JPH11207629A - Grinding device having ground article flow-out preventing function and grinding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding device and a grinding method, wherein grinding efficiency is high even for a small and light article to be ground, and low manufacturing and running cost ground article flow-out preventing function is provided. SOLUTION: A cap 15 is placed on a grinding table 12 for placing an article 13 to be ground so as to form a grinding space 16, high pressure air is blown into the grinding space 16 by a high pressure air injection pipe 25, a projecting material 27 is injected from a projecting material tank 28 through a projection material supply pipe 26 together with the high pressure air into the grinding space 16 by using an ejector effect generated by the high pressure air, the projecting material 27 injected into the grinding space 16 is returned through a projecting material recovery pipe 30 to the projecting material tank 28 and, further, the article 13 to be ground is prevented from flowing out to the projecting material recovery pipe 30 by a ground article flow-out preventing net 32 provided in the cap 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and a polishing method having a function of preventing outflow of various objects to be polished, particularly small and light objects.

[0002]

2. Description of the Related Art Conventionally, there is a polishing apparatus B of the type shown in FIG. 2 as an apparatus for polishing objects to be polished of various dimensions by using shot blasting. The polishing apparatus B loads the object to be polished into the rotating tumbler 100 made of wire mesh through the object to be polished 101 and the blasting material ejecting apparatus 10.
The surface of the object to be polished can be polished by spraying the projecting material (abrasive) onto the object to be polished by the method 2.

[0003]

However, the above-described polishing apparatus B still has the following problems to be solved. That is, as described above, the object to be polished is a tumbler 1 made of wire mesh.
When the object to be polished is sprayed with a blasting material (abrasive) while rotating the object to be polished to uniformly polish the surface of the object to be polished, the object to be polished has a diameter of, for example, 5 to 6 mm and a weight of 0. In the case of a small and light object (a sample for various analysis, a small bolt, etc.) of 0.5 to 1 g, it is blown out by the high-speed air injected into the tumbler 100 and flows out.
Since the projection material (abrasive material) does not hit the corner of the surface, the polishing efficiency is poor, and even if the projection is performed for a long time, the material is hardly polished.

The present invention has been made in view of such circumstances, and has a function of preventing outflow of an object to be polished even if the object to be polished is small and lightweight, with high polishing efficiency and low manufacturing and running costs. An object of the present invention is to provide a polishing apparatus and a polishing method having the same.

[0005]

According to the present invention, there is provided a semiconductor device comprising:
The polishing apparatus having the function of preventing the outflow of the object to be polished includes a polishing table on which the object to be polished is mounted, a cap removably mounted on the polishing table to form a closed polishing space together with the polishing table, A blasting material tank for storing a material, a high-pressure air injection pipe for blowing high-pressure air into the polishing space, and the blasting material from the blasting material tank into the polishing space using an ejector effect generated by the high-pressure air. A blast material supply pipe that blasts with the high-pressure air, a blast material collection pipe that collects the blast material sprayed into the polishing space into the blast material tank, and between the polishing space and the blast material collection pipe. And an intervening net for preventing the object to be polished from flowing out to the blast material collecting pipe.

According to a second aspect of the present invention, there is provided a polishing method having a function of preventing a material to be polished from flowing out from a blasting material tank by utilizing an ejector effect by blowing high-pressure air into a closed polishing space for accommodating the material to be polished. The blasting material is jetted together with the high-pressure air through the blasting material supply pipe in a state, and the blasting material and the object to be polished are stirred in the polishing space to polish the object to be polished, and the blasting material is transferred to the polishing object. A polishing step of collecting the blast material in the blast material tank through a projection prevention net and a blast material collection tube, closing the blast material supply tube and blowing only the high-pressure air into the polishing space, and polishing the blast material in the polishing space to the polished material; The blast material collecting step of collecting the blast material in the blast material tank through the material outflow prevention net and the blast material collecting pipe is alternately repeated.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.

First, referring to FIG. 1, a polishing apparatus A according to an embodiment of the present invention having a function of preventing an object to be polished from flowing out.
Will be described. As shown in FIG. 1, a polishing table 12 is attached to the tip of a cylinder rod 11 of a polishing table elevating cylinder 10.
A sample mounting recess 14 for mounting a sample 13 which is an example of an object to be polished in a stable state is formed on the upper surface of the sample 2.

A bell-shaped cap 15 having a lower surface opening is disposed directly above the vertically movable polishing table 12, and the upper surface of the polishing table 12 is brought into contact with the edge of the lower end opening of the cap 15 so that the upper surface of the polishing table 12 abuts. Closed polishing space 16
Can be formed. On one side of the cap 15,
A sample loading chute 18 that is movable toward and away from the cap 16 by driving the advance / retreat cylinder 17 is disposed, and a sample receiving hopper 19 is disposed above the sample loading chute 18.

