JPH1084178A - Arrangement method of minute substances and forming method of connection structure employing the arrangement method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an arrangement method which enables fine arrangement of minute substances easily and securely, and provide the forming method of a connection structure which enables the highly reliable connection of fine pattern pitch electrodes with conductive substances which are arranged by the arrangement method. SOLUTION: An ultraviolet radiation 4 is applied to an ultraviolet curing adhesive layer 2 formed on a substrate 1 by using a mask 3 to cure the adhesive layer 2. Then, minute substances 5 are brought into contact with the whole surface of the adhesive layer 2 and bonded to the parts of the adhesive layer 2 to which the ultraviolet radiation 4 is not applied. The unnecessary minute substances on the substrate 1 are removed. Or, a transparent substrate 1 may be employed and, after the minute substances 5 are arranged on the adhesive layer 2, the ultraviolet radiation 4 may be applied to the rear side of the substrate 1. Or, a patterned photoresist layer may be used as the adhesive layer 2. Further, by utilizing the above mentioned arrangement method, conductive particles are arranged on electrodes of a wiring board only and the other electrodes are connected to the electrodes of the board with the conductive particles therebetween to obtain a highly reliable connection structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for arranging a minute object at a target position, and more particularly to a method of arranging a conductor at opposite electrode terminal positions on two electric circuit boards. The present invention relates to a method for making an electrical connection.
The method of arranging the minute objects can be applied to an image forming apparatus by using a toner as the arrangement.

[0002]

2. Description of the Related Art FIG. 6 is a cross-sectional view showing a connection structure of an electrode pattern according to the prior art, in which 11 is a first wiring substrate, 12 is a second wiring substrate, 13 and 14 are electrodes, and 15 is an electrode. The conductive particles 16, 17 are adhesives. As shown in FIG. 6, conventionally, when joining fine electrode patterns,
An anisotropic conductive material exhibiting conductivity is used only for the contact pressing portion. For example, in the connection structure of a circuit disclosed in Japanese Patent Publication No. 3-40899, a mixture of conductive particles in an insulating adhesive is inserted between substrates, and the conductive particles are applied to the electrodes of both substrates. The electrical connection is made at the sandwiched and pressurized portions. In such a connection method,
When the connection pitch is reduced, there is a problem that conductive particles existing between the substrates and not originally contributing to the connection are likely to contact in the lateral direction, and a short circuit occurs.

[0003] Therefore, in the anisotropic conductive film disclosed in Japanese Patent Application Laid-Open No. 4-292803, a film having an insulating coating as a connecting material and containing a resin containing conductive particles dispersed therein is used. Since this connection material does not exhibit conductivity in an unpressurized state, there is no short circuit even if the connection pitch becomes fine and the connection materials come into contact with each other. However, this structure has a problem that the process of forming the connecting material is complicated and the manufacturing cost is increased.

As another example of the prior art, a mask having a through hole at a predetermined position is brought into close contact with a member having a surface viscosity, and after the conductive particles are put into the through hole, the mask is separated to form a conductive film. In some arrangements, the particles are arranged and then transferred onto the electrode terminals, so that the conductive particles are arranged only on the electrodes, so that a short circuit in the lateral direction does not occur. However, since the conductive particles are formed by forming a metal film on the surface of the resin particles, during the process of putting the particles into the through holes of the mask, the end surface of the through hole or the end surface of the particle moving means comes into contact with the conductive particles. In some cases, destruction or peeling of the metal film occurs, resulting in poor connection.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and an arrangement method capable of easily and reliably performing a fine arrangement of minute objects, and utilizing the arrangement method. It is an object of the present invention to provide a method for forming a connection structure of an electrode pattern, which can provide a highly reliable connection at a low cost even with a fine connection pitch by using conductors arranged in such a manner. .

[0006]

According to the first aspect of the present invention, a part of an adhesive layer made of an ultraviolet-curable resin provided on a substrate is irradiated with ultraviolet rays, and the adhesive layer is cured by curing the adhesive layer in the irradiated portion. Reducing the force, contacting the microscopic object on the entire surface of the adhesive layer, adhering the microscopic object to the non-irradiated portion of the ultraviolet light and arranging the microscopic object, removing unnecessary microscopic objects attached to the irradiated portion Characterized by having a step of performing

[0007] The invention of claim 2 is a step of adhering a minute object to the entire surface of an adhesive layer made of an ultraviolet-curable resin provided on a transparent substrate, and the step of adhering a part of the adhesive layer from the back side of the substrate. Irradiating a part of the adhesive layer with ultraviolet light, curing the adhesive layer in the irradiated part to reduce the adhesive force, and removing the minute object in the irradiated part to remove the minute object on the non-irradiated part of the ultraviolet light. The method has a step of arranging objects.

