JPH11140278A - Resin composition for semiconductor sealing and resin-sealed type semiconductor device sealed with the composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition having improved hardening properties and preservation stability without decreasing mechanical characteristics or the like by including a specific thermoset resin composition, a specified additive, an inorganic filler and a specific coupling agent. SOLUTION: The objective composition comprises (A) 100 pts.wt. thermoset resin composition comprising 2-87 wt.% thermoset resin having a dihydrobenzoxazine ring, 3-67 wt.% epoxy resin and 10-31 wt.% phenol resin, (B) 0.01-30 pts.wt. one or more kinds of additives selected from a hardening promoter, a mold-release agent, a coloring agent and a flame retardant, (C) 200-1,200 pts.wt. inorganic filler, (D) 0.1-8 pts.wt. coupling agent selected from a dialkoxysilane coupling agent, a monoalkoxysilane coupling agent and a silicone oligomer synthesized from an alkoxysilane and (E) optionally 1-50 pts.wt. elastomer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for semiconductor encapsulation and a resin encapsulation type semiconductor device. The present invention relates to a resin composition for semiconductor encapsulation of a dihydrobenzoxazine-based resin, which generally surpasses in storage stability, and a resin-encapsulated semiconductor device.

[0002]

2. Description of the Related Art Conventionally, epoxy resins have been widely used in resin-encapsulated semiconductor devices because of their well-balanced mechanical properties, heat resistance, and moldability with high productivity. But,
As semiconductor devices have become thinner and denser and surface mounting methods have become more widespread, the characteristics required of semiconductor devices have become more stringent, and accordingly, epoxy resins have also required better characteristics and more functions. . Modification methods of epoxy resins that have been taken to meet such demands include, specifically, modification with a flexibilizing agent, reduction in elastic modulus by alloying, increase in functional group density, and the like. However, reforming by these techniques is approaching its limit. Further, in recent years, from the viewpoint of environmental protection, reduction of the addition amount of antimony and halide, which has been indispensable for maintaining flame retardancy, has been promoted. From this point, a new resin composition has been developed. It has been demanded. Several attempts have been made to achieve the above requirements. For example, JP-A-2
In JP-A-3345, a composition using a polyimide resin is exemplified as a resin composition for semiconductor encapsulation. However, polyimide resins have the disadvantages that they are insufficient in flexibility and adhesiveness, are extremely expensive, and have poor moldability. Accordingly, dihydrobenzoxazine compounds are mentioned as novel resin systems (JP-A-49-47387, US Pat. No. 5,152,939). Since the curing reaction of this compound utilizes a ring-opening polymerization reaction of a dihydrobenzoxazine ring similar to an epoxy resin,
There is a feature that hardly causes generation of volatile components. On the other hand, a cured product of a dihydrobenzoxazine compound utilizing a ring-opening polymerization reaction has better heat resistance and higher strength and flexibility than conventionally known thermosetting resins. However, the resin composition described in Japanese Patent Application Laid-Open No. 49-47387 has a disadvantage that it takes a long time to cure, and a sufficient resin composition for use as a sealing material is not shown. Further, the resin composition for semiconductor encapsulation described in JP-A-6-322121 has a drawback that the crosslinked density of the cured product is low, the hardness of the molded product immediately after molding is low, and it is difficult to remove the mold.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has been made without deteriorating various properties such as a mechanical property and a low water absorption characteristic of a thermosetting resin having a dihydrobenzoxazine ring. It is an object of the present invention to provide a resin composition for semiconductor encapsulation and a resin-encapsulated semiconductor device that have improved curability and are excellent in storage stability, which is a problem of general epoxy resin encapsulants.

