JPH11191362A - Manufacture of image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the bad influence of a discharge gas accompanying the decomposition and combustion of a frit glass paste or a resin adhesive varnish and properly perform an electric forming processing or activating processing by baking an adhesive for connecting an outer frame to a rear plate and a spacer to the rear plate, and then performing a charging thin film process. SOLUTION: A paste consisting of powder glass and a vehicle added thereto or a resin adhesive varnish is applied to a position for arranging a spacer or outer frame 104 on a rear plate 101 by a dispenser 114 or the like and baked. A spacer 113 and the outer frame 104 are arranged in the adhesive applied position, and pressurized by a presser plate followed by baking to adhere them. A conductive thin film 108 solution is applied by an ink jet device 115 having a droplet discharge head. The adhesive is applied also to a face plate 102 in the same manner to perform the adhesion with the rear plate 101. Since the conductive thin film 108 is formed after fixing the spacer and the outer frame to the rear plate 101, the conductive thin film 108 is never exposed to the decomposition or combustion gas of an organic solvent, and a sufficient electron emitting current can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an image display device using an electron source, and more particularly, to a method for manufacturing an image display device which is joined by using an atmospheric pressure resistant spacer and a bonding agent for an outer frame.

[0002]

2. Description of the Related Art Conventionally, generally, in an image display apparatus using electrons, a face plate, which is a glass member,
A vacuum envelope composed of a rear plate and an outer frame for maintaining a vacuum (reduced pressure) atmosphere, an electron source for emitting electrons and its driving circuit, an image forming member having a phosphor that emits light by collision of electrons, and the like. An acceleration electrode for accelerating toward the image forming member and a high-voltage power supply for the electrode are required.

As an image display apparatus using a surface conduction electron-emitting device, an apparatus as shown in FIG. 16 is known (for example, JP-A-6-342636 of the present applicant).

In a surface conduction electron-emitting device, an electron-emitting portion is generally formed by applying a current to a conductive thin film before the electron emission by an energization process called energization forming. That is, energization forming means applying a direct current voltage or a very slowly increasing voltage to both ends of the conductive thin film and energizing the same to locally break, deform or alter the conductive thin film, thereby bringing the conductive thin film into an electrically high-resistance state. Is to form an electron emitting portion.

[0005] It is preferable to perform an activation process on the element after forming. The activation treatment can be performed, for example, by repeating the application of a pulse in an atmosphere containing a gas of an organic substance, similarly to the energization forming.
By this treatment, carbon or a carbon compound is deposited on the device from organic substances present in the atmosphere, and the electron emission current becomes
To increase.

Further, in an image display device using a flat vacuum envelope such as a thin image display device, a spacer is often used as an atmospheric pressure resistant support structure (for example, Japanese Patent Application Laid-Open No. 2-399136). ). The outer frame and the spacer are similarly fixed by a bonding agent such as a frit.

[0007]

The formation of a conductive thin film between the device electrodes on the rear plate and the fixing of the spacer and the outer frame to the rear plate with a frit or an adhesive show, for example, a partial cross section of an image display device. This is performed as shown in FIGS. In the figure, 201 is a rear plate made of glass, 202 is a face plate made of glass, 203 is an outer frame made of glass, 204 and 20.
5, 211, 212 are bonding agents, 206 is upper wiring, 207
Is an element electrode (lower wiring side), 208 is a conductive thin film, 209
Is a phosphor, 210 is a metal back, 213 is a spacer,
214 is a dispenser, 25 is an inkjet device,
216 is a holding plate. The lower wiring and the element electrode (upper wiring side) are not shown.

(1) One Example of a Process of Forming a Conductive Thin Film Between Device Electrodes on a Rear Plate In the process of forming a conductive thin film, ordinary photolithography technology is used. As shown in FIG. 2A, a solution containing a conductive thin film material is placed between a pair of element electrodes of a rear plate on which upper and lower wirings, element electrodes, and the like are formed in advance. It can be formed by applying at least one droplet to a portion corresponding to 208 in the drawing (between element electrodes) and then heating and firing the droplet.

(2) Step of applying bonding agent solution on rear plate: FIG. 2 (b) Frit glass paste as bonding agent solution, that is, powder glass, a vehicle (a low molecular weight acrylic resin melted in an organic solvent) Using a dispenser 214 or the like, the paste to which the spacer is added is placed on the rear plate (electron source substrate) 201 on which the conductive thin film 208 has been formed in advance, where the spacers are arranged (on the wiring 206 in this figure) and the outer frame is arranged. It is applied and baked at the position to be performed.

(3) Step of joining (sealing) the spacer and the outer frame to the rear plate: FIG. (C) The spacer and the outer frame are arranged on the bonding agent solution applied portion on the rear plate, and the holding plate is placed. It is baked while applying pressure, and the spacer (outer frame) and the rear plate are joined (sealed).
After bonding, remove the holding plate.

(4) Face plate joining (sealing) step: FIG. 4 (d) Thereafter, a frit is applied to the position of the spacer and the outer frame on the face plate in the same manner as in FIG. (Sealing) with the rear plate to which the spacer and the outer frame are fixed, and bonding (sealing) with the rear plate to which the spacer and the outer frame are fixed in (c) above. An envelope capable of maintaining a vacuum is manufactured.