The invention according to claim 3 is a step of patterning a photoresist layer provided on a substrate by photolithography, and using the photoresist layer that has been patterned and remains on the substrate as an adhesive layer. The method is characterized in that it has a step of adhering and arranging minute objects on the layer.

According to a fourth aspect of the present invention, there is provided a method of adhering a minute object to the entire surface of a first adhesive layer made of an ultraviolet-curable resin provided on a transparent first substrate; A step of superposing a second substrate provided with a second pressure-sensitive adhesive layer and the first substrate to which the fine object is adhered, and
Irradiating a part of the pressure-sensitive adhesive layer with ultraviolet light, curing the first pressure-sensitive adhesive layer at the irradiated portion to reduce the adhesive force, and peeling the first substrate from the second substrate to remove the first substrate. The method according to claim 1, further comprising a step of transferring and arranging the minute objects of the irradiated portion on one substrate on the second substrate.

According to a fifth aspect of the present invention, there is provided a method for forming a connection structure wherein an electrode terminal on a first wiring board and an electrode terminal on a second wiring board are electrically connected via a conductor. , The first wiring board and the second wiring board,
The conductor is fixed by a first adhesive filled between the wiring boards, and the conductor is present only in a region to be electrically connected, and a second conductor provided on at least one of the electrode terminals is provided. Characterized by being fixed by an adhesive.

According to a sixth aspect of the present invention, there is provided a method of forming a connection structure according to the fifth aspect, wherein the step of obtaining the first or second wiring board in which a conductor is disposed on an electrode terminal is provided. A step of arranging a conductor corresponding to the minute object on a first substrate provided with a first adhesive layer, by a method of arranging a minute object according to any one of to 3; A second substrate provided with a second adhesive layer having a high adhesive strength is superimposed on the first substrate on which the conductors are arranged, and the second conductor adheres to the second conductor by the adhesive force of the second adhesive layer. Transferring the substrate to the second substrate, laminating the wiring substrate having electrode terminals provided with an adhesive on the surface and the second substrate to which the conductor has been transferred, and applying the adhesive force of the adhesive. Having a step of transferring and arranging a conductor on the electrode terminal. It is obtained by, characterized in that as the.

According to a seventh aspect of the present invention, there is provided a method for forming a connection structure according to the fifth aspect, wherein the step of obtaining the first or second wiring board in which a conductor is disposed on an electrode terminal is provided. A step of arranging a conductor corresponding to the minute object on the second base body by the method of arranging the minute object, the first wiring board including an electrode terminal provided with an adhesive on a surface thereof, and A step of superimposing the second substrate on which the conductors are arranged, and transferring and arranging the conductors on the electrode terminals by the adhesive force of the adhesive. .

According to an eighth aspect of the present invention, in the method for forming a connection structure according to the sixth or seventh aspect, the second substrate is transparent, the second adhesive layer is made of an ultraviolet curable resin, The method is characterized in that the adhesive force of the second adhesive layer is sometimes reduced by irradiating ultraviolet rays to facilitate the transfer.

According to a ninth aspect of the present invention, there is provided a method of forming a connection structure according to the fifth aspect, wherein the step of obtaining the first or second wiring board in which a conductor is disposed on an electrode terminal is provided. Or a step of arranging a conductor corresponding to the minute object on a transparent substrate by the method of arranging the minute object according to 2, and the wiring board and the conductor provided with an electrode terminal provided with an adhesive on the surface. Superimposing the arranged bases, irradiating ultraviolet rays from the back side of the bases to cure the adhesive layer to reduce the adhesive strength, and transferring and arranging the conductor on the electrode terminals. It is characterized by doing so.

