JPH11126996A - Component mounting equipment - Google Patents

Abstract

(57) [Problem] To provide a component mounting apparatus capable of simplifying the entire apparatus configuration and reducing or dispersing the generated exercise load. A substrate stage (10) on which a substrate (20) is mounted and movable in the Y direction, and a component supply device (7) sandwiching the substrate (10)
Suction nozzles 31a to 31d, 6 that can move in the X direction between 1 and 74 independently of the movement of the substrate stage.
1st and 2nd mounting heads 30 equipped with 1a to 61d,
60 are provided. The first and second mounting heads are alternately moved in the direction of the board, and the components sucked by the respective suction nozzles are mounted on the board. At this time, the acceleration / deceleration of the second mounting head is controlled so as to cancel the force generated by the acceleration / deceleration of the first mounting head. Thereby, the exercise load generated due to the movement of the mounting head can be reduced or dispersed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus for mounting components such as electronic components on a substrate.

[0002]

2. Description of the Related Art In such a component mounting apparatus, a chip component such as an electronic component supplied from a component supply unit is suctioned by a suction nozzle mounted on a suction head, and is conveyed to a predetermined position on a circuit board. It can be roughly divided into three types according to its configuration.

[0003] First, the components sequentially supplied from the component supply unit are sequentially sucked by a plurality of suction nozzles arranged on a rotary head, and the substrate is moved in the X and Y directions below the rotary head so that the substrate is moved. The component is mounted at a predetermined upper position, and is characterized in that the board moves on a plane in the XY directions.

Second, a mounting head provided with a suction nozzle for sucking a component is moved in either the X direction or the Y direction, and a substrate on which the component is mounted is moved in a plane perpendicular to the mounting head. The mounting head moves in the X (Y) direction and the substrate moves in the Y (X) direction, and the device that moves in the X or Y direction separates. There is a feature in the place.

On the other hand, the third one is that the mounting head is X
It moves to a predetermined position on the board in the Y direction and mounts the component on the fixed board. Unlike the first one, the board is fixed and the mounting head moves in the XY directions. There is.

In these component mounting apparatuses, a method of moving a substrate or a mounting head in the X or Y direction is disclosed in Japanese Patent Laid-Open No. 5-2 / 5-2.
As described in Japanese Patent No. 67896, this is a method of converting the rotation of a rotary motor into a linear motion of a substrate or a mounting head via a linear motion conversion element component such as a ball screw, a sliding screw, a rack and pinion, and a belt. On the other hand, a component mounting apparatus that moves elements using a linear servomotor without using the linear motion converting element parts as described above is disclosed in Japanese Patent Application Laid-Open No. Hei 5-41596 or Japanese Patent Laid-Open No. Hei 4-28619.
No. 8 publication.

The second type of XY separation type component mounting apparatus is provided with a tool stage for nozzle replacement which holds a plurality of suction nozzles. In the same direction, it is placed between the feeder (component supply device) and the substrate stage, or placed on the substrate stage, or arranged in front of the feeder. When the nozzle is replaced, it moves under the mounting head, and the suction nozzle is replaced. ing. Also, Japanese Patent Application Laid-Open No. 3-78295
In the component mounting apparatus disclosed in the publication, the tool table is movable in parallel with the substrate stage, and this is arranged adjacent to the substrate stage.

In any of the component mounting apparatuses, the suction nozzle does not always pick up the component in the correct posture. Therefore, the suction position of the component is recognized by the recognition device, and the angle deviation of the component or the center of the suction and the center of the component are detected. Are mounted on a substrate by correcting the positional deviation and the like, and correcting these positional deviations.

As a method for recognizing the suction attitude of the component, for example, as proposed in Japanese Patent Application Laid-Open No. 61-265230, a recognition means is disposed on a table shaft on which a mounting head moves, and a suction nozzle is provided. Recognition of picked-up parts is performed. According to JP-A-8-78895,
The suction component is recognized by a line sensor provided on the holding head via a pair of mirrors disposed between the feeder and the substrate, and the positional deviation is corrected.

Further, in the first and second types of component mounting apparatuses, when the substrate stage is driven, the moving speed and acceleration of the substrate stage are controlled in order to prevent the components mounted on the substrate from dropping and displacing. The method of slowing down is adopted. However, in this method, the mounting efficiency is unnecessarily deteriorated, and Japanese Patent Application Laid-Open No. 61-160999 proposes to mount components in ascending order at the moving speed of the stage determined from the size of the components. ing. Also,
Japanese Patent Application Laid-Open No. 61-161800 proposes reducing the acceleration of the substrate stage for large components and increasing the acceleration of the substrate stage for small components.

[0011]

In these conventional component mounting apparatuses, in order to improve the mounting tact time and to obtain high productivity, the above-described first and second methods for simultaneously moving the mounting head and the board are required. It is necessary to disperse the motion load of a machine element moving at high speed, and to linearly move the substrate on one axis or plane mainly by using linear conversion element parts. I have dealt with it.

To solve these problems, the problems of the conventional method will be described by dividing them into the following (1), (2), and (3). (1) The first problem is that Is a problem,
There are problems such as an increase in size of the device and an increase in exercise load.

For example, the structure of the feeder will be described. In the first type of component mounting system, a plurality of suction nozzles arranged thereon are sequentially opposed to the feeder by rotating a rotary head. Therefore, only one line of feeders can be arranged on the suction point side of the rotary head. Further, if a method of arranging a plurality of feeders radially in accordance with the suction points of the suction nozzles in order to avoid this is employed, there is a problem that the space becomes large and it is difficult to replace parts at once.

On the other hand, in the second type of component mounting apparatus, instead of the first type with a high price range, the structure is simple and the cost is low. However, the rotation of the rotary motor is controlled via the conversion element. Since the motion is converted into a linear motion and the mounting head or the substrate is moved in the X and Y directions, the arrangement of the feeder is restricted. For example, as shown in Japanese Patent Application Laid-Open No. Hei 5-267896, feeders are provided on both sides in the substrate transport direction.
Proposals have also been made to arrange the surfaces, but this required two station occupied areas.

Further, Japanese Patent Application Laid-Open No. 5-267896 describes
In Japanese Patent Application Laid-Open No. 7-30292, which employs a one-station system instead of a station system, a two-sided feeder is arranged so as to be movable in a substrate transfer direction, and one or a plurality of mounting heads are arranged at right angles to the feeder. However, moving a feeder having a larger mass than the mounting head has a problem in terms of exercise load, and has disadvantages such as an increase in energy consumption and an increase in the size of the apparatus. In this publication, three rotary motors and three ball screws are used as an embodiment for moving a plurality of mounting heads, and these arrangements require considerable space. For the above reasons, install multiple heads,
This method of moving a heavy feeder has disadvantages in that the size of the apparatus is increased and the exercise load is increased.

On the other hand, the method disclosed in JP-A-3-203298 or JP-A-5-15497 has been proposed in which two stations are mounted alternately on the same axis. Since the movement mechanism is an XY integrated mechanism, exercise load cannot be dispersed and energy consumption is disadvantageous. The station moves on the recognition device, so that the moving distance of the station is reduced by the suction and the mounting position. There is a problem that the productivity is reduced because the moving distance is longer than when moving to a straight line.

Further, regarding the arrangement of the tool stage for replacing the suction nozzle provided on the mounting head, a structure in which the tools are arranged in parallel with the traveling of the mounting head between the substrate stage and the feeder is a structure in which the feeder and the substrate stage are arranged. The disadvantage is that more space is required between them. On the other hand, in the method of arranging the tool stage adjacent to the substrate on the substrate stage, the tool stage is added to the load of the substrate stage, which causes an obstacle to speeding up and a structural limitation. In other examples, there is a problem that the feeders are arranged only on one side of the rear surface, so that the moving amount of the head stage is increased, and the area occupied by the apparatus is increased.