However, in a method of manufacturing an image display device in which an atmospheric pressure-resistant spacer or an outer frame is bonded (sealed) to a rear plate on which the above-mentioned conductive thin film is formed in advance by using a bonding agent, When firing the frit glass paste or resin adhesive varnish formed above, the resistance of the above conductive thin film near the frit glass paste or resin adhesive varnish is affected by the release gas accompanying the decomposition and combustion of the binder and organic solvent. May change. The resistance change indicates that the conductive thin film is a fine particle film (a film in which a plurality of fine particles are aggregated,
The film is not only in a state where the fine particles are individually dispersed and arranged, but also in a state in which the fine particles are adjacent to each other or in a state where they are in an overlapped state including an island shape. In some cases, the thin film is reduced and the resistance is reduced, or the resistance is increased due to further aggregation after the reduction. In any case, the energization forming process and the activation process are performed appropriately. In some cases, a sufficient electron emission current could not be obtained.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a process for eliminating the adverse effects of the released gas accompanying the decomposition and combustion of an organic solvent when firing a frit glass paste or a resin adhesive varnish formed on a rear plate. It is an object of the present invention to provide a method of manufacturing an image display device which can realize the following energization forming process and activation process appropriately.

[0014]

The above object is achieved by the following means.

That is, the present invention relates to a face plate on which a phosphor and an electron accelerating electrode are formed, a pair of device electrodes, a conductive thin film connecting the pair of device electrodes, and having an electrode emission part in a part thereof. Plate (electron source substrate) formed with a plurality of surface conduction electron-emitting devices composed of
An outer frame surrounding the periphery between the face plate and the rear plate; and a spacer disposed between the face plate and the rear plate as an anti-atmospheric pressure support structure. In the manufacturing method, the conductive thin film forming step is performed after performing a firing step of a bonding agent for bonding the outer frame and the rear plate and bonding the spacer and the rear plate. It proposes a manufacturing method,
The method of manufacturing the image display device, wherein the step of baking a bonding agent for bonding the outer frame and the rear plate and bonding the spacer and the rear plate includes a step of baking a frit glass paste. A method of manufacturing an image display device, wherein the step of baking a bonding agent for bonding the outer frame and the rear plate and bonding the spacer and the rear plate includes a baking step of a resin adhesive varnish; The method for manufacturing an image display device, wherein the step of forming the conductive thin film is a step of forming the conductive thin film by an ink jet device having a droplet discharge head; The electron source thus formed is a surface conduction electron-emitting device.

According to the present invention, after performing the bonding agent firing step, that is, after fixing the spacer and the outer frame on the rear plate,
Conducting the conductive thin film forming process, which keeps the conductive thin film from being exposed to the release gas atmosphere accompanying the decomposition and combustion of the binder and organic solvent when firing the frit glass paste and adhesive varnish formed on the rear plate be able to. Therefore, it is possible to appropriately perform the energization forming process and the activation process without causing a change in the resistance of the conductive thin film due to the emission gas accompanying the classification and combustion of the binder and the organic solvent. It is possible to provide a method for manufacturing an image display device that can be obtained.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The method of manufacturing an image display device of the present invention is preferably used in a method of manufacturing an image display device provided with spacers of an anti-atmospheric pressure support structure.

In the following, according to the method of manufacturing an image display device of the present invention, the steps of forming a conductive thin film between the device electrodes on the rear plate and fixing the spacer and the outer frame to the rear plate with a frit or an adhesive are described below. This is performed as shown in FIGS. 1 (a) to 1 (d) which show a partial cross section of the apparatus. In the figure, 101 is a rear plate made of blue glass,
102 is a face plate made of blue sheet glass, 103
Is an outer frame made of blue sheet glass, 104, 105, 111,
112 is a bonding agent, 106 is an upper wiring, 107 is an element electrode (upper wiring side), 108 is a conductive thin film, 109 is a phosphor,
110 is a metal backing, 113 is a spacer, 114 is a dispenser, 115 is an ink jet device, and 116 is a holding plate.

(1) Step of applying bonding agent solution on rear plate: (a) Frit glass paste as bonding agent solution, that is, powder glass, vehicle (low molecular weight acrylic resin melted in organic solvent) Paste and resin adhesive varnish (mainly heat-resistant resin adhesive dissolved in organic solvent)
Using the dispenser 114 or the like,
Rear plate (electron source substrate) 1 on which 08 is not formed
01 (the wiring 10 in this drawing)
6) Apply and bake at the positions where the outer frame is to be arranged.

(2) Step of joining (sealing) the spacer and the outer frame to the rear plate: FIG. (B) The spacer and the outer frame are arranged on the bonding agent solution application portion on the rear plate, and the holding plate is placed. It is baked while applying pressure, and the spacer (outer frame) and the rear plate are joined (sealed).
After bonding, remove the holding plate.

(3) Step of applying a conductive thin film solution between device electrodes on the rear plate: FIG. 3C. Conductivity between a pair of device electrodes of the rear plate on which upper and lower wiring, device electrodes, etc. are formed in advance. Ink jet apparatus 21 having a solution containing a thin film material, for example, a droplet discharge head
5 is used to apply at least one droplet between the device electrodes.

