JPH11170193A - Hole machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the hole machining ability of via hole in the multilayer substrate and to improve a joining quality between the layers of a multi-layer substrate by reducing the defective machining of a hole. SOLUTION: This hole machining device is composed of a first stage having a punching pin 7 and a receiving die 8; a second stage having a hole machining and inspecting system 12; and a third stage having a defective hole machining and correcting pin 16 and a receiving die 17. In each stage, a substrate 4 is loaded on a common movable carriage 9. Therefore, a hole machining and the inspection and correction of hole machining can be simultaneously carried out in every hole located on the relatively same coordinates.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer substrate used for AV, information-related equipment and the like.

[0002]

2. Description of the Related Art In a multi-layer substrate, in particular, an IVH as shown in FIG.
(Inner-via-hole, hereafter referred to as via hole).

FIG. 2 is a sectional view showing the structure of a multilayer substrate. In FIG. 2, 1a, 1b, 1c and 1d are substrates,
Is a via hole, and 3 is an inner wiring line. The via hole 2 is a hole formed in each of the substrates 1a to 1d, and a conductive material (shown in solid color in FIG. 2) is provided inside the via hole 2.
Is filled. A substrate 1a via a via hole 2;
The inner wiring lines 3 of 1b, 1c and 1d are connected.

If the via holes 2 are defective in hole processing, for example, if the chips are clogged during the hole processing, the filling of the conductive material becomes insufficient, resulting in poor conduction between the substrates.

[0005] Hole forming methods for forming via holes include laser processing, drilling, punching, and etching, and the most appropriate processing method is selected and used according to the workability of the substrate material. For example, in the case of a ceramic multi-layer substrate or the like, an NC punching device is operated based on processing coordinate data input in advance at a desired location (coordinate) for each green sheet of each layer, and holes for via holes are continuously formed for each hole. I do. Disconnection failure due to processing failure or the like during hole processing (hereinafter, referred to as punching) on the green sheet is caused by forming a desired inner layer wiring line for each green sheet and then laminating the green sheets into a finished product. And electrical inspection after the formation of the uppermost conductor.

[0006]

Since the hole formability by punching differs depending on the composition of the green sheet, the powder lot of the material, and the like, the punching under the same conditions tends to cause a variation in the workability. Although setting is performed, it is difficult to eliminate processing defects.

[0007] In addition, with the demand for higher density, the number of layers and the number of via holes per unit area tend to increase further, and the workability and quality of punched holes (via holes) are increasing. Improvement is needed in the future.

The present invention has been made to solve the above-mentioned drawbacks and to provide a drastically improved drilling apparatus.

[0009]

In order to achieve this object, the present invention is to perform hole processing inspection and hole processing repair at different stages simultaneously with hole processing in a hole processing apparatus (punching apparatus). is there.

According to the present invention, the punching workability of the green sheet can be surely known for each hole (via hole) by using the above-described process, and the information on the hole having insufficient workability can be obtained from the information. Is rework,
Those that cannot be reprocessed can be handled as defective sheets at that time.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a first stage for mounting a sheet-shaped or plate-shaped substrate and a hole penetrating the substrate mounted on the first stage are formed. A hole processing means, a second stage for mounting the substrate processed by the hole processing means, a hole processing inspection means for inspecting holes of the substrate mounted on the second stage, a first stage and a second stage, Alternatively, the hole drilling apparatus and the hole drilling inspection means have position control means for performing position control so as to move relatively the same plane coordinates, and the hole drilling inspection is performed on all holes. And the position control of the hole drilling inspection apparatus can be the same as, or shared with, the position control means of the hole drilling means. In addition, since the drilling process and the inspection process can be performed simultaneously,
Line speed does not decrease.

The second aspect of the present invention is the first aspect of the present invention.
And a hole receiving and repairing means for restoring a hole formed in the substrate placed on the third receiving stand, and a third receiving means for restoring a hole formed in the substrate placed on the third receiving stand. Position control means for controlling the position of the base or the hole processing restoration means so as to move on the same plane coordinates as the first receiving stand, the second receiving base, the hole processing means, or the hole processing inspection means. Since the position control between the third stage and the hole processing repairing means is accurate, accurate hole processing can be repaired. Further, it is possible to stably improve the opening property of the via hole before lamination and the connectivity between the layers after lamination in the multilayer substrate. Also, the yield of via holes in the green sheet can be improved by reworking.