[0004]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, a thermosetting resin having a dihydrobenzoxazine ring, an epoxy resin and a phenol resin are blended and specified. A thermosetting resin having a dihydrobenzoxazine ring and a phenolic resin or a thermosetting resin having a dihydrobenzoxazine ring and an epoxy resin by compounding an inorganic filler in an amount and, if necessary, a halogenated epoxy resin. It has been found that the curability which could not be achieved with the composition (i.e., the curing speed) and the hardness of the molded product immediately after molding are dramatically improved. That is, with a thermosetting resin having a dihydrobenzoxazine ring, a sufficient composition and a curing rate cannot be obtained with a composition containing only a phenolic resin or a composition containing only an epoxy resin, and the three components are mixed in a well-balanced manner. As a result, the epoxy resin and the phenol resin act as a crosslinking agent for the thermosetting resin having a dihydrobenzoxazine ring, or the thermosetting resin having a dihydrobenzoxazine ring and the phenol resin act as a crosslinking agent for the epoxy resin, resulting in sufficient curability. Was obtained, and the flame retardancy was good without deteriorating various properties such as mechanical properties and low water absorption. Further, by using a dialkoxysilane coupling agent or a monoalkoxysilane coupling agent as a coupling agent for improving the adhesion between the resin and the inorganic filler and the adhesion between the substrate and the other materials, the conventional semiconductor encapsulation is achieved. Storage stability that could not be attained with the resin composition for use could be drastically improved. It has been found that the resin composition using a thermosetting resin having a dihydrobenzoxazine ring has excellent storage stability, but is deteriorated by the silane coupling agent used when compounding the inorganic filler. However, they found that storage stability was good when a dialkoxysilane coupling agent or a monoalkoxysilane coupling agent was used as the silane coupling agent, and based on this finding, completed the present invention.

That is, the present invention relates to 100 parts by weight of a thermosetting resin composition comprising 2-87% by weight of a thermosetting resin having a dihydrobenzoxazine ring, 3-67% by weight of an epoxy resin and 10-31% by weight of a phenol resin. To 0.01 to 30 parts by weight of an additive consisting of at least one selected from the group consisting of a curing accelerator, a release agent, a colorant and a flame retardant, and 200 to 1200 parts by weight of an inorganic filler. It is intended to provide a resin composition for semiconductor encapsulation containing 0.1 to 8 parts by weight of an agent or a monoalkoxysilane coupling agent, and a resin-encapsulated semiconductor device obtained by using the same.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The thermosetting resin having a dihydrobenzoxazine ring used in the present invention is not particularly limited as long as it has a dihydrobenzoxazine ring and is cured by a ring-opening polymerization reaction of the dihydrobenzoxazine ring. For example, the compound is synthesized from a compound having a phenolic hydroxyl group, a primary amine, and formalin according to the following formula.

Embedded image (In the formula, R1 is a methyl group, a phenyl group, or a phenyl group substituted with at least one alkyl group or alkoxyl group having 1 to 3 carbon atoms.) Examples of the compound having a phenolic hydroxyl group include a polyfunctional phenol, Biphenol, a bisphenol compound, a trisphenol compound, a phenol resin and the like can be mentioned. Polyfunctional phenols include catechol, hydroquinone, and resorcinol. Examples of the bisphenol compound include bisphenol A, bisphenol F and its positional isomers, bisphenol S, tetrafluorobisphenol A, and the like. Examples of the phenol resin include a novolak phenol resin having three or less nuclei. Specific examples of the primary amine include substituted anilines such as methylamine, aniline, toluidine, and anisidine. When it is an aliphatic amine, the obtained thermosetting resin cures quickly but has poor heat resistance. When an aromatic amine such as aniline is used, a cured product obtained by curing the obtained thermosetting resin has good heat resistance, but cures slowly.