Since the spacer and the outer frame have already been joined to the rear plate in the step (2), ordinary photolithography cannot be used in the conductive thin film forming step. By using a device that can discharge the conductive thin film, the conductive thin film solution applying step can be performed even if the spacer and the outer frame are first joined to the rear plate. It is also a feature of the present invention that the conductive thin film solution coating step is performed from above the spacer and the outer frame using this ink jet apparatus.

(4) Face plate joining (sealing) step: (d) After that, a frit or an adhesive is applied to the position of the spacer and the outer frame on the face plate in the same manner as in (a). By joining (sealing) the spacer and the rear plate to which the outer frame is fixed in (b), an envelope capable of maintaining the vacuum of the image display device is manufactured.

As described above, after performing the bonding agent baking step, that is, after fixing the spacer and the outer frame on the rear plate, the conductive thin film forming step is performed, whereby the frit glass formed on the rear plate is formed. It is possible to prevent the conductive thin film from being exposed to an atmosphere of a released gas accompanying decomposition and combustion of a binder or an organic solvent when baking a paste or an adhesive varnish. Therefore, the resistance of the conductive thin film did not change due to the released gas accompanying the decomposition and combustion of the binder and the organic solvent. In addition, since the energization forming process and the activation process can be appropriately performed later, it is possible to provide a method of manufacturing an image display device capable of obtaining a sufficient electron emission current.

[0025]

EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.

Embodiment 1 As a first embodiment, a case where frit glass is used as a bonding agent will be described.

First, an image display device using a surface conduction electron-emitting device will be described. FIG. 3 is a partially cutaway perspective view of the image display device of the present invention. An envelope 808 is made up of a face plate 806, a rear plate 801, a spacer 213, an outer frame 802, and an adhesive (not shown) for joining them, and a vacuum is maintained inside.

As the rear plate, a blue plate (soda lime gas), a blue plate glass having SiO ₂ formed on its surface, etc. are used as a substrate, and the electron-emitting device 804 and a wiring for supplying a signal for driving the electron-emitting device are provided thereon. 702 and 703
Are formed on the substrate. On the other hand, for the face plate, the above-mentioned glass or the like is usually used as a substrate. A metal back 805 (electron acceleration electrode) is formed. The electrons emitted from the electron-emitting device are
It is accelerated by the high voltage applied to the metal back, collides with the phosphor, and causes the phosphor to emit light. When the conductivity of the metal back is not sufficient, a transparent conductive layer may be provided between the glass substrate and the black stripe (black matrix) and the phosphor as an auxiliary means.

FIG. 4 schematically shows the fluorescent film formed on the face plate of the image display device shown in FIG. The fluorescent film 804 can be composed of only a phosphor in the case of monochrome. For color display,
In order to make color mixing less noticeable, the necessary three primary color phosphors 90 are used.
Assume that the non-light emitting portion 901 is between the two. It is preferable that the non-light-emitting portion be a black body because a decrease in contrast due to reflection of external light can be suppressed. The pattern of the non-light-emitting portion is preferably a stripe shape or a matrix shape according to the pixel arrangement.

As a method of applying a fluorescent substance to the glass substrate 803, a precipitation method, a printing method, and the like can be adopted regardless of whether it is monochrome or color. Usually, a metal back 805 is provided on the inner surface side of the fluorescent film 804.

The electron-emitting device to be used is not particularly limited, and a thermionic electron source and a cold cathode electron source can be used, but a surface conduction electron-emitting device which is a cold cathode electron source is particularly preferable.

FIGS. 5A and 5B are a plan view and a cross-sectional view of a surface conduction electron-emitting device, respectively.
02 and 303 are device electrodes, 304 is a conductive thin film, 305
Denotes an electron emission portion. In FIG. 6, reference numeral 421 denotes a step forming portion, which includes a substrate 401, device electrodes 402 and 403, a conductive thin film 404, an electron emitting portion 405, and the like. The planar surface conduction electron-emitting device can be manufactured by a method.

The image display device shown in FIG. 3 has a simple matrix arrangement. This is schematically shown in FIG. 7, reference numeral 701 denotes a substrate, 702 denotes an X-direction wiring, and 703 denotes a Y-direction wiring. 704 is a surface conduction electron-emitting device, and 705 is a connection. Note that the surface conduction electron-emitting device 704 may be either of the above-mentioned flat type or vertical type.

The m X-direction wirings 702 are Dx1, Dx
2, ... Dxm, vacuum deposition method, printing method,
It can be made of a conductive metal or the like formed by a sputtering method or the like. The material, thickness, and width of the wiring are appropriately designed. The Y-method wiring 703 includes Dy1, Dy2,.
., Dyn and are formed in the same manner as the X-direction wiring 702. These m X-directional wirings 702 and n
An interlayer insulating layer (not shown) is provided between the Y-direction wiring 703 and the Y-direction wiring 703 to electrically separate them from each other (m, m).
n is an integer).

A pair of electrodes (not shown) constituting the surface conduction electron-emitting device 704 are electrically connected to m X-directional wires 702 and n Y-directional wires 703 by a connection 705 made of a conductive metal or the like. Have been.

