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JPH1112047A - Production of ceramic substrate - Google Patents

Production of ceramic substrate

Info

Publication number
JPH1112047A
JPH1112047A JP9168996A JP16899697A JPH1112047A JP H1112047 A JPH1112047 A JP H1112047A JP 9168996 A JP9168996 A JP 9168996A JP 16899697 A JP16899697 A JP 16899697A JP H1112047 A JPH1112047 A JP H1112047A
Authority
JP
Japan
Prior art keywords
ceramic
ceramic green
porous substrate
substrate
green sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9168996A
Other languages
Japanese (ja)
Inventor
Hitoshi Kimura
均 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9168996A priority Critical patent/JPH1112047A/en
Publication of JPH1112047A publication Critical patent/JPH1112047A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Furnace Charging Or Discharging (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing ceramic substrates, enabling to control blisters generated on the surfaces of ceramic green sheets by disposing the ceramic green sheets on a porous substrate which is disposed on a rack plate in a sintering oven and has a specific profile irregularity, and subsequently sintering the green sheets. SOLUTION: This method for producing ceramic substrate comprises disposing a porous substrate on a rack plate in a sintering oven, disposing ceramic green sheets on the porous substrate, and subsequently thermally sintering the ceramic green sheets. The porous substrate comprises an alumina ceramic substrate having a profile irregularity Ra of <=2.0, a porosity of >=15% and plural penetrated holes and is obtained by laminating alumina granules having a granule diameter of 0.1-2.0 mm and subsequently thermally calcining the laminate. When alumina granules having a small granule diameter are used to give a low porosity after the calcination, penetrated holes having a diameter of 1.0 mm are formed at distances of 5 mm before the calcination, and subsequently calcined to secure a porosity of >=15% in the porous substrate.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は炉内に配置したセラ
ミックグリーンシートを焼成して形成されるセラミック
基板の製造方法に関するものである。
The present invention relates to a method for manufacturing a ceramic substrate formed by firing a ceramic green sheet placed in a furnace.

【0002】[0002]

【従来の技術】プリント配線板等に使用されるセラミッ
ク基板は、複数枚のセラミックグリーンシートを炉内の
焼成用棚板上に配置し、上記炉を電熱ヒータやバーナー
により高温に加熱し、上記セラミックグリーンシートを
焼成して得ることができる。
2. Description of the Related Art A ceramic substrate used for a printed wiring board or the like is obtained by arranging a plurality of ceramic green sheets on a firing shelf in a furnace, and heating the furnace to a high temperature by an electric heater or a burner. It can be obtained by firing a ceramic green sheet.

【0003】この方法でセラミックグリーンシートを焼
成すると、セラミックグリーンシートに含まれる結合
材、分散材、潤滑材等の有機物を除去する工程(以下、
脱脂工程)で発生するガスが焼成用棚板に妨げられ、透
過することができないためにセラミックグリーンシート
内に脱脂工程で発生するガスのたまりが形成され、その
部分にフクレが生じたり、割れが発生していた。
When a ceramic green sheet is fired by this method, a step of removing organic substances such as a binder, a dispersing agent, and a lubricant contained in the ceramic green sheet (hereinafter, referred to as a "step").
The gas generated in the degreasing step) is impeded by the baking shelf plate and cannot pass through, so that a pool of gas generated in the degreasing step is formed in the ceramic green sheet, and blisters and cracks are generated in that portion. Had occurred.

【0004】[0004]

【発明が解決しようとする課題】本発明は、上記のよう
な事情に鑑みてなされたものであって、その目的とする
ところは、セラミックグリーンシートを焼成してもセラ
ミックグリーンシートの表面に発生するフクレを抑制す
ることができるセラミック基板の製造方法を提供するこ
とである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to generate a ceramic green sheet even if it is fired. It is an object of the present invention to provide a method for manufacturing a ceramic substrate which can suppress blistering.