The above-mentioned thermosetting resin having a dihydrobenzoxazine ring is a compound having at least one hydroxyphenylene group in which at least one of the ortho positions of the hydroxyl group is hydrogen (hereinafter referred to as a reactive hydroxyphenylene group). ) And a primary amine are added to formaldehyde such as formalin heated to 70 ° C or more, and the mixture is heated at 70 to 110 ° C, preferably 90 to 100 ° C for 20 minutes to Let react for 2 hours,
Thereafter, it is obtained by drying under reduced pressure at a temperature of 120 ° C. or less. In the above reaction, the primary amine is usually added in an amount of 0.5 to 1 mol per mol of all phenolic hydroxyl groups of the compound having a hydroxyphenylene group capable of reacting.
The reaction is carried out at a ratio of 1.0 mol, preferably 0.6 to 1.0 mol, and 1 mol of primary amine to 2 mol or more of formaldehyde. If the amount of the primary amine is less than 0.5 mol, the crosslinking density may be reduced, and the heat resistance may be insufficient.
The above-mentioned thermosetting resin having a dihydrobenzoxazine ring is cured at 150 ° C. or higher, preferably 170 to 220 ° C., without using a catalyst or a curing agent, without generating by-products. Examples of the epoxy resin used in the present invention include a novolak epoxy resin, a cresol novolak epoxy resin, a biphenyl epoxy resin, and a bisphenol A epoxy resin. In some cases, a halogenated epoxy is used. From the viewpoint of flame retardancy, a brominated epoxy resin having a bromine content of 30 to 50% by weight is used, and a brominated novolak epoxy resin and a tetrabromobisphenol A epoxy resin are particularly preferably used.

The mixing ratio of the epoxy resin is 3 to 67% by weight, and more preferably 5 to 58% by weight. 3% by weight
If it is less than 1, the crosslink density is low, and a molded product immediately after molding cannot have sufficient hardness, and if it is 67% by weight or more, the water absorption increases. Of the epoxy resins, the blending ratio of the halogenated epoxy resin is suitably 10% by weight or less, and since the amount of halogen is smaller than that of a general epoxy resin sealing material, highly toxic halogen generated as a by-product during combustion. Not only the compounds can be reduced, but also good flame retardancy can be obtained without using antimony trioxide which is a deleterious substance. In the present invention, a novolak-type phenol resin or a xylylene-type phenol resin is used as the phenol resin mixed with the thermosetting resin. Examples of the novolak type phenol resin include a phenol novolak resin, a bisphenol novolak resin, a phenol-modified xylene resin, and an alkylphenol resin. A thermosetting resin having a dihydrobenzoxazine ring is self-curing but has a slow curing reaction. Therefore, by blending the phenol resin in an amount of 10 to 31% by weight, preferably 13 to 25% by weight, the curability can be improved without lowering the mechanical properties. If the amount of the phenolic resin is less than 10% by weight, sufficient curability cannot be obtained.

A particularly important point in the present invention is the selection of a coupling agent. The use of a dialkoxysilane coupling agent or a monoalkoxysilane coupling agent makes the storage more stable than when a trialkoxysilane coupling agent is used. In addition to the dramatic improvement in the properties, it also improves the aluminum peel adhesion and reflow resistance. In the case of a conventional epoxy resin-based semiconductor encapsulation resin composition, storage stability does not improve even if a dimethoxysilane coupling agent is used as a coupling agent, but rather a decrease in properties such as a decrease in strength occurs. Storage stability can be improved without deteriorating various properties. Examples of the dialkoxysilane coupling agent include γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyljetoxysilane, and γ-glycidoxypropylmethyldimethoxysilane. (2-aminoethyl) aminopropylmethyldimethoxysilane,
γ- (2-aminoethyl) aminopropylmethyldiethoxysilane, γ-anilinopropylmethyldimethoxysilane, γ-anilinopropylmethyldiethoxysilane,
γ-mercaptopropylmethyldimethoxysilane, γ-
Mercaptopropylmethyldiethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylmethyldiethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, and as the monoalkoxysilane coupling agent, Trimethylmethoxysilane, trimethylethoxysilane, γ-glycidoxypropyldimethylmethoxysilane, γ-glycidoxypropyldimethylethoxysilane, γ-anilinopropyldimethylmethoxysilane, γ-anilinopropyldimethylethoxysilane, γ-mel Butoxypropyldimethylmethoxysilane and γ-mercaptopropyldimethylethoxysilane.