The third aspect of the present invention is the second aspect of the present invention.
The hole drilling device according to any one of claims 1 to 3, further comprising: a storage unit configured to store an inspection result from the hole drilling inspection unit; Then, the hole processing can be repaired only in the defective hole processing portion.

According to a fourth aspect of the present invention, there is provided the drilling apparatus according to the first, second, or third aspect, wherein the repairable hole and the unrepairable hole are distinguished. It is characterized by having a hole processing inspection means having a discriminating function, and a separation means for separating a substrate after inspection based on information from the hole processing inspection means. The efficiency of the process can be increased.

According to a fifth aspect of the present invention, there is provided the hole processing apparatus according to the first, second, third or fourth aspect, wherein the sheet-like substrate is fixed by a frame. Since the sheet is fixed to the frame, the positional accuracy of the substrate can be increased even in the case of a soft sheet-like substrate, and the transfer of the substrate between the stages can be facilitated.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, taking punching of a ceramic multilayer substrate as an example.

(Embodiment 1) FIG. 1 is a view schematically showing a main part of a hole drilling apparatus according to an embodiment of the present invention.

FIGS. 1 (a), 1 (b) and 1 (c) show the respective stages of drilling, in which 4 is a green sheet, and 5 is a metal sheet to which the green sheet 4 is attached and fixed. , 6 is the first stage frame support, 7
Is a punching pin for drilling holes, 8 is a receiving die for the punching pin 7, 9 is a movable table on which the frame receiving table 6 is mounted, 1
Reference numeral 0 denotes a control system for controlling the moving coordinates of the moving table 9 and the vertical movement of the punching pins 7, and 11 denotes a frame receiving table of the second stage mounted on the same moving table 9 as the first stage. , 12 is an inspection system, 13 is a light receiving unit, 1
4 is a light-emitting unit, 15 is a third stage frame receiver mounted on the same mobile stage 9 as the first stage mobile stage 9,
Reference numeral 16 denotes a punching pin for repairing a defective hole, 17 denotes a receiving die for the punching pin 16, and 18 denotes a defective hole.

As a substrate material of the green sheet 4, a slurry obtained by mixing an organic binder, a plasticizer, and an organic solvent with a ceramic material containing borosilicate glass powder and alumina powder as inorganic components was used. The slurry was formed into a sheet on an organic film by a doctor blade method, and a drying step was continuously performed from the film formation to form a green sheet 4.

The green sheet 4 is cut into a fixed shape,
Affixed to the frame 5 and set on the frame support 6 on the first stage of the hole drilling device. The frame receiving base 6 is attached to the moving base 9, and the positions of the punching pins 7 and the frame receiving base 6 are accurately positioned.

The movement of the moving table 9 and the punching operation of the punching pin 7 are controlled by a control system 10. When the control system 10 operates, the movable table 9 moves in a horizontal plane according to the processing coordinate data input in advance. At the same time, the punching operation of the punching pin 7 starts. The punching pin 7 (Φ0.15 diameter) is formed in the pin receiving die 8 by making a hole. The punched pieces are collected under the pin receiving die 8.

Then, the frame 5 that has been subjected to the punching processing in the first stage is automatically moved to the receiving table 11 in the next second stage. The second stage is provided with a hole processing inspection machine including a light emitting unit 14 and a light receiving unit 13.

The second stage frame receiver 11 and the first stage
The stage frame receivers 6 are relatively located at the same coordinates. The mounting position of the light emitting unit 14 and the light receiving unit 13 is determined by the punching pin 7 and the pin receiving die 8 of the first stage.
And a position corresponding to Therefore, when a new green sheet is set on the first stage and punching of the first hole is started, the frame 5 set on the frame receiving base 11 of the second stage is also positioned at the inspection position of the first processing hole. It is in.

The light emitted from the light emitting section 14 passes through the processing hole and reaches the light receiving section 13 where the information on the processing hole is transmitted to the inspection system 12.
Tell For example, information of a non-defective product (having no defective holes such as clogging) is input to the inspection system 12 in advance, and the data received from the light receiving unit 13 and the non-defective product data are judged for each hole for quality (inspection). I do. The pass / fail judgment data for each hole inspected in the second stage is automatically stored in a storage device (not shown) of the inspection system 12.

