafter referred to as “parts”), 30 parts of a liquid phenol resin (trade name: DABPA), and 7 parts of a curing catalyst (trade name: DMP-30). It was dissolved in an organic solvent mixture of toluene at a ratio of 1: 1 to prepare a non-volatile content of about 25% by weight.
【0035】(2)絶縁テープの作製 上記(1)で得られた絶縁テープ用バインダ樹脂溶液を
用いて、集成マイカシート{商品名:DR―2,岡部マ
イカ工業(株)製}の厚さ0.07mm、幅1000m
mのものと、厚さ0.03mmのガラスクロスとを貼り
合わせ、バインダ樹脂溶液の混合有機溶剤を140℃で
5分間加熱乾燥させ、バインダ樹脂含量6〜10重量%
の絶縁テープを作製した。(2) Preparation of Insulating Tape Using the binder resin solution for insulating tape obtained in the above (1), the thickness of laminated mica sheet (trade name: DR-2, manufactured by Okabe Mica Industry Co., Ltd.) 0.07mm, width 1000m
m and a glass cloth having a thickness of 0.03 mm are bonded together, and the mixed organic solvent of the binder resin solution is heated and dried at 140 ° C. for 5 minutes, and the binder resin content is 6 to 10% by weight.
Was produced.
【0036】(3)熱硬化性樹脂の調製 エポキシ樹脂(商品名:E825)41.5部、エポキ
シ樹脂(商品名:EX―201)10.4部、酸無水物
硬化剤(商品名:QH―200)48.1部を配合し
て、含浸用の熱硬化性樹脂を得た。(3) Preparation of thermosetting resin 41.5 parts of epoxy resin (trade name: E825), 10.4 parts of epoxy resin (trade name: EX-201), acid anhydride curing agent (trade name: QH) -200) 48.1 parts to obtain a thermosetting resin for impregnation.
【0037】(4)複合絶縁組織板の作製 複合絶縁組織板は、3.0mmのスペーサをセットした
テフロンテープを張り離型処理したガラス板に、10c
m×10cmの切断した上記(2)の絶縁テープを27
枚積層して、上記(3)の熱硬化性樹脂を真空加圧含浸
して、室温から毎分0.36℃の昇温条件で155℃ま
で昇温し、155℃で16時間保持し熱硬化性樹脂を硬
化して評価用の複合絶縁組織板を得た。(4) Preparation of Composite Insulating Tissue Plate A composite insulating tissue plate was prepared by adding a Teflon tape set with a 3.0 mm spacer to a glass plate and subjecting it to a mold release treatment.
Cut the mx 10 cm cut insulating tape of (2) above into 27
The thermosetting resin of the above (3) is vacuum-impregnated, and the temperature is raised from room temperature to 155 ° C. at a rate of 0.36 ° C./min, kept at 155 ° C. for 16 hours. The curable resin was cured to obtain a composite insulating tissue board for evaluation.
【0038】(5)複合絶縁組織板の耐熱性試験 上記(4)で作製した、板厚3.0mmの10cm×1
0cmの複合絶縁組織板を200℃のオーブン中で熱劣
化を行い、熱劣化による複合絶縁組織板の膨れやはがれ
を目視により観察した。(5) Heat Resistance Test of Composite Insulated Tissue Plate 10 cm × 1 having a plate thickness of 3.0 mm prepared in (4) above.
The 0 cm composite insulating tissue plate was thermally degraded in an oven at 200 ° C., and swelling and peeling of the composite insulating tissue plate due to the thermal deterioration were visually observed.
【0039】(6)複合絶縁組織板の誘電正接(tan
δ)測定 誘電正接(tanδ)測定の温度依存性は、上記(4)
で作製した、板厚3.0mmの10cm×10cmの複
合絶縁組織板を評価サンプルとしてJIS K6911
に準拠して測定を行った。(6) Dielectric tangent (tan) of the composite insulating tissue plate
δ) Measurement The temperature dependence of the dielectric loss tangent (tan δ) measurement is as described in (4) above.
A composite insulating tissue board of 10 cm × 10 cm with a board thickness of 3.0 mm produced in JIS K6911 was used as an evaluation sample.
The measurement was carried out according to.
