JPH11135907A - Wiring circuit board structure equipped with test electrode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring circuit board equipped with a test electrode and capable of electrically and surely connecting its test electrode to the electrode of a target work, when a continuity test is carried out for the target work's electrode which is formed of material such as aluminum or copper that is liable to get oxidized. SOLUTION: A wiring circuit board is composed of a test electrode 19, a wiring circuit pattern 17, and an insulating board 11, wherein the test electrode 19 is electrically connected to the wiring circuit pattern 17 through the intermediary of the insulating board 11. Only the one side of the edge 19a of the test electrode 19 is electrically connected to the wiring circuit pattern 17, and an insulating layer 18 prescribed in thickness is formed on the side of the insulating board 11 where the root 19b of the test electrode 19 and the wiring circuit pattern 17 are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection jig substrate used for conducting a continuity inspection of a semiconductor device or a printed circuit board.

[0002]

2. Description of the Related Art In a conventional printed circuit board structure having test electrodes used for testing the continuity of a semiconductor device or a printed circuit board, the test electrodes are arranged on the printed circuit board, and the test electrodes of the object to be tested are used as test electrodes. The continuity test was performed by pressing.

In the conventional printed circuit board structure having test electrodes, the test electrodes are pressed against the electrodes of the device under test to establish electrical continuity. However, the test electrodes are only pressed perpendicularly to the electrodes of the device under test. Therefore, if the electrode of the test object is formed of easily oxidizable material such as aluminum or copper,
There is a problem that the oxide film of the electrode of the test object cannot be broken, and a contact failure occurs during the test.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of a continuity test of an electrode of a test object whose surface is formed of a material such as aluminum or copper which is easily oxidized. An object of the present invention is to provide a printed circuit board having an inspection electrode capable of reliably performing electrical conduction between an electrode and an electrode of a device under test.

[0005]

In order to solve the above-mentioned problems in the present invention, according to a first aspect of the present invention, there is provided a printed circuit board having a test electrode formed on one surface of an insulating substrate and a printed circuit pattern formed on the other surface. The inspection electrode is electrically connected to the wiring circuit pattern via an insulating substrate, is connected to a wiring circuit pattern only on one side of the inspection electrode base end, and the inspection electrode base end and An insulating layer having a predetermined thickness is formed on the insulating substrate on a surface on which a wiring circuit pattern is formed.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partial cross-sectional view showing the structure of a printed circuit board having test electrodes of the present invention. FIG. 1 is a schematic cross-sectional view showing a state in which a continuity test is being performed with a predetermined load applied to each of them.

As shown in FIG. 1, the printed circuit board structure having test electrodes according to the present invention has a structure in which a test electrode 19 and a printed circuit pattern 17 are electrically connected to each other through an insulating substrate 11, and a test electrode base end portion. The insulating layer 18 is formed on the insulating substrate 11 on the surface on which the test electrode base end 19b and the wiring circuit pattern 17 are formed, being connected to the wiring circuit pattern 17 only on one side of the wiring substrate 19b.

As shown in FIG. 2, when a predetermined load is applied between the inspection electrode 19 and the electrode 22 of the device under test 21, the base end 19 b of the inspection electrode 19 becomes the insulating layer 18 without the wiring circuit pattern 17. The tip 19 a of the test electrode 19 moves so as to rub the surface of the electrode 22 of the device under test 21 while tilting in the opposite direction to the wiring circuit pattern 17. As a result, the oxide film on the surface of the electrode 22 of the test object 21 is broken, and the test electrode 1
9 and the electrode 22 of the device under test 21 can be reliably electrically connected.

Hereinafter, a method for forming a printed circuit board structure having an inspection electrode according to the present invention will be described. First, the insulating substrate 11
A resist layer 12 is formed thereon, and a metal substrate 13 is attached (see FIG. 3A). As the insulating substrate 11, a polyimide film or the like having insulating properties and heat resistance is used.
Is preferably a dry film resist having a uniform thickness.
Furthermore, a stainless steel substrate is advantageous as the metal substrate 13 in consideration of a post-process. Here, the resist layer 12
In the case where a dry film resist is used, it also has a function as an adhesive layer, and thus has an advantage that the metal substrate 13 can be easily laminated.

Next, openings 14 are formed at predetermined positions of the insulating substrate 11 and the resist layer 12 by using a laser processing machine (see FIG. 3B). An excimer laser machine or a carbon dioxide laser machine can be used as the laser machine.

Next, a conductor electrode 15 is formed in the opening 14 by electrolytic plating (see FIG. 3C). Electrolytic plating differs depending on the material of the electrode, but the conductor electrode can be formed by using electrolytic copper plating, electrolytic nickel plating, or the like. Here, the thickness of the conductor electrode is preferably a value obtained by summing the thickness of the resist layer 12 and half the thickness of the insulating substrate 11.