At the top of the sample receiving hopper 19, first to
The tip portions of the third sample transfer pneumatic tubes 20 to 22 are connected to each other. First and second sample transport pneumatic tubes 20, 21
Is connected to, for example, first and second cutting and punching machines in a sample preparation device (not shown), and the base of the third sample transfer pneumatic tube 22 is connected to an air compressor (not shown), On the way, a manual charging hopper 38 having an on-off valve 37 is connected. Also,
At the lower part of the sample receiving hopper 19, an electric on-off valve 35,
A sample drop confirmation sensor 36 is attached. With this configuration, the first to third sample transport pneumatic tubes 20 to 22 are provided.
The various samples 13 can be conveyed to the sample receiving hopper 19 through the passage, and by opening the electric open / close valve 35, an arbitrary amount or number of the samples 13 can be transferred onto the polishing table 12 via the sample loading chute 18. Sample mounting recess 1
4 can be supplied.

In the polishing space 16 provided in the cap 15, a high-pressure air injection pipe 2 penetrates through the top of the cap 15.
5 is open, and the base of the high-pressure air injection pipe 25 is connected to a high-pressure air compressor (not shown) or the like. A high-pressure air opening / closing valve 39 is mounted at a location on the upstream side of the communication connection portion 29 of the high-pressure air injection pipe 25,
By opening the high-pressure air opening / closing valve 39, high-pressure air can be blown into the polishing space 16.

A high-pressure air injection pipe 25 is connected to a front end of a blast material supply pipe 26 in the middle thereof, and a base of the high-pressure air injection pipe 25 is connected to a blast material tank 28 for storing a blast material 27. In the middle of the blast material supply pipe 26, the supply of the blast material 27
The projection material supply valve 26a which can perform stop repeatedly at predetermined time intervals alternately or intermittently is attached.

With such a configuration, the high-pressure air injection pipe 25
When the high-pressure air is blown into the polishing space 16 and the projection material supply valve 26a is opened, a venturi is formed in the communication connection portion 29 between the high-pressure air injection pipe 25 and the projection material supply pipe 26, and the ejector effect causes The blast material 27 filled in the blast material tank 28 is
6 and is sucked into the high-pressure air flowing through the high-pressure air supply pipe 25 through the high-pressure air supply pipe 25, and thereafter, is injected together with the high-pressure air toward the sample 13 in the polishing space 16 to perform a shot blasting operation (polishing step). On the other hand, the shot material supply valve 2
When high-pressure air is blown into the polishing space 16 through the high-pressure air injection pipe 25 with the valve 6a closed, only high-pressure air is injected into the polishing space 16 and the projection material 27 is not injected (projection material recovery step). ).

As shown in FIG. 1, a large-diameter projectile material is provided around a portion downstream of the communication connecting portion 29 between the high-pressure air injection pipe 25 and the projectile material supply tube 26 and around most of the projectile material supply tube 26. The collection pipe 30 is attached concentrically. The base of the blasting material collection pipe 30 is connected to the top of the cap 15, and the tip is communicatively connected to the top of the blasting material tank 28. With this configuration, the blast material 27 injected to the sample 13 by the high-pressure air injection tube 25 can be collected in the blast material tank 28 through the blast material collection tube 30 in a state of being mixed with the high-pressure air.

Further, in the present embodiment, the polishing space 16
A large number of projecting material passage holes 31 larger than the diameter of the projecting material 27 but smaller than the diameter of the sample 13 are provided between the material and the projecting material collecting pipe 30, that is, in the upper space of the cap 15, to prevent the outflow of the polished object. A network 32 is provided. With this configuration, the projection material 27 can be removed during polishing of the sample 13.
With the high-pressure air, the material can flow out to the blast material collection pipe 30 through the blast material passage hole 31 provided in the polished material flow prevention net 32, while the sample 13 has the polished material flow prevention net 3.
By means of 2, it is possible to reliably prevent the outflow toward the blasting material recovery pipe 30 together with the high-pressure air.

The other configuration of the polishing apparatus A having the function of preventing the object to be polished shown in FIG. 1 will be described. A sample receiving chute 33 is provided on one side of the polishing table 12 and on the other side. Is provided with a sample take-out pusher 34. Therefore, by driving the sample removing pusher 34, the polished sample 13 can be pushed out of the polishing table 12 to the sample receiving chute 33.