【0040】(7)ゲル化時間 ゲル化時間は上記(3)の熱硬化性樹脂に対し硬化触媒
(商品名:DMP―30)を0.000027mol/
g添加して150℃でゲルタイムテスター{安田精機
(株)製}を用いて測定した。(7) Gelation time The gelation time was 0.000027 mol / h of the curing catalyst (trade name: DMP-30) to the thermosetting resin of the above (3).
g was added and measured at 150 ° C. using a gel time tester (manufactured by Yasuda Seiki Co., Ltd.).
【0041】(8)全含浸方式による絶縁コイルの作製 図1は、本発明の実施例の絶縁コイルを説明するための
説明図で、絶縁コイルを高圧回転電機に用いた場合のス
ロット出口部を示す。図中、1はケイ素鋼板を積層した
固定子鉄心、2は本発明の実施例の絶縁コイル、3は導
体、4は絶縁層、5はウエッジ、6は中間フィラー、7
は固定子鉄心スロット、9は保護絶縁層である。絶縁コ
イル2は導体3の周りに上記(2)で得られた絶縁テー
プを所定回数巻回し、コイルの絶縁層4を形成し、この
絶縁層4の表面に、ガラステープを巻回して保護絶縁層
9とする。これを鉄心スロット7へ挿入し、ウエッジ5
を打ち込みコイル2を固定した。しかる後、上記(3)
で調製した熱硬化製樹脂の含浸および室温から毎分0.
36℃の昇温条件で155℃まで昇温し、155℃で1
6時間保持し熱硬化性樹脂を硬化して絶縁コイルを得
た。(8) Production of Insulated Coil by Total Impregnation Method FIG. 1 is an explanatory view for explaining an insulated coil according to an embodiment of the present invention. Show. In the figure, 1 is a stator core laminated with silicon steel plates, 2 is an insulating coil of the embodiment of the present invention, 3 is a conductor, 4 is an insulating layer, 5 is a wedge, 6 is an intermediate filler, 7
Is a stator core slot, and 9 is a protective insulating layer. The insulating coil 2 is formed by winding the insulating tape obtained in the above (2) a predetermined number of times around the conductor 3 to form an insulating layer 4 of the coil. A glass tape is wound around the surface of the insulating layer 4 for protection insulation. Layer 9. This is inserted into the core slot 7 and the wedge 5
And the coil 2 was fixed. After a while, the above (3)
Impregnation of the thermosetting resin prepared in step 1 and from room temperature to 0.
The temperature was raised to 155 ° C under the temperature increasing condition of 36 ° C,
After holding for 6 hours, the thermosetting resin was cured to obtain an insulating coil.
【0042】(9)単体含浸方式による絶縁コイルの作
製 コイル導体の周りに絶縁テープを所定回数巻回し、対地
絶縁層を形成し、更に保護絶縁層としてガラステープを
巻回し、しかる後、上記(3)で調製した熱硬化性樹脂
の含浸を行い、金型に挿入して、金型温度155℃、圧
力20kg/cm2で16時間保持し加熱加圧して熱硬
化性樹脂を硬化して絶縁コイルを得た。(9) Production of Insulated Coil by Single Impregnation Method An insulating tape is wound around the coil conductor a predetermined number of times to form a ground insulating layer, and a glass tape is further wound as a protective insulating layer. The thermosetting resin prepared in 3) is impregnated, inserted into a mold, maintained at a mold temperature of 155 ° C. and a pressure of 20 kg / cm 2 for 16 hours, and heated and pressed to cure the thermosetting resin and to insulate the resin. A coil was obtained.
【0043】(10)絶縁コイルの絶縁特性測定 絶縁コイルの絶縁特性は、初期および180℃で16時
間熱劣化後の絶縁コイルの誘電正接―電圧特性(Δtan
δ)(12kV―2kVの誘電正接の差)および絶縁破
壊電圧(BDV)(1kV/秒の一定昇温で油中での測
定)測定により得た。これらの結果を表1に示した。(10) Measurement of Insulation Characteristics of Insulated Coil The insulation characteristics of the insulated coil were determined by the dielectric loss tangent-voltage characteristics (Δtan
δ) (dielectric tangent difference between 12 kV and 2 kV) and breakdown voltage (BDV) (measured in oil at a constant temperature rise of 1 kV / sec). The results are shown in Table 1.