The X-direction wiring 702 is connected to a scanning signal applying means (not shown) for applying a scanning signal for selecting a row of the surface conduction electron-emitting devices 704 arranged in the X direction. On the other hand, a modulation signal generating means (not shown) for modulating each column of the surface conduction electron-emitting devices 704 arranged in the Y direction according to an input signal is connected to the Y-direction wiring 703. The driving voltage applied to each electron-emitting device is supplied as a difference voltage between a scanning signal and a modulation signal applied to the device.

In the above configuration, individual elements can be selected and driven independently using a simple matrix wiring.

Next, an example of the configuration of a drive circuit for performing television display based on an NTSC television signal on a display panel configured using electron sources arranged in a simple matrix arrangement will be described with reference to FIG. .

In FIG. 8, reference numeral 1001 denotes a display panel;
002 is a scanning circuit, 1003 is a control circuit, and 1004 is a shift register. 1005 is the main memory, 100
6 is a synchronization signal separation circuit, 1007 is a modulation signal generator, V
xVa is a DC voltage source.

In the image display device of the present invention which can take such a configuration, each of the electron-emitting devices is provided with an external terminal Do.
By applying a voltage via x1 to Doxm and Doy1 to Doyn, electron emission occurs. High voltage terminal H
A high voltage (several kV to several tens of kV) is applied to the metal back 805 or a transparent electrode (not shown) via v to accelerate the electron beam. The accelerated electrons collide with the fluorescent film 804 and emit light to form an image.

The configuration example of the image display device described here is merely an example, and various modifications can be made based on the technical idea of the present invention. The input signal is not limited to the NTSC system, but may be a PAL or SECAM system or a TV signal (for example, MUSE) composed of a larger number of scanning lines.
And other high-definition TV) systems.

Furthermore, the present invention can be applied to an image display device provided with a ladder-type electron source. This will be described with reference to FIGS.

FIG. 9 is a schematic view showing an example of a ladder-type electron source. In FIG. 9, reference numeral 1100 denotes an electron source substrate, and 1101 denotes an electron-emitting device. 1120 (Dx1
To Dx10) are common wirings connected to the electron-emitting device 1101. A plurality of electron-emitting devices 1101 are arranged on the substrate 1100 in parallel in the X direction (this is called an element row). A plurality of the element rows are arranged to constitute an electron source. By applying a drive voltage between the common wires of each element row, each element row can be driven independently.
That is, a voltage equal to or higher than the electron emission threshold is applied to an element row that wants to emit an electron beam, and a voltage equal to or lower than the electron emission threshold is applied to an element row that does not emit an electron beam. The common wirings Dx2 to Dx9 between the element rows are, for example, Dx2
Dx3 may be the same wiring.

FIG. 10 is a schematic diagram showing an example of the structure of a panel in an image display device having a ladder-type electron source. 1200 is a grid electrode, 1201 is a hole for passing electrons, 1202 is Dox1, Dox2,.
... External terminals made of Doxm. 1203
Are G1, G2,... Connected to the grid electrode 1200.
.., External terminals made of Gn. In FIG. 10, the same portions as those shown in FIGS. 3 and 9 are denoted by the same reference numerals as those shown in these drawings. A major difference between the image display device shown here and the image display device having the simple matrix arrangement shown in FIG. 3 is whether or not a grid electrode 1200 is provided between the electron source substrate 1110 and the face plate 806.

The grid electrode 1200 modulates the electron beam emitted from the surface conduction electron-emitting device, and allows the electron beam to pass through a stripe-shaped electrode provided orthogonal to the ladder-shaped device row. Therefore, one circular opening 1201 is provided for each element. The shape and installation position of the grid are not limited to those shown in FIG. For example, a large number of passage openings may be provided in the form of a mesh as openings, and a grid may be provided around or near the surface conduction electron-emitting device.

The terminal outside the container 1202 and the terminal outside the grid container 1203 are electrically connected to a control circuit (not shown).

In the image display apparatus of this embodiment, a modulation signal for one line of an image is simultaneously applied to the grid electrode rows in synchronization with the sequential driving (scanning) of the element rows one by one. This makes it possible to control the irradiation of each electron beam to the phosphor and display an image one line at a time.

In the case of such an image display device having a ladder-shaped arrangement of electron sources, the conductive spacers are arranged in an area of the grid having no electron passage holes (openings), and the image display device of the above-described image display device is provided. It can be manufactured in the same way as manufacturing.

The image display device of the present invention is used not only as a display device for a television broadcast, a display device such as a video conference system or a computer, but also as an image display device as an optical printer using a photosensitive drum or the like. be able to.

FIGS. 1, 11, 12, and 13 show examples in which a flat surface conduction electron-emitting device is used as an electron-emitting device and an image display device using an electron source arranged in a simple matrix is manufactured.
This will be described with reference to FIGS.

FIG. 11 is a plan view of a part of the electron source. FIG. 12 is a sectional view taken along the line AA ′ in FIG.
And FIG. However, FIG. 11, FIG. 12, FIG.
In FIG. 14, the same reference numerals indicate the same members.