The conventional method of linearly moving the substrate or the mounting head converts the rotation of the rotary motor into a linear motion via a linear motion conversion element component. Since the linear motion conversion element is interposed, the following method is used. There was a problem.

(A) The rigidity, efficiency, and reliability are lower than that of the rotary motor alone due to the linear motion conversion element.
Need cost for linear motion conversion element parts,
(C) Since it is difficult to completely remove the backlash of the linear motion conversion element, the accuracy is reduced accordingly.
(D) When a plurality of movers are provided on one axis, there are restrictions in terms of the arrangement space, the structure, and the cost. (E) High speed when an object moves linearly over a long distance; The so-called intermittent operation that repeatedly moves a short distance,
Incompatible, in particular, with respect to (e), if the required acceleration torque is T

[0020]

(Equation 1)

(Where m = conveyed mass, l = ball screw lead, ω (with an abbreviation above) = angular acceleration), so if the transport speed during movement is to be increased, lead l must be increased. However, as a result, the acceleration torque is increased, so that it is apparent that high acceleration / deceleration and high-speed performance are hardly compatible.

Regarding (c), for example, in order to reduce the backlash of the ball screw, there is only a means for applying a preload, which causes an increase in load torque and an increase in motor capacity. (A), (d),
As a complex problem related to (e), JP-A-7-30
As shown in Japanese Patent Publication No. 292, when a plurality of movable parts are provided on one axis, a corresponding space is required, and the longer the moving distance is, the larger the diameter of the ball screw becomes. As a result, the nut portion is large and the mass is increased, so that the efficiency is reduced, the load is increased, and the motor capacity is increased.

As described above, in the conventional mounting apparatus, the size of the entire apparatus increases, the load due to the moving configuration of the mounting head or the substrate increases, the energy consumption increases, and the mounting efficiency deteriorates. was there.

(2) Further, since the suction nozzle does not always pick up the component in the correct posture, the suction position of the component is recognized by the recognition device, the positional deviation at the time of suction is corrected, and the mounting on the substrate is performed. To do so, a component recognition device is required, and there are problems associated with this.

For example, Japanese Patent Application Laid-Open No. 61-265230 discloses that when the mounting head reaches the position of the recognition camera,
The head is stopped once to recognize the position error of the component with respect to the mounting head, but this method causes the time loss required for stopping and re-moving the mounting head, which reduces the productivity in mounting components. There is a problem to make it.

As means for solving this problem, Japanese Unexamined Patent Application Publication No.
According to JP-A-78895, a line sensor mounted on a holding head by disposing a mirror below a path along which the holding head moves and inverting the image of the lower surface of the component by 180 ° by the mirror while the holding head is moving toward the substrate. It has been proposed to read by: According to this, it is not necessary to temporarily stop the holding head to image the component, and the above problem can be solved. However, the following problem occurs.

First, in order to obtain a two-dimensional image by a line sensor, if the line direction is horizontal scanning, the vertical scanning must be obtained by moving the holding head. In order to achieve this, it is necessary to perform deceleration, synchronous constant-speed movement, intermittent operation, etc., in accordance with the detection speed of the sensor, by adjusting the running speed from just before the component approaches the field of view of the mirror. In addition, the mechanical backlash caused by this operation, the accuracy and reliability of the transmission mechanism are affected, and the tolerance for mounting accuracy must be increased. In addition, the reflecting mirror extends over the entire surface of the head on the path There is a problem in management such as maintenance of flatness of mirror, angle for facing, parallelism, cleaning of dust, and the like because of installation, and there is a problem that it is insufficient in terms of productivity improvement.

(3) A third problem is that, in the above-described first and second types of mounting systems, the temporarily mounted components are shifted and dropped in some cases because the board is moved. It is mentioned. To cope with this problem, Japanese Patent Application Laid-Open No. 61-161800 proposes mounting the substrate by adjusting the substrate speed and acceleration by dividing large components and small components. However, there are actually large and small parts that cannot be determined, and because the method of changing the mounting order of parts has been taken into consideration in consideration of productivity, it is assumed that acceleration and deceleration are reduced in all cases, and the performance of the equipment is reduced. I couldn't pull it out enough.

Japanese Unexamined Patent Publication No. Hei 6-310898 proposes a method of determining the acceleration of a substrate stage at which a component does not fall off and is displaced experimentally. The limit acceleration related to displacement is not determined.For example, when a mounted component on a viscous body receives a force in the lateral direction, the component tilts, and from this point on, a rotational moment acts on the component. There was a problem that many experiments had to be repeated in order to determine.

Accordingly, the present invention has been made to solve the above-mentioned problems, and can simplify the entire apparatus configuration, increase the mounting tact, and improve the efficiency of mounting components on a substrate. It is an object of the present invention to provide a component mounting apparatus capable of performing the following.

[0031]

According to the present invention, in order to solve the above-mentioned problems, a suction head having a suction nozzle is moved between a substrate and a component supply device, and a component supplied from the component supply device by the suction nozzle is moved. In a component mounting apparatus that adsorbs and mounts at a predetermined position on a substrate, a substrate stage on which the substrate is mounted and can be moved in a predetermined direction and a component supply device interposing the substrate therebetween are orthogonal to the predetermined direction. A plurality of mounting heads equipped with suction nozzles that can move independently of the movement of the substrate stage in the direction, and control means for preventing the running interference of the plurality of mounting heads in order to run the plurality of mounting heads on the same movement axis. In addition, a configuration is adopted in which a plurality of mounting heads are moved in the direction of the substrate and the components sucked by the suction nozzles are mounted on the substrate.

In such a configuration, since a plurality of mounting heads are moved in the predetermined direction in the direction of the substrate with the substrate interposed therebetween, the occupied space can be reduced, and the work of mounting components by suction can be performed in parallel, and the mounting efficiency can be improved. Can be improved.

According to the present invention, in a component mounting apparatus for mounting a component at a predetermined position on a substrate, a mounting head movable in a predetermined direction with respect to the substrate, a suction nozzle mounted on the mounting head, Recognition means mounted on the mounting head for recognizing the suction attitude of the component sucked by the nozzle via an optical reflection means arranged along the movement path of the mounting head, wherein the reflection surface of the optical reflection means has a mounting surface , And extends over a predetermined section in parallel with the movement path of the mounting head, and the adsorbing posture is recognized by the recognition means while the mounting head is moving in the predetermined section.

In this configuration, since the optical reflection element does not shake, accurate measurement of the component attitude can be performed while the mounting head is running, the accuracy of component position recognition and the speed are increased, and the mounting efficiency is increased. be able to.

In the present invention, the suction head having the suction nozzle is moved between the substrate and the component supply device, and the component supplied from the component supply device is suctioned by the suction nozzle and mounted on a predetermined position of the substrate. In the component mounting apparatus, a plurality of mounting heads each mounted with a suction nozzle movable in a predetermined direction between the component supply device with the substrate interposed therebetween, and the plurality of mounting heads pick up or mount components by the suction nozzle. For this reason, a configuration having control means for controlling acceleration / deceleration of another mounting head so as to cancel out a force generated by acceleration / deceleration of one mounting head when moving between the substrate and the component supply device is also adopted. .

In this configuration, the exercise load generated by the movement of the mounting head can be reduced or dispersed, and the moving speed of the mounting head can be increased, so that the mounting efficiency can be improved.