【0044】[0044]
【表1】 [Table 1]
【0045】実施例2〜4.バインダ樹脂のフェノール
樹脂として実施例1で用いたXLC―4L、DABPA
のかわりにPSM―4261、YLH129、DABP
Fを用いた以外は実施例1と同様にして、絶縁テープ、
複合絶縁組織板、絶縁コイルを作製して評価を行った。
これらの結果を表1に示した。Embodiments 2-4. XLC-4L, DABPA used in Example 1 as a phenol resin for the binder resin
Instead of PSM-4261, YLH129, DABP
In the same manner as in Example 1 except that F was used, an insulating tape,
A composite insulating tissue board and an insulating coil were prepared and evaluated.
The results are shown in Table 1.
【0046】実施例5〜7.硬化触媒として実施例1に
おいて用いたDMP―30のかわりにDBU、2E4M
Z、1B2MZを用いた以外は実施例1と同様にして、
絶縁テープ、複合絶縁組織板、絶縁コイルを作製して評
価を行った。これらの結果を表1に示した。Embodiments 5 to 7 Instead of DMP-30 used in Example 1 as a curing catalyst, DBU, 2E4M
Z, except that 1B2MZ was used.
An insulating tape, a composite insulating tissue board, and an insulating coil were prepared and evaluated. The results are shown in Table 1.
【0047】実施例8、9.硬化触媒としてDMP―3
0のかわりに1B2MZ―オクチル酸亜鉛混合触媒、1
B2MZ―ナフテン酸亜鉛混合触媒を用いた以外は実施
例1と同様にして、絶縁テープ、複合絶縁組織板、絶縁
コイルを作製して評価を行った。これらの結果を表2に
示した。Embodiments 8 and 9 DMP-3 as curing catalyst
1B2MZ-zinc octylate mixed catalyst instead of 0, 1
In the same manner as in Example 1 except that the B2MZ-zinc naphthenate mixed catalyst was used, an insulating tape, a composite insulating tissue board, and an insulating coil were prepared and evaluated. Table 2 shows the results.
【0048】[0048]
【表2】 [Table 2]
【0049】実施例10〜13.硬化触媒としてDMP
―30のかわりにTEA―Cl、BTEA―Cl、 B
TEA―Br、BTEA―Iを用いた以外は実施例1と
同様にして、絶縁テープ、複合絶縁組織板、絶縁コイル
を作製して評価を行った。これらの結果を表2に示し
た。Embodiments 10 to 13 DMP as curing catalyst
TEA-Cl, BTEA-Cl, B instead of -30
Except for using TEA-Br and BTEA-I, an insulating tape, a composite insulating tissue board, and an insulating coil were prepared and evaluated in the same manner as in Example 1. Table 2 shows the results.
【0050】比較例1.バインダ樹脂のXLC―4L、
DABPAのかわりにE834、E1001をDMP―
30のかわりにオクチル酸亜鉛を用いた以外は実施例1
と同様にして、絶縁テープ、複合絶縁組織板、絶縁コイ
ルを作製して評価を行った。これらの結果を表3に示し
た。Comparative Example 1 XLC-4L of binder resin,
Instead of DABPA, E834 and E1001 are DMP-
Example 1 except that zinc octylate was used instead of 30
In the same manner as described above, an insulating tape, a composite insulating tissue board, and an insulating coil were prepared and evaluated. Table 3 shows the results.
【0051】[0051]
【表3】 [Table 3]
【0052】表3から明かなように、オクチル酸亜鉛は
触媒活性が低くゲルタイムが長いため全含浸方式での絶
縁コイル製造では含浸した熱硬化性樹脂の樹脂漏れが硬
化中に発生し、初期においても十分な絶縁特性が得られ
ない。また、初期には十分な絶縁特性が得られた単体含
浸で製造した絶縁コイルにおいても熱劣化により絶縁特
性の低下が見られる。また、複合絶縁組織板の耐熱性試
験においても200℃、1日で界面剥離がおき膨れが発
生し耐熱性が低い。As is apparent from Table 3, since zinc octylate has a low catalytic activity and a long gel time, resin leakage of the impregnated thermosetting resin occurs during curing in the production of an insulated coil by the full impregnation method. However, sufficient insulation properties cannot be obtained. In addition, even in an insulating coil manufactured by impregnation with a simple substance having sufficient insulating properties at the initial stage, a decrease in insulating properties due to thermal deterioration is observed. Also, in the heat resistance test of the composite insulating tissue plate, interface peeling occurs at 200 ° C. for one day, swelling occurs, and the heat resistance is low.