Here, 1 is a substrate, 72 is an X-direction wiring (also called a lower wiring), 73 is a Y-direction wiring (also called an upper wiring), 3
Is a thin film including an electron emitting portion, 2 and 3 are device electrodes, 151 is an interlayer insulating layer, and 152 is a contact hole for electrical connection between the device electrode 3 and the lower wiring 72.

Next, the manufacturing method will be specifically described in the order of steps with reference to FIGS. The following steps a to f correspond to (a) to (f) of FIGS. 13 and 14.

Step-a A 50 Å thick Cr film and a 6000 Å film thickness are formed on a substrate 1 having a 0.5 μm thick silicon oxide film formed on a cleaned blue plate glass by sputtering.
After sequentially stacking Angstrom Au, a host resist (AZ1370, manufactured by Hoechst) is spin-coated with a spinner, baked, and then exposed to a photomask image.
Developing to form a resist pattern of the lower wiring 72;
The u / Cr deposited film was wet-etched to form a lower wiring 72 having a desired shape.

Step-b Next, an interlayer insulating layer 151 made of a silicon oxide film having a thickness of 1.0 μm was deposited by RF sputtering.

Step-c The contact hole 1 is formed in the silicon oxide film deposited in the step b.
A photoresist pattern for forming 52 was formed, and using this as a mask, the interlayer insulating layer 151 was etched to form a contact hole 152. Etching is CF ₄
RIE (Reactive Ion Etching) method using H ₂ and H ₂ gas.

Step-d Thereafter, a pattern to be a gap L between the device electrodes 2 and 3 and the device electrode is formed by a photoresist (RD-2000N-41).
・ Hitachi Kasei Co., Ltd.) and have a thickness of 5
0 Å of Ti and 1000 Å of Ni were sequentially deposited. The photoresist pattern was dissolved with an organic solvent, and the Ni / Ti deposited film was lifted off to form device electrodes 2 and 3 having a device electrode interval L1 of 3 micrometers and a width W1 of 300 microns.

Step-e After a photoresist pattern for the upper wiring 73 is formed on the device electrodes 2 and 3, a 50 angstrom thick Ti,
5000 Å thick Au is sequentially deposited by vacuum evaporation, and unnecessary portions are removed by lift-off,
The upper wiring 73 having a desired shape was formed.

Step-f A resist was applied to portions other than the contact hole 152 to form a pattern, and 50 Å thick Ti and 5000 Å thick Au were sequentially deposited by vacuum evaporation. Unnecessary portions were removed by lift-off to bury the contact holes 152. Through the above steps, a rear plate (electron source substrate) 71 before forming a conductive thin film between the device electrodes 2 and 3 was manufactured.

Using the rear plate before the conductive film formed as described above, according to the method of manufacturing an image display device of the present invention, the step of fixing the spacer and the outer frame to the rear plate from the frit and the rear plate The formation of the conductive thin film between the upper element electrodes is performed as shown in FIGS. 1A to 1D showing a partial cross section of the image display device. Since the figure is the same as the embodiment, the description of the figure is omitted.

(1) Step of applying bonding agent solution on rear plate: (a) As a bonding agent solution, a frit glass paste, that is, powdered glass (LS3081 manufactured by Nippon Electric Glass Co., Ltd.) is applied to a vehicle (acrylic resin: Elba). Using a dispenser 114, a paste to which a site is melted in turbineol at 10%) is preliminarily rear-plated (electron source substrate).
101 (where wiring 1 is located)
06) and the position where the outer frame is arranged under the following conditions. The frit glass paste is loaded into a depenser equipped with a nozzle having an inner diameter of 0.2 mm, and the discharge pressure is 1 kg.
The measurement was performed under the conditions of f / cm ² , a gap (distance between the tip of the nozzle and the member to be coated) of 0.2 mm, and a nozzle feed speed of 15 mm / sec.

(2) Step of joining (sealing) the spacer and the outer frame to the rear plate: FIG. (B) The spacer and the outer frame are aligned and arranged on the above-mentioned frit glass paste application portion on the rear plate. After placing the presser plate and placing it in an electric furnace, it was put on a weight and baked at a maximum temperature of 410 ° C. for 10 minutes in the air to join (sealing) the spacer and the outer frame to the rear plate.

(3) Step of applying a solution containing a conductive thin film material between the device electrodes on the rear plate: FIG. 3 (c) A method of forming a conductive thin film (fine particle film) on the electron source substrate will be described below. . That is, a method for applying a solution containing a conductive thin film material in the form of droplets using the inkjet apparatus 115 having a droplet discharge head will be described.

FIG. 17 is a schematic structural view showing a discharge head unit of an ink jet type droplet applying apparatus used for forming a conductive thin film (fine particle film) of a surface conduction electron-emitting device on an electron source substrate.

Here, the configuration of the ejection head unit will be described with reference to FIG. Reference numeral 1707 denotes a detection optical system which captures image information on the electron source substrate.
The optical axis 1711 and the focal position of 707, and the landing position 1710 of the droplet 1709 by the inkjet head 1708
Are arranged so as to match. In this case, the positional relationship between the detection optical system 1707 and the inkjet head 1708 can be precisely adjusted by the head alignment fine movement mechanism 1712 and the head alignment control mechanism 1713. The detection optical system 1707 uses a CCD camera and a lens. An aqueous solution of a palladium acetate-ethanol-amine complex was used as a raw material solution for the droplets. The ink ejection head is of a bubble jet type.