Further, according to the present invention, in a component mounting apparatus for mounting a component supplied from a component supply device by a suction nozzle and mounting the substrate at a predetermined position on the substrate, a substrate stage capable of mounting the substrate and moving in a predetermined direction. And means for limiting the acceleration of the movement of the substrate stage based on the position of the center of gravity and the radius of rotation of the components mounted on the substrate, or promotes the evaporation of the solvent of the cream solder applied on the substrate Also, a configuration having a means for cooling or a means for cooling the cream solder applied on the substrate is adopted.

In such a configuration, the board stage can be increased to the limit acceleration while preventing the components from being displaced or falling down on the board, so that the mounting efficiency can be drastically improved.

[0039]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

[Explanation of Overall Configuration] FIGS. 1 to 5 show an embodiment of a main component of a component mounting apparatus according to the present invention for mounting chip components such as electronic components (hereinafter simply referred to as components) on a substrate. Is shown.

In the plan view of FIG. 1, the X axis is the substrate transport direction (as viewed from the arrow), and the direction orthogonal thereto is the Y axis. The base 1 has a substantially cross shape, and a substrate stage 10 is disposed substantially at the center. As shown in detail in FIG. 3, the substrate stage 10 can be moved along the Y-axis by guides 13 and 14 by a Y-axis linear servomotor 12 including a magnet 11, a coil, and a yoke. The position is detected by the encoder 15 (the detection head is not shown), and the position thereof is controlled to a predetermined position by a controller described later.

On both sides of the substrate stage 10,
Substrate transfer conveyors 16 and 17 for transferring the substrate 20 to the substrate stage 10 are arranged. When the substrate 20 is transferred to the substrate stage 10 by the substrate transfer conveyors 16 and 17, the clamp member 21 slides in the Y-axis direction. Then, the substrate 20 is held on the substrate stage 10.

Further, on the upper surface of the base 1, stands 2 and 3 are erected from places avoiding the substrate stage 10 and the substrate transport conveyors 16 and 17, and the stands 2 and 3
The shaft mount 4 is supported. The X-axis pedestal 4 can reciprocate in the X-axis direction by the X-axis linear servomotor along the guide 35 independently of each other within a range that does not physically interfere with other members or devices on the X-axis. A first mounting head (X1 stage) 30 and a second mounting head (X2 stage) 60 are provided. First and second mounting heads 30,
Reference numeral 60 denotes a similar configuration. As shown in FIG. 1, each suction head has suction nozzles 31a to 31d, 61a to 61d for sucking components in a manner sandwiching the X-axis pedestal 4, and a component recognition or board position. A recognition device for recognition is attached.

The base 1 also has a feeder (component supply device) 7 for supplying components mounted on the substrate 20.
1 to 74 are arranged. As shown in FIG. 1, the feeders are arranged on a total of four surfaces on both sides of the base 1 in the X and Y axes, and the suction positions of the components by the suction nozzles are parallel to the X axis and are attached to the mounting heads 30 and 60. It is coincident with the movement center line of the mounting nozzle.

The suction nozzles 31a, 31 of the mounting head 30
b sucks the component supplied from the feeder 71, and the suction nozzles 31c and 31d of the mounting head 30
2 and the suction nozzles 61a and 61b of the mounting head 60 apply the components supplied from the feeder 73 to the suction nozzles 61c and 61d of the mounting head 60.
Sucks the components supplied from the feeder 74, respectively.

As shown in FIG. 3, a tool stage 90 having a plurality of replacement suction nozzles 90a is provided. The tool stage 90 is driven separately from the substrate stage 10 on the Y axis. Is driven in the Y-axis direction along the Y-axis guides 13 and 14 by the linear servo motor 91 for movement, and moves directly below the suction nozzles mounted on the mounting heads 30 and 60 moving on the X-axis. Replaced with the suction nozzle installed so far. The position of the tool stage 90 is detected by the encoder 15 and positioned at the target position.

Further, as shown in FIG. 3, mirrors (or half mirrors) 50 to 53 and 50 'to 53' are arranged along the moving path of the mounting head with the substrate stage 10 interposed therebetween. 53 are as described below.
The image of the component sucked by each suction nozzle of the mounting head 30 is guided to a recognition camera mounted on the mounting head 30, and similarly, the mirrors 50 ′ to 53 ′ are images of the component sucked by each suction nozzle of the mounting head 60. Is guided to a recognition camera mounted on the mounting head 60.

The two mounting heads 30 and 60 are electrically controlled so as not to physically interfere with each other.
Shock absorbers 93 and 94 for absorbing the collision energy of the linear servomotor are installed on the surfaces facing each other to prevent a collision, and both ends of the X-axis pedestal 4 collides with each end of the mounting head. Shock absorbers 95, 96, 97, and 98 for absorbing the energy of the above. Instead of the shock absorbers, permanent magnets capable of sufficiently repelling the collision energy may be mounted facing each other, or may be replaced with a shock-absorbing material such as rubber.

[Configuration of Mounting Head and Recognition Device] FIG. 5
Are suction nozzles 31a, 3 mounted on the mounting head 30;
FIG. 3C is a cross-sectional view of the vicinity of the mounting head when viewed from the direction of the arrow when 1c sucks components from the feeders 71 and 72 and moves from left to right in FIG.

In FIG. 5, an X-axis linear servomotor 32 is arranged on an X-axis support base 4 fixed by a stand 2. The X-axis linear servomotor 32 is composed of a stator composed of a magnet array 33 fixed to the gantry 4 in the X-axis direction, and a movable element opposed to the stator and composed of a coil and a yoke 34 with a gap. Head 3
0 is reciprocated in the X-axis direction along the rail guides 35, 35 'by the linear servomotor 32.

Rail guides 36, 36 'slidable in the vertical direction (Z direction) are locked on both sides of the mounting head 30, and Z-axis linear servomotors 37, 37' are respectively engaged with the rail guides 36, 36 '. Stator magnet 3
8, 38 'are fixed. In opposition to this, a mover formed of a coil and yokes 39, 39 'with a gap is fixed to Z-axis driving plates (Z stages) 40, 40', and the Z-axis driving plates 40, 40 ' 3
It can reciprocate in the Z-axis direction along 6 '. The positions of the Z-axis driving plates 40 and 40 'are detected by linear encoders 47 and 47' (detection heads are not shown), and the positions are positioned at target positions.

At the lower end of the Z-axis driving plates 40, 40 ', a suction nozzle rotating motor (built-in encoder for angle detection) 41 is provided.
The suction nozzles 31a, 31c are fixed to the motor shaft via chucks 42a, 42c for nozzle replacement.
c is attached. The suction nozzles 31a, 31
c is a feeder 71 by a vacuum from a negative pressure source (not shown).
Components 76 and 77 supplied from 72 are vacuum-sucked, respectively.

The mounting head 30 and the Z-axis driving plate 40
The springs 43a and 43c are suspended between the 40 'and the springs for compensating the gravity of the Z-axis driving plate and its component parts. , 37 ′.

Further, a mounting table 45 is fixed substantially at the center of the mounting head 30, and the mounting table 45 is used to image and recognize the suction posture of the components 76 and 77 sucked by the suction nozzles 31a and 31c. Are mounted with their optical axes parallel to the nozzle axis.