【0053】比較例2.バインダ樹脂のXLC―4L、
DABPAのかわりにE1032をDMP―30のかわ
りにCo(II)AAを用いた以外は実施例1と同様に
して、絶縁テープ、複合絶縁組織板、絶縁コイルを作製
して評価を行った。これらの結果を表3に示した。表3
から明かなように、Co(II)AAは触媒活性が低く
ゲルタイムが長いため全含浸方式での絶縁コイル製造で
は含浸した熱硬化性樹脂の樹脂漏れが硬化中に発生し、
初期においても十分な絶縁特性が得られない。また、初
期には十分な絶縁特性が得られた単体含浸で製造した絶
縁コイルにおいても熱劣化により絶縁特性の低下が見ら
れる。また、複合絶縁組織板の耐熱性試験においても2
00℃、1日で界面剥離がおき膨れが発生し耐熱性が低
い。Comparative Example 2 XLC-4L of binder resin,
An insulating tape, a composite insulating tissue board, and an insulating coil were prepared and evaluated in the same manner as in Example 1, except that E1032 was used instead of DABPA and Co (II) AA was used instead of DMP-30. Table 3 shows the results. Table 3
As is clear from the graph, Co (II) AA has a low catalytic activity and a long gel time, so that in the production of an insulating coil by the full impregnation method, resin leakage of the impregnated thermosetting resin occurs during curing,
Sufficient insulation properties cannot be obtained even at the initial stage. In addition, even in an insulating coil manufactured by impregnation with a simple substance having sufficient insulating properties at the initial stage, a decrease in insulating properties due to thermal deterioration is observed. In addition, in the heat resistance test of the composite insulating tissue board, 2
Interfacial peeling occurs at 00 ° C. for one day, causing swelling and low heat resistance.
【0054】比較例3.バインダ樹脂のXLC―4L、
DABPAのかわりにE834、E1001をDMP―
30のかわりに2E4MZを用いた以外は実施例1と同
様にして絶縁テープを作製した。これらの結果を表3に
示した。絶縁テープ製造時にバインダ溶液の混合有機溶
剤を140℃で5分間加熱乾燥させた熱履歴で、イミダ
ゾールの触媒効果によりバインダのエポキシ樹脂の反応
が進行し、それに伴って絶縁テープが堅くなり、評価用
のサンプルおよび絶縁コイルを作製することが出来なか
った。Comparative Example 3 XLC-4L of binder resin,
Instead of DABPA, E834 and E1001 are DMP-
An insulating tape was produced in the same manner as in Example 1 except that 2E4MZ was used instead of 30. Table 3 shows the results. The thermal history of heating and drying the mixed organic solvent of the binder solution at 140 ° C. for 5 minutes during the production of the insulating tape, the reaction of the epoxy resin of the binder progressed due to the catalytic effect of imidazole, and the insulating tape became harder, No sample and insulated coil could be manufactured.
【0055】比較例4.バインダ樹脂のXLC―4L、
DABPAのかわりにをダップ、PKHHを、DMP―
30のかわりに2E4MZを用いた以外は実施例1と同
様にして、絶縁テープ、複合絶縁組織板、絶縁コイルを
作製して評価を行った。これらの結果を表3に示した。
表3から明らかなように、単体含浸方式または全含浸方
式いずれの方式で製造した絶縁コイルも初期には十分な
絶縁特性が得られた。しかし、熱劣化により絶縁特性の
低下が見られる。また、複合絶縁組織板の耐熱性試験に
おいても200℃、1日で界面剥離がおき膨れが発生し
耐熱性が低い。Comparative Example 4 XLC-4L of binder resin,
Dap instead of DABPA, PKHH, DMP-
An insulating tape, a composite insulating tissue board, and an insulating coil were prepared and evaluated in the same manner as in Example 1 except that 2E4MZ was used instead of 30. Table 3 shows the results.