【0005】[0005]

【課題を解決するための手段】請求項1に係る発明のセ
ラミック基板の製造方法は、炉内に配置したセラミック
グリーンシートを焼成するセラミック基板の製造方法に
おいて、炉内の棚板上に面精度Ra=2.0以下の多孔
質のポーラス基板を配し、その上にセラミックグリーン
シートを配置したのち加熱してセラミックグリーンシー
トを焼成することを特徴とするセラミック基板の製造方
法。
According to a first aspect of the present invention, there is provided a method of manufacturing a ceramic substrate, comprising: firing a ceramic green sheet disposed in a furnace; A method for manufacturing a ceramic substrate, comprising: arranging a porous substrate having a Ra of 2.0 or less, arranging a ceramic green sheet thereon, and then heating and firing the ceramic green sheet.

【0006】請求項2に係る発明のセラミック基板の製
造方法は、上記請求項1記載のセラミック基板の製造方
法において、ポーラス基板の空隙率が15%以上である
ことを特徴とするセラミック基板の製造方法。
According to a second aspect of the present invention, there is provided a method of manufacturing a ceramic substrate according to the first aspect, wherein the porosity of the porous substrate is 15% or more. Method.

【0007】上記ポーラス基板は、面精度Ra=2.0
以下、空隙率が15%以上の多孔質基板であって、耐熱
性と耐熱衝撃性の面より96〜99%以上の純度を有す
るAl2 3 質の基板を使用するのが好ましい。上記ポ
ーラス基板の面精度Raが2.0より大きくなると、空
隙率が15%以上となるが、焼成の際に熱収縮するセラ
ミックグリーンシート面とポーラス基板が当接し、表面
にキズが発生する。また、ポーラス基板の空隙率が15
%未満になると、面精度Raが2.0以下になるが、緻
密になると焼成の際、脱脂工程で発生するガスの透過に
対する抵抗が大きくなり、フクレや割れが発生する。
The above porous substrate has a surface accuracy Ra = 2.0.
Hereinafter, it is preferable to use a porous substrate having a porosity of 15% or more and an Al 2 O 3 substrate having a purity of 96 to 99% or more in terms of heat resistance and thermal shock resistance. When the surface accuracy Ra of the porous substrate is larger than 2.0, the porosity becomes 15% or more. However, the ceramic green sheet surface, which is thermally contracted during firing, comes into contact with the porous substrate, and the surface is scratched. Further, the porosity of the porous substrate is 15
%, The surface accuracy Ra becomes 2.0 or less, but when it becomes dense, the resistance to permeation of gas generated in the degreasing step during firing increases, causing blisters and cracks.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施形態を説明す
る。
Embodiments of the present invention will be described below.

【0009】本発明のセラミック基板の製造方法で得ら
れるセラミック基板としては、例えば、アルミナ、窒化
アルミ、窒化ケイ素、窒化ボロン、フェライト、チタン
酸バリウム等のセラミック粉末が使用され、バインダー
としては、例えば、水、メチルセルロース、スターチ、
アミノ酸、フェノール樹脂、アクリル、酢酸ビニル、グ
リセリン及びグリコール等のように液状、粉末状を問わ
ず用いられ、各々を併用することもできる。これらの材
料を混合分散し、例えばドクターブレード法等でシート
状にして一定の大きさに打ち抜いてセラミックグリーン
シートが形成される。
As the ceramic substrate obtained by the method of manufacturing a ceramic substrate according to the present invention, for example, ceramic powders such as alumina, aluminum nitride, silicon nitride, boron nitride, ferrite, and barium titanate are used. , Water, methylcellulose, starch,
It is used irrespective of liquid or powder, such as amino acid, phenol resin, acryl, vinyl acetate, glycerin and glycol, and they can be used in combination. These materials are mixed and dispersed, and formed into a sheet by, for example, a doctor blade method or the like, and punched into a predetermined size to form a ceramic green sheet.