The upper wall of the blast material tank 28 is provided with an exhaust port 28a for discharging high-pressure air refluxed into the blast material tank 28 through the blast material collection pipe 30 as described later. . A dust box 40 is provided on the back side of the sample receiving chute 33.

Next, a method of polishing an object to be polished using the polishing apparatus A having the above-mentioned structure and having a function of preventing the object from flowing out will be described with reference to FIG. First,
The sample 13 is put into the sample receiving hopper 19 through the first or second sample transfer pneumatic tubes 20, 21.

After confirming that the sample loading chute 18 for feeding the sample 13 to the polishing table 12 is located immediately below the sample receiving hopper 19, the electric open / close valve 35 is opened and the sample 1 is opened.
3 is supplied onto the polishing table 12 via the sample loading chute 18. Thereafter, the sample loading chute 18 is retracted, and it is confirmed that the sample loading chute 18 has come off the polishing table 12.
The polishing table 12 is moved up by driving the polishing table elevating cylinder 10, and the polishing table 12 is brought into close contact with the lower edge of the cap 15 to form a closed polishing space 16 on the polishing table 12.

After the above preparation is completed, a shot blasting operation including a polishing step and a shot material collecting step is performed. Before the shot blasting operation, the injection time and the collecting time of the shot material 27 are set. For example, if the injection time is 1
Set 0 seconds, collection time to 5 seconds, and number of injections to 5 times.
Thereafter, the polishing apparatus A having the function of preventing the outflow of the object to be polished is operated, and the following shot blast operation is performed.

First, in the polishing step, the high-pressure air opening / closing valve 39 is opened, and high-pressure air is rushed toward the polishing table 12 through the high-pressure air injection pipe 25. Since a venturi is formed in the communication connecting portion 29 between the high-pressure air injection pipe 25 and the blast material supply pipe 26, the blast material 27 filled in the blast material tank 28 is ejected by the ejector effect.
It is sucked into the high-pressure air through the blast material supply pipe 26, and then jetted together with the high-pressure air toward the sample 13 in the polishing space 16. Then, the high-pressure air is inverted and the cap 15
After passing through the polished material outflow prevention net 32 provided therein, passing through the blast material collection pipe 30 and returning to the blast material tank 28 together with a part of the blast material 27, high-pressure air is exhausted from the blast material tank 28. The projectile material 27 is discharged to the outside through 28a, and is collected in the projectile material tank 28.

During this time, since the sample 13 is bathed in the blasting material 27 while vigorously moving between the polishing table 12 and the net 32 for preventing the object to be polished, the sample 13 is stirred in the polishing space 16 and is effectively polished. Become. By the way, as described above, the projection material 27 sucked by the venturi
Is blown onto the polishing table 12 by high-pressure air, and is collected in the blast material tank 28 through the polished material outflow prevention net 32 and the blast material collection pipe 30. The suction amount and the air flow rate match well. When not performed, especially when the suction amount is small, the blast material 27 is gradually removed from the polishing table 1.
There is a possibility that the movement of the sample 13 may be slowed down, or the sample 13 may be buried in the blast material 27 deposited on the polishing table 12, and the polishing efficiency may be significantly reduced, or polishing may not be performed at all.

Therefore, in this embodiment, a blast material collecting step is provided after the above-mentioned polishing step. That is, after the set injection time (10 seconds) elapses, the collection time (5 seconds)
Only for (seconds), the blast material supply valve 26a automatically closes and shuts off the blast material 27 from being sucked into the high-pressure air. Therefore, only the high-pressure air can be blown onto the polishing table 12, and the blast material 27 remaining in the polishing space 16 can be completely collected through the blast material collection pipe 30.

When so-called "blowing" is performed for the above-mentioned collection time, the blast material supply valve 2
6a is opened again and the blasting material 2 is polished for the polishing time (10 seconds).
The sample is polished again by injecting 7. When the projection and collection of the set number of times are completed in this way, the high-pressure air on-off valve 39 closes, and the supply of high-pressure air is stopped.

The polishing table 12 is lowered by the polishing table elevating cylinder 10, and the sample 13 on the polishing table 12 can be pushed out toward the sample receiving chute 33 by the sample removing pusher 34. In the above-described shot blasting operation, since the opening and closing time of the blasting material supply valve 26a can be set arbitrarily, the type, size, and weight of the object to be polished, the material and particle size of the blasting material 27, high-pressure air An optimum opening / closing time can be set by the pressure of the high-pressure air flowing through the pipe 25, and desired polishing can be performed in a short time.