As is evident from Table 3, the insulation coils manufactured by either the simple impregnation method or the full impregnation method had sufficient insulation properties at the beginning. However, a decrease in insulation properties due to thermal degradation is observed. Also, in the heat resistance test of the composite insulating tissue plate, interface peeling occurs at 200 ° C. for one day, swelling occurs, and the heat resistance is low.
【0056】一方、表1または表2から明らかなよう
に、上記実施例において、いずれのフェノール樹脂をバ
インダ樹脂として用いても従来のエポキシ樹脂やアリル
基含有ポリマーをバインダにしたもの(比較例1〜4)
に比べて、複合絶縁組織板の耐熱性試験および絶縁コイ
ルの熱劣化後の絶縁特性において耐熱性が大幅に改善さ
れている。On the other hand, as is clear from Table 1 and Table 2, in any of the above-mentioned examples, a binder made of a conventional epoxy resin or an allyl group-containing polymer was used regardless of which phenol resin was used as the binder resin (Comparative Example 1). ~ 4)
In comparison with the above, the heat resistance is significantly improved in the heat resistance test of the composite insulating tissue board and the insulating properties of the insulating coil after the heat deterioration.
【0057】また、上記実施例において、いずれの硬化
触媒を用いたものも、オクチル酸亜鉛などの有機酸金属
塩を硬化触媒に用いた比較例1または比較例2に比べ
て、ゲルタイムが短くなり硬化速度が大幅に改善され、
有機酸金属塩を硬化触媒に用いたものでは不可能であっ
た全含浸方式により製造した絶縁コイルにおいても単体
含浸により製造した絶縁コイルと同等の信頼性が得られ
ている。In each of the above Examples, the gel time of any of the curing catalysts was shorter than that of Comparative Example 1 or Comparative Example 2 in which an organic acid metal salt such as zinc octylate was used as the curing catalyst. The curing speed has been greatly improved,
Insulation coils manufactured by the total impregnation method, which were not possible using organic acid metal salts as curing catalysts, have obtained the same reliability as insulation coils manufactured by simple impregnation.
【0058】特に、イミダゾール系化合物である2E4
MZ、1B2MZを硬化触媒に用いたもの(実施例6〜
9)は上記の絶縁信頼性の向上に加え、ゲルタイムが更
に短くなりかつガラス転移温度も向上している。さら
に、1B2MZ等のイミダゾール系化合物単独触媒系に
比べ、イミダゾール系化合物と有機酸金属塩の混合触
媒、または4級アンモニウム塩を触媒として用いた複合
絶縁組織板の高温でのtanδ特性が大幅に改善されてい
る。In particular, 2E4 which is an imidazole compound
Using MZ, 1B2MZ as a curing catalyst (Examples 6 to 6)
In the case of 9), in addition to the improvement of the insulation reliability, the gel time is further shortened and the glass transition temperature is also improved. Furthermore, the tan δ characteristics at high temperature of the composite insulating tissue board using a mixed catalyst of an imidazole compound and an organic acid metal salt or a quaternary ammonium salt as a catalyst are significantly improved as compared with a single catalyst system of an imidazole compound such as 1B2MZ. Have been.
【0059】[0059]
【発明の効果】本発明の第1の絶縁コイルによれば、コ
イル導体、およびこの導体に絶縁材を補強材にバインダ
樹脂で接着してなる絶縁テープを巻回し熱硬化性含浸樹
脂を含浸して硬化した絶縁層を備えた絶縁コイルにおい
て、上記バインダ樹脂が硬化触媒を含有したフェノール
樹脂であり、上記熱硬化性含浸樹脂がエポキシ樹脂およ
び酸無水物のものであり、信頼性が高いという効果があ
る。According to the first insulated coil of the present invention, a coil conductor and an insulating tape formed by bonding an insulating material to a reinforcing material with a binder resin are wound around the conductor and impregnated with a thermosetting impregnating resin. In the insulating coil provided with the cured insulating layer, the binder resin is a phenol resin containing a curing catalyst, and the thermosetting impregnated resin is an epoxy resin and an acid anhydride. There is.