These can be used alone or as a mixture of two or more. If the amount is small, a trialkoxysilane may be used in combination, but if it exceeds 1 part by weight, the storage stability is comparable to that of a conventional epoxy resin. In addition, as a silicone oligomer, methyltrimethoxysilane,
Methyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, γ-mercaptopropyltrimethoxy It is synthesized by a reaction of one or two or more of a mixture of trialkoxysilanes such as silane, γ-mercaptopropyltriethoxysilane and the above-mentioned dialkoxysilanes with tetramethoxysilane or tetraethoxysilane. The amount of the coupling agent is 0.1 to 8 parts by weight, preferably 0.5 to 5 parts by weight. When the amount is less than 0.1 part by weight, the adhesion between the resin and the inorganic filler is deteriorated. Strength may be reduced.

The inorganic filler used in the present invention includes fusible silicon dioxide powder, zinc borate, aluminum hydroxide and the like. These are used singly or as a mixture of two or more. As the fusible silicon dioxide powder, either spherical or crushed silicon dioxide powder can be used, or both can be used in combination. The particle size is suitably from 0.5 to 100 μm, and if it is out of this range, the strength is reduced or molding failure occurs. In addition, an inorganic filler surface-treated with a predetermined coupling agent in advance can be used, which not only improves storage stability but also provides sufficient mechanical properties or adhesive strength with a smaller amount of coupling agent than before. . The coupling agent to be used is not particularly limited. The compounding amount of the inorganic filler is 200 to 120 parts by weight based on 100 parts by weight of the thermosetting resin.
0 parts by weight, more preferably 300 to 800 parts by weight, is suitable. If the amount is less than 200 parts by weight, the strength and the effect of reducing the coefficient of thermal expansion decrease, and if it exceeds 1200 parts by weight, molding becomes difficult.

The resin composition for semiconductor encapsulation of the present invention may contain additives such as a curing accelerator, a release agent, a coloring agent, and a flame retardant, if necessary. Examples of the curing accelerator include polyfunctional phenol compounds such as catechol and bisphenol A; sulfonic acids such as P-toluenesulfonic acid and P-phenolsulfonic acid; carboxylic acids such as benzoic acid, salicylic acid, oxalic acid, and adipic acid; A) acetylacetonate, metal complexes such as aluminum (III) acetylacetonate zirconium (IV) acetylacetonate, metal oxides such as calcium oxide, cobalt oxide, magnesium oxide and iron oxide, calcium hydroxide, particularly preferably imidazole and Tertiary amines such as derivatives thereof, diazabicycloundecene, diazabicyclononene and phenol novolak salts thereof, triphenylphosphine, triphenylphosphine / benzoquinone derivatives, triphenylphosphine / triphenylboron salts; Phosphorus compounds such as tetraphenylphosphonium / tetraphenylborate and derivatives thereof. These are used alone or as a mixture of two or more. The compounding amount of the curing accelerator is 5 parts by weight or less, more preferably 3 parts by weight or less, based on 100 parts by weight of the thermosetting resin composition. When the amount exceeds 5 parts by weight, the water absorption increases and the storage stability deteriorates. I do.