According to a tenth aspect of the present invention, in the method for forming a connection structure according to the eighth or ninth aspect, the adhesive is an ultraviolet-curing adhesive, and the conductive particles and the adhesive are irradiated with ultraviolet rays during the transfer. It is characterized by being made to adhere firmly.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method for arranging minute objects and a method for forming a connection structure to which the present invention is applied will be specifically described below with reference to the accompanying drawings. In all the drawings for describing the embodiments, components having the same function are denoted by the same reference numerals, and a repeated description thereof will be omitted. FIG. 1 is a view for explaining the invention of claim 1 and shows a sectional view of an embodiment of a method for arranging minute objects according to steps. In the figure, 1 is a substrate, 2 is an ultraviolet curable resin layer (adhesive layer), 3 is a mask, 4 is ultraviolet light, and 5 is a minute object. As shown in FIG. 1A, an adhesive member having an ultraviolet-curable resin layer 2 (for example, dicing tape (UC1827) manufactured by Furukawa Electric Co., Ltd.) was prepared.
As shown in (B), ultraviolet rays 4 are radiated by a prescribed amount or more through a mask 3 provided with an ultraviolet transmitting portion and a shielding portion. As a result, the ultraviolet curable resin layer 2 in the portion irradiated with the ultraviolet rays
Hardens and loses tackiness. In this state, as shown in FIG. 1 (C), the minute object 5 is disposed on the entire surface of the ultraviolet curable resin layer 2 side and light pressure is applied, or the adhesive member is applied to a portion where the minute object 5 is accumulated. Press. Thereby, the minute object 5 is fixed to the ultraviolet ray non-irradiated portion by the inherent adhesive force of the ultraviolet curable resin layer 2. Although some minute objects may adhere to the ultraviolet irradiation part, they can be removed by applying a slight air blow or vibration to the adhesive surface. Therefore, after these steps, as shown in FIG. 1 (D), the minute object 5 can be fixed only to the ultraviolet ray non-irradiated portion of the adhesive member. Here, since the ultraviolet-curable resin layer 2 has adhesive strength, it is usual to irradiate with the mask 3 separated, and it is preferable to use a stepper used in a semiconductor process.

The above-mentioned dicing tape has a three-layer structure in which a separator is stuck on an ultraviolet-curable resin layer usually formed by coating on the surface of a substrate. Therefore,
By adopting the method of irradiating UV light with the mask in close contact with the separator without removing the separator, the distance between the mask and the UV-curable resin layer becomes almost constant. Instead, a fixed pattern can be formed. Further, since the substrate itself of such a dicing tape is also transparent, the same effect can be obtained by irradiating similarly from the back surface of the adhesive surface.

FIG. 2 is a view for explaining the invention according to claim 2, showing a sectional view of another embodiment of a method for arranging minute objects according to steps. Here, the same adhesive member as that of the embodiment shown in FIG. 1 is used, and the minute object 5 is disposed on the entire surface of the ultraviolet-curable resin layer 2 of the adhesive member, or the minute object 5 is spread over one surface, Here, the member is pressed. As a result, as shown in FIG. 2B, a state in which the minute object 5 adheres to the entire surface of the ultraviolet curable resin layer 2 is obtained. Then, as shown in FIG. 2C, a prescribed amount of ultraviolet light 4 is irradiated from the back surface of the adhesive surface via the mask 3. As a result, the ultraviolet light passes through the transparent substrate 1 and reaches the ultraviolet-curable resin layer 2, and the resin layer in the irradiated portion is cured and loses adhesive strength. In this state, air blowing or vibration is applied to the surface of the ultraviolet-curable resin layer 2 so that the minute object 5 adhered to the irradiation area is formed.
Can be removed. Therefore, after these steps, as shown in FIG. 2 (D), the minute objects 5 can be fixed and arranged only on the ultraviolet ray non-irradiated portion on the adhesive member.

FIG. 3 is a view for explaining claim 3 and shows a sectional view of still another embodiment of the method for arranging minute objects according to steps. In the figure, 1 'is a substrate, and 6 is a resist layer. First, as shown in FIG. 3A, a photoresist layer 6 is formed on a non-adhesive substrate 1 'such as glass. The photoresist at this time is desirably an emulsion-based photoresist, for example, a BMR resist manufactured by Tokyo Ohka Co., Ltd. Next, FIG.
As shown in FIG. 3B and FIG. 3C, the feto-resist layer 6 is patterned by a photolithography process so that a resist region is left only at a position where a minute object is to be arranged. As shown in FIG. 3D, the minute object 5 is arranged on the entire surface of the substrate 1 'thus formed, or the substrate 1' is pressed against a portion where the minute object 5 is laid on one surface. Since the same type of photoresist has some adhesive strength, as shown in FIG. 3E, a minute object can be arranged and held only in the photoresist portion.