【0060】本発明の第2の絶縁コイルによれば、コイ
ル導体に絶縁材を補強材にバインダ樹脂で接着してなる
絶縁テープを巻回した絶縁層を設け、固定子鉄心スロッ
トに収納され、固定子鉄心と共に熱硬化性含浸樹脂を含
浸して硬化し、上記樹脂の硬化物により上記固定子鉄心
と一体化される絶縁コイルにおいて、上記バインダ樹脂
が硬化触媒を含有したフェノール樹脂であり、上記熱硬
化性含浸樹脂がエポキシ樹脂および酸無水物のものであ
り、全含浸方式により製造可能で、信頼性が高いという
効果がある。According to the second insulating coil of the present invention, the coil conductor is provided with an insulating layer formed by winding an insulating tape obtained by bonding an insulating material to a reinforcing material with a binder resin, and is housed in the stator core slot. A thermosetting impregnating resin is impregnated and cured together with the stator core, and in an insulating coil integrated with the stator core by a cured product of the resin, the binder resin is a phenol resin containing a curing catalyst, The thermosetting impregnated resin is an epoxy resin and an acid anhydride, and can be manufactured by the full impregnation method, and has an effect of high reliability.
【0061】本発明の第3の絶縁コイルによれば、上記
第1または第2の絶縁コイルにおいて、フェノール樹脂
のフェノール性水酸基が2以上のものであり、信頼性が
高いという効果がある。According to the third insulated coil of the present invention, in the first or second insulated coil, the phenolic resin has two or more phenolic hydroxyl groups and has an effect of high reliability.
【0062】本発明の第4の絶縁コイルによれば、上記
第1ないし第3のいずれかの絶縁コイルにおいて、硬化
触媒がイミダゾール系化合物、イミダゾール系化合物お
よび有機酸金属塩、または4級アンモニウム塩のもので
あり、信頼性が高いという効果がある。According to the fourth insulating coil of the present invention, in any one of the first to third insulating coils, the curing catalyst is an imidazole compound, an imidazole compound and a metal salt of an organic acid, or a quaternary ammonium salt. And has the effect of high reliability.
【0063】本発明の第1の絶縁テープによれば、硬化
触媒を含有したフェノール樹脂で、絶縁材を補強材に接
着したものであり、取扱いが容易であるという効果があ
る。According to the first insulating tape of the present invention, the insulating material is bonded to the reinforcing material with a phenol resin containing a curing catalyst, and there is an effect that handling is easy.
【図1】 本発明の実施例の絶縁コイルを説明するため
の説明図である。FIG. 1 is an explanatory diagram illustrating an insulated coil according to an embodiment of the present invention.
2 絶縁コイル、3 導体、4 絶縁層。 2 Insulation coil, 3 conductors, 4 insulation layers.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤岡 弘文 東京都千代田区丸の内二丁目2番3号 三 菱電機株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hirofumi Fujioka 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation
Claims (5)
を補強材にバインダ樹脂で接着してなる絶縁テープを巻
回し熱硬化性含浸樹脂を含浸して硬化した絶縁層を備え
た絶縁コイルにおいて、上記バインダ樹脂が硬化触媒を
含有したフェノール樹脂であり、上記熱硬化性含浸樹脂
がエポキシ樹脂および酸無水物であることを特徴とする
絶縁コイル。1. An insulating coil comprising: a coil conductor; and an insulating layer formed by winding an insulating tape formed by bonding an insulating material to a reinforcing material with a binder resin around the conductor, impregnating with a thermosetting impregnating resin, and curing. An insulating coil, wherein the binder resin is a phenol resin containing a curing catalyst, and the thermosetting impregnated resin is an epoxy resin and an acid anhydride.