As the releasing agent, montanic acid ester wax, carnauba wax or the like can be used, and as the coloring agent, carbon black or the like can be used. Further, if necessary, antimony trioxide can be used as a flame retardant. In the present invention, the elastomer blended in the thermosetting resin composition as needed is not particularly limited, but a part of the main chain structural unit is an elastomer and a dihydrobenzoxazine ring crosslinked by the structural unit. A thermosetting resin and a liquid elastomer having a functional group capable of reacting with a phenolic hydroxyl group generated by opening of a dihydrobenzoxazine ring are preferably used. In the case of an elastomer in which some of the structural units of the main chain are cross-linked by structural units, it is particularly preferable to use an acrylonitrile-butadiene copolymer elastomer or a silicone gel synthesized from a monomer having a siloxane bond as a starting material (for example, see JP-A-63-241020 discloses a mixture of an epoxy and amino-modified silicone obtained by dispersing a mixture of phenol novolak as a dispersion medium and a catalyst and then gelling the mixture. Further, a thermosetting resin having a dihydrobenzoxazine ring in the elastomer and a phenolic hydroxyl group generated by opening the dihydrobenzoxazine ring can react with, for example, a functional group such as an epoxy group, a hydroxyl group or a carboxyl group. Those having a functional group having a high solubility parameter are particularly preferred. In the case of a solid elastomer, the particle size is preferably 0.2 mm or less. When these crosslinked elastomers are mixed and cured with a thermosetting resin having a dihydrobenzoxazine ring, it is possible to easily obtain a sea-island type dispersion structure in which the selected particle size is maintained as long as aggregation of the particles does not occur. Can be obtained and toughness is improved. In contrast, in a method of depositing and dispersing an elastomer in a thermosetting resin composition such as spinodal decomposition when an elastomer having no crosslinked structure is used, it is difficult to control the particle size of the elastomer, and a uniform sea-island structure cannot be obtained. Sometimes.

The functional groups of the thermosetting resin having a dihydrobenzoxazine ring and the liquid elastomer having a functional group capable of reacting with a phenolic hydroxyl group formed by opening of the dihydrobenzoxazine ring include amino groups, epoxy groups, Carboxyl groups and phenolic hydroxyl groups. The proportion of the elastomer is preferably 1 to 50 parts by weight, more preferably 2 to 40 parts by weight, based on 100 parts by weight of the thermosetting resin composition. If the amount is less than 1 part by weight, it is difficult to improve toughness, and 5
If the amount exceeds 0 parts by weight, mechanical properties may be deteriorated. The present invention also provides a resin-sealed semiconductor device in which a semiconductor element is sealed with the resin composition. The method for manufacturing the above resin-encapsulated semiconductor device is not particularly limited. ・ The resin composition is adjusted by kneading at 60 to 120 ° C. with a heating roll or the like, and then the semiconductor element is arranged in a mold. Next, the obtained resin composition is cured by compression molding or transfer molding at 160 to 220 ° C. under a molding pressure of 20 to 120 kgf / cm ² for 1 to 10 minutes, and further cured by 160.
By post-curing at 220 ° C. for 1 to 6 hours, a resin-encapsulated semiconductor device having better characteristics can be obtained.

[0015]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples of the present invention and Comparative Examples thereof, but the present invention is not limited to these Examples. Examples 1 to 7 and Comparative Examples 1 to 5 [1] Synthesis of thermosetting resin having dihydrobenzoxazine ring 1.0 kg of bisphenol F (equivalent to 5 mol), 0.93 kg of aniline (equivalent to 10 mol) and 0.1 mol of methyl ethyl ketone. The mixture was mixed in 5 kg and stirred at 80 ° C. for 5 hours to prepare a uniform mixed solution. 1.62 kg of formalin was charged into a 5 liter flask, heated to 90 ° C., and a mixed solution of hebisphenol F / aniline / methyl ethyl ketone was added little by little over 30 minutes. Reflux temperature is maintained for 30 minutes after the end of the addition, then 266 ° C. for 2 hours at 100 ° C.
The condensation water was removed by reducing the pressure to 6.1 Pa or less to obtain a thermosetting resin in which 75% of the reactive hydroxyl groups were converted to dihydrobenzoxazine. [2] Synthesis of novolak-type phenol resin 2.4 kg of phenol, formalin (37% aqueous solution)
0.13 kg, paraformaldehyde 0.5 kg, and oxalic acid 3 g were charged into a 5 liter flask and heated at reflux temperature to 4 g.
Allowed to react for hours. Subsequently, the internal pressure was reduced to 6666.1 Pa or less to remove unreacted phenol and water. [3] Epoxy resin Orthocresol novolak type epoxy resin (ESCN-195 epoxy equivalent, trade name, manufactured by Sumitomo Chemical Co., Ltd.)
200 g / eq) Biphenyl type epoxy resin (trade name YX-4000H manufactured by Yuka Shell Epoxy Co., Ltd. Epoxy equivalent: 192 g /
eq) A brominated novolak type epoxy resin (BREN-S epoxy equivalent: 2809 / eq bromine content: 36%, manufactured by Nippon Kayaku Co., Ltd.) was used.