On the other hand, a mirror base 48 is mounted on the base, and the mirror base 48 is provided with feeders 71 and 72 in FIG. 1 so as not to interfere with the running of the mounting head 30.
1 and is fixed between the substrate stage 10 (not shown in FIG. 1). An optical reflection element, for example, a half mirror 50, mirrors 51 and 52, and a half mirror 53 are arranged on the mirror base 48. The reflecting surfaces of the mirrors 50 to 53 extend long along the running path of the mounting heads 30 and 60 in the X-axis direction. Light sources (eg, LEDs) 54, 54 'for illuminating the components sucked by the suction nozzles are arranged on the mirror base 48 below the half mirrors 50, 53 over the entire length of each half mirror.

Each of the mirrors 50 to 53 has a reflecting surface as shown in FIG.
Are mounted on the mirror table 48 at an angle of about 45 degrees, and the component 76 sucked by the suction nozzle 31a is illuminated by the light source 54 via the half mirror 50, and the image thereof is reflected by the half mirror 50 and the mirror 51. The component 77, which is reflected by the camera 46a and picked up by the recognition camera 46a, is sucked by the suction nozzle 31c, is illuminated by the light source 54 'via the half mirror 53, and the image is reflected by the half mirror 53 and the mirror 52 for recognition. The image is captured by the camera 46c. The reflecting surfaces of the mirrors 50 to 53 extend in parallel with the moving direction of the mounting head over a predetermined section L (FIG. 2), and while the mounting head moves in the predetermined section L, the suction nozzle 31a ( The suction posture of the component sucked by 31c) is captured and recognized by the recognition camera 46a (46c).

The above description has been made in relation to the suction nozzles 31a and 31c of the mounting head 30, but the suction nozzles 31b and 31d of the mounting head 30 are similarly operated by the corresponding nozzle rotation motor, chuck, and chuck. A recognition camera or the like is provided, and the suction nozzle 31b (31d) moves while the mounting head 30 moves in the predetermined section L of the mirrors 50 to 53.
The suction postures of the components picked up by are picked up and recognized by the recognition cameras provided correspondingly. The mounting head 60 is also configured in the same manner as the mounting head 30. A nozzle rotation motor, a recognition camera, and the like are provided for each of the suction nozzles 61a to 61d of the mounting head 60, and further, for the mirrors 50 to 53. Mirrors (one of which is shown in FIG. 2, 50 ′) are provided.
Images of the components sucked at a to 61d are respectively captured via the corresponding mirror and the recognition camera.

The current positions of the mounting heads 30 and 60 are as follows:
It is detected by an encoder 65 attached to the gantry 4 (the detection head is not shown), and is positioned at a predetermined position by a controller described later.

The mounting head moves on the substrate 20 fixed to the substrate stage, and one (or a plurality of recognition cameras) of recognition cameras mounted on each mounting head, for example, 46
The specified mark on the substrate 20 is imaged by a, and the set position of the substrate 20 set on the substrate stage before mounting is recognized.

In FIG. 5, covers 85 and 85 ′ are attached to the stand 2 on both sides of the gantry 4 for safety, protection of the moving body and soundproofing.

[Cooling of Substrate] In this embodiment, the substrate 20
Is cooled. The reason for cooling the substrate will be described below. When the substrate is cooled, the cream solder is also cooled accordingly. As for the physical properties of the cream solder, the viscosity increases as the temperature decreases. In a method of mounting a component by moving a substrate on a substrate stage, the force for holding the component largely depends on the viscosity of the cream solder.

FIG. 6 shows an assumed model of cream solder. The component 80 is mounted on a substrate 81 by cream solder that can be modeled by a spring having an elastic coefficient k and a damper having a viscosity coefficient c. Therefore, the force acting on the component changes with the displacement and speed of the spring and the damper.

The component deviation is a value obtained when an external force acts on the component (the value obtained by multiplying the acceleration α when the substrate is moved by the mass m of the component itself,
First, the yield value f tries to resist these forces against m · α = F (force acting on the electronic component) or its own inertial force, but when the external force or inertia is larger than the yield value f, the component starts to move. . Once the component starts moving, it gradually shifts from its originally mounted position due to the magnitude of its external force / inertial force and the number of repetitions, and the contact area with the cream solder decreases, and in extreme cases, falls off. Therefore, it is necessary not to apply an external force or an inertial force higher than the yield value f to the component in order not to displace the component.

For this reason, in the present invention, the yield value is increased by lowering the cream solder temperature, thereby preventing the components mounted on the board from shifting or falling, and enabling the board stage to move at a higher speed.

As an example of the cooling means of the cream solder,
Cold air is generated using compressed air to blow cold air from the back or front surface of the substrate. As a result, the temperature of the entire substrate can be lower than the ambient temperature (room temperature). This configuration is illustrated in FIG.

4A and 4B, each clamp member 21 slides in the Y-axis direction by a driving member 23 driven by a driving mechanism (not shown), and holds the substrate 20 on the substrate stage. At the same time, the clamp member 21 is formed with a shaft hole 21 a in the X-axis direction and a plurality of downward blow holes 21 b communicating with the shaft hole, and is sent from a cooling device 22 attached to the clamp member 21. Cool air is blown onto the substrate 20 through the plurality of air holes 21b to cool the cream solder on the substrate 20.

On the other hand, as another means for preventing the components mounted on the board from shifting easily, a volatilization promoting device may be provided instead of the cooling device. Similar effects can be obtained with this volatilization promoting device. This will be described below.

The cream solder is mainly composed of two components, a solder ball and a flux, and the flux contains an organic solvent. The flux secures the viscosity by this organic solvent. The components mounted on the cream solder are apt to be misaligned while the organic solvent is contained in the flux. Maintains a state in which the lead portion when mounted is embedded in the cream solder.

If the components are left to some extent after being mounted, it can be confirmed that the maximum acceleration (of the substrate stage) at which the components do not shift is more than doubled. A volatilization amount corresponding to the natural volatile content or a volatilization accelerating device for substantially evacuation is attached to the clamp member (in place of the cooling device 22), and the organic solvent is forcibly volatilized by ventilating, so that the cream solder is removed. Fluidity can be eliminated. in this case,
Since the cream solder maintains the state in which the lead portion of the component is sunk, the component is less likely to be displaced, so that the substrate stage can be moved at a higher speed. Further, a cooling device and a volatilization promoting device may be used together, or a cooling device may be mounted on the substrate stage 10.

Further, in order to prevent the mounting position of the component from shifting, the movement acceleration of the substrate stage is limited. The maximum allowable acceleration of the substrate stage is obtained as follows for a low-profile flat component such as a QFP.

The electronic component information held by the device controller includes an area A where the lead contacts the cream solder, a component mass m, and the like, and these are stored in the mounted component data portion. Assuming that the yield stress obtained by dividing the yield value of the shear resistance f at a shear rate of 0 by the area is σ, σ = f / A, and f
= Σ · A. On the other hand, the force F acting on the component is F
= M · α and F ≦ f, the maximum allowable acceleration of the substrate stage can be defined as α ≦ σ · A / m from the shear resistance for each data of f. The maximum allowable acceleration of the board stage 10 is determined for each component and each cream solder based on the calculation result according to this equation.

On the other hand, as shown in FIG. 7, in the case of a component 80 having a high shape, the region of viscosity and elasticity shown in FIG. 6 is obtained. Or a major factor in the fall. in this case,
7A and 7B, the cream solder 82 on the substrate 81 on which the component 80 receiving the acceleration α is placed is arranged in the acceleration direction, and in FIGS. 7C and 7D, Lined up. As can be understood from the drawing, the easiness of falling depends not only on the height of the center of gravity of the component but also on the turning radius of the component, that is, the mounting direction. As described above, since the operating direction of the substrate is in the uniaxial direction (Y direction) depending on the mounting position (direction) of the lead portion, the inclination of the component is greatly affected.