FIG. 4 is a diagram for explaining claim 4.
FIG. 9 is a cross-sectional view of a further embodiment of a method for arranging minute objects according to steps. In the figure, reference numeral 7 denotes a second adhesive member. Here, as shown in FIG. 4 (A), an adhesive member similar to the embodiment shown in FIG. 1 is prepared, and as shown in FIG. 4 (B), a minute object is arranged on the entire surface of the ultraviolet-curable resin layer 2. Alternatively, the pressure-sensitive adhesive member is pressed against a portion where a minute object is spread all over the surface. As a result, a state in which a minute object adheres to the entire surface of the ultraviolet curable resin layer 2 is obtained.
In this adhesive member, the base 1 is transparent as described above,
In this state, as shown in FIG. 4C, the second adhesive member 7 having a lower adhesive strength than the adhesive member is pressed. A specific example of a material suitable for the adhesive member 7 is silicone rubber. Here, on the entire surface of the ultraviolet-curable resin layer 2, only the portion where the microparticles 5 are arranged is the substrate 1
A predetermined amount of ultraviolet light 4 is irradiated from the back of the device. As a result, the ultraviolet-curable resin layer 2 in the irradiated part is cured and loses adhesive strength.
Thereafter, as shown in FIG. 4 (D), when the two are separated, the minute object 5 in the UV-irradiated portion remains attached to the UV-curable resin layer 2 while the minute object 5 in the UV-irradiated portion remains.
Is transferred to the second adhesive member 7 side, and as a result, a minute object can be arranged on the second adhesive member 6.

One cycle of the arranging step is completed here. The minute objects 5 arranged on the second adhesive member 7 are moved to another place, and are shown in FIGS. 4 (E) to 4 (G). As described above, the same arrangement can be formed on the second adhesive member 7 by pressing the substrate 3 again and irradiating the ultraviolet light 4 while shifting the position of the mask 3. According to such a method, it is possible to increase the use efficiency of the minute object 5.

FIG. 5 is a cross-sectional view showing a connection structure of an electrode pattern for explaining claim 5, in which parts having the same functions as in FIG. 6 are denoted by the same reference numerals as in FIG. . First
The wiring board 11 and the second wiring board 12 have electrodes 13 and 14 which are to be connected to each other and have a convex shape on each substrate surface. An adhesive layer 16 is provided on at least one of these electrode surfaces, and the conductive particles 15 are fixed by the adhesive layer 16 so as to be sandwiched between both electrodes. An insulating adhesive 1 is applied to other gaps between these substrates.
7, and the two substrates are joined together. At this time, the conductive particles 15 are connected to the electrode 1 to be connected.
The structure is such that it exists only on 3 and 14.
In such a structure, even if the electrode interval is narrowed, electrical contact in the horizontal direction hardly occurs.

By using the arrangement method according to any one of claims 1 to 4, the conductive particles (fine objects) arranged on the arrangement member (substrate provided with the adhesive layer) can be provided with an adhesive force larger than the adhesive force of the arrangement member. The conductive particles are transferred to the transfer member due to the difference in adhesive strength between the transfer member and the transfer member (substrate provided with the second adhesive layer). Then, after the transfer member on which the conductive particles are arranged is positioned so that the conductive particles come on the electrodes of the substrate, the transfer member and the substrate are overlapped. In this state, the conductive particles on the transfer member are fixed on the electrode by, for example, curing the adhesive formed on the electrode surface. Thereafter, the conductive particles can be arranged on the electrodes by separating the transfer member from the substrate. At this time, by using a dicing tape as described above as a transfer member as described in claim 8, by irradiating ultraviolet rays from the back side of the adhesive surface after overlapping on the electrode,
It can be easily transferred onto the electrode.

After arranging the conductive particles thereon by using a dicing tape as the above-mentioned arrangement member, the resin is cured over the entire arrangement member by irradiating ultraviolet rays from the back surface after directly superimposing on the electrodes of the substrate. Therefore, the conductive particles are transferred onto the electrodes. According to this method, the transfer member and the transfer step can be omitted (claim 9).