Next, a copper thin film conductor layer having a thickness of 3000 mm is formed on the insulating substrate 11 and the conductor electrode 15 by using a sputtering apparatus. Further, a resist pattern 16 for forming a wiring circuit pattern is formed by a semi-additive method (see FIG. 3D).

Next, a copper conductor layer having a thickness of 15 μm is formed on the thin film conductor layer by electrolytic copper plating using the resist pattern 16 as a mask. The thin film conductor layer at the lower portion is removed by etching to produce a wiring circuit pattern 17 electrically connected to the conductor electrode 15 (FIG. 3E).
reference).

Next, a thermosetting epoxy resin or a polyimide resin is applied by screen printing or spin coating, and is cured by heating to form an insulating layer 18 (FIG. 3).
(F)).

Finally, the printed circuit board having the electrodes of the present invention can be formed by immersing the substrate in a caustic soda solution and removing the metal substrate 13 and the resist layer 12 (see FIG. 3 (g)). .

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings. First, a 50 μm-thick dry film resist (DFR: manufactured by Hitachi Chemical Co., Ltd.) was attached on an insulating substrate 11 made of a 25 μm-thick polyimide film using a laminator to form a resist layer 12. Further, a metal substrate 13 made of a stainless steel plate having a thickness of 0.3 mm was attached using the resist layer 12 as an adhesive layer (FIG. 3).
(A)).

Next, an opening 14 having a diameter of 40 μm was formed at a predetermined position of the insulating substrate 11 and the resist layer 12 by using an excimer laser processing machine (see FIG. 3B). The processing conditions of the excimer laser processing machine are the energy density of 1.5 J / cm
² went.

Next, a conductive electrode 15 made of nickel metal having a thickness of 63 μm was formed in the opening 14 by electrolytic Ni plating using the metal substrate 13 as a plating electrode (see FIG. 3C).

Next, a thin copper conductor layer having a thickness of 3000 mm was formed on the insulating substrate 11 and the conductor electrodes 15 by using a sputtering apparatus. Further, a resist pattern 16 for forming a wiring circuit pattern was formed by a semi-additive method (see FIG. 3D).

Next, a copper conductor layer having a thickness of 15 μm is formed on the thin film conductor layer by electrolytic copper plating using the resist pattern 16 as a mask, and the resist pattern 16 is peeled off with a dedicated peeling liquid. The thin film conductor layer underneath was removed by etching to produce a wiring circuit pattern 17 electrically connected to the conductor electrode 15 (FIG. 3E).
reference).

Next, a thermosetting epoxy resin solution was applied by screen printing, and heat-cured to form an insulating layer 18 (see FIG. 3F).

Finally, the substrate was immersed in a 10% caustic soda solution, and the metal substrate 13 and the resist layer 12 were removed to obtain a printed circuit board having the test electrodes of the present invention (FIG. 3). (G)).

When a continuity test was performed on an Al electrode formed on a silicon wafer using the printed circuit board having the test electrode of the present invention, a load of about 5 g per electrode, which could not be conducted with the conventional electrode structure, was obtained. However, it was confirmed that sufficient electrical continuity was obtained.

[0024]

By using the printed circuit board having the inspection electrode of the present invention, the tip of the electrode operates so as to break the oxide film even if the electrode of the object to be inspected is made of a material which is easily oxidized. , Electrical conduction can be obtained with a load smaller than the measured load, and the problem of poor contact can be greatly improved. Further, since the load at the time of measurement is reduced, the electrode is less likely to be crushed or deformed, and the effect of extending the electrode life is also produced. Furthermore, since the life of the inspection board is also improved, the inspection cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing the configuration of a printed circuit board having an inspection electrode according to the present invention.

FIG. 2 is a schematic cross-sectional view showing a state where a continuity test is performed by applying a predetermined load to an electrode of a device under test using a printed circuit board having a test electrode of the present invention.

3 (a) to 3 (g) are partial cross-sectional views showing steps of manufacturing a printed circuit board having an inspection electrode according to the present invention.

[Explanation of symbols]

 11 insulating substrate 12 resist layer 13 metal substrate 14 opening 15 conductive electrode 16 resist pattern 17 wiring circuit pattern 18 insulating layer 19 inspection electrode 19a inspection Electrode base end 19b ... Test electrode tip 21 ... Test object 22 ... Electrode

Claims (1)

[Claims] 1. A printed circuit board having test electrodes formed on one surface of an insulating substrate and a printed circuit pattern formed on the other surface, wherein the test electrodes are electrically connected to the printed circuit pattern via the insulating substrate. An insulating layer having a predetermined thickness connected to a wiring circuit pattern only on one side of the test electrode base end, and having a predetermined thickness on the insulating substrate on a surface where the test electrode base end and the wiring circuit pattern are formed; A printed circuit board structure having a test electrode, wherein a printed circuit board is formed.