After the droplets are sequentially applied to the gaps of the device electrodes four times by using this apparatus, the device electrode substrate is removed from the device electrode substrate.
By heating for 20 minutes in a baking furnace at 0 ° C. to remove moisture and organic components, palladium oxide (PdO)
A conductive thin film composed of fine particles was formed.

(4) Face plate joining (sealing) step: (d) in the same figure. Then, a frit is applied to the position of the spacer and outer frame on the face plate in the same manner as (a), and the above (b) is applied. (Sealing) with the spacer and the rear plate to which the outer frame is fixed, thereby manufacturing an envelope capable of maintaining the vacuum of the image display device.

As described above, after performing the bonding agent baking step, that is, fixing the spacer and the outer frame on the rear plate, and then performing the conductive thin film forming step, the frit glass formed on the rear plate is formed. It is possible to prevent the conductive thin film from being exposed to an atmosphere of a released gas accompanying decomposition and combustion of a binder or an organic solvent when baking a paste or an adhesive varnish. Therefore, a change in resistance of the conductive thin film due to the released gas accompanying the decomposition and combustion of the binder and the organic solvent could hardly be detected.

After the atmosphere in the envelope completed as described above reaches a sufficient vacuum, the outer terminals Dx1 to Dx1
A voltage was applied to the device through m and Dy1 to Dyn, and the conductive thin film was subjected to a forming treatment to produce an electron-emitting portion.

FIG. 15 shows the voltage waveform of the forming process. In this embodiment, T1 is set to 1 millisecond, and T2 is set to 1
Assuming 0 ms, the peak value of the triangular wave was gradually increased in steps of 0.1 V to perform forming. Forming was terminated when the measured value of the resistance measurement pulse was about 1 M ohm or more, and voltage application to the element was terminated at the same time.

Next, while measuring the device current If and the emission current Ie at a peak value of 14 V and a pulse width of 30 microseconds,
An activation step was performed. The activation treatment, for example, under an atmosphere containing a gas of an organic substance, similarly to the energization forming,
It can be performed by applying a voltage. By this treatment, carbon or a carbon compound is deposited on the device from the organic gas substance existing in the atmosphere, and the device current If and the emission current Ie
Increase. Note that the applied voltage is appropriately set.

The surface conduction electron-emitting device having the electron-emitting portion was manufactured by performing the forming step and the activating step as described above.

After performing a sufficient baking process,
The exhaust pipe was welded by heating with a gas burner, and the envelope was sealed.

Finally, in order to maintain the degree of vacuum after sealing,
Getter processing was performed. This is to heat a getter disposed at a predetermined position (not shown) in the envelope by heating using resistance heating or high-frequency heating immediately before or after sealing to form a deposited film. This is the processing to be performed. In the getter process, Ba or the like is usually the main component, and the degree of vacuum is maintained by the adsorption action of the deposited film.

A drive circuit for image display (not shown) is attached to the envelope completed as described above, and in the completed image display device of the present invention, each electron-emitting device has external terminals Dx1 to Dxm. By applying a voltage to the device through Dy1 to Dyn, electrons are emitted, and the high voltage terminal H
Through v, a high voltage was applied to the metal back, the electron beam was accelerated, collided with the fluorescent film, and excited and emitted to display an image. The images were uniformly excellent, stable and of good quality.

As described above, after the frit paste baking step is performed, that is, after the spacer and the outer frame are fixed on the rear plate, the conductive thin film forming step is performed, whereby the frit glass formed on the rear plate is formed. The conductive thin film does not need to be exposed to the atmosphere of the released gas accompanying the decomposition and burning of the binder and organic solvent when baking paste and adhesive varnish, and the conductivity due to the released gas accompanying the decomposition and burning of the binder and organic solvent can be eliminated. To provide a method of manufacturing an image display device capable of obtaining a sufficient electron emission current because a resistance change of a conductive thin film hardly occurs and a subsequent energization forming process and an activation process can be appropriately performed. Was completed.

[Embodiment 2] As a second embodiment, a case where an adhesive mainly composed of a resin is used as a bonding agent will be described.

Instead of the frit (low-melting glass) shown in Embodiment 1 as a bonding agent, an adhesive mainly composed of a resin can be used. The conditions of the adhesive applicable to the image display device of the present invention are as follows.

1. Sealability: High vacuum can be maintained (minimum vacuum leak, minimum gas permeation), but only where vacuum maintenance is required. 2. Heat resistance: Heat resistance in the baking in vacuum (high vacuum forming) process. Emission gas characteristics: Low emission gas (high vacuum maintained) characteristics

Adhesive candidates mainly composed of a resin satisfying the above conditions include polyamide imide, polybenzimidazole, polyimide, polyquinazolone, polyoxadiazole and the like.

