JPH11185673A - Image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To display an image of high quality by controlling scattering of an electron beam reflected by a fluorescent screen layer, and by reducing a voltage charge phenomenon. SOLUTION: This display is provided with a back plate 2 in which a cathode electrode 10 and a cathode chip 7 are formed on a board 9 and in which a gate electrode 13 is formed, and a face plate 3 in which an anode electrode 16 and a fluorescent screen layer 8 black matrix 17 are formed on a transparent board 15 to face to the back plate 2 via a vacuum space part 6. The black matrix 17 is formed as a riblike protrusion projected more than a luminescent surface of the fluorescent screen layer 8, using glass as a base material, corresponding to a non-light emitting region between the fluorescent screen layers 8. Substantially whole surfaces of the fluorescent screen layer and the black matrix 17 are covered with conductive thin film layers 18, 19.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an image display device, and more particularly to a field emission display (hereinafter abbreviated as FED) which is thin and has a large screen.

[0002]

2. Description of the Related Art In image display devices, various types of thin display devices, which are so-called flat panel displays (F), have been replaced by cathode ray tubes which are thin and have limitations in increasing the screen size and weight.
PD) is being studied. Examples of the FPD include a plasma display panel (PDP), an FED,
A plasma-addressed liquid crystal (PALC) panel or an organic electroluminescence (EL) display has been proposed.

[0003] A PDP generally comprises a large number of cells partitioned by a partition between a pair of glass substrates facing each other, and a phosphor is applied to the inside of these cells to form a phosphor film layer and xenon. And a discharge gas containing the same. A PDP generates a discharge phenomenon in a discharge gas by applying a voltage to an electrode provided in a cell in accordance with an image data signal, and the generated ultraviolet light irradiates a fluorescent film layer to excite / emit light to thereby generate an image. Display. PD
As described above, P emits light in each cell unit, so that color display is performed by separately applying red, green, and blue phosphors for each cell.

Further, PALC is proposed as a device for solving the problem of a thin film transistor (TFT) type LCD which is difficult to increase in size, and a device in which a switching unit of the LCD is constituted by a plasma switch instead of the TFT. It is. PALC is composed of a first glass substrate in which a cathode electrode and an anode electrode which are parallel to each other are formed in a long groove-shaped discharge space, and a stripe electrode which is orthogonal to the cathode electrode and the anode electrode and connected to a probe. The LCD is joined to the second glass substrate so as to form a discharge space between the second glass substrate and the first glass substrate, and a discharge gas is formed in the discharge space. Is filled. PALC
In the state where a driving signal for the LCD is applied to the striped electrode, a voltage corresponding to the image data signal is applied to the cathode electrode to generate plasma discharge in the discharge gas, and the probe between the striped electrode and the anode electrode is Is turned on to drive the LCD.

On the other hand, the FED generally has a first glass substrate (back) in which a cathode electrode and a number of cathode chips (electron-emitting devices) are formed, and a gate electrode is arranged corresponding to each cathode electrode. Plate) and a second glass substrate (face plate) in which a large number of anode electrodes corresponding to each gate electrode and a fluorescent film layer are formed and arranged opposite to the back plate via a vacuum space. Become. For the cathode chip, an FED in which a planar element is formed on a substrate has also been proposed.

In a FED, when a voltage corresponding to an image data signal is applied to each electrode, an electron beam emitted from a cathode chip is accelerated by a gate electrode to irradiate a fluorescent film layer on a face plate. In the FED, an image is displayed by excitation / emission of the fluorescent film layer. FED
Since the basic principle of irradiating an electron beam to excite / emit a fluorescent film layer in the same manner as in a cathode ray tube is the same, excellent color reproducibility is expected.