【0010】図1は本発明のセラミック基板の製造方法
に使用される焼成装置の一例を示す概略図である。
FIG. 1 is a schematic view showing an example of a firing apparatus used in the method of manufacturing a ceramic substrate according to the present invention.

【0011】図1に示す如く、焼成装置は、炉1内に焼
成用棚板3が備えられ、この焼成用棚板3の上にセラミ
ックグリーンシート2が配置される。上記焼成用棚板3
は、焼成するセラミックグリーンシート2を保持するも
のであり、アルミナセラミックや窒化アルミニウムセラ
ミックを主成分とした無孔板が使用される。
As shown in FIG. 1, in the firing apparatus, a firing shelf 3 is provided in a furnace 1, and ceramic green sheets 2 are arranged on the firing shelf 3. The baking shelf 3
Is for holding a ceramic green sheet 2 to be fired, and a non-perforated plate mainly composed of alumina ceramic or aluminum nitride ceramic is used.

【0012】次に上記焼成装置を用いて本発明のセラミ
ック基板の製造方法について説明する。
Next, a method of manufacturing a ceramic substrate according to the present invention using the above-described firing apparatus will be described.

【0013】本発明は、炉1内に設けられた焼成用棚板
3上にポーラス基板4を配置し、さらにその上に焼成し
てセラミック基板となる複数のセラミックグリーンシー
ト2を重ね合わせて配置する。
According to the present invention, a porous substrate 4 is arranged on a firing shelf 3 provided in a furnace 1, and a plurality of ceramic green sheets 2 to be fired thereon to form a ceramic substrate are superposed and arranged. I do.

【0014】上記ポーラス基板4は、図2の断面図に示
す如く、複数の通孔5を有する多孔質の純度97%のア
ルミナセラミック基板で、粒径が異なるアルミナ粒子が
積層されて上記通孔5が形成されている。このアルミナ
粒子の粒径は、0.1mm〜2.0mmで、積層されて
加熱焼成されて面精度Ra=1.5、空隙率16%のポ
ーラス基板4を形成している。また、図3に示すポーラ
ス基板4は、0.1mm〜0.5mmの粒径を有するア
ルミナ粒子を使用し、焼成すると面精度Ra=1.0、
空隙率10%のポーラス基板が形成されるシートに、焼
成する前に直径0.1mmの貫通孔6を5mm間隔で形
成することにより、空隙率20%のポーラス基板を得
た。
The porous substrate 4 is, as shown in the sectional view of FIG. 2, a porous alumina ceramic substrate having a plurality of through holes 5 and having a purity of 97%. 5 are formed. The alumina particles have a particle size of 0.1 mm to 2.0 mm, and are laminated and heated and fired to form a porous substrate 4 having a surface accuracy of Ra = 1.5 and a porosity of 16%. In addition, the porous substrate 4 shown in FIG. 3 uses alumina particles having a particle size of 0.1 mm to 0.5 mm.
By forming through-holes 6 having a diameter of 0.1 mm at intervals of 5 mm on a sheet on which a porous substrate having a porosity of 10% is formed before firing, a porous substrate having a porosity of 20% was obtained.

【0015】次に、上記図2で示されたポーラス基板4
を焼成用棚板3に配置し、さらに、セラミックグリーン
シート2が重ね合わされた炉1内に、空気を強制的に排
出しながら不活性ガスを充填していく。本実施形態で
は、不活性ガスとして窒素ガスを使用した。炉1内が窒
素で充填されると、炉1内に配されたヒータで炉1内を
所定の焼成温度、本発明の実施形態ではアルミナのセラ
ミックグリーンシートを使用したため1500℃まで加
熱した。すると、セラミックグリーンシート2は、焼結
収縮し、焼成前では一辺30cmの正方形であったもの
が、一辺10cmの正方形に収縮した。
Next, the porous substrate 4 shown in FIG.
Is placed on a firing shelf 3, and the furnace 1 on which the ceramic green sheets 2 are superimposed is filled with an inert gas while forcibly discharging air. In this embodiment, nitrogen gas is used as the inert gas. When the inside of the furnace 1 was filled with nitrogen, the inside of the furnace 1 was heated to a predetermined baking temperature by a heater arranged in the furnace 1, and to 1500 ° C. because ceramic green sheets of alumina were used in the embodiment of the present invention. As a result, the ceramic green sheet 2 shrank and shrunk. Before firing, the ceramic green sheet 2 was a square having a side of 30 cm, but shrunk to a square having a side of 10 cm.