ダ樹脂で接着してなる絶縁テープを巻回した絶縁層を設
け、固定子鉄心スロットに収納され、固定子鉄心と共に
熱硬化性含浸樹脂を含浸して硬化し、上記樹脂の硬化物
により上記固定子鉄心と一体化される絶縁コイルにおい
て、上記バインダ樹脂が硬化触媒を含有したフェノール
樹脂であり、上記熱硬化性含浸樹脂がエポキシ樹脂およ
び酸無水物であることを特徴とする絶縁コイル。2. An insulating layer formed by winding an insulating tape formed by bonding an insulating material to a reinforcing material with a binder resin is provided on a coil conductor, housed in a stator core slot, and thermoset impregnated resin together with the stator core. Is cured by impregnating the resin, in an insulating coil integrated with the stator core by a cured product of the resin, the binder resin is a phenolic resin containing a curing catalyst, the thermosetting impregnated resin is an epoxy resin and An insulating coil, which is an acid anhydride.
2以上であることを特徴とする請求項1または請求項2
に記載の絶縁コイル。3. The phenolic resin according to claim 1, wherein the phenolic resin has two or more phenolic hydroxyl groups.
4. The insulated coil according to claim 1.
ダゾール系化合物および有機酸金属塩、または4級アン
モニウム塩であることを特徴とする請求項1ないし請求
項3の何れかに記載の絶縁コイル。4. The insulating coil according to claim 1, wherein the curing catalyst is an imidazole compound, an imidazole compound and a metal salt of an organic acid, or a quaternary ammonium salt.
絶縁材を補強材に接着してなる絶縁テープ。5. A phenol resin containing a curing catalyst,
An insulating tape made by bonding an insulating material to a reinforcing material.
Priority Applications (1)
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JP1708198A JPH11215753A (en) | 1998-01-29 | 1998-01-29 | Insulating coil and insulating tape used with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1708198A JPH11215753A (en) | 1998-01-29 | 1998-01-29 | Insulating coil and insulating tape used with the same |
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Publication Number | Publication Date |
---|---|
JPH11215753A true JPH11215753A (en) | 1999-08-06 |
Family
ID=11934036
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JP1708198A Pending JPH11215753A (en) | 1998-01-29 | 1998-01-29 | Insulating coil and insulating tape used with the same |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8314342B2 (en) | 2006-04-26 | 2012-11-20 | Hitachi, Ltd. | Winding applied single vacuum pressure impregnation insulation system, a winding applied global vacuum pressure impregnation insulation system and an electrical rotating machine having said insulation systems |
CN107852059A (en) * | 2015-07-17 | 2018-03-27 | 西门子公司 | Solid insulating material, its purposes and the insulation system being produced from it |
WO2018082938A1 (en) | 2016-11-01 | 2018-05-11 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Electrical insulation system based on epoxy resins for generators and motors |
WO2018099734A1 (en) * | 2016-11-30 | 2018-06-07 | Hexion GmbH | Composition for an insulation tape |
US11414542B2 (en) | 2017-09-25 | 2022-08-16 | Hexion Inc. | Impregnation resin mixture |
-
1998
- 1998-01-29 JP JP1708198A patent/JPH11215753A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8314342B2 (en) | 2006-04-26 | 2012-11-20 | Hitachi, Ltd. | Winding applied single vacuum pressure impregnation insulation system, a winding applied global vacuum pressure impregnation insulation system and an electrical rotating machine having said insulation systems |
CN107852059A (en) * | 2015-07-17 | 2018-03-27 | 西门子公司 | Solid insulating material, its purposes and the insulation system being produced from it |
US10774244B2 (en) * | 2015-07-17 | 2020-09-15 | Siemens Aktiengesellschaft | Solid insulation material |
WO2018082938A1 (en) | 2016-11-01 | 2018-05-11 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Electrical insulation system based on epoxy resins for generators and motors |
WO2018099734A1 (en) * | 2016-11-30 | 2018-06-07 | Hexion GmbH | Composition for an insulation tape |
CN110072923A (en) * | 2016-11-30 | 2019-07-30 | 瀚森有限责任公司 | Composition for insulating tape |
RU2717793C1 (en) * | 2016-11-30 | 2020-03-25 | Хексион Гмбх | Insulation tape composition |
CN114664478A (en) * | 2016-11-30 | 2022-06-24 | 瀚森德国有限公司 | Composition for insulating tape |
US11414542B2 (en) | 2017-09-25 | 2022-08-16 | Hexion Inc. | Impregnation resin mixture |
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