Therefore, when the height of the component is large, the maximum allowable speed of the substrate stage is calculated in consideration of the position of the center of gravity and the radius of rotation of the component. As shown in FIG. 7, assuming that the pulling resistance force (the product of the tack value and the contact area) is Pc, the height of the center of gravity of the component 80 is h, and the turning radius is b, m · α · h <b
When the condition of Pc is satisfied, the component 80 does not fall down. Therefore, by setting the maximum allowable acceleration of the substrate stage 10 to α ≦ b · Pc / (m · h),
Component 8 mounted on cream solder 82 of substrate 81
Substrate stage 1 without shifting the position of 0 or falling down
0 can be accelerated to the maximum.

[Structure of Controller] FIG. 8 is a block diagram showing a structure of a controller for driving and controlling the above-described elements.

In the same figure, what is indicated by reference numeral 100 is
A CPU (Central Processing Unit) that controls the entire operation,
The CPU 100 has a function of providing an output signal by selecting, comparing and judging an operation for giving an operation command to each actuator in accordance with various signals and data input via the bus 101 and corresponding necessary data. There is.

The solder data section 102 is composed of a memory for recording the above-mentioned solder characteristics (shear resistance f and tack value and data of the tensile resistance Pc calculated from the following area A). Are various component data supplied from the feeder (for example, component type, shape, mounting position, other component mass m required for calculating the maximum allowable acceleration of the board stage, area A where the lead contacts the cream solder). , The position of the center of gravity, the radius of rotation, etc.).

The CPU 100 of the device controller calculates the maximum allowable acceleration of the board stage 10 after mounting the components for each component based on the data stored in the solder data portion 102 and the mounted component data portion 103 as described above. Then, the acceleration of the substrate stage is limited to the calculated maximum allowable acceleration.

The process management system 104 is a host computer, and has a function of instructing the operation of the mounting apparatus. A camera Z1 indicates a component imaging recognition camera 46a mounted on the mounting head 30 in FIG.
Similarly, Zn is also shown with the recognition camera group mounted on the mounting head 30 or 60 omitted.

The image processing unit 105 recognizes the suction posture of the component sucked by the suction nozzle based on the component image data from each recognition camera, and calculates the suction position and inclination of the component.
This calculation result is sent to the CPU 100 via the bus 101 and provided as correction value data of the mounting position of the substrate, and the position of the mounting head or the substrate stage is corrected according to the correction value.

Also provided are various position sensors (not shown) necessary for the operation of the apparatus and various switches 106 used by the operator for inputting signals from these sensors and switches via the interface 107 to the CP.
It is taken in by U100.

Substrate, Tool Stage Drive Control Unit 110
Is a controller that calculates and outputs real-time acceleration / deceleration position control from the position information of the linear encoder 15 of the linear servomotors 12 and 91 for the substrate stage 10 and the tool stage 90 for nozzle replacement based on a command value from the CPU 100. Substrate stage 10, Tool stage 9
Based on the target position and the actual position of 0, the linear servomotors 12 and 91 are driven via the driver unit 111 to perform feedback control or feedforward control of the substrate stage 10 and the tool stage 90 to predetermined positions.

Similarly, the mounting head drive control section 120
The linear servomotor 32 for the mounting head 30 and the mounting head 60 via the driver unit 121 based on the position information from the linear encoder 65 for measuring the position of the mounting heads 30 and 60 in the X-axis direction and the command value from the CPU 100.
, A feedback control or feedforward control of each mounting head to a predetermined position is performed.

Further, the nozzle Z-direction drive control unit 130
Based on the position information from the linear encoder 47 for measuring the position of the suction nozzle 31a in the Z direction and the command value from the CPU 100, the suction nozzle 31a is provided via the driver unit 131.
The linear servomotor 37 for the suction nozzle 31
a is subjected to feedback control or feedforward control to a predetermined position. Further, the other suction nozzles 31b, 3
.. Are also driven by driving the linear servo motors corresponding to the respective suction nozzles.

The nozzle rotation drive control section 140 rotates the suction nozzle 31a via the driver section 141 based on information from a built-in encoder for measuring the rotation (θ) of the suction nozzle 31a and a command value from the CPU 100. The suction nozzle 31a is feedback-controlled to a predetermined angle by driving the motor 41a that drives the suction nozzle 31a.
31c... Perform the same control by driving the motor corresponding to each suction nozzle.

The linear servo motors 32, 66, 37, and 37 'that are driven in the X-axis and Z-axis directions assume that the mover side is a coil. It is provided corresponding to the number. When the stator side is a coil, a method of dividing the coil winding according to the moving range of the mover may be used, and in this case, the range in which the movers overlap and move can be further divided into a plurality. Since one mover always moves in the overlapping portion, the same effect can be obtained by controlling the switching of each winding.

Further, a valve solenoid other than the linear servomotor, driving of a feeder, a cooling device for cooling a substrate,
Alternatively, various other actuators and the like are driven by various drive circuits 150 in accordance with commands from the CPU 100, respectively.

Although not particularly shown, it is needless to say that when incorporated into a line organization, it has a communication function for exchanging information with another central processing unit (CPU).

[Description of Operation] The operation of mounting components in the above configuration will be described below.

The substrate placed at the entrance is carried to the substrate stage 10 by the substrate transport conveyor, and the substrate 20 is clamped on the substrate stage 10 by the clamp member 21.

The following is a description according to the time chart of FIG. In the figure, the horizontal axis represents time, and the vertical axis represents the amount of movement of each element. The movement of the substrate stage 10 is performed until the position detected by the linear encoder 15 reaches the target position. Is performed by the linear servomotor 12 driven through the driver unit 111 by the control unit. The mounting head 30 (60) is moved by the linear servo motor 3 driven by the mounting head drive control unit 120 via the driver unit 121 until the position detected by the linear encoder 65 reaches the target position.
2 (66), and further, the suction nozzles 31a to 31a to
The movement of 31d in the Z direction is performed by the linear servo motors 37 and 37 'driven by the nozzle Z direction drive control unit 130 via the driver unit 131 until the position detected by the linear encoder 47 reaches the target position. ,
Further, the rotation of the suction nozzles 31a to 31d is performed by the motors 41a to 41d driven by the nozzle rotation drive control unit 140 via the driver unit 141 until the angle detected by the built-in encoder reaches the target angle.

The mounting head 30 (X1 stage) sucks a component from a predetermined feeder based on the board mounting information from the mounted component data unit 103. That is, the time points t1 to t
At 4, the mounting head 30 moves as shown in FIG. 9, and at time t1, t2, t3, and t4, the suction nozzles 31c, 31a, 31b, and 31d move downward in the Z-axis direction to feeder 71, respectively. The component supplied from 72 is sucked, and when the component is sucked, it rises to its original position.
If the position of each nozzle and the position of the feeder that supplies the component match according to the board mounting information, the suction nozzles 31a to 31d
Alternatively, the components may be simultaneously picked up at each time.

At this time, the other mounting head 60 (X2 stage) moves to a predetermined position to recognize the position of the reference mark of the substrate 20 on the substrate stage (Y stage) 10 at time t2, and moves to time t3. The mark is imaged by one of the recognition cameras corresponding to the suction nozzles 61a to 61d, and the substrate 20
Is calculated, and a correction value of the component mounting position is calculated.

After the board recognition, the two mounting heads 30
60 moves in the same direction (time points t4 and t5), and at time point t6, the mounting head 30 that has absorbed the component moves to the position of the substrate 20 mounted on the substrate stage 10 that has moved to the predetermined position, and moves to another mounting head. The 60 moves on the feeders 73 and 74 to suck the next component.