【0016】セラミックグリーンシート2の焼成が終了
すると、温度を700℃前後まで低下させ炉1内に酸素
を流入、さらに、冷却した。得られたセラミック基板の
表面には、表面にキズやフクレ、割れがないことが目視
により確認できた。
When the firing of the ceramic green sheet 2 was completed, the temperature was lowered to about 700 ° C., oxygen was introduced into the furnace 1 and further cooled. It was visually confirmed that the surface of the obtained ceramic substrate had no scratches, blisters, or cracks on the surface.

【0017】同様に、炉1内に設けられた焼成用棚板3
上に、図3に示す、貫通孔6を形成したポーラス基板4
配置し、さらにその上に焼成してセラミック基板となる
複数のセラミックグリーンシート2を重ね合わせて焼成
を行なった。
Similarly, the firing shelf 3 provided in the furnace 1
A porous substrate 4 having a through-hole 6 formed thereon as shown in FIG.
A plurality of ceramic green sheets 2 to be placed and fired thereon to become a ceramic substrate were overlaid and fired.

【0018】得られたセラミック基板を目視により確認
すると、その表面にキズやフクレ、割れがないことが確
認できた。
When the obtained ceramic substrate was visually checked, it was confirmed that the surface of the substrate was free from scratches, blisters and cracks.

【0019】上述したように、本発明のセラミック基板
の製造方法によると、炉内の棚板上に配置された複数の
セラミックグリーンシートと焼成用棚板との間に、面精
度Ra=2.0以下の多孔質のポーラス基板を配置する
ことにより、収縮する際に発生するキズを抑制すること
ができた。
As described above, according to the method for manufacturing a ceramic substrate of the present invention, a surface accuracy Ra = 2... Between a plurality of ceramic green sheets disposed on a shelf plate in a furnace and a firing shelf plate. By arranging a porous substrate having a pore size of 0 or less, it was possible to suppress scratches generated when the substrate contracted.

【0020】さらに、上記ポーラス基板の空隙率が15
%以上の多孔質基板であるので、脱脂工程で発生するガ
スを透過するので、セラミックグリーンシート内に滞留
するガスを取り除くことができた。
Further, the porosity of the porous substrate is 15
%, The gas generated in the degreasing step is permeated, so that the gas remaining in the ceramic green sheet can be removed.

【0021】[0021]

【発明の効果】本発明に係るセラミック基板の製造方法
によると、炉内の棚板上に面精度Ra=2.0以下の多
孔質のポーラス基板を配し、その上にセラミックグリー
ンシートを配置したのち加熱してセラミックグリーンシ
ートを焼成するので、収縮する際の抑制力が抑制されキ
ズの発生を軽減することができる。さらに、ポーラス基
板の空隙率が15%以上であるので、脱脂工程で発生す
るガスを透過するので、セラミックグリーンシート内に
滞留するガスを取り除き、フクレや割れの発生を防ぐこ
とができた。
According to the method of manufacturing a ceramic substrate according to the present invention, a porous porous substrate having a surface accuracy of Ra = 2.0 or less is disposed on a shelf plate in a furnace, and a ceramic green sheet is disposed thereon. After that, the ceramic green sheet is heated and fired, so that the suppressing force at the time of shrinkage is suppressed, and the occurrence of scratches can be reduced. Furthermore, since the porosity of the porous substrate is 15% or more, the gas generated in the degreasing step is permeated, so that the gas remaining in the ceramic green sheet is removed, and the occurrence of blisters and cracks can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のセラミック基板の製造方法に使用され
る焼成装置の一例を示す概略図である。
FIG. 1 is a schematic view showing an example of a firing apparatus used in a method for manufacturing a ceramic substrate according to the present invention.