When transferring the conductive particles by irradiating ultraviolet rays on the electrodes, an ultraviolet-curable adhesive is applied on the electrodes. Thereby, the adhesive on the electrode is cured by irradiating the ultraviolet ray during the transfer, and the conductive particles can be fixed reliably.

[0026]

【The invention's effect】

Advantageous Effects of Claims 1 and 2: Since the method is a method of arranging minute objects by controlling the adhesive force of the adhesive layer by irradiating ultraviolet rays, the arrangement of the minute objects can be easily determined by the irradiation pattern of ultraviolet rays. The minute objects can be arranged in a reliable manner.

According to the third aspect of the present invention, since a region for arranging particles is formed by photolithography, a finer arrangement can be realized.

According to the fourth aspect of the present invention, since the minute objects of only the ultraviolet irradiation portion on the substrate on which the minute objects are arranged on the entire surface are used for the transfer and arrangement, the transfer is performed while shifting the substrate during the irradiation of the ultraviolet light. Thereby, the same substrate can be transferred and arranged a plurality of times, and the utilization efficiency of the particles can be increased.

According to the first to fourth aspects, the arrangement of the minute objects can be collectively formed in the plane on the substrate.
Regardless of the shape of the array and the number of objects to be arrayed, the array can be obtained in the same process.

According to the fifth aspect, since the conductor is present only on the electrode to be connected, even if the connection pitch becomes fine, short-circuiting does not occur and high-density connection can be realized.

According to the sixth aspect of the present invention, the conductive particles arranged on the first substrate are transferred to the second substrate after the ultraviolet irradiation step, and then transferred again to the electrodes.
The transfer can be performed a plurality of times with one substrate, and the manufacturing cost can be reduced.

Effect of Claim 7: Since the arrangement method according to Claim 4 is used, the particles adhered to the entire surface can be used for forming the arrangement plural times, the use efficiency of the particles is high, and the mounting cost is reduced. can do.

According to the eighth aspect of the present invention, when transferring the conductive particles onto the electrodes, the base on which the conductive particles are arranged is irradiated with ultraviolet rays, whereby the holding power of the conductive particles is reduced.
The conductive particles can be more reliably arranged on the electrode.

According to the ninth aspect of the present invention, the base on which the conductive particles are arranged is directly overlaid on the substrate to transfer the conductive particles onto the electrodes. Therefore, the second base for transfer can be omitted, and this can be used. Since the number of transfer steps can be reduced, manufacturing costs can be reduced.

According to the tenth aspect, since the adhesive applied to the electrode is an ultraviolet-curing type, the adhesive is cured by irradiating ultraviolet rays at the time of transferring the conductive particles, so that the conductive particles are surely formed on the electrode. A fixed and highly reliable connection structure can be obtained.

[Brief description of the drawings]

FIG. 1 is a view for explaining the invention of claim 1, showing a sectional view of an embodiment of a minute object array method according to steps;

FIG. 2 is a view for explaining the invention according to claim 2, showing a sectional view of another embodiment of the method for arranging minute objects according to steps.

FIG. 3 is a view for explaining claim 3 and shows a sectional view of still another embodiment of the method for arranging minute objects according to steps.

FIG. 4 is a view for explaining claim 4, showing a sectional view of still another embodiment of the method for arranging minute objects according to steps.

FIG. 5 is a sectional view showing a connection structure of an electrode pattern for explaining claim 5;

FIG. 6 is a cross-sectional view showing a connection structure of an electrode pattern according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base, 1 '... Substrate, 2 ... UV curable resin layer (adhesive layer), 3 ... Mask, 4 ... Ultraviolet, 5 ... Fine object, 6 ... Resist layer, 7 ... Second adhesive member, 11 ... No. 1 wiring board, 12 ... second wiring board, 13, 14 ... electrode, 15 ...
Conductive particles, 16, 17 ... adhesive.