In the meantime, the mounting head 30 is
3 (at time t5, the amount of movement is indicated by M1 corresponding to the length L of the mirror in the X-axis direction), the recognition cameras 46a to 46d corresponding to the suction nozzles 31a to 31d, respectively. (At that time is indicated by a vertical black dot), and each suction nozzle 3
The positions of the components sucked in 1a to 31d are respectively imaged by the corresponding recognition cameras.

The image processing unit 105 is connected to each recognition camera 46a.
Image processing is performed on the component image picked up in the range of .about.46d, and the suction posture is recognized. Then, based on the recognition result, the displacement and inclination of the suction center with respect to the component center in the X and Y directions are calculated. The inclinations of the components sucked by the suction nozzles 31a to 31d are t7 to t8, t6 to t7, and t, respectively.
The nozzle rotation motors 41a to 41a to 8 to t9 and t5 to t6
1d (the correction time is indicated by a horizontally long black dot in FIG. 9), and the displacement in the X direction is
The positional deviation in the Y direction via the control unit 120 and the mounting head 30 and the substrate stage 10 are corrected by moving the correction amount via the control unit 110, respectively.

In this way, at times t6, t7, t8,
At t9, the substrate stage 10 and the suction head 30 move by a predetermined distance based on the shift amounts in the X and Y directions with respect to the component mounting position, respectively, and the suction nozzles 31d, 31b, 31a, 3a
1c is rotated by a predetermined amount in order to correct the corresponding inclination and descends, and the components sucked by the suction nozzles are sequentially and accurately mounted at predetermined mounting positions on the substrate.

From time t9 to time t11, the mounting head 30 returns to the position of the feeders 71 and 72 again, and
At 1, t12, t13 and t14, the suction nozzles 31d and 31d
b, 31a, and 31c sequentially descend to suck the component, and thereafter, at time t16, the same recognition cameras 46a to 46a as at time t5.
6d is performed, and the same operation is repeated thereafter.

During this time, the mounting head 60 moves at time t10.
M corresponding to the length L in the X-axis direction of the corresponding mirror 50 '
2 and the suction nozzles 61a to 61d
Then, the camera shutter of the recognition camera corresponding to (1) is opened, the picked-up component is imaged, and the component is mounted on the board by the same operation as the mounting head 30.

As described above, the parallel operation of the component suction and the component mounting operation of the mounting heads 30 and 60 is repeated, and when all the components are mounted on one substrate, the substrate stage 10 is moved to the transport position of the substrate transport conveyor. Then, the clamp member 21 is opened to transfer the substrate.

Before the transfer of the substrate, the mounting accuracy inspection can be performed by making full use of all the cameras. In this case, the mounting accuracy inspection can be performed on all mounted components, but the inspection time can be shortened by performing the inspection only on long components such as ICs and connectors that require accuracy and components that are easily displaced. Can be achieved.

In the series of operations described above, the operation of the substrate stage 10 is based on the information about the shear resistance, the tensile resistance of the cream solder, the area of the lead portion of the component, the mass of the component, the position of the center of gravity, and the mounting direction. The maximum allowable acceleration of the substrate stage is input to the device controller, and the maximum allowable acceleration of the substrate stage is determined for each component as described above. Also determine the maximum acceleration of each component obtained from the shear resistance, the tensile resistance,
Rewrite the mounting order from the maximum acceleration / deceleration of the substrate stage to the minimum acceleration / deceleration. Rewriting may be manually input by an operator, automatically input by a device controller, or commanded by a line management computer.

In this manner, it is possible to operate at the substrate stage drive limit acceleration in which the influence of the cream solder characteristics is minimized, and to improve the mounting tact by accelerating the substrate stage to the maximum allowable acceleration. . At this time, as described above, it goes without saying that the substrate is cooled or the solvent of the cream solder on the substrate is volatilized.

Although not shown in the time chart of FIG. 9, the mounting heads on which the components have been mounted are t10 and t16.
In addition, it is also added that the substrate stage is retracted before the next component is picked up by the feeder, and the tool stage 90 has a function of moving right below the suction nozzle and replacing it with a necessary suction nozzle. Since the tool stage 90 is driven independently of the substrate stage 10, the forcible vibration to the base 1 can be reduced as much as possible by performing idle motion in the corresponding direction at the timing to cancel the acceleration / deceleration of the substrate stage. Can be.

In the present invention, the mounting heads 30, 60
Moves between the board and the component supply device for component suction by the suction nozzle or component mounting, the mounting head 30
The acceleration / deceleration of the mounting head 60 (30) is controlled so as to cancel the force generated by the acceleration / deceleration of (60). The acceleration and deceleration operations of the mounting head (X1 stage) 30 and the mounting head (X2 stage) 60 will be described with reference to FIG.

In FIG. 10, when the mounting head 60 moves to the feeder side, it is shown above the vertical axis, and when it moves to the substrate side, it is shown below, and the mounting head 30 is reversed. Further, the waveform shows a velocity waveform, and explains the cooperative operation thereof in comparison with the movement amount waveform of the mounting head. In addition, the gantry load in the lower part of FIG.
It represents the reaction force that is received.

First, at time t9, the mounting head 60 after component mounting on the board is accelerated in the direction of the feeders 73 and 74 (to the right in FIG. 1). At this time, the gantry 4 receives a leftward force due to the reaction. The mounting head 60 is a feeder 73,
At the point when the vehicle head reaches the upper portion 74 and starts to decelerate, the mounting head 30 that has already completed the pickup of the next mounted component starts to accelerate in the direction of the substrate (rightward). At this time, the mounting head 60,
30 is decelerated and accelerated in the same direction, the action on the gantry 4 is in the opposite direction, and no kinetic force acts on the gantry (in this case, the internal stress of compression and tension received in the longitudinal direction of the gantry 4 On the assumption that there is no problem).

At time t10, the mounting head 60 completes deceleration for stopping at the first component mounting position information on the feeder. At this time, the gantry 4 obtains a rightward reaction force, but the mounting head 30 completes the rightward acceleration and acts to reduce the reaction force. In this way, the order of component mounting and pickup can be operated so as to apply the minimum reaction force to the gantry 4 (t11 to t15). t15 ~
At t20, the operation directions of the mounting heads 30 and 60 are reversed, and the same operation is performed. This completes one cycle.

According to such a configuration, the reaction force received by the gantry is half that in the case where the two mounting heads are started simultaneously to replace the two mounting heads on the substrate, and the effect of the gantry upon mounting components is minimized. By being programmed, forced vibration as a vibration source of the gantry can be reduced.
In this manner, the operation acceleration direction of each mounting head is controlled in the reverse direction as much as possible to minimize the effects on the gantry 4 and the base 1, reduce vibration noise, and impede the component mounting accuracy affected by the vibration noise. I try to eliminate.

[Other Embodiments] FIG. 11 shows a method of changing the recognition field of view of a recognition camera according to the size of a component attached to the tip of a suction nozzle, and alternately imaging two components with the same recognition camera. FIG. 5 is a principle diagram showing a method for
The optical configuration after reflection by the mirror 51 for viewing the component 76 sucked by the suction nozzle 31a is shown.