【図2】本発明のセラミック基板の製造方法に使用され
る一実施形態のポーラス基板の断面図である。
FIG. 2 is a cross-sectional view of one embodiment of a porous substrate used in the method for manufacturing a ceramic substrate of the present invention.

【図3】本発明のセラミック基板の製造方法に使用され
る他の一実施形態のポーラス基板の断面図である。
FIG. 3 is a cross-sectional view of another embodiment of a porous substrate used in the method for manufacturing a ceramic substrate of the present invention.

【符号の説明】[Explanation of symbols]

1 炉 2 セラミックグリーンシート 3 焼成用棚板 4 ポーラス基板 5 通孔 6 貫通孔 DESCRIPTION OF SYMBOLS 1 Furnace 2 Ceramic green sheet 3 Baking shelf plate 4 Porous substrate 5 Through hole 6 Through hole

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 炉内に配置したセラミックグリーンシー
トを焼成するセラミック基板の製造方法において、炉内
の棚板上に面精度Ra=2.0以下の多孔質のポーラス
基板を配し、その上にセラミックグリーンシートを配置
したのち加熱してセラミックグリーンシートを焼成する
ことを特徴とするセラミック基板の製造方法。
In a method of manufacturing a ceramic substrate for firing ceramic green sheets placed in a furnace, a porous porous substrate having a surface accuracy of Ra = 2.0 or less is disposed on a shelf plate in the furnace. A ceramic green sheet, and heating the ceramic green sheet to fire the ceramic green sheet.
【請求項2】 上記請求項1記載のセラミック基板の製
造方法において、ポーラス基板の空隙率が15%以上で
あることを特徴とするセラミック基板の製造方法。
2. The method for manufacturing a ceramic substrate according to claim 1, wherein the porosity of the porous substrate is 15% or more.
JP9168996A 1997-06-25 1997-06-25 Production of ceramic substrate Withdrawn JPH1112047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9168996A JPH1112047A (en) 1997-06-25 1997-06-25 Production of ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9168996A JPH1112047A (en) 1997-06-25 1997-06-25 Production of ceramic substrate

Publications (1)

Publication Number Publication Date
JPH1112047A true JPH1112047A (en) 1999-01-19

Family

ID=15878427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9168996A Withdrawn JPH1112047A (en) 1997-06-25 1997-06-25 Production of ceramic substrate

Country Status (1)

Country Link
JP (1) JPH1112047A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051469A (en) * 2002-07-24 2004-02-19 Takasago Ind Co Ltd Method for operating microwave heating furnace and placing table for workpiece
CN116794278A (en) * 2023-08-29 2023-09-22 北京超材信息科技有限公司 Method for detecting cracks of ceramic substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051469A (en) * 2002-07-24 2004-02-19 Takasago Ind Co Ltd Method for operating microwave heating furnace and placing table for workpiece
JP4497798B2 (en) * 2002-07-24 2010-07-07 高砂工業株式会社 Operation method of microwave heating furnace and stage for placing object to be heated
CN116794278A (en) * 2023-08-29 2023-09-22 北京超材信息科技有限公司 Method for detecting cracks of ceramic substrate
CN116794278B (en) * 2023-08-29 2024-01-26 北京超材信息科技有限公司 Method for detecting cracks of ceramic substrate

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Legal Events

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A761 Written withdrawal of application

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Effective date: 20040705