[4] Silane Coupling Agent As silane coupling agents, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyldimethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane (each of Toray Dow Corning Silicone Toray) SH6040, AY-43-02, trade name
6, SZ6070, AY-43-004).
Also, γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropylmethyldimethoxysilane and tetramethoxysilane were reacted at 65 ° C. to synthesize a silicone oligomer. [5] Inorganic filler previously treated with a coupling agent As the inorganic filler, a fusible silicon dioxide powder having a particle size distribution of 0.5 to 100 µm and an average particle size of about 20 µm is selected. Silane coupling agent SH
Those treated with 6040 and SZ6070 were used. The processing amount of the coupling agent is 0.1 to the amount of the inorganic filler.
5%. [6] Other Compounds As the elastomer, a crosslinked acrylonitrile-butadiene copolymer having a particle diameter of 70 nm (trade name XER-91 manufactured by Nippon Synthetic Rubber Co., Ltd .; liquid acrylonitrile-butadiene copolymer (trade name ATBN130 manufactured by Ube Industries, Ltd.))
0 × 16, AN amount 1.65% by weight, amino group content, amine equivalent 900) were used. As for the silicone gel, 25 g of amino silicone (KF-86 amine equivalent: 2000, manufactured by Shin-Etsu Chemical Co., Ltd.) and epoxy silicone (X-22-16, manufactured by Shin-Etsu Chemical Co., Ltd.) are used.
3B epoxy equivalent 1800) 45g, temperature 1
It is added to 210 g of the novolak-type phenolic resin (A) melted at 20 ° C., and the mixture is stirred until it becomes uniformly cloudy, and then heated at about 120 ° C. for 1 hour to prepare a silicone gel-containing phenolic resin mixture. did.

[Curing] The raw materials were mixed according to the composition shown in Tables 1 and 2, and the mixture was heated at 80 ° C. using a biaxial heating roll.
After kneading for 0 minutes, the mixture was pulverized to prepare a powdery resin composition. In addition, the filling amount of the fusible silicon dioxide powder in the resin composition was standard 70 vo1%. Next, the semiconductor element is placed in the mold cavity of the transfer molding machine,
Each resin composition was transferred and molded in the mold under the conditions of 70 kgf · cm ² and 90 seconds, and the QFP 54 pin (external size 2
A semiconductor device having a size of 0 mm × 14 mm × 2 mm, 42 alloy of lead frame material, and a semiconductor element size of 8 mm × 10 mm) was obtained. Post-curing was performed at 175 ° C. for 6 hours.