The images of the parts sucked by the suction nozzle 31a are reflected on mirrors 161, 1 arranged along the optical axis 160a.
After being bent at right angles by 62, the light passes through the half mirror 163 and enters the large-view camera 165. The component image reflected by the half mirror 163 is reflected at a right angle by the mirror 164, and then is reflected by the camera 16 for the small visual field.
It is incident on 5 '. Also, in FIG. 5, the suction nozzle 31a
The image of the component sucked by the suction nozzle 31b, which is not visible behind, is bent at a right angle by a mirror 166 arranged along the optical axis 160b shown by a dotted line, and then reflected by the half mirror 163 to be large. Field of view camera 1
After passing through the half mirror 163, the light is reflected by the mirror 164 and enters the small-field camera 165 ′. The mirrors 161, 162, 164, 166
In addition, the half mirror 163 travels the same as the recognition cameras 165 and 165 ′ attached to the mounting head 30.

In this configuration, the suction nozzle 31a (31
If the component adsorbed in b) is a large component, the shutter of the large-view camera 165 operates in conjunction with the position information of the X-axis linear encoder 65, and the component image is captured by the large-view camera 165. In the case of a small component, the shutter of the small-field camera 165 'operates in conjunction with the shutter, and the component image is captured by the small-field camera 165'.

In this embodiment, the imaging field of view can be changed according to the size of the component, and the optical axes 160a and 16a can be changed.
Since 0b has a time shift from the X-axis travel, the same recognition camera can be used for the two suction nozzles 31a and 31b, and the cost is reduced. In addition, since the mirror 51 is a rectangle that extends long along the traveling path of the mounting head, it is possible to capture an image without blurring the component image while the component and the recognition camera are traveling.

The above description is based on the suction nozzles 31a and 31b.
However, the present invention can also be applied to imaging of the other suction nozzles 31c and 31d of the mounting head 30 and the components suctioned by the suction nozzles 61a to 61d mounted on the mounting head 60.

The illumination for picking up the component is illuminated by the LED light sources 54 and 54 'arranged behind the half mirrors 50 and 53 in FIG. 5, but instead of this arrangement, the mirrors 51 and 52 are used. The light sources 55 and 55 'may be arranged at the positions. At this time, mirrors 50 and 53
Is a total reflection mirror, and the mirrors 51 and 52 are half mirrors. Further, the illumination light sources 56, 5
6 'may be attached.

Further, as described above, the specified mark on the board 20 is imaged by the recognition camera, and the board 20 is mounted before mounting.
Although the set position is accurately recognized, not only the recognition of the board position information by each recognition camera but also the mounting accuracy inspection of the mounted component may be performed. In such cases, when recognizing the mark on the board or checking the mounting accuracy, arrange each optical member so that the optical path length from the mark or mounted component to the recognition camera is the same, or mount the recognition camera itself. Move up and down. In this case, the focus may be automatically adjusted by a recognition camera with an automatic focus function, or a lens may be further arranged in the middle to expand the field of view.

The number of mounting heads is not limited to two, but may be only one, or two or more mounting heads may be provided. Further, the number of suction nozzles mounted on one mounting head is not limited to two, but may be one suction nozzle, or two or more suction nozzles may be mounted on one mounting head. It may be mounted. In any case, recognition means such as a recognition camera are provided in accordance with the number of mounting heads or suction nozzles provided respectively.

For example, when three mounting heads are provided, one of which is configured to suck a component from a feeder near the substrate stage, and the other two mounting heads are configured to suck a component from a feeder at both ends, a feeder arrangement is provided. Restrictions such as optimization are small, and high productivity can be obtained by increasing the number of mounting heads.

When three mounting heads are provided, the first mounting head (X1 stage) is stopped at the mounting position on the substrate, and the third mounting head (X3 stage) is replaced with the second mounting head (X2 stage). Direction, stop at a position at a certain distance or in a close contact position, end the imaging by the start of the movement of the second mounting head, and then move the third mounting head to the first mounting head Can perform the same operation.

Further, the third mounting head may be provided with a component or board recognition device. in this case,
No recognition device is mounted on the first and second mounting heads.
It is possible to adopt a structure in which a recognition camera mounted on the first mounting head tracks and captures an image of the first or second mounting head. In this case, the weight of each mounting head can be reduced, the high-speed performance can be improved, and the effect that components can be directly imaged can be obtained. At this time, the first and third mounting heads are moved to the mounting position on the substrate at a constant distance or in close contact with each other at the same speed, and the performance aspects of the linear servo motor such as a method of recognizing components during the movement are improved. You can also use it. In addition, by providing the component and the board recognition device in the third mounting head, the load is dispersed, the capacity of the linear servomotor can be reduced, and the device can be made more compact.

When the third mounting head is mounted,
When the first and second mounting heads accelerate (decelerate) in either direction, the third mounting head is moved in the opposite direction at the same acceleration (deceleration) to greatly reduce the vibration in the X-axis direction. be able to.

When the third mounting head is mounted, there is a method of providing the third mounting head with a cooling device, a yield value measuring device, and the like. When a cooling device is provided, the cooling air can be directly blown onto the mounting surface, so that rapid cooling can be performed. Also, a dispensing (glue / cream solder) function can be added to the third mounting head.

Further, as for the substrate stage, a second substrate stage can be added to the basic configuration. In this case, similarly to the case where the movement of the two mounting heads is controlled so as to cancel the acceleration / deceleration, when the two substrate stages move, when one accelerates, the other decelerates. The load at the time of driving can be reduced.

As for the cooling device, the cooling stage is moved between the entrance and the component mounting position, that is, the substrate standby position (not shown).
May be provided. Here, after cooling the substrate (when the temperature of the substrate is lowered by the cooling device and becomes constant), the substrate is conveyed to the substrate stage 10 by the substrate transport conveyor, and the substrate 20 is clamped on the substrate stage 10 by the clamp member 21.
Further, a refrigerator may be built in the apparatus to cool the entire apparatus. In this case, the cream solder viscosity is high until the board enters and exits, so component misalignment is less likely to occur,
The effect of suppressing heat generation of the actuator is also obtained.

The detection head (not shown) for detecting the X-axis linear encoder 65 includes the mounting heads 30 and 60.
However, a linear encoder and a detection head for detecting the linear encoder may be attached to each mounting head.

The combination of the coil and the magnet of the linear servomotor used for the X and Y axes or the Z axis is not limited to the combination in which the movable side is provided with the coil and the fixed side is provided with the magnet.

[0126]

As described above, according to the present invention, the X-axis movement of the mounting head and the Y-axis movement of the substrate can be separated.
Since the reaction force received by each element of the axis and the Y axis is independently independent of one direction, the motor capacity can be reduced and the power consumption can be reduced by simplifying the structure and reducing the load. In addition, since a plurality of mounting heads are moved in a predetermined direction in the direction of the substrate with the substrate interposed therebetween, the occupied space can be reduced, and the work of sucking and mounting the components can be parallelized, and the mounting efficiency can be greatly improved. .

Also, since a plurality of mounting heads can alternately mount components on the substrate with the substrate interposed therebetween, the mounting tact can be improved.

Further, since a linear servomotor is used to drive the substrate stage and the mounting head, the moving time is greatly reduced as compared with the combination of the rotary motor and the linear motion conversion element, and the transmission of backlash and the like is delayed. Also, mechanical vibration is eliminated, and the mounting efficiency can be improved.

Further, when each mounting head moves between the substrate and the component supply device, the acceleration / deceleration of another mounting head is controlled so as to cancel out the force generated by acceleration / deceleration of one mounting head. Can be reduced or dispersed due to the movement load caused by the movement of the object.

Also, the posture of the component being picked up is determined by the recognition means (recognition camera) mounted on each mounting head via the optical reflection means (mirror) arranged along the movement path of each mounting head during the movement of each mounting head. Since the recognition is performed, accurate measurement of the component attitude can be performed while the mounting head is running since the optical reflection means does not shake, and the component position recognition accuracy and speed are improved.