In the FED, a part of the electron beam applied to the fluorescent film layer is randomly reflected and scattered toward the back plate according to the constituent material of the fluorescent film layer. In the FED, an anode electrode is formed as a transparent electrode layer on a face plate, and a metal pack layer for grounding a voltage charged by projecting electrons on the fluorescent film layer is formed by evaporating aluminum. In the FED, when an aluminum metal pack layer is formed, nearly 20% of the amount of electrons incident on the fluorescent film layer is reflected by the metal pack layer and scattered toward the back plate. The reflected electrons are again attracted to the face plate side by the voltage between the anode electrode and the cathode electrode, and project the phosphor film layer.

In the FED, since the reflected electrons are reflected in a state of being scattered by the fluorescent film layer as described above, the return electron beam may be incident on the fluorescent film layer in another adjacent region. For this reason, the FED has a problem that the display quality is deteriorated due to a decrease in contrast and color purity.

In order to solve such a problem, US Pat. No. 5,477,105 discloses that a black matrix is formed on a main surface of a face plate corresponding to a non-light emitting region between phosphor layers, and the black matrix is formed. Are raised to the cathode side with respect to the light emitting surface of each fluorescent film layer. According to the FED of the U.S. Pat. .

Further, US Pat. No. 5,160,871 discloses a display device in which a three-dimensional non-light emitting region is formed on a plate surface by using lead glass (solder glass) having a characteristic of lower external light reflectance than a fluorescent film layer. Have been. The portion formed by the lead glass functions as an insulator for preventing the fluorescent film layer and the spacer from directly contacting each other.

[0011]

By the way, in the above-mentioned first US patent, as a material for forming a black matrix, metal, ceramic, semiconductor, carbon or the like can be cited. Is disclosed. However, all of these black matrix forming materials satisfy conditions such as adhesion to a face plate made of a glass material, mechanical strength, securing sufficient height dimensions, manufacturability or reliability as a vacuum material. is not.

The above-mentioned second US patent solves the above-mentioned problems of the first US patent because the use of lead glass makes it compatible with a face plate made of a glass material. At the same time, the contrast difference between the light emitting region and the non-light emitting region is provided, so that a clearer image display is performed. However, the black matrix formed by such lead glass is naturally configured as an insulating material because lead glass is a member that maintains the insulation between the fluorescent film layer and the spacer as described above. It is electrically insulated and forms an insulating portion on the faceplate.

In the FED, a voltage charge is generated in an insulating portion existing on a face plate by irradiation of an electron beam. This voltage charging causes a problem that display quality becomes unstable due to generation of noise due to minute discharge from the insulating portion or generation of luminance unevenness due to the influence on the trajectory of the electron beam. Therefore, in the FED, a black matrix that suppresses the diffusion of reflected electrons from the fluorescent film layer described in the first US patent is formed on the face plate by the lead glass described in the second US patent. In this case, since the black matrix is formed of an insulating material, a voltage charging phenomenon occurs, and the above-described disadvantage cannot be solved.

In the above-mentioned first US patent, since the black matrix is formed by a plurality of materials, for example, the material is constituted by a lead glass and an appropriate conductive material, so that, for example, a metal back is formed. Development of an FED that maintains electrical conduction with the FED is also considered. However, in such an FED, it is difficult to manage a plurality of materials in an appropriate state, so that reliability is low, and a problem such as how to treat a side portion of a black matrix to suppress a voltage charging phenomenon. It is not enough to eliminate the points.

Accordingly, the present invention provides an image display device which achieves high image quality and stabilization of a display image by suppressing scattering of an electron beam reflected on a fluorescent film layer and reducing a voltage charging phenomenon. It has been proposed for the purpose.

[0016]

In order to achieve the above object, an image display apparatus according to the present invention has a cathode electrode and an electron beam emission electrode formed on a substrate, and a gate electrode opposed to the cathode electrode. And a back plate formed. The image display device, on a transparent substrate, a transparent anode electrode formed corresponding to each gate electrode,
A face plate is formed in which a fluorescent film layer formed on the anode electrode and a black matrix positioned in a non-light emitting region between the fluorescent film layers are formed, and are arranged to face a back plate via a vacuum space. In the image display device, the black matrix of the face plate is formed as rib-shaped protrusions protruding from the light emitting surface of the fluorescent film layer using glass as a base material, and almost the entire surface of the black matrix and the fluorescent film layer is formed. Is covered with a conductive thin film layer.

According to the image display apparatus of the present invention having the above-described configuration, the voltage corresponding to the image data signal is applied to each electrode, so that the electron beam emitted from the cathode tip is accelerated by the gate voltage. And irradiates the fluorescent layer of the face plate to excite / excit the fluorescent layer.
The image is displayed by emitting light. In the image display device, the rib-like black matrix suppresses the reflection in the diffusion direction of the electrons reflected by the fluorescent film layer and reduces the incidence on the other fluorescent film layers, so that the contrast and the color purity are good. And a high-quality display is performed. Further, in the image display device, since the rib-like black matrix is formed of the glass base material, the mechanical bonding with the substrate is strong and the productivity is formed with high productivity. Further, in the image display device, since the conductive thin film covers almost the entire surface of the rib-like black matrix irradiated with the electron beam and the fluorescent film layer, the voltage charging phenomenon on the face plate is suppressed, and the minute discharge noise is reduced. And the displacement of the electron beam is reduced, thereby stabilizing the displayed image.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. As an embodiment, a color display FED (field
The emission display 1 includes a back plate (emitter array panel) 2 and a face plate (anode panel) 3 which are held at predetermined intervals by a frame 4 and frit seals 5a and 5b and a vacuum space 6 And are combined. F
The ED 1 has a number of cathode chips 7 called so-called Spindt-type emitters as electron-emitting devices. The FED 1 has a red color formed by applying three colors of phosphors in a stripe shape corresponding to each pixel to form the electron beam emitted from the cathode chip 7 on the main surface of the face plate 3 as will be described later in detail. An image is displayed by projecting onto the fluorescent film layer 8R, the blue fluorescent film layer 8B, and the green fluorescent film layer 8G (hereinafter, simply referred to as the fluorescent film layer 8) to excite / emit light.

The back plate 2 is composed of a large number of first layers formed on a main surface 9a of a substrate 9 made of glass, silicon, or the like by a predetermined pattern by etching or vacuum evaporation. A cathode electrode 10; and a resistance layer 11 formed as a second layer on the cathode electrode 10.
On the resistance layer 11, a large number of the above-described cathode chips 7 constituting an emitter electrode as a third layer are formed in a stacked state to constitute a cathode portion. The back plate 2 has a spacer 12 with respect to the cathode portion.
A thin plate-shaped gate electrode 13 is arranged to face through. The cathode electrode 10 and the resistance layer 11 are formed in a stripe shape on the main surface 9a of the substrate 9 corresponding to the stripe-like fluorescent film layer 8, respectively. Cathode electrode 10
And the gate electrode 13 are arranged in a matrix shape orthogonal to each other, and their intersections correspond to the respective pixels.

A large number of the cathode chips 7 are formed corresponding to the fluorescent film layer 8 described in detail later, that is, for example, several hundreds to several thousands are formed for one pixel. Each cathode chip 7 is configured as a cold cathode having a conical shape with a sharp tip, and is formed in a chip shape on the main surface of the substrate 9 via a cathode electrode 10 and a resistance layer 11. Each of the cathode tips 7 has a tip portion at the gate electrode 1.
3 corresponding to the electron emission holes 14 formed. The spacers 12 are formed of, for example, a ceramic material, and are disposed between the phosphor layers 8 of the respective colors so as to maintain the facing distance between the cathode electrode 10 and the gate electrode 13.

As for the back plate 2, the electron emitting element is constituted by the Spindt-type cathode chip 7 formed on the substrate 9 as described above, but may be constituted by other electron emitting elements. Of course. In the back plate 2, the cathode electrode 10 and the gate electrode 13 are held at predetermined intervals by the spacers 12. For example, a glass substrate is subjected to an etching process to form a large number of fine micro channels. You may hold | maintain by inserting a microchannel plate. In the microchannel plate, each microchannel constitutes an electron emission hole.

As shown in FIG. 2, the face plate 3 has an anode electrode 16 formed on a main surface 15a of the transparent glass substrate 15 facing the back plate 2, and a fluorescent electrode formed on the anode electrode 16. It comprises a film layer 8, a black matrix 17, and a metal pack layer 18 formed by covering the fluorescent film layer 8 and the black matrix 17. The fluorescent film layer 8 is formed on the main surface 1 of the glass substrate 15.
A red phosphor layer, a blue phosphor layer, and a green phosphor layer are applied to each of the pixels 5a in a stripe shape to form a red phosphor layer 8R, a blue phosphor layer 8B, and a green phosphor layer 8G, respectively. It becomes. The anode electrode 16 is formed on the main surface 15 a of the glass substrate 15 in parallel with the gate electrode 13, in other words, as a stripe-shaped transparent electrode orthogonal to the cathode electrode 10, for example, by photolithography. The intersection of the anode electrode 16 with the cathode electrode 10 constitutes each pixel.

The black matrix 17 is formed on a non-light-emitting region between the respective fluorescent film layers 8 through a process which will be described in detail later, using a glass paste which is made of lead glass as a base material and is colored black with a metal oxide such as cobalt oxide. Each is located and formed in a matrix. The black matrix 17 is formed in a matrix shape and located in a non-light emitting region between the respective fluorescent film layers 8 to prevent the occurrence of a color mixing phenomenon due to a shift of the electron beam. Further, since the black matrix 17 is made of lead glass as a base material, the external light reflectance with respect to the light emitting surface of the fluorescent film layer 8 is reduced, and the color ratio is increased by increasing the contrast ratio between the light emitting portion and the non-light emitting portion. The operation is improved.

The fluorescent film layer 8 has a black matrix 17
Is applied to the matrix space divided by
As described above, each pixel includes the red fluorescent film layer 8R, the blue fluorescent film layer 8B, and the green fluorescent film layer 8G. The red fluorescent film layer 8R is formed by using, for example, a rare earth fluorescent paint in which eurobium is mixed with yttrium oxide sulfide or yttrium oxide. The blue fluorescent film layer 8B is formed using, for example, a zinc sulfide fluorescent paint containing silver. Further, the green fluorescent film layer 8G is formed using, for example, a mixed crystal sulfide fluorescent paint containing copper and aluminum.

The metal pack layer 18 is composed of an aluminum thin film which covers the above-mentioned fluorescent film layer 8 and black matrix 17 by applying, for example, a vacuum deposition method to the glass substrate 15, and is connected to the anode electrode 16. The metal pack layer 18 holds the acceleration of the electron beam and suppresses the generation of minute noise due to the discharge of the charge voltage or the trajectory of the electron beam by suppressing the voltage charging phenomenon generated in the fluorescent film layer 8 by the irradiation of the electron beam. It has the effect of preventing displacement. Of course, the metal pack layer 18 is formed so as to cover the black matrix 17, but may not be formed on the surface from the original function.

The face plate 3 is formed on the main surface 15a of the glass substrate 15 as a rib-shaped convex portion having a predetermined height in which the thickness of the black matrix 17 is larger than the thickness of the fluorescent film layer 8. It is formed. In the face plate 3, as shown in FIG. 2, the fluorescent film layer 8 is formed to have a thickness t of about 10 μm, the pixel pitch is set to 0.3 mm, and the black matrix 17 is set to a pitch p of 0.1 mm. The width dimension w is formed to be 40 μm, the height dimension h is formed to be 50 μm, and the metal pack layer 18 is formed to have a thickness m of about 0.2 μm. Therefore,
The face plate 3 has a state in which the black matrix 17 projects on the main surface 15 a of the glass substrate 15 with respect to the fluorescent surface of the fluorescent film layer 8.

As described above, a metal pack layer 18 that covers the fluorescent film layer 8 and the black matrix 17 is formed on the face plate 3. Since the metal pack layer 18 is formed by the vacuum evaporation method, the metal pack layer 18 is hardly formed on the vertical outer peripheral side surface 17 a of the black matrix 17 protruding from the fluorescent film layer 8. As described above, the black matrix 17 is formed by a glass paste using lead glass as an insulating material as a base material. Therefore, in the face plate 3, an insulating portion that is not covered by the metal pack layer 18 occurs on a part of the irradiation surface of the electron beam due to the outer peripheral side surface 17 a of the black matrix 17.

In the face plate 3, when forming the black matrix 17, for example, a conductive material in which a mixed oxide of In and Sn (ITO) or tin oxide is slurried with an organic solvent is used in advance on the entire outer peripheral surface thereof. The conductive thin film 19 is formed by coating. The conductive thin film 19 is electrically connected to the anode electrode 16 by forming the metal pack layer 18 on the surface thereof as shown in FIG. Therefore,
The face plate 3 is configured by the metal pack layer 18 and the conductive thin film 19 such that the above-mentioned insulating portions do not exist on the electron beam irradiation surfaces of the fluorescent film layer 8 and the black matrix 17.

According to the FED 1 configured as described above, the voltage corresponding to the image data signal is applied between the cathode tip 7 of the emitter electrode and the gate electrode 13, so that the electron from the tip of the cathode tip 7. A beam is emitted. The electron beam is emitted from the electron emission hole 14 of the gate electrode 13 into the vacuum space 6 as shown by an arrow in FIG. The FED 1 is accelerated and formed on the face plate 3 because a negative potential voltage is applied to the cathode electrode 10 on the back plate 2 side and a positive potential voltage is applied to the anode electrode 16 on the face plate 3 side. The image is displayed by irradiating the fluorescent film layer 8 and exciting / emitting the fluorescent film layer 8.

In the FED 1, since the aluminum metal pack layer 18 is deposited on the surface of the fluorescent film layer 8 as described above, a part of the electron beam is randomly transmitted to the back plate 2 by the metal pack layer 18. Is reflected by The reflected electron beam reaches the fluorescent film layer 8 again due to the potential difference between the cathode electrode 10 and the anode electrode 16. In the FED 1, since the black matrix 17 that divides the fluorescent film layer 8 is configured as a rib-shaped convex as described above, diffusion of the reflected electron beam is suppressed.
Therefore, in the FED 1, the reflected electron beam is prevented from reaching another adjacent fluorescent film layer 8, so that the contrast and the color purity are not reduced and the high-definition image quality is maintained.

The FED 1 has a conductive thin film 19 formed on the outer peripheral surface of the black matrix 17 and has no insulating portion on the electron beam irradiation surface of the face plate 3. The function of suppressing the occurrence of occurrence is surely achieved. Therefore, in the FED 1, the voltage drop between the cathode electrode 10 and the anode electrode 16 is suppressed, and the emission brightness of the phosphor is maintained because the electron beam irradiates the phosphor layer 8 at a sufficient speed.

Further, the FED 1 is formed of a lead glass having a good compatibility with the glass substrate 15 and a similar coefficient of thermal expansion to form the rib-like black matrix 17, so that it is mechanically and strongly bonded. Therefore, the FED 1 can prevent the black matrix 17 from suffering from inconveniences such as peeling and cracking even under high temperature or vacuum conditions, thereby improving reliability.

The black matrix 17 is formed on the main surface 15a of the glass substrate 15 by a process similar to the process of forming the cells formed on the glass substrate in the plasma display panel (PDP). That is,
The step of forming the black matrix 17 includes a step of coating a glass thick film on the entire main surface 15a of the glass substrate 15 on which the transparent anode electrode 16 is formed in a stripe shape by a sputtering method and a lithographic method. And the process. As described above, a glass paste colored black with cobalt oxide using lead glass as a base material is used for the glass thick film, and is formed by, for example, a spin coating method or the like. The thick film forming technology is a technology for forming a uniform film having a thickness of several microns on a substrate.

The glass substrate 15 is coated with a dry film resist on the surface of a thick glass film, and is subjected to exposure / development processing in accordance with the pattern of the black matrix 17. After the glass substrate 15 is subjected to sandblasting and the unexposed portions are dry-etched, the black matrix 17 is removed by removing the dry film resist in the glass thick film portion corresponding to the black matrix 17 and performing a baking process. Form. In addition, the sand blasting process is performed on the black matrix 1 to be formed.
Although fine irregularities are formed on the end portion of the substrate 7 and the main surface 15a of the glass substrate 15, the use of a sand having smaller particles makes it possible to perform processing without affecting the subsequent steps.

In the above-described step of forming the black matrix 17, the height dimension is about 50 μm, which is about 程度 of that of the PDP cell, and a glass thick film is formed on the glass substrate 15 by a relatively simple method. Since the black matrix 17 can be formed with high precision, the black matrix 17 can be formed with high productivity. The conductive thin film layer 19 is formed on the glass substrate 15 by performing a coating process of ITO or tin oxide on the entire peripheral surface of the formed black matrix 17.

The glass substrate 15 is coated with a predetermined fluorescent paint in a region partitioned by the black matrix 17 by, for example, a screen printing method, and is subjected to a baking treatment to form the fluorescent film layer 8. Aluminum is vapor-deposited on the surfaces of the fluorescent film layer 8 and the black matrix 17 on the glass substrate 15 by a vacuum vapor deposition method to form a metal pack layer 18.
Is produced.

The above-described black matrix 17
In the forming step, a thick glass film may be formed using lead glass having photosensitivity. The glass thick film is directly exposed / developed through a mask corresponding to the black matrix 17.

The present invention is not limited to the structure of the FED 1 described above. For example, the FED 1 shown in FIG.
Expanded to ED. In the following description, since each back plate is the same as the back plate 2 provided in the above-described FED 1, the description thereof will be omitted, and only the configuration of the face plate will be described. About F
The same components as those of the face plate 3 provided in the ED 1 are denoted by the same reference numerals, and description thereof is omitted.

As another embodiment of the present invention, a face plate 20 shown in FIG.
Has a feature in the method of forming. That is, the transparent anode electrode 16 is formed on the main surface 15a of the glass substrate 15, and as shown in FIG. 3A, the black matrix 23 is formed on the anode electrode 16 by a metal oxide or carbon. Thin light-shielding film layer 2 corresponding to the pattern
1 is formed. The light-shielding film layer 21 is formed to have a thickness of 1 μm or less and 2 μm or less. It is configured as a region having a low reflectance.

A lead glass layer 22 having a predetermined thickness is formed on the glass substrate 15 so as to cover the anode electrode 16 and the light shielding film layer 21 as shown in FIG. The lead glass layer 22 is made of photosensitive lead glass.
Is formed with a uniform thickness over the entire surface of the substrate. The glass substrate 15 has a light-shielding film layer 21 as shown by an arrow in FIG.
The exposure process of the lead glass layer 22 is performed from the main surface 15b opposite to the main surface 15a on which is formed. Note that the lead glass only needs to have photosensitivity, and it is not particularly necessary to use black glass.

As shown in FIG. 3 (C), the glass substrate 15 is subjected to an optical treatment because the light shielding film layer 21 has a masking effect and other portions except for the corresponding portions of the black matrix 23 are exposed. This exposed portion is removed. A black matrix 23 made of lead glass is formed on the light shielding film layer 21 by performing a baking process on the glass substrate 15.

As shown in FIG. 3D, a conductive thin film layer 19 is formed on the glass substrate 15 by coating the entire periphery of the formed black matrix 23 with ITO or tin oxide. You. The glass substrate 15 is further coated with a predetermined fluorescent paint in an area divided by the black matrix 23 by, for example, a screen printing method, and is baked to form the fluorescent film layer 8. The face plate 20 is manufactured on the glass substrate 15 by depositing aluminum on the surfaces of the fluorescent film layer 8 and the black matrix 23 by vacuum evaporation to form the metal pack layer 18. Face plate 20 configured as above
In this method, since the black matrix 23 is formed as a rib-shaped convex portion, the diffusion of the reflected electron beam reflected on the metal pack layer 18 is suppressed, and the influence of the reflected electron beam on the other adjacent fluorescent film layer 8 is reduced. It suppresses the decrease in contrast and color purity so that high-precision image display is performed. In addition, the face plate 20 has a metal pack layer 18 and a conductive thin film layer 19 which cover almost the entire surface irradiated with the electron beam.
The voltage drop is suppressed, and the electron beam irradiates the fluorescent film layer 8 with a sufficient speed so that a bright image is displayed.

Further, since the face plate 20 is formed of a rib-like black matrix 23 using lead glass having good compatibility with the glass substrate 15 and having the same coefficient of thermal expansion, the face plate 20 has high reliability even under high temperature or vacuum conditions. Improvement is achieved. Further, in the face plate 20, when the black matrix 23 is formed by optical processing, the black matrix 2
Since the light-shielding film layer 21 for reducing the external light reflectance at the formation portion 3 also functions as a mask member, the efficiency of the manufacturing process is improved.

FIG. 4 shows still another embodiment of the present invention.
Is similar to each of the face plates 3 and 20 described above in that the rib-shaped black matrix 26 is formed of lead glass having a low external light reflectance with respect to the light emitting surface of the fluorescent layer 8. , Has a characteristic in its shape. That is, as shown in FIG. 4, the black matrix 26 is formed to have a substantially trapezoidal cross-sectional shape in which the width of the bottom side is larger than that of the upper side. Therefore, the black matrix 26 is formed on the side surface 26 that divides the fluorescent film layer 8 formed on the glass substrate 15.
a is configured as an inclined surface.

The above-described manufacturing process of the face plate 25 is performed in the same manner as the glass substrate 15 on which the transparent anode electrode 16 is formed.
A glass thick film forming step of coating a glass thick film having a predetermined thickness with black lead glass on the main surface 15a of the substrate. In the manufacturing process of the face plate 25, the rib-like black matrix 26 is formed by performing an optical process, an etching process, and the like on the glass thick film in the same manner as the above-described process. Black matrix 26
Is formed to have a trapezoidal cross section as described above by an appropriate method such as, for example, removing a glass thick film at a portion corresponding to the fluorescent film layer 8 by an ion sputtering method in which a sutter angle is oblique.

In the manufacturing process of the face plate 25, a fluorescent substance is applied to the glass substrate 15 on which the black matrix 26 is formed by applying a fluorescent substance in an area divided by each black matrix 26 in the fluorescent film layer forming step. The fluorescent film layer 8 is formed. In the manufacturing process, a metal pack layer 27 is formed on the surfaces of the fluorescent film layer 8 and the black matrix 26 by a metal pack layer forming step of performing vacuum evaporation of aluminum on the glass substrate 15.

In the vacuum deposition method, it is generally difficult to form an aluminum film layer having a stable thickness on a vertical plane perpendicular to the deposition surface. In the face plate 25, as described above, the black matrix 26 has a trapezoidal cross section and the outer peripheral side surface is formed as an inclined surface, so that aluminum is also formed on the outer peripheral side surface in a stable state by so-called oblique deposition. Therefore,
In the face plate 25, a metal pack layer 27 is formed continuously on the entire surface of the black matrix 26 together with the surface of the fluorescent film layer 8.

The face plate 25 configured as described above is provided with a metal pack layer 2 on a black matrix 26.
The step of previously forming a conductive thin film layer for maintaining the conductivity with the layer 7 is not required, and the manufacturing can be performed by a simpler step. The face plate 25 suppresses the diffusion of the reflected electron beam reflected by the metal pack layer 27 because the black matrix 26 is configured as a rib-shaped convex portion, and transfers the reflected electron beam to another adjacent fluorescent film layer 8 by the reflected electron beam. , And a high-precision image display is performed while suppressing a decrease in contrast and color purity. In the face plate 25, since the metal pack layer 27 is formed continuously on the entire surface of the fluorescent film layer 8 and the black matrix 26, the voltage drop between the cathode electrode 10 and the anode electrode 16 due to the voltage charging phenomenon is reduced. Is suppressed. Therefore, face plate 2
The step 5 irradiates the fluorescent film layer 8 with an electron beam at a sufficient speed so that a bright image is displayed.

[0049]

As described above in detail, according to the image display apparatus of the present invention, the black matrix of the face plate is formed of glass as a base material, and the rib-shaped protrusion protruding from the light emitting surface of the fluorescent film layer. And a substantially entire surface of the black matrix and the fluorescent film layer is covered with a conductive thin film layer. Therefore,
The image display device suppresses the diffusion of the reflected electron beam reflected by the conductive thin film layer, suppresses the influence of the reflected electron beam on other adjacent fluorescent film layers, and suppresses a decrease in contrast and color purity. Accurate image display is performed. In addition, the image display device irradiates the fluorescent film layer without causing a speed loss by suppressing the voltage charging phenomenon due to the electron beam irradiation on the fluorescent film layer and the black matrix. A bright image display without luminance unevenness due to the orbital deviation is performed. Furthermore, in the image display device, since the black matrix is formed with sufficient mechanical strength with respect to the substrate and has the same thermal expansion, cracks and peeling are suppressed even under high temperature / vacuum environment conditions. Thus, reliability is improved. Furthermore, in the image display device, the black matrix is formed with high accuracy by an extremely simple process, and the productivity is improved.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view of a main part for explaining a schematic configuration of an FED shown as an embodiment of the present invention.

FIG. 2 is a schematic diagram of a main part of a face plate provided in the FED.

FIG. 3 is a schematic view of a main part for explaining a manufacturing process of another face plate.

FIG. 4 is a schematic diagram of a main part of still another face plate.

[Description of Signs] 1 FED (field emission display, image display device), 2 back plate, 3 face plate, 6 vacuum space, 7 cathode chip, 8
Fluorescent film layer, 9 glass substrate, 10 cathode electrode, 13
Gate electrode, 14 electron emission holes, 15 glass substrate,
16 anode electrode, 17 black matrix, 1
8 Metal pack layer (conductive thin film layer), 19 conductive thin film layer, 20 face plate, 21 light shielding film layer (thin film pattern), 22 lead glass layer, 23 black matrix, 25 face plate, 26 black matrix, 27 metal pack layer

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI H01J 29/28 H01J 29/28 29/32 29/32

Claims (5)

[Claims] A back plate having a cathode electrode and an electron beam emission electrode formed on a substrate and a gate electrode formed opposite to the cathode electrode; and a gate electrode formed on a transparent substrate. A transparent anode electrode formed corresponding to the electrode, a fluorescent film layer formed on the anode electrode, and a black matrix located in a non-light emitting region between the fluorescent film layers are formed, and are formed through a vacuum space. And a face plate disposed opposite to the back plate, wherein the face plate is formed as a rib-shaped convex portion in which the black matrix is made of glass as a base material and protrudes from the light emitting surface of the fluorescent film layer. And an image display characterized in that substantially the entire surface of the black matrix and the fluorescent film layer is covered with a conductive thin film layer. Location. 2. The image according to claim 1, wherein a base conductive thin film layer electrically connected to the conductive thin film layer is formed on a surface of the black matrix including an outer peripheral side surface thereof. Display device. 3. The image display device according to claim 1, wherein the black matrix is made of lead glass having a lower external light reflectance than the fluorescent film layer, as glass constituting a base material. 4. The image according to claim 1, wherein the black matrix is formed on a thin film pattern having a lower external light reflectance than the fluorescent film layer formed on the main surface of the face plate. Display device. 5. The black matrix has a substantially trapezoidal cross section in which the width of the bottom side is larger than the upper side, and the side surface is configured as an inclined surface, and the inclined surface is coated with the conductive thin film layer. The image display device according to claim 1, wherein the image display device is formed.