As an adhesive containing a resin as a main component, an adhesive containing a polybenzimidazole (PBI) resin as a main component is most preferably used. When a varnish of polybenzimidazole (PBI) is used, by heating at 300 ° C. or more, the solvent is evaporated and the PBI is cross-linked to improve the strength and chemical resistance.
Condition can be satisfied. It is preferable that PBI has an extremely small gas permeability as compared with other adhesives.

An adhesive containing a polyimide resin as a main component is preferably used. When a polyimide varnish is used, it is heated at 300 ° C. or more, dried and thermally imidized, and then bonded by thermocompression bonding.
~ 3 conditions can be satisfied.

The above two types of resin adhesive varnish and the above-mentioned frit glass paste were dipped,
The joints are coated by a known coating method such as spraying, dispenser coating, screen printing, and positive electrode coating, and cured by heat treatment to bond.

In this example, a method of applying a varnish of polybenzoyl imidazole (PBI) by a dispenser was used.

According to the method of manufacturing an image display device of the present invention, a step of fixing the spacer and the outer frame to the rear plate from the frit using the rear plate before the formation of the conductive film manufactured in the same manner as in Example 1. The formation of the conductive thin film between the device electrodes on the rear plate is performed as shown in FIGS. 1A to 1D showing partial cross sections of the image display device. Since the figure is the same as the embodiment, the description of the figure is omitted.

(1) Step of applying bonding agent solution on rear plate: (a) Polybenzimidazole (PBI) is used as the bonding agent solution.
Nowis: Hoechst Industry Co., Ltd. Product name PB
Using the dispenser 114, IMR Solution (matrix resin solution: resin concentration 10 wt%, solvent dimethylacetamide) is used to dispose the spacers on the rear plate (electron source substrate) 101 in advance (on the wiring 106 in this figure) and It was formed under the following conditions at the position where the outer frame was arranged. The varnish was loaded into a depenser equipped with a nozzle having an inner diameter of 0.3 mm, a discharge pressure was 0.03 kgf / cm ² , a gap (distance between the nozzle tip and the member to be coated) was 0.1 mm, and a nozzle feed speed was 12 mm /
This was performed under the condition of sec.

(2) Step of bonding (sealing) the spacer and the outer frame to the rear plate: FIG. (B) The spacer and the outer frame are aligned and arranged on the frit glass paste application portion on the rear plate. After placing the presser plate and placing it in an electric furnace, it was put on a weight and baked at a maximum temperature of 300 ° C. for 60 minutes in the air to join (sealing) the spacer and the outer frame to the rear plate.

(3) Step of applying a solution containing a conductive thin film material between element electrodes on the rear plate: FIG. 9C. The ink was applied in the form of droplets using an ink jet device 115 having a liquid crystal layer, and was baked to form a conductive thin film made of palladium oxide (PdO) fine particles connecting between the device electrodes.

(4) Face plate joining (sealing) step: FIG. 9D Thereafter, a frit is applied to the position of the spacer and the outer frame on the face plate in the same manner as in FIG.
Bonding (sealing) with the replate to which the spacer and the outer frame are fixed is performed in the same manner as in (b), and an envelope capable of maintaining the vacuum of the image display device is manufactured.

As described above, after performing the bonding agent firing step, that is, after fixing the spacer and the outer frame on the rear plate, the conductive thin film forming step is performed, whereby the frit glass formed on the rear plate is formed. It is possible to prevent the conductive thin film from being exposed to an atmosphere of a released gas accompanying decomposition and combustion of a binder or an organic solvent when baking a paste or an adhesive varnish. Therefore, the resistance of the conductive thin film did not change due to the released gas accompanying the decomposition and combustion of the binder and the organic solvent.

Thereafter, the energization forming and the activation process were performed in the same manner as in the first embodiment to complete the image forming apparatus. When an image was displayed by applying a high voltage to this image display device, the image was uniformly excellent and stable.

As described above, after the frit paste baking step is performed, that is, after the spacer and the outer frame are fixed on the rear plate, the conductive thin film forming step is performed, whereby the adhesive material formed on the rear plate is formed. The conductive thin film can be kept from being exposed to the atmosphere of the release gas accompanying the decomposition and combustion of the organic solvent when firing the varnish, and the resistance of the conductive thin film changes due to the release gas due to the decomposition and combustion of the organic solvent. Since the energization forming process and the activation process can be appropriately performed later, a method of manufacturing an image display device capable of obtaining a sufficient electron emission current can be provided.

[0093]

As described above, according to the present invention, the rear plate is formed by performing the bonding agent firing step, that is, after fixing the spacer and the outer frame on the rear plate, and then performing the conductive thin film forming step. The conductive thin film could be kept from being exposed to the atmosphere of the released gas accompanying the decomposition and combustion of the binder and the organic solvent when firing the frit glass paste and the adhesive varnish formed thereon. Therefore, the resistance of the conductive thin film did not change due to the released gas accompanying the decomposition and combustion of the binder and the organic solvent.

Further, since the energization forming process and the activation process can be appropriately performed later, a method of manufacturing an image display device capable of obtaining a sufficient electron emission current can be provided.