Further, since the recognition means is attached to the mounting head, the component can be recognized without stopping the mounting head while transferring the component, and the stroke of the suction and mounting operation of the suction nozzle can be reduced to the shortest moving distance. As a result, productivity can be improved by shortening the vertical movement time.

Also, since a plurality of parts are recognized by the same recognition camera, the weight of the mounting head is reduced, and a field-of-view camera can be selected according to the shape of the parts. It is possible to provide a highly productive mounting apparatus that can cope with the development of the system.

Further, since the maximum value of the acceleration / deceleration of the substrate stage is limited in accordance with the characteristics of the mounted parts and the cream solder previously applied on the substrate, the movement of the substrate stage can be set to the maximum acceleration, and the maximum acceleration can be achieved. By limiting the acceleration, it is possible to prevent misalignment of components on the temporarily mounted board.

In addition, since the cream solder previously applied on the substrate is cooled or the solvent of the cream solder is promoted, the viscosity of the cream solder is increased, or the cream solder is promoted by promoting volatilization. Since the state in which the lead portion is recessed can be maintained, the limit acceleration of the substrate stage can be increased, and the mounting efficiency can be improved.

Further, since the component supply devices are arranged on both sides in the moving direction of each mounting head, it is possible to supply many components without moving the component supply devices. In addition, since the soundproof cover can be easily attached to each mounting head, effects such as improved safety and quietness can be obtained.

Also, since the tool stage for replacing the suction nozzle, which can move independently and coaxially with the substrate stage, is provided, the area occupied by the apparatus can be reduced without unnecessarily increasing the moving amount of the mounting head. The load on the substrate stage is reduced, enabling high-speed driving. Further, since feeders can be arranged on the front and rear surfaces of the substrate stage, the area occupied by the apparatus can be reduced even if a large number of feeders are arranged.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall configuration of a component mounting apparatus.

FIG. 2 is a side view showing the overall configuration of the component mounting apparatus.

FIG. 3 is a plan view showing a detailed configuration of a substrate stage.

FIG. 4A is a perspective view showing a substrate cooling structure,
(B) is a sectional view taken along line BB 'of (A).

FIG. 5 is a sectional view taken along the line A-A 'of FIG.

FIG. 6 is a model diagram showing a cream solder model.

7 (A) and 7 (C) are plan views of the component, and FIGS. 7 (B) and 7 (D) are side views of the component for explaining the inclination of the component mounted on the substrate.

FIG. 8 is a block diagram illustrating a configuration of a controller of the component mounting apparatus.

FIG. 9 is a timing chart showing an operation of component mounting.

FIG. 10 is a timing chart illustrating an operation of controlling acceleration / deceleration of two mounting heads.

FIG. 11 is an optical diagram showing another embodiment of the recognition device.

[Explanation of symbols]

 Reference Signs List 1 base 10 substrate stage 12 linear servo motor 15 encoder 20 substrate 30 mounting head 31a-31d suction nozzle 32, 37, 37 'linear servo motor 46a, 46b recognition camera 50, 53 half mirror 51, 52 mirror 54, 54' light source 60 Mounting head 61a-61d Suction nozzle 65 Encoder 71-74 Feeder

Continued on the front page (72) Inventor Akihiko Nakamura 8-Juku Corporation, 8-2-2 Kokuryo-cho, Chofu City, Tokyo (72) Inventor Yasufumi Nishii 1-Juki Stock, 8-2-2 Kokuryo-cho, Chofu City, Tokyo In-company (72) Inventor Kohei Maruyama 1 Juki Co., Ltd., 8-2-2 Kokuryo-cho, Chofu-shi, Tokyo

Claims (13)

[Claims] 1. A component mounting apparatus in which a suction head having a suction nozzle mounted thereon is moved between a substrate and a component supply device, and the suction nozzle sucks a component supplied from the component supply device and mounts the component at a predetermined position on the substrate. A substrate stage on which a substrate is mounted and movable in a predetermined direction; and a suction nozzle movable between the component supply device across the substrate in a direction orthogonal to the predetermined direction independently of the movement of the substrate stage. Equipped with a plurality of mounting heads, and control means for preventing the running interference of the plurality of mounting heads on the same movement axis, by moving the plurality of mounting heads in the direction of the substrate and controlling each suction nozzle. A component mounting apparatus for mounting a sucked component on a substrate. 2. The component mounting apparatus according to claim 1, wherein the substrate stage and the plurality of mounting heads are moved by a linear servo motor. 3. The component mounting apparatus according to claim 1, wherein a tool stage for replacing the suction nozzle is arranged so as to be movable independently of the substrate stage along a moving direction of the substrate stage. 4. A component mounting apparatus for mounting a component at a predetermined position on a substrate, comprising: a mounting head movable in a predetermined direction with respect to the substrate; a suction nozzle mounted on the mounting head; And a recognition unit mounted on the mounting head for recognizing the suction posture of the component via the optical reflection unit arranged along the movement path of the mounting head, wherein the reflection surface of the optical reflection unit is located on the movement path of the mounting head. A component mounting apparatus, which extends in parallel over a predetermined section, and wherein the suction posture is recognized by the recognition means while the mounting head is moving in the predetermined section. 5. The component mounting apparatus according to claim 4, wherein the positions of the substrate stage and the mounting head are corrected based on the recognition of the suction posture. 6. The component mounting apparatus according to claim 4, wherein said recognition means recognizes a board position. 7. The apparatus according to claim 4, wherein said recognizing means is constituted by a plurality of recognizing means having different visual fields, and the component is recognized by any one of the visual field recognizing means according to the type. The component mounting device according to any one of the above. 8. The suction head according to claim 4, wherein a plurality of suction nozzles are mounted on the mounting head, and one or each recognition means is provided for each suction nozzle.
The component mounting apparatus according to any one of the above. 9. A component mounting apparatus in which a suction head mounted with a suction nozzle is moved between a substrate and a component supply device, and a component supplied from the component supply device is suctioned by the suction nozzle and mounted at a predetermined position on the substrate. A plurality of mounting heads each mounted with a suction nozzle movable in a predetermined direction between the component supply device with the substrate interposed therebetween; and a plurality of mounting heads mounted on the substrate for component suction by the suction nozzle or component mounting. And control means for controlling acceleration and deceleration of another mounting head so as to cancel the force generated by acceleration and deceleration of one mounting head when moving between the component mounting apparatus and the component mounting apparatus. . 10. A component mounting apparatus for sucking a component supplied from a component supply device by a suction nozzle and mounting the component at a predetermined position on a substrate, wherein the substrate stage mounts the substrate and is movable in a predetermined direction; Means for limiting acceleration during movement of the substrate stage based on the position of the center of gravity and the radius of rotation of the component mounted on the component mounting apparatus. 11. A component mounting apparatus for picking up a component supplied from a component supply device by a suction nozzle and mounting the component at a predetermined position on a substrate, wherein the substrate stage mounts the substrate and is movable in a predetermined direction; Means for promoting the volatilization of the solvent of the cream solder applied thereon. 12. A component mounting apparatus for adsorbing a component supplied from a component supply device by a suction nozzle and mounting the component at a predetermined position on a substrate, wherein the substrate stage mounts the substrate and is movable in a predetermined direction; Means for cooling the cream solder applied thereon. 13. A device for fixing a substrate to a substrate stage, and cold air generating means connected to the fixing means,
13. The component mounting apparatus according to claim 11, wherein the cold air generated from the cold air generating means promotes volatilization of the solvent of the cream solder or cools the cream solder.