Claims (10)

[Claims] 1. A step of irradiating a part of an adhesive layer made of an ultraviolet-curable resin provided on a substrate with ultraviolet light, thereby curing the adhesive layer in the irradiated part to reduce the adhesive strength, and Contacting the whole surface with a minute object, adhering and arranging the minute object on the non-irradiated part of the ultraviolet ray, and removing unnecessary minute object attached to the irradiated part. Array method. 2. A step of adhering a fine object to the entire surface of an adhesive layer made of an ultraviolet-curable resin provided on a transparent substrate;
Irradiating a part of the adhesive layer with ultraviolet light from the back side of the substrate to a part of the adhesive layer, and curing the adhesive layer in the irradiated part to reduce the adhesive strength; and A method for arranging a minute object, comprising the step of removing the object and arranging the minute object in a portion not irradiated with the ultraviolet light. 3. A step of patterning a photoresist layer provided on a substrate by photolithography, and the step of patterning the photoresist layer remaining on the substrate as an adhesive layer to form a fine object on the adhesive layer. A method of arranging minute objects, comprising a step of arranging by sticking. 4. A step of adhering a minute object to the entire surface of a first adhesive layer made of an ultraviolet-curable resin provided on a transparent first substrate, and a second adhesive having a lower adhesive force than the first adhesive layer. Superimposing the second substrate provided with the adhesive layer on the first substrate and the first substrate adhered to the minute object, and removing the first adhesive layer from the back side of the superposed first substrate Irradiating the portion with ultraviolet light, curing the first adhesive layer of the irradiated portion to reduce the adhesive strength, and peeling the first substrate from the second substrate and removing the first substrate from the second substrate A method for arranging minute objects, comprising a step of transferring and arranging the minute objects of the irradiation part on the second base. 5. A method for forming a connection structure in which an electrode terminal on a first wiring board and an electrode terminal on a second wiring board are electrically connected via a conductor.
The wiring board and the second wiring board are fixed by a first adhesive filled between the wiring boards, and the conductor is present only in the area to be electrically connected, A method of forming a connection structure, characterized in that the connection structure is fixed by a second adhesive provided on at least one of the electrode terminals. 6. The method according to claim 5, wherein the step of obtaining the first or second wiring board in which a conductor is disposed on an electrode terminal used in the method of forming a connection structure according to claim 5.
A step of arranging a conductor corresponding to the minute object on a first substrate provided with a first adhesive layer by the method for arranging a minute object according to any one of the first and second aspects; A second substrate provided with a second pressure-sensitive adhesive layer is superimposed on the first substrate on which the conductors are arranged, and the second conductor adheres to the second substrate by the adhesive force of the second pressure-sensitive adhesive layer. A step of transferring to the base, the wiring substrate having electrode terminals provided with an adhesive on a surface thereof, and the second base to which the conductor is transferred are superimposed, and the conductor is applied by the adhesive force of the adhesive. And a step of transferring and arranging them on the electrode terminals. 7. The method according to claim 5, wherein the step of obtaining the first or second wiring board in which a conductor is disposed on an electrode terminal used in the method of forming a connection structure according to claim 5. Arranging a conductor corresponding to the minute object on the second base body by an arranging method, and arranging the first wiring board including an electrode terminal provided with an adhesive on the surface and the conductor. A method for forming a connection structure, comprising a step of superimposing the second substrate and transferring and arranging the conductor on the electrode terminal by the adhesive force of the adhesive. 8. The method according to claim 6, wherein the second base is transparent, and the second base is transparent.
The adhesive layer is made of an ultraviolet curable resin, and is irradiated with ultraviolet rays during the transfer to reduce the adhesive strength of the second adhesive layer,
A method for forming a connection structure, wherein the transfer is performed easily. 9. The method according to claim 5, wherein the step of obtaining the first or second wiring board in which a conductor is disposed on an electrode terminal used in the method of forming a connection structure according to claim 5. An object arranging method, a step of arranging a conductor corresponding to the minute object on a transparent substrate, and the wiring substrate including an electrode terminal provided with an adhesive on a surface thereof; and the substrate on which the conductor is arranged. Superimposing, curing the adhesive layer by irradiating ultraviolet rays from the back side of the base to reduce the adhesive strength, and transferring and arranging the conductor on the electrode terminal. A method for forming a connection structure as a feature. 10. The method for forming a connection structure according to claim 8, wherein the adhesive is an ultraviolet-curable adhesive, and the conductive particles and the adhesive are firmly adhered to each other by ultraviolet rays irradiated during the transfer. A method for forming a connection structure.