Although the step of heating the conductive thin film at several hundred degrees Celsius was conventionally performed twice, in the present invention, the conductive thin film is formed after the sputter and the outer frame are joined in advance, so that the conductive thin film is formed. The film undergoes only one heating step. As a result, deterioration of the conductive thin film due to heating can be suppressed.

[Brief description of the drawings]

FIGS. 1A to 1D are cross-sectional views illustrating a process of manufacturing an image display device according to the present invention.

FIGS. 2A to 2D are cross-sectional views illustrating a manufacturing process of a conventional image display device.

FIG. 3 is a perspective view showing an example of the image display device of the present invention.

FIGS. 4A and 4B are schematic diagrams showing an example of a fluorescent film.

FIGS. 5A and 5B are a plan view and a cross-sectional view, respectively, of a flat surface conduction electron-emitting device of the present invention.

FIG. 6 is a sectional view of a surface conduction electron-emitting device showing another example of the present invention.

FIG. 7 is a schematic view showing an example of a matrix arrangement type electron source substrate of the present invention.

FIG. 8 is a block diagram illustrating an example of a driving circuit for performing display on the image forming apparatus in accordance with an NTSC television signal.

FIG. 9 is a schematic view illustrating an example of a ladder-positioned electron source substrate according to the present invention.

FIG. 10 is a schematic diagram illustrating an example of a display panel of the image forming apparatus of the present invention.

FIG. 11 is a schematic view of an electron source substrate used in the present invention.

FIG. 12 is a cross-sectional view of the electron source substrate of the present invention.

13 (a) to 13 (d) are cross-sectional views showing the first half of the manufacturing process of the electron source substrate of the present invention.

FIGS. 13E to 13F are cross-sectional views showing the latter half of the manufacturing process of the electron source substrate of the present invention.

FIG. 15 is a diagram showing a voltage waveform diagram of a forming process.

FIG. 16 is a perspective view illustrating a configuration of a conventional image display device.

FIG. 17 is a schematic configuration diagram of an ejection head unit used in the present invention.

[Explanation of symbols]

1,101,201,301,401,701,801
Rear plate (element substrate) 2, 3, 107, 207, 302, 302, 402, 4
03, 1702, 1703 Electrode 4 Thin film 72, 702 Lower (X-direction) wiring 73, 106, 206, 703 Upper (Y-direction) wiring 114, 214 Dispenser 115, 215 Ink-jet apparatus 102, 202 having a droplet discharge head 806 Face plate 103, 203, 802 Support frame 104, 105, 204, 205, 211, 212
Adhesives 109, 209, 804, 902 Fluorescent films 110, 210, 805 Metal backs 108, 208 Thin film including an electron emitting portion 151 Interlayer insulating layer 152 Contact hole 153 Cr film 304, 404 Conductive thin film 305, 405 Electron emitting portion 421 Step forming portion 704 Surface conduction type electron-emitting device 705 Connection 807 High voltage terminal 808 Envelope 901 Black member 1001 Display panel 1002 Scanning circuit 1003 Control circuit 1004 Shift register 1005 Line memory 1006 Synchronous signal separation circuit 1007 Modulation signal generator 1100 Electron source Substrate 1101 Electron-emitting devices 1102 Dx1 to Dx10 are common wiring for wiring the electron-emitting devices 1200 Grid electrode 1201 Opening for passing electrons 1202 Dox1, Dox2,. Doxm
G1 connected to the grid electrode 1200
G2 1702, 1703 Element electrode 1706 Discharge head unit 1707 Detection optical system 1708 Inkjet head 1709 Droplet 1710 Droplet landing position 1711 Optical axis 1712 Head alignment fine movement mechanism 1713 Head alignment control mechanism

Claims (5)

[Claims] 1. A face plate on which a phosphor and an electron accelerating electrode are formed, a pair of device electrodes, and a conductive thin film connecting the pair of device electrodes and having an electrode emission part in a part thereof. A rear plate (electron source substrate) on which a plurality of surface conduction electron-emitting devices are formed; an outer frame surrounding the periphery between the face plate and the rear plate; In a method for manufacturing an image display device comprising a spacer disposed between the rear plate and the rear plate, a firing step of a bonding agent for bonding the outer frame to the rear plate and bonding the spacer to the rear plate is performed. A method for manufacturing an image display device, wherein the conductive thin film forming step is performed later. 2. The method of manufacturing an image display device according to claim 1, wherein the step of firing the bonding agent for bonding the outer frame and the rear plate and the step of bonding the spacer and the rear plate includes firing the frit glass paste. The method for manufacturing an image display device according to claim 1, comprising: 3. The method for manufacturing an image display device according to claim 1, wherein the step of firing the bonding agent for bonding the outer frame and the rear plate and bonding the spacer and the rear plate includes firing a resin adhesive varnish. The method for manufacturing an image display device according to claim 1 including a step. 4. The method for manufacturing an image display device according to claim 1, wherein the step of forming the conductive thin film is a step of forming the conductive thin film using an ink jet device having a droplet discharge head.
4. The method for manufacturing an image display device according to any one of Items 3 to 3. 5. The method for manufacturing an image display device according to claim 1, wherein the electron source formed of the conductive thin film is a surface conduction electron-emitting device.
Item 13. The method for manufacturing an image display device according to item 9.