As described above, the present invention has been described with reference to one embodiment. However, the present invention is not limited to the configuration described in the above embodiment, and is described in the claims. It also includes other embodiments and modifications that can be considered within the scope of the matters described. For example, in the above-described embodiment, polishing of the analysis sample has been described. However, if the object to be polished moves in the cap by the injection force of the high-pressure air, the outflow preventing function of the object to be polished according to the present invention is provided. Can be polished by a polishing apparatus having the same. Further, when the object to be polished has a large flat surface and only a specified flat portion is polished, the polishing can be performed by directly applying the cap to the flat surface of the object to be polished.

[0027]

According to the first aspect of the present invention, there is provided a polishing apparatus having a function of preventing a material to be polished from flowing out, comprising: a polishing table on which a material to be polished is mounted; and a cap for covering the polishing table. An outflow prevention net is mounted on the polishing table so that the material can pass through but cannot pass through the polishing object, and the blast material is blown against the sample on the polishing table together with high-pressure air. Therefore, the blasting object receives the blasting material while vigorously moving in the space between the polishing table and the polished material outflow prevention net by the blasting of the blasting material. Since it is greatly simplified, the polishing apparatus for the object to be polished can be downsized, and the manufacturing cost can be greatly reduced. In addition, a small and light object to be polished, which was impossible with a conventional apparatus, can be polished in a short time even with a single object.

In the polishing method having the function of preventing the outflow of the object to be polished, the shot blasting operation is constituted by repeating a polishing step and a shot material collecting step, so that the shot material is intermittently jetted. In the polishing step, the object to be polished is polished with the blast material, and the blast material remaining on the polishing table is completely recovered in the blast material collecting step, and the next polishing is started, so that the polishing time can be reduced. In addition to this, the surface of the object to be polished can be polished evenly.

[Brief description of the drawings]

FIG. 1 is a conceptual explanatory diagram of a polishing apparatus according to an embodiment of the present invention, which has a function of preventing an object to be polished from flowing out.

FIG. 2 is a perspective view of a conventional polishing apparatus.

[Explanation of symbols]

A Polishing device having a function of preventing outflow of a polishing object 10 Polishing table elevating cylinder 11 Cylinder rod 12 Polishing table 13 Sample (subject to be polished) 14 Sample mounting recess 15 Cap 16 Polishing space 17 Reciprocating cylinder 18 Sample loading chute 19 Sample Receiving hopper 20 Sample transfer pneumatic tube 21 Sample transfer pneumatic tube 22 Sample transfer pneumatic tube 25 High-pressure air injection tube 26 Projection material supply tube 26a Projection material supply valve 27 Projection material 28 Projection material tank 28a Exhaust port 29 Communication Connecting part 30 Projectile collection pipe 31 Projectile passage hole 32 Polishing object outflow prevention net 33 Sample receiving chute 34 Sample removal pusher 35 Electric open / close valve 36 Sample drop confirmation sensor 37 Open / close valve 38 Manual input hopper 39 High-pressure air open / close valve 40 Dust box

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Teruki Nishi 2-1, Hibata-cho, Tobata-ku, Kitakyushu-shi, Fukuoka Co., Ltd. Kyushu Techno Research Sales Engineering Department

Claims (2)

[Claims] A polishing table for mounting an object to be polished, a cap removably mounted on the polishing table to form a closed polishing space together with the polishing table, a projection material tank for storing a projection material, A high-pressure air injection tube for blowing high-pressure air into the polishing space; and a projecting material supply tube for injecting the projecting material together with the high-pressure air from the projecting material tank into the polishing space using an ejector effect generated by the high-pressure air. And, a blast material collection tube for collecting the blast material injected into the polishing space into the blast material tank, interposed between the polishing space and the blast material collection tube, and A polishing apparatus having an outflow prevention function for an object to be polished, comprising: a net for preventing the outflow of an object to be polished, which prevents the outflow to the blast material collecting pipe. 2. A projecting material is injected together with the high-pressure air from a projecting material tank through a projecting material supply pipe in an open state by using an ejector effect by blowing high-pressure air into a closed polishing space for accommodating an object to be polished. Agitating the projecting material and the object to be polished in the polishing space to polish the object to be polished, and collecting the projecting material into the projecting material tank through a net for preventing the object to be polished outflow and a projecting material collecting pipe. Polishing process,
The projection material supply pipe is closed and the high-pressure air alone is blown into the polishing space, and the projection material in the polishing space is collected in the projection material tank through the polished work outflow prevention net and the projection material collection pipe. A polishing method having a function of preventing an object to be polished from flowing out, wherein the steps are alternately repeated.