[Evaluation of Properties] In order to know the general properties of the resin composition such as mechanical properties, heat resistance, flame retardancy, adhesiveness, etc., plate-shaped cured products were prepared under the same conditions as above. The properties of the cured product are JIS K6911 for mechanical and electrical properties.
The flame retardancy was measured according to UL-94. As for the hardness during heating, the hardness of the molded product immediately after the molding at 175 ° C. for 90 seconds was measured. Regarding the storage stability, the thermosetting resin composition was left in a thermo-hygrostat at 25 ° C. and 50% RH, and the change rate of the spiral flow after a predetermined time had elapsed was examined. The flexibility of the molded product depends on
A heat cycle test in which the temperature was maintained at 55 ° C. and 150 ° C. for 30 minutes was performed, and the crack occurrence rate (the number of cracked test pieces per 10 test pieces) in each predetermined cycle was determined and evaluated. Further, the molded semiconductor device is heated at 85 ° C. for 8 hours.
After moisture absorption under the condition of 5% RH, a heat treatment is performed at 215 ° C. for 90 seconds (reflow crack test) to determine the rate of occurrence of package cracks (the number of semiconductor devices having package cracks per 10 semiconductor devices). The humidity resistance of the semiconductor device was evaluated. Tables 1 to 4 show the composition and the measurement results in each of Examples and Comparative Examples. In addition, all the composition was shown by the weight part.

[0019]

[Table 1]

[0020]

[Table 2]

[0021]

[Table 3]

[0022]

[Table 4]

[0023]

By using the resin composition for encapsulating a semiconductor according to the present invention, it is possible to achieve a conventional epoxy resin-based resin composition for encapsulating a semiconductor having a low water absorption, good mechanical properties and good reflow resistance. The reduction of the flame retardant which did not exist and the long-term storage stability were realized.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI C08L 61/34 C08L 61/34 H01L 23/29 H01L 23/30 R 23/31 (72) Inventor Shunichi Numata Shimodate, Ibaraki 1500 Ogawa, Shimodate Plant, Hitachi Chemical Co., Ltd. (72) Inventor Tatsuo Kawada, 172-1 Kajikubo, Yuki-shi, Ibaraki Prefecture Inside Shimodate Plant, Hitachi Chemical Co., Ltd. (72) Inventor Fumio Furusawa, 1772-Kazakuo, Yukigo, Yuki-shi, Ibaraki Prefecture 1 Hitachi Chemical Industry Co., Ltd. Shimodate Plant (72) Inventor Masanobu Fujii 172-1 Okakabo, Yuki-shi, Ibaraki Prefecture Hitachi Chemical Industry Co., Ltd. Shimodate Plant (72) Inventor Aihiko Sato 172-1-1, Okakabo, Yuki-shi, Ibaraki Hitachi Chemical Industry Co., Ltd.

Claims (4)

[Claims] 1. A thermosetting resin composition comprising 2 to 87% by weight of a thermosetting resin having a dihydrobenzoxazine ring, 3 to 67% by weight of an epoxy resin and 10 to 31% by weight of a phenol resin as a main component. Parts by weight of 0.01 to 30 parts by weight of at least one additive selected from the group consisting of a curing accelerator, a release agent, a colorant and a flame retardant, and 200 to 1200 parts by weight of an inorganic filler. A resin composition for semiconductor encapsulation comprising 0.1 to 8 parts by weight of a coupling agent selected from a coupling agent, a monoalkoxysilane coupling agent and a silicone oligomer synthesized from alkoxysilane. 2. A 100% by weight thermosetting resin composition comprising 2-87% by weight of a thermosetting resin having a dihydrobenzoxazine ring, 3-67% by weight of an epoxy resin and 10-31% by weight of a phenol resin as main components. Parts by weight, 0.01 to 30 parts by weight of an additive comprising at least one selected from a curing accelerator, a release agent, a colorant and a flame retardant, and the inorganic filler 200 previously surface-treated with a silane coupling agent.
A resin composition for encapsulating a semiconductor, comprising -1200 parts by weight. (3) 100 parts by weight of the thermosetting resin composition,
3. The resin composition for semiconductor encapsulation according to claim 1, further comprising 1 to 50 parts by weight of an elastomer. 4. A resin-encapsulated semiconductor device which is encapsulated with the resin composition for encapsulating a semiconductor according to claim 1, 2 or 3.