Then, the frame 5 which has been inspected in the second stage is automatically moved to the receiving table 15 in the next third stage. Also in the third stage, the frame 5, the punching pins 16 for repairing defective holes, and the pin receiving dies 17 are relatively at the same position as the frame, the punching pins 7, and the pin receiving dies 8 of the first stage. Therefore, when punching of a new green sheet is started in the first stage and the first hole is punched, in the third stage, the first hole is at the repair processing position. Based on the inspection data stored and stored in the inspection system, the defective hole is re-processed using the punching pins 16 and reproduced.

As described above, the drilling apparatus according to the present embodiment uses the coordinate control unit of the punching control device for both the drilling inspection stage and the drilling repairing stage. Positioning at each stage is possible. Also, the operation signal of the punching pin can be used as a synchronization signal for the hole drilling inspection and hole drilling repairing step in each step.

In this embodiment, the first stage, the second stage, and the third stage are provided on the same moving table with the frame receiving bases of the respective stages. At the same time,
It is not necessary to do it at the same time. If each stage operates independently, each process can select an optimum processing speed.

Further, the hole processing inspection apparatus according to the present embodiment
Although it was assumed that two types of good processed holes and defective processed holes can be determined, if three types of good processed holes, repairable defective processed holes, and unrepairable defective processed holes can be determined, repair can be performed. Impossible working holes can be excluded during the process. In this way, it is not necessary to treat a defective product in the process after the hole processing, and the process efficiency and the reliability and stability of the finished product can be improved. The determination of the repairable defective hole and the non-repairable defective hole is performed, for example, so that the light receiving unit of the inspection device can detect the diameter of the processed hole, the roundness, the sharpness of the edge of the processed hole, the presence of burrs, and the like. What should I do?

In this embodiment, the coordinates of the substrate on which the hole is to be formed are moved. However, the same effect can be obtained by moving a processing machine such as a punching pin.

In this embodiment, an example of a hole processing apparatus for a ceramic multilayer substrate has been described. However, even in the case of other hole processing, the present invention can be applied to a substrate which requires a large number of fine through holes positioned. You can do it.

[0031]

As described above, the present invention relates to a hole punching apparatus for automatically detecting and repairing defective holes caused by punching scum or the like generated when a sheet or a plate used for a multilayer substrate is drilled. The inspection of the machined hole and the repair of the defective machined hole are performed accurately using the coordinate control device of the apparatus. As a result, hole processing defects can be reduced, and interlayer disconnection defects after lamination can be eliminated.

[Brief description of the drawings]

FIG. 1 is a schematic view of a main part of a hole drilling apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view of a cross section of a multilayer substrate.

[Explanation of symbols]

 Reference Signs List 4 Green sheet 5 Frame 6 Frame receiving stand 7 Punching pin 8 Pin receiving die 9 Moving stand 12 Inspection system 13 Light receiving unit 14 Light emitting unit 16 Punching pin for correcting defective hole processing 17 Pin receiving die

Claims (5)

[Claims] 1. A first receiving table on which a sheet-shaped or plate-shaped substrate is mounted, a hole processing means for making a hole penetrating through the substrate mounted on the first receiving table, and a hole processed by the hole processing means. A second receiving pedestal on which the mounted substrate is mounted, hole processing inspection means for inspecting a hole in the substrate mounted on the second receiving pedestal,
A hole drilling apparatus, comprising: a cradle or a hole control means for controlling the position of the hole drilling means and the hole drilling inspection means so as to move on the same plane coordinates. 2. A third pedestal for mounting a substrate which has been subjected to hole processing inspection, a hole processing and repairing means for recovering a hole formed in the substrate mounted on the third pedestal, and a third pedestal, or Position control means for controlling the position of the drilling repairing means so as to move the same plane coordinates relative to the first cradle, the second cradle, the drilling means, or the drilling inspection means. The hole drilling device according to claim 1. 3. The apparatus according to claim 2, further comprising storage means for storing inspection results from the hole processing inspection means, and hole processing repair control means for controlling the hole processing repair means based on information in the storage means. The hole machining apparatus according to claim 1. 4. A hole machining inspection means having a discriminating function for discriminating between a good machining hole, a repairable bad machining hole, and an unrepairable bad machining hole, and a substrate after the inspection is inspected based on information from the hole machining inspection means. 4. The hole drilling device according to claim 1, further comprising a separating means for separating. 5. The hole processing apparatus according to claim 1, wherein the sheet-like substrate